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What is 3 layer PCB?

3 Layer PCB or Three layer PCB Board , Is less in the normally in the

market, most most multilayer plural layer like 4 layer , 6 layer, 32 Layer.

Sometime some electronic device need special layer stack up to get the

performance , and sometime ,just PCB designer want to save cost , not

do 4 layer .

RayMing is 3 layer PCB manufacturer ,Welcome to send your design

to sales@raypcb.com , We will give your quote asap

Request 3 Layer PCB Manufacturing Quote Now

Table of Contents

Introduction

A printed circuit board (PCB) forms the foundation for

building electronic circuits by providing the base for mounting and

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interconnecting components. PCBs with multiple conductive layers enable

increased component density and complex circuit routing. A 3 layer PCB

refers to a board with three copper layers separated by insulating

dielectric substrates.

This article provides a comprehensive overview of 3 layer PCB technology.

We will cover the advantages of 3 layer boards, their construction,

common design techniques, applications, and manufacturing

considerations. With an understanding of their capabilities and limitations,

engineers can effectively utilize 3 layer PCBs in many types of electronic

designs.

Advantages of 3 Layer PCBs

Three layer boards provide the following benefits compared to simpler 2

layer PCBs:

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 Added routing flexibility – The extra layer allows more

interconnectivity and circuit optimization. Parts placement and

routing are less constrained.

 Improved signal integrity – The middle layer can be a

continuous ground plane. This provides controlled impedance

signal routing on outer layers.

 Lower EMI/noise – Enclosing signals between power and ground

layers reduces interference and crosstalk.

 Better power distribution – Additional layer allows power-ground

plane pairs for each voltage domain.

 Higher component density – Components can be placed on both

sides with vertical interconnects through the middle layer.

 Smaller board sizes – Miniaturization by utilizing both sides

for SMT parts placement.

 Mixed signal designs – Analog and digital sections can be

segregated across layers.

For these reasons, 3 layer construction provides excellent capability and

cost-benefit for many electronic products.

Construction of 3 Layer PCBs

The fabrication of 3 layer printed circuit boards involves laminating

conductive copper layers separated by insulating dielectric substrates:

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 The center substrate is called the core. It provides mechanical

support. The default material for core and prepreg layers is typically

glass reinforced FR-4.

 A sheet of copper foil is laminated onto both sides of the core.

These form the top and bottom conductive layers of the PCB.

 Photolithographic processing patterns the copper layers into the

required circuit traces, pads, and features.

 Plated through holes and buried vias provide vertical

interconnections between the layers.

 Soldermask selectively coats the copper layers for protection and

isolation.

This creates a 3 layer board ready for component assembly. The sequence

can be repeated to build multilayer boards.

Typical 3 Layer Stackups

While all 3 layers can be used for routing signals, some standard layer

assignments provide good design starting points:

3 Layer With Ground Plane

 Layer 1 – Signals

 Layer 2 – Ground plane

 Layer 3 – Signals

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This offers a continuous reference ground plane for controlled impedance

routing and shielding.

3 Layer With Split Power Planes

 Layer 1 – Signals

 Layer 2 – Split power planes (VCC and VDD)

 Layer 3 – Signals

Separate power supply domains can be isolated between the split power

planes.

3 Layer With Buried Signal Plane

 Layer 1 – Ground

 Layer 2 – Signals

 Layer 3 – Ground

The buried signal layer fully encompasses routing surrounded by ground

planes.

The stackup can be customized based on signal isolation, thermal

and EMI requirements.

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Design Considerations for 3 Layer Boards

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Here are some important design practices when working with 3 layer

PCBs:

 Split power planes correctly for digital and analog domains based

on current levels.

 Use a large number of via stitches to connect split power planes for

lowest impedance.

 Assign critical signals to outer layers adjacent to the ground/power

planes.

 Route opposing signal polarities on same layer to minimize

crosstalk.

 Use diagonal routing over middle layer to change layers when

needed.

 Enable thermal relief stitching for highest current paths.

 Maximize copper area on outer layers for best heat dissipation.

 Follow adequate design clearances between planes and traces.

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 Model power and ground impedances to avoid resonance and

coupling issues.

 Simulate signal integrity and radiated emissions to high

frequencies.

Proper 3 layer stackup design and layout techniques result in schematics

which transition smoothly through manufacturing.

Typical Applications of 3 Layer PCBs

Here are some examples of products where 3 layer boards are commonly

used:

 Consumer electronics – IoT devices, smart home gadgets, wearable

tech

 Vehicles – Auto infotainment panels, GPS display units

 Industrial – PLCs, motor controllers, sensors

 Instrumentation – Meters, analyzers, handheld testers

 Medical – Diagnostic equipment, body-worn monitors

 IT – Ethernet switches, modems, routers

 Communications – Radio transceivers, video gear

3 layer boards balance cost, complexity and performance for mid-range

applications. The proliferation of digital electronics drives large volumes of

3 layer PCBs today.

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3 Layer PCB Manufacturing Overview

3 layer PCB fabrication in volume involves the following key steps:

 Materials – Core substrates, prepreg, copper foils

 Imaging – Photoresists, direct laser/mechanical patterning

 Lamination – Stacking layers under heat and pressure

 Etching – Chemically etching away unwanted copper

 Drilling – Machines drilling holes for vias and mounting

 Plating – Electroplating copper over hole walls and surfaces

 Solder mask – Liquid photoimageable solder resist layers

 Silkscreen – Printed reference markings

 Testing – Electrical testing, quality inspection

 Assembly – SMT component placement and soldering

High-yielding fabrication lines enable cost-effective mass production of 3

layer boards.

Conclusion

With three conductive layers to work with, PCB designers have sufficient

flexibility to route out interconnects and partition domains without undue

complexity. 3 layer boards offer excellent capability per unit cost, enabling

their ubiquity across industrial and consumer electronics. Advances in PCB

materials, fabrication equipment and assembly technologies will continue

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to improve technical features, density and reliability while reducing

manufacturing costs.

Frequently Asked Questions

Here are some common questions about 3 layer PCBs:

What are the typical substrate thicknesses used in 3 layer boards?

Standard cores are commonly 0.8mm, 1.0mm, 1.6mm while prepregs

range from 0.1mm to 0.25mm. Overall thickness is usually between

1.6mm to 2.4mm.

What are the minimum track/spacing dimensions achievable on 3 layer boards?

With processes like direct imaging, trace/space down to 125um (5 mils) is

routinely achievable on outer layers.

What are common 3 layer PCB sizes?

Smaller boards of around 50x50mm to 160x100mm are typical. Large

boards up to 460x360mm area are also manufactured cost-effectively.

What are the limitations of 3 layer boards compared to 4+ layer ones?

Design constraints in routing congestion, inability to isolate multiple

signals, lower component density and lack of flexibility for high pin-count

parts.

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What are common materials available for core and prepreg in 3 layer PCBs?

Standard FR-4, High Tg FR-4, Halogen-free FR-4, Rogers materials for high

frequency, Polyimide for flexibility, Ceramic-filled substrates for thermal

conduction.

Related Posts:

1. 28 Layer PCB: An Integrated Multi-Layer PCBs

2. An Introduction to 2 Layer PCB

3. 6 layer PCB Stackup,Thickness and Manufacturing

4. High Quality 20 Layer PCB Manufacturer

https://www.raypcb.com/3-layer-pcb/

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