PD - 97676A

AUTOMOTIVE GRADE

AUIRF1324WL
Features HEXFET® Power MOSFET
l Advanced Process Technology D V(BR)DSS 24V
l Ultra Low On-Resistance
RDS(on) typ. 1.16m
l 50% Lower Lead Resistance
l 175°C Operating Temperature max. 1.30m
G
l Fast Switching ID (Silicon Limited) 382A c
l Repetitive Avalanche Allowed up to Tjmax S
ID (Package Limited) 240A
l Lead-Free, RoHS Compliant
l Automotive Qualified *

Description
Specifically design for automotive applications this Widelead TO-
262 package part has the advantage of having over 50% lower
lead resistance and delivering over 20% lower Rds(on) when
compared with a traditional TO-262 package housing the same
silicon die. This greatly helps in reducing condition losses, achieving
S
higher current levels or enabling a system to run cooler and have
D
improved efficiency. Additional features of this design are a 175°C G
junction operating temperature, fast switching speed and improved
repetitive avalanche rating . These features combine to make this TO-262 WideLead
design an extremely efficient and reliable device for use in
Automotive and other applications. G D S
Gate Drain Source

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only; and functional operation of the device at these or any other condition beyond those
indicated in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended
periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 382c
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 270c A
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited) 240
IDM Pulsed Drain Current d 1530
PD @TC = 25°C Maximum Power Dissipation 300 W
Linear Derating Factor 2.0 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS (Thermally limited) Single Pulse Avalanche Energy e 530 mJ
IAR Avalanche Current d See Fig. 14, 15, 22a, 22b, A
EAR Repetitive Avalanche Energy d mJ
dv/dt Peak Diode Recovery f 1.3 V/ns
TJ Operating Junction and -55 to + 175
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 seconds 300 (1.6mm from case)
Thermal Resistance
Parameter Typ. Max. Units
RJC Junction-to-Case j ––– 0.50 °C/W

HEXFET® is a registered trademark of International Rectifier.

*Qualification standards can be found at http://www.irf.com/
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Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)

Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 24 ––– ––– V VGS = 0V, ID = 250μA
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– 0.022 ––– V/°C Reference to 25°C, ID = 5mA g
RDS(on) Static Drain-to-Source On-Resistance ––– 1.16 1.30 m VGS = 10V, ID = 195A g
VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250μA
gfs Forward Transconductance 210 ––– ––– S VDS = 10V, ID = 195A
RG Internal Gate Resistance ––– 2.4 ––– 
IDSS Drain-to-Source Leakage Current ––– ––– 20 VDS = 24V, VGS = 0V
μA
––– ––– 250 VDS = 19V, VGS = 0V, TJ = 125°C
IGSS Gate-to-Source Forward Leakage ––– ––– 200 VGS = 20V
nA
Gate-to-Source Reverse Leakage ––– ––– -200 VGS = -20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Qg Total Gate Charge ––– 120 180 ID = 195A
Qgs Gate-to-Source Charge ––– 58 ––– VDS =12V
Qgd Gate-to-Drain ("Miller") Charge ––– 36 –––
nC
VGS = 10V g
Qsync Total Gate Charge Sync. (Qg - Qgd) ––– 84 ––– ID = 195A, VDS =0V, VGS = 10V g
td(on) Turn-On Delay Time ––– 18 ––– VDD = 16V
tr Rise Time ––– 200 ––– ID = 195A
ns
td(off) Turn-Off Delay Time ––– 75 ––– RG = 2.7
tf Fall Time ––– 110 ––– VGS = 10V g
Ciss Input Capacitance ––– 7630 ––– VGS = 0V
Coss Output Capacitance ––– 3390 ––– VDS = 19V
Crss Reverse Transfer Capacitance ––– 1960 ––– pF ƒ = 1.0MHz, See Fig.5
Coss eff. (ER) Effective Output Capacitance (Energy Related) ––– 4660 ––– i
VGS = 0V, VDS = 0V to 19V , See Fig.11
Coss eff. (TR) Effective Output Capacitance (Time Related) ––– 4685 ––– VGS = 0V, VDS = 0V to 19V h
Diode Characteristics
Parameter Min. Typ. Max. Units Conditions
IS Continuous Source Current ––– ––– 382 c MOSFET symbol D

(Body Diode) showing the

A
ISM Pulsed Source Current ––– ––– 1530 integral reverse G

(Body Diode) d p-n junction diode. S

VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 195A, VGS = 0V g
trr Reverse Recovery Time ––– 46 69 TJ = 25°C VR = 20V,
ns
––– 45 68 TJ = 125°C IF = 195A
Qrr Reverse Recovery Charge ––– 395 593 TJ = 25°C di/dt = 100A/μs g
nC
––– 345 518 TJ = 125°C
IRRM Reverse Recovery Current ––– 1.9 ––– A TJ = 25°C
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

Notes:
 Calculated continuous current based on maximum allowable junction „ ISD  195A, di/dt  600A/μs, VDD V(BR)DSS, TJ  175°C.
temperature. Package limitation current is 240A. Note that current … Pulse width  400μs; duty cycle  2%.
limitations arising from heating of the device leads may occur with † Coss eff. (TR) is a fixed capacitance that gives the same charging time
some lead mounting arrangements.(Refer to AN-1140 as Coss while VDS is rising from 0 to 80% VDSS .
http://www.irf.com/technical-info/appnotes/an-1140.pdf ‡ Coss eff. (ER) is a fixed capacitance that gives the same energy as
‚ Repetitive rating; pulse width limited by max. junction Coss while VDS is rising from 0 to 80% VDSS.
temperature. ˆ R is measured at TJ approximately 90°C.
ƒ Limited by TJmax, starting TJ = 25°C, L = 0.028mH
RG = 50, IAS = 195A, VGS =10V. Part not recommended for use
above this value.
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†
Qualification Information
Automotive
††
(per AEC-Q101)
Qualification Level Comments: This part number(s) passed Automotive
qualification. IR’s Industrial and Consumer qualification
level is granted by extension of the higher Automotive level.

TO-262
Moisture Sensitivity Level MSL1
WideLead
Machine Model Class M4 (+/- 425V)
†††

AEC-Q101-002
Human Body Model Class H2 (+/- 4000V)
†††
ESD
AEC-Q101-001
Charged Device Class C5 (+/- 1125V)
†††

Model AEC-Q101-005
RoHS Compliant Yes

† Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/

†† Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report.
††† Highest passing voltage.

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AUIRF1324WL
10000 10000
VGS VGS
TOP 15V TOP 15V
10V 10V
6.5V 6.5V
ID, Drain-to-Source Current (A)

ID, Drain-to-Source Current (A)

5.8V 5.8V
5.4V 5.4V
5.0V 5.0V
1000 4.8V 1000 4.8V
BOTTOM 4.5V BOTTOM 4.5V

100 100

4.5V

4.5V 60μs PULSE WIDTH 60μs PULSE WIDTH

Tj = 25°C Tj = 175°C
10 10
0.1 1 10 100 0.1 1 10 100
V DS, Drain-to-Source Voltage (V) V DS, Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics

10000 2.0
ID = 195A

RDS(on) , Drain-to-Source On Resistance

VGS = 10V
ID, Drain-to-Source Current (A)

1000
1.5

100 T J = 175°C
(Normalized)

1.0

10
TJ = 25°C

0.5
1
VDS = 15V
60μs PULSE WIDTH
0.1 0.0
2 3 4 5 6 7 8 9 -60 -40 -20 0 20 40 60 80 100120140160180

VGS, Gate-to-Source Voltage (V) T J , Junction Temperature (°C)

Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance vs. Temperature

100000 14.0
VGS = 0V, f = 1 MHZ
ID= 195A
C iss = C gs + C gd, C ds SHORTED
C rss = C gd 12.0
VDS= 19V
VGS, Gate-to-Source Voltage (V)

C oss = C ds + C gd VDS= 12V

10.0
C, Capacitance (pF)

8.0
10000 Ciss
Coss 6.0

Crss 4.0

2.0

1000 0.0
1 10 100 0 20 40 60 80 100 120 140 160 180
VDS, Drain-to-Source Voltage (V) QG, Total Gate Charge (nC)

Fig 5. Typical Capacitance vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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10000 10000
OPERATION IN THIS AREA
LIMITED BY R DS(on)

ID, Drain-to-Source Current (A)

1000
ISD, Reverse Drain Current (A)

1000

T J = 175°C 100μsec
100
1msec
100

10
DC
TJ = 25°C
10msec
10
1 Tc = 25°C
Tj = 175°C
VGS = 0V Single Pulse
1.0 0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1 10 100
VSD, Source-to-Drain Voltage (V) VDS, Drain-toSource Voltage (V)
Fig 7. Typical Source-Drain Diode Fig 8. Maximum Safe Operating Area
Forward Voltage

V(BR)DSS , Drain-to-Source Breakdown Voltage (V)

400 30
Id = 5mA
Limited By Package 29
300
ID, Drain Current (A)

28

200 27

26
100
25

0 24
25 50 75 100 125 150 175 -60 -40 -20 0 20 40 60 80 100120140160180
T C , Case Temperature (°C) T J , Temperature ( °C )
Fig 9. Maximum Drain Current vs. Fig 10. Drain-to-Source Breakdown Voltage
Case Temperature
1.6 2500
EAS , Single Pulse Avalanche Energy (mJ)

ID
1.4 TOP 99A
2000 100A
1.2 BOTTOM 195A

1.0
1500
Energy (μJ)

0.8

0.6 1000

0.4
500
0.2

0.0 0
-5 0 5 10 15 20 25 25 50 75 100 125 150 175
Starting T J , Junction Temperature (°C)
VDS, Drain-to-Source Voltage (V)
Fig 11. Typical COSS Stored Energy Fig 12. Maximum Avalanche Energy vs. DrainCurrent
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D = 0.50
Thermal Response ( Z thJC ) °C/W

0.1 0.20
0.10
0.05
R1 R2 R3
0.01 0.02 R1 R2 R3 Ri (°C/W) i (sec)
J
0.01 J
C

0.0493 0.000124
1 2 3
1 2 3 0.1910 0.003004
Ci= iRi 0.2586 0.021684
0.001 Ci iRi
SINGLE PULSE
( THERMAL RESPONSE ) Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t1 , Rectangular Pulse Duration (sec)

Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case

1000

Allowed avalanche Current vs avalanche

pulsewidth, tav, assuming Tj = 150°C and
Duty Cycle = Single Pulse Tstart =25°C (Single Pulse)
Avalanche Current (A)

100 0.01
0.05

0.10

10

Allowed avalanche Current vs avalanche

pulsewidth, tav, assuming  j = 25°C and
Tstart = 150°C.
1
1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01
tav (sec)

Fig 14. Typical Avalanche Current vs. Pulsewidth

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600
Notes on Repetitive Avalanche Curves , Figures 14, 15:
TOP Single Pulse
(For further info, see AN-1005 at www.irf.com)
BOTTOM 1.0% Duty Cycle 1. Avalanche failures assumption:
500 ID = 195A Purely a thermal phenomenon and failure occurs at a temperature far in
EAR , Avalanche Energy (mJ)

excess of Tjmax. This is validated for every part type.

400 2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figure 22a, 22b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
300 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
200 7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 14, 15).
tav = Average time in avalanche.
100 D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav ) = Transient thermal resistance, see Figures 13)
0
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC
25 50 75 100 125 150 175
Iav = 2DT/ [1.3·BV·Zth]
Starting T J , Junction Temperature (°C) EAS (AR) = PD (ave)·tav

Fig 15. Maximum Avalanche Energy vs. Temperature

4.0
VGS(th) , Gate threshold Voltage (V)

3.5

3.0

2.5
ID = 250μA
2.0 ID = 1.0mA
ID = 1.0A
1.5

1.0

0.5
-75 -50 -25 0 25 50 75 100 125 150 175
T J , Temperature ( °C )

Fig 16. Threshold Voltage vs. Temperature

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AUIRF1324WL
Driver Gate Drive
P.W.
D.U.T P.W.
Period D=
Period
+

ƒ
*
VGS=10V
Circuit Layout Considerations
 Low Stray Inductance
Ground Plane
- Low Leakage Inductance D.U.T. ISD Waveform
Current Transformer
+
Reverse
‚ Recovery Body Diode Forward
-
„ + Current Current
- di/dt
D.U.T. VDS Waveform
Diode Recovery
 dv/dt
VDD

RG dv/dt controlled by RG VDD Re-Applied

Driver same type as D.U.T. + Voltage Body Diode Forward Drop
I SD controlled by Duty Factor "D" - Inductor Current
Inductor Curent
D.U.T. - Device Under Test

Ripple  5% ISD

* VGS = 5V for Logic Level Devices

Fig 21. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs

V(BR)DSS

15V
tp

L DRIVER
VDS

RG D.U.T +
V
- DD
IAS A
20V
tp 0.01
I AS

Fig 22a. Unclamped Inductive Test Circuit Fig 22b. Unclamped Inductive Waveforms

LD
VDS VGS
90%
+
VDD -

D.U.T
10%
VGS
Second Pulse Width < 1μs
VDS
Duty Factor < 0.1%

td(off) tf td(on) tr

Fig 23a. Switching Time Test Circuit Fig 23b. Switching Time Waveforms

Id
Vds

Vgs

L
VCC
DUT
0
Vgs(th)
1K
S
20K

Qgodr Qgd Qgs2 Qgs1

Fig 24a. Gate Charge Test Circuit Fig 24b. Gate Charge Waveform
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TO-262 WideLead Package Outline

Dimensions are shown in millimeters (inches)

TO-262 WideLead Part Marking Information

Part Number AUIRF1324WL

Date Code
Y= Year
IR Logo
YWWA WW= Work Week
A= Automotive, Lead Free

XX or XX

Lot Code

Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRF1324WL

Ordering Information
Base part number Package Type Standard Pack Complete Part Number
Form Quantity
AUIRF1324WL TO-262 WideLead Tube 50 AUIRF1324WL

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 AUIRF1324WL

IMPORTANT NOTICE

Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make
corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or
services without notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific requirements with regards
to product discontinuance and process change notification. All products are sold subject to IR’s terms and conditions of sale supplied at the time of order
acknowledgment.

IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with IR’s standard warranty. Testing
and other quality control techniques are used to the extent IR deems necessary to support this warranty. Except where mandated by government
requirements, testing of all parameters of each product is not necessarily performed.

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components. To minimize the risks with customer products and applications, customers should provide adequate design and operating safeguards.

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any non-designated products in automotive applications, IR will not be responsible for any failure to meet such requirements.

For technical support, please contact IR’s Technical Assistance Center

http://www.irf.com/technical-info/

WORLD HEADQUARTERS:
101 N. Sepulveda Blvd., El Segundo, California 90245
Tel: (310) 252-7105

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