From Technologies to Markets

From Technologies
to Market
MRAM
Technology
and Business
2019

Sample
© 2019
ABOUT THE AUTHORS
Biographies & contacts

Simone Bertolazzi, PhD

Simone is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of the
Yole’s memory team and he contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and
fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging
semiconducting materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals and was awarded the
prestigious Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne
(Switzerland), where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics.
Simone earned a double M.A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Contact: bertolazzi@yole.fr

Emilie Jolivet
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies. Emilie manages
the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships
with semiconductor leaders and the development of market research and strategy consulting activities. With its previous collaborations at Freescale
and EV Group, Emilie developed a core expertise dedicated to package & assembly, semiconductor manufacturing, memory and software & computing.
Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France) and graduated with an MBA
from IAE (Lyon, France).

Contact: jolivet@yole.fr

2
COMPANIES CITED IN THIS REPORT

A*STAR, Advantest, Aeroflex, Antaios, Applied Materials, Avalanche, Canon, Capres-KLA, CEA
Leti, CNE, Crocus, CXMT, Cypress, Despatch, Dow, Evaderis, Evatec, Everspin, JHICC,
GlobalFoundries, H-Grace, HFC Semiconductor, Hikstor, Hitachi, Honeywell, HP, Hprobe,
Huawei, IBM, Imec, Infineon, Intermolecular, Inston, Intel, ITRI, Lam Research, Macronix,
Maxim, Materion, Mediatek, Merk, Microchip, Micron, MicroSense Mythic, Nantero, Nanya,
National Tsing Hua University, Nokia, Numen, NVE Corporation, NXP, OHT, Panasonic,
Qualcomm, Quantum, Reliance, Renesas, Samsung, SanDisk, Seagate, SK Hynix, Shanghai Ciyu,
SilTerra, Singulus, Smart Modular Technologies, SmartTip, SMIC, Sony, Spin Memory, Spintec,
STMicroelectronics, Stanford University, Synopsis, Syntiant, TDK, TEL, TEL Magnetic Solutions,
Teledyne e2v, Tezzaron, Tohoku University, Toshiba, Towerjazz, Tsinghua Unigroup , TSMC,
UMC, Veeco, Western Digital, Winbond, XFab, XMC,YMTC, and more

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TABLE OF CONTENTS
Introduction 7 Embedded memory (slow SRAM) – low-power memory for 165
ASICS/ASSP chips (e.G., Display drivers and edge-ai accelerators)
Noteworthy MRAM news 2017-2019 19
Embedded cache memory (SRAM, edram) – fast memory for 173
Executive summary 25 high-level caching in CPU and mobile processors

Context - overview of the memory business 65

Long-term potential applications 180
Stand-alone memory – NAND, DRAM, NOR, (NV)SRAM 72
MRAM supply chain and player dynamics 184
Embedded memory – eflash, edram, SRAM 87 Supply chain analysis 188
Emerging non-volatile memories – MRAM, PCM, RRAM, etc. 96 MRAM players and activities 201
Overview of MRAM applications and market trends 107 Mergers & acquisitions, partnerships and funding 219
Market forecast and financial analysis 114 China MRAM development 223
Market forecast 2018-2024 (in $M, Gb and 12’’ eq. wafers with breakdown by
applications and technologies) for stand-alone and embedded MRAM Technology description and trends 231
MRAM technologies 239
Stand-alone MRAM applications and market trends 124
MRAM manufacturing 251
Industrial, transportation and other (NVSRAM) 126
Next-generation magnetic memories (SOT- and VC-MRAM) 259
Enterprise storage – SSD caching and storage accelerators 134
Summary and conclusions 264
Persistent memory (NVDIMM) 140
Related reports 269
Embedded MRAM applications and market trends 148
How should you use our data? 270
Embedded storage (eflash) – code/data storage in mcus and other 155
ASICS/ASSP chips.
Yole Développement’s presentation 271

4
REPORT METHODOLOGY
Yole’s market forecast model is based on the matching of several sources:

Preexisting
information

Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)

Information
Aggregation

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KEY FEATURES OF THIS REPORT - SCOPE
After recognizing the growing importance of MRAM – particularly within the embedded space – Yole decided to publish the new report “MRAM
Technology and Business”, which provides a detailed overview of the latest MRAM technology developments together with a high-resolution
snapshot of the current state of the MRAM ecosystem

The scope of the report is as follows:

• Technology and Market Trends • Supply chain and players analysis

• (STT-)MRAM technology description, latest • Mapping of the entire (STT-)MRAM supply chain
developments, roadmaps and trends • Players’ activities at different levels of the supply chain
• Market drivers, challenges & opportunities • Analysis of the ecosystem’s maturity, challenges, strengths
• Market forecasts in M$, Gb and 12’’ eq. wafers • Competitive landscape: players strategies and dynamics
• Next-generation magnetic memories (e.g. SOT-
and VC-MRAM) enabling new applications
Yours needs are
• Stand-Alone and Embedded Applications
• Stand-alone:
out of the report’
• Industrial, transportation, defense and other (<256 Mb). scope?
• Enterprise storage, e.g. accelerators and SSD caching (≥256Mb) Contact us for a custom:
• Persistent memory, e.g. (>1 Gb).
• Embedded:
• Code/data storage memory (e.g. eFlash replacement in MCUs),
• Working memory (Slow SRAM) for ASSPs/ASICs (e.g. AI edge accelerators)
• Cache memory (SRAM) in CPUs and mobile processors.
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KEY FEATURES OF THIS REPORT - OBJECTIVES
• Present an overview of the overall semiconductor memory market:
• Stand-alone memory (DRAM, NAND, NOR, (NV)SRAM): markets, forecast, and main trends
• Embedded memory (SRAM, eDRAM, eFlash) and emerging NVM businesses
• Provide an understanding of MRAM applications:
• Total addressable markets, market drivers & challenges, technology roadmaps, players, and main trends
• Offer market forecasts for stand-alone and embedded MRAM:
• 2018-2024 market forecast in units, Gb, US$/Gb, and number of equivalent 12’’ wafers
• Describe (STT-)MRAM technologies:
• Working principle, manufacturing methods, advantages/limitations, development status, price, time-to-market
• Roadmap with technological nodes, and chip density evolution with main players
• Latest product development status for each key market player
• Detail and analyze the competitive landscape:
• Key players, by technologies and applications
• Recent acquisitions, partnerships and funding
• Latest company news
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COMPARISON WITH THE “EMERGING NVM 2018” REPORT

• The “Emerging NVM 2018” report provides a systematic comparison among emerging memory technologies – particularly
phase-change memory (PCM), resistive RAM (RRAM) and magnetoresistive RAM (MRAM) – that could complement/replace the
industry workhorses NAND (non-volatile) and DRAM (volatile) in a number of market applications.
• More specifically, the “MRAM Technology and Business 2019” provides a deep insight into the spectrum of MRAM
technologies and applications, and analyzes the supply chain at different levels: chip manufacturers, equipment & material suppliers,
system integrators, and more. A profile for all key players with their MRAM activities is provided.
• In terms of market/business evolution, here are some new key facts discussed in this report:
• Foundry/IDM activities on embedded MRAM are advancing at fast pace: Samsung Foundry is now in mass production @28nm
FDSOI, Intel is ready for production @22nm FinFET, while TSMC is sampling embedded MRAM @22nm (planar bulk).
• Samsung and TSMC are focusing on embedded MRAM for replacing SRAM in applications where performance is not a priority,
whereas GlobalFoundries will continue to offer embedded MRAM as a code/data storage technology instead of eFlash
• Samsung’s embedded MRAM could be adopted as a slow SRAM implementation in CMOS image sensors or display driver ICs.
• Strong involvement of equipment players for solving deposition, etching and metrology/testing challenges  Big R&D
investments for developing full MRAM manufacturing solutions for foundry customers. The latter are still evaluating the tools
offered by multiple players.
• China has plans to develop MRAM as an embedded memory option for its future foundry business.
• Density improvements in stand-alone STT-MRAM (1 Gb chips are now in pilot production) and cost/bit reduction could enable
new markets in the long term.

8
STAND-ALONE MEMORIES - OVERVIEW
• In 2018, NAND and DRAM account for ~97% of the stand-
alone memory market (~$160B).
• The remaining ~3% of the market (~$XXB) consists of:
- Flash NOR (~$2.6B)
- EEPROM, EPROM, Mask PROM/ROM, etc. (~$1B)
- Volatile RAM (~$280M)
• Asynchronous SRAM
• Synchronous SRAM
- Non-Volatile RAM (~$420M)
• nvSRAM
• BBSRAM
• Ferroelectric RAM
- Stand-alone emerging NVMs (~$275M)

• Compared to NAND and DRAM, these markets are much

less volatile and relatively more stable. Stand-alone memory market 2018
(~$XXXB)

9
STAND-ALONE AND EMBEDDED MRAM APPLICATIONS
Key MRAM Applications
Stand-alone Embedded

Industry, Code/Data Storage “Working” Memory Cache Memory

transportation, Enterprise Storage Persistent Memory
(eFlash) (Slow SRAM) (SRAM, eDRAM)
and other

NVSRAM
MCU, ASSP, ASIC, SoC CMOS Image Sensors
Industrial Storage Accelerators Image memory buffer
NVDIMM CPU
automation Network Interface Cards Persistent Memory for Servers
Transport
2023+ IoT / Wearables Display Driver ICs
Aerospace Tcon, memory buffers
Medical
Mobile AP
Gaming General Purpose
Network & Solid State Drives 2023+
Write caching, journaling, logs,
Infrastructure data buffering and streams Edge AI accelerator chips
In memory computing
Automotive

Required Speed/Density Required Speed/Density

10
 STAND-ALONE MEMORY - TECHNOLOGY COMPARISON
2018 commercial products performance

Memory pricing position in 2018 ($/Gb)

Price ($/Gb) $1 000,00
5: best value 5
$100,00
0: worst value Data Storage
4
$10,00
3
$1,00
Price and
scalability are 2
$0,10

obstacles for 1 $0,01

NAND PCM DRAM NOR STT-MRAM RRAM
emerging Speed 0 Density (Gb)
memories to Density position in 2018 (Gb)
compete with 10000
DRAM and 1000
NAND 100
10
1
Working Memory
0,1
Endurance
0,01
0,001
NAND PCM DRAM NOR STT-MRAM RRAM NAND PCM DRAM NOR STT-MRAM RRAM

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STAND-ALONE STT-MRAM - ROADMAP
Chip density and technology node scaling - Comparison with DRAM
• STT-MRAM will target enterprise storage (SCM) applications for a long time before trying to substitute DRAM (not before 2022)

Stand-alone memory roadmap (Gb/die) Technology-node scaling (nm)

© Yole Development, July 2019

Density (Gb/chip)

Technology Node (nm)

© Yole Development, July 2019

2018 2019 2020 2021 2022 2023 2024 2018 2019 2020 2021 2022 2023 2024
DRAM 16 16 16 32 32 32 32 DRAM 15 15 13 13 13 11 11
STT-MRAM 0,256 1 1 4 4 8 8 STT-MRAM 40 28 28 22 22 16 16

DRAM scalability finally went two generations below 20nm!

 STT-MRAM must catch the DRAM running train…a big challenge!

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 EMBEDDED STT-MRAM - ROADMAP
Technology node evolution and embedded MRAM adoption

Technology-Node Scalng (nm)

© Yole Development, July 2019

eFlash Technology Node (nm)

substitution by
will be starting
in 2019, while
SRAM cache
eFlash / “slow” SRAM
applications will
begin in 2022 SRAM LL cache

2017 2018 2019 2020 2021 2022 2023 2024

SRAM 10 7 7 5 5 5 3 3
eFlash 40 28 28 28 28 22 22 22
eMRAM 40 28 22 22 22 14 14 14

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TECHNOLOGY ANALYSIS - COMPARISON WITH OTHER MEMORIES

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(STT-)MRAM KEY RESEARCH INSTITUTES AND LABORATORIES

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SUPPLY CHAIN MAPPING AND ANALYSIS

16
EMBEDDED STT-MRAM BUSINESS
Key partnerships and developments for the top players.
• The top foundry players are all preparing for 28/22nm embedded STT-MRAM. Intel has confirmed that its MRAM is now
achieving high yields making mass production viable.

Foundry / IDM (To be announced)

(STT-)MRAM
Players

CMOS bulk FD-SOI 22nm FD-SOI 28nm CMOS bulk CMOS 22nm
Technology
22nm planar planar planar 28/22nm planar FinFET 28/22nm
Process
(sampling) (sampling) (in mass production) (in development) (sampling)

Expected Short- eFlash eFlash

“Slow” SRAM eFlash “Slow” SRAM “Slow” SRAM
Term Application “Slow” SRAM “Slow” SRAM

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TIME-TO-MARKET FOR (STT-)MRAM PLAYERS
By applications, for leading players – fabless/IP/IDM (stand-alone) and foundry/IDM (embedded) players
Embedded Cache Memory
(SRAM, eDRAM) – Mobile AP
© Yole Development, July 2019

Embedded Cache Memory

Embedded

(SRAM, eDRAM) – High-End CPU

Embedded Memory (slow SRAM)

Embedded Data/Code Storage

(eFlash)

Persistent Memory (NVDIMM)

Stand-alone

Enterprise Storage (SCM)

Industrial, transportation and

other applications

2018 2019 2020 2021 2022 2023 2024

Entrance into the (STT-)MRAM market (commercial product availability)

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(STT-)MRAM MARKET FORECAST

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DENSITY AND PRICE EVOLUTION

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CHINA MRAM DEVELOPMENTS

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MRAM MANUFACTURING

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 YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
DRAM & NAND Service Status of the Memory
– Memory Research Industry 2019

Contact our
Sales Team
for more
information

Emerging Non-Volatile Memory Packaging Market

and Technology Report
Memory 2018 2017

©2019 | www.yole.fr | MRAM Technology and Business | Sample 23

 YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting

Contact our
Leading-edge 3D NAND
Sales Team Memory Comparison 2018
for more
information

©2019 | www.yole.fr | MRAM Technology and Business | Sample 24

MRAM TECHNOLOGY AND BUSINESS 2019
Market & Technology Report - August 2019
MRAM promises life beyond eFlash: the embedded MRAM market is taking off and is expected to
reach $1.2B by 2024.
KEY FEATURES
• Overview of the spectrum of
(STT-)MRAM technologies, along
with their manufacturing processes
and related technical/economic
challenges
• Description of three stand-alone
and three embedded (STT-)MRAM
applications
> Stand-alone:
- industrial, transportation,
defense and other applications
requiring low-density memory
chips
- enterprise storage, including
accelerators and SSD caching
- persistent memory such as
NVDIMM
> Embedded:
- code/data storage memory, as
an eFlash replacement
- working memory, or “slow”
SRAM, for ASSPs/ASICs such as
AI edge accelerators
- last-level cache memory, as
eDRAM/SRAM replacements,
in CPUs and mobile processors
• 2018-2024 market forecast for
stand-alone and embedded
applications in $US, Gb and
equivalents of 12’’ wafer starts
• Overview of the latest R&D
developments and next-generation
magnetic memories such as SOT-
MRAM and VC-MRAM
• Overview of potential applications
in the long term, including L1-L2
caching based on SOT-MRAM,
execute-in-place (XIP) memory such
as high-density NOR replacements
at 2Gb and above, and storage class
memory via STT-MRAM crosspoint
architectures
• Mapping of the embedded and
stand-alone MRAM supply chain
with key partnerships
• Analysis of the ecosystem’s maturity,
challenges and strengths and
description of the players’ activities
at different levels of the supply chain
• Presentation of the latest MRAM
developments within the growing
Chinese memory business
EMBEDDED MRAM IS PICKING UP STEAM THANKS TO THE STRONG
INVOLVEMENT OF TOP FOUNDRY/IDM PLAYERS AND EQUIPMENT SUPPLIERS
Nowadays, there is broad consensus in
the computer memory industry that the
28nm/22nm silicon lithography nodes will be
the last technology nodes for embedded Flash
(eFlash). This is not because of fundamental
scalability limitations, but because of economic
barriers. Therefore a new embedded non-
volatile memory (NVM) for code/data storage
is needed. At the same time, scaling of volatile
static random access memory (SRAM) is slowing
down due to cell footprint degradation occurring
at advanced nodes. A denser working embedded
memory would therefore be highly desirable.
Among various emerging NVM technologies,
spin transfer torque magnetoresistive RAM
(STT-MRAM) is gaining significant momentum. It
is poised to become the next embedded memory
solution for a variety of integrated circuit (IC)
products manufactured at the 28nm node and
below. That includes low-power wearables and
Internet-of-Things (IoT) devices, microcontroller
units (MCUs), automotive, imaging and display
ICs, edge artificial intelligence (AI) accelerators,
and other application specific ICs (ASICs) and
application specific standard parts (ASSPs).
In 2018, the embedded STT-MRAM market was
still limited, with no volume shipments. 2019 is
expected to be the year this market takes off.
Samsung has recently started mass production
of embedded STT-MRAM, and we expect other
major foundry/integrated device manufacturers
(IDMs) to enter the race soon. At the same
time, multiple equipment suppliers like Applied
Embedded memory technology trends & MRAM market evolution
Technology-node scaling roadmap for embedded memories
30
Technology node (nm)
20
code/data storage
working memory
10
0 2018 2021 2024
2018 2019 2020
SRAM eFlash
(Yole Développement, August 2019)
Materials, Tokyo Electron Limited (TEL), Canon,
and Lam Research, and logic companies like
Qualcomm, ARM and Synopsis are increasing
their research spending on MRAM. This is further
propelling the development of the embedded
STT-MRAM business. Thanks to the support
of a large number of leading companies, Yole
Développement analysts believe the embedded
memory market has the potential to reach $1.2B
by 2024, growing with a compound annual growth
rate over this period (CAGR2018-2024) of 295%.
On the other hand, the stand-alone memory
market is expected to grow less vigorously, with
a CAGR 2018-2024 of 54%, and will remain below
$600M in 2024. So far, the growth has been
driven by low-density (STT-)MRAM devices
at 16Mb and below manufactured by a few key
players, such as Everspin and Avalanche/Sony.
In coming years, the stand-alone market will be
mainly driven by enterprise storage applications.
These include solid state drive (SSD) caching and
storage/network accelerators, which are served
by high-density STT-MRAM chips at 256Mb
and above. The latter are typically sold to IDMs
and system makers in the enterprise storage
business. These companies require 12-18
months to develop new systems, so the ramp-up
of STT-MRAM sales has taken a relatively long
time. Notably, 1Gb 28nm devices from Everspin
have recently moved into the pilot-production
phase at GlobalFoundries. Their forthcoming
availability in the market could trigger further
growth of enterprise storage applications.
Expected MRAM market evolution
2 400
MRAM market in $B
1,5 300
Thousand wafers
1 200
LL caching 0,5 100
0 0
2021 2022 2023 2024
Stand-Alone Market (in $B)
eMRAM eMRAM applications
Embedded Market (in $B)
Total Wafer Production
 MRAM TECHNOLOGY AND BUSINESS 2019

EQUIPMENT SUPPLIERS ARE TACKLING THE CHALLENGES OF HIGH-VOLUME

MANUFACTURING OF STT-MRAM
STT-MRAM combines the best attributes of
conventional memory types in a single technology.
It features the speed of SRAM and the non-
volatility of eFlash with unlimited endurance. It can
be added to process flows for logic chips without
significant cost increase, offering a remarkable
density gain over SRAM, together with low power
consumption. However, a number of difficult
technical challenges need to be tackled to fully
exploit the potential of STT-MRAM and enable its
high-volume production. Fortunately, equipment
suppliers are working hard to solve such issues
and are offering new solutions enabling continuous
progress.
Critical (STT-)MRAM manufacturing challenges and key equipment
players*’ involvement towards high volume production
Deposition of MTJ stack
Goal: real-time property
monitoring
Etching MTJ pillars
Goal: high-density, narrow
pitch patterning
Testing and Metrology
Goal: high-speed measurement of
electrical and magnetics properties
The magnetic tunneling junction (MTJ) – the
fundamental element of the MRAM memory cell –
consists of a delicate multi-layer stack comprising
20-to-30 different layers, whose thickness must
be controlled with sub-nanometer precision. For
reliable MTJ production, deposition systems capable
of on-board monitoring of key material properties
are needed, such as the Endura® Clover™ MRAM
physical vapor deposition (PVD) tool recently
announced by Applied Materials. Furthermore, the
etch steps for patterning MRAM cells are among
the most challenging in the manufacturing process.
The CoFe and CoFeB layers used in the MTJ cannot
be etched with conventional reactive ion etch (RIE)
tools because such materials are not prone to form
volatile compounds with plasma gases. RIE could
also damage the stack. Hence, the industry has to
implement suitable ion-beam etching techniques
and optimize them to avoid the re-deposition of
byproducts. For instance, Lam Research and TEL
have developed chemically-enhanced ion beam
etching tools.
Last but not least, metrology and testing are also
critical steps and cannot be overlooked. They have
to be performed multiple times during the device
fabrication process to assess the material/device
response to electrical and magnetic stimuli. Also in
this framework, there are companies developing ad
hoc solutions for fast measurements on wafers, as
well as packaged devices.

(Yole Développement, August 2019) *Non-exhaustive list of companies

EVERSPIN IS THE CLEAR LEADER IN THE STAND-ALONE MARKET. THE

COMPETITION IS GETTING FIERCER IN THE EMBEDDED MRAM BUSINESS
Everspin is the clear leader of the stand-alone (STT-) MRAM for the enterprise storage market. Avalanche
MRAM market. It is the only supplier of toggle has started shipping stand-alone STT-MRAM parts
MRAM at 16Mb and below for applications requiring from 1-32Mb, manufactured at Sony using 40nm
high reliability, such as industrial, transportation, lithographic processes. It is targeting the NVSRAM
defence and medical markets, which have for long market, partially challenging Everspin’s Toggle
been served by non-volatile SRAM (NVSRAM). It MRAM.
is also the only player supplying high-density STT- In the embedded business, foundry/IDM activities
are advancing at a fast pace. Samsung is now in
Key partnerships* within the embedded MRAM ecosystems mass production on 28nm Fully Depleted Silicon
On Insulator (FDSOI). Intel, after working silently
T
( o be on MRAM for several years, recently confirmed
Foundry / announced
IDM that its embedded MRAM, which uses a 22nm
FinFET architecture, is ready for production. At
Partnership
the same time, TSMC is sampling on 22nm planar
(STT-)
MRAM
bulk silicon. Also, Gyrfalcon’s MRAM-based AI
players chips, manufactured at TSMC, should enter volume
production by mid-2020. GlobalFoundries will enter
CMOS bulk FD-SOI FD-SOI CMOS bulk CMOS the market with embedded MRAM for replacing
Technology 22nm 22nm 28nm 28/22nm 22nm eFlash on 22nm FDSOI, and is working on an SRAM-
28/22nm
process planar planar planar planar FinFET
(sampling) (sampling) (in mass (in (sampling) like version for the subsequent 12nm FDSOI node.
production) development)
Seemingly, Intel is targeting eFlash replacement.
Expected eFlash eFlash Samsung and TSMC seem to be focusing primarily
short-term “Slow” eFlash “Slow” “Slow” “Slow” “Slow” on embedded MRAM for replacing SRAM in
application SRAM SRAM SRAM SRAM SRAM
applications where performance is not a priority.
*Non-exhaustive list of companies They are expected to enter the market with a “slow
(Yole Développement, August 2019) SRAM” implementation.
 MARKET & TECHNOLOGY REPORT

The overall MRAM ecosystem appears well
developed and multiple companies, like NXP
and Sony, are ready to adopt embedded MRAM
in their IC products. We expect that 2019 will
be the year of the MRAM market take off.
The new “MRAM Technology and Business”
report by Yole Développement provides
an overview of embedded and stand-alone
memory technologies. It details the market
evolution for each application, the competitive
landscape, the players’ dynamics, the challenges
and the strategies in moving towards mass
adoption of (STT-)MRAM.

REPORT OBJECTIVES
AUTHORS
• Present an overview of the semiconductor memory industry with market insights and trends for Simone Bertolazzi, PhD is a Technology
different stand-alone and embedded technologies. & Market analyst at Yole Développement
• Analyze embedded and stand-alone MRAM applications including: total addressable markets, (Yole) working with the Semiconductor &
roadmaps, market drivers, challenges and players’ objectives. Software division. He is member of the Yole’s
• Describe established and newly emerging magnetic memory technologies including: working principles, memory team and he contributes on a day-
manufacturing methods, advantages and limitations, average selling price and time-to-market. to-day basis to the analysis of nonvolatile
• Outline the latest activities for each key market player, as well as the current product development status. memory technologies, their related materials
• Provide roadmaps with technological nodes, chip density and price evolution. and fabrication processes. Previously, Simone
• Analyze the MRAM ecosystems and its competitive landscape: carried out experimental research in the field
of nanoscience and nanotechnology, focusing
> Mapping of the entire supply chain
on emerging semiconducting materials and
> Recent acquisitions, partnerships and funding their opto-electronic device applications. He
> Latest company news (co-) authored more than 15 papers in high-
impact scientific journals and was awarded
COMPANIES MONITORED IN THE PRODUCT the prestigious Marie Curie Intra-European
A*STAR, Advantest, Aeroflex, Antaios, Applied Materials, Avalanche, Canon, Capres-KLA, Fellowship. Simone obtained a PhD in
CEA Leti, CNE, Crocus, CXMT, Cypress, Despatch, Dow, Evaderis, Evatec, Everspin, JHICC, physics in 2015 from École Polytechnique
GlobalFoundries, H-Grace, HFC Semiconductor, Hikstor, Hitachi, Honeywell, HP, Hprobe, Fédérale de Lausanne (Switzerland), where
Huawei, IBM, Imec, Infineon, Intermolecular, Inston, Intel, ITRI, Lam Research, Macronix, he developed novel flash memory cells based
Maxim, Materion, Mediatek, Merk, Microchip, Micron, MicroSense Mythic, Nantero, Nanya, on heterostructures of two-dimensional
National Tsing Hua University, Nokia, Numen, NVE Corporation, NXP, OHT, Panasonic, materials and high-k dielectrics. Simone
Qualcomm, Quantum, Reliance, Renesas, Samsung, SanDisk, Seagate, SK Hynix, Shanghai Ciyu, earned a double M. A. Sc. degree from
SilTerra, Singulus, Smart Modular Technologies, SmartTip, SMIC, Sony, Spin Memory, Spintec, Polytechnique de Montréal (Canada) and
STMicroelectronics, Stanford University, Synopsis, Syntiant, TDK, TEL, TEL Magnetic Solutions, Politecnico di Milano (Italy), graduating cum
Teledyne e2v, Tezzaron, Tohoku University, Toshiba, Towerjazz, Tsinghua Unigroup , TSMC, laude.
UMC, Veeco, Western Digital, Winbond, XFab, XMC, YMTC, and more...

TABLE OF CONTENTS (complete content on i-Micronews.com)

Introduction 7 > E mbedded memory (slow SRAM) – Low-power
Noteworthy MRAM news 2017-2019 19 memory for ASICS/ASSP chips
> E mbedded cache memory (SRAM, eDRAM) –
Context - Overview of the memory business 65
Fast memory for high-level caching in CPU and
> Stand-alone memory – NAND, DRAM, NOR,
mobile processors
(NV)SRAM
> Embedded memory – eFlash, eDRAM, SRAM Long-term potential applications 180
> E merging non-volatile memories – MRAM, PCM,
MRAM supply chain and player dynamics 184 Emilie Jolivet is Director of the
RRAM, etc. Semiconductor & Software Division at Yole
Overview of MRAM applications and market > Supply chain analysis
Développement, part of Yole Group of
trends 107 > MRAM players and activities
Companies, where her specific interests
Market forecast and financial analysis 114 > Mergers and acquisitions, partnerships and funding
cover package & assembly, semiconductor
Stand-alone MRAM applications and market China MRAM development 223 manufacturing, memory and software &
trends 124
Technology description and trends 231 computing fields. Based on her valuable
> Industrial, transportation and other (NVSRAM) experience in the semiconductor industry,
> MRAM technologies
> E nterprise storage – SSD caching and storage Emilie manages the expansion of the technical
> MRAM manufacturing
accelerators and market expertise of the Semiconductor
> Next-generation magnetic memories (SOT- and
> Persistent memory (NVDIMM) and Software Team. The team interacts
Embedded MRAM applications and market VC-MRAM)
daily with leading companies allowing
trends 148 Summary and conclusions 264
semiconductor & software analysts to
> E mbedded storage (eFlash) – Code/data storage
in MCUs and other ASICS/ASSP chips Yole Développement’s presentation 271 collect a large amount of data and integrate
their understanding of the evolution of the
RELATED REPORTS market with technology breakthroughs. In
addition, Emilie’s mission focusses on the
Benefit from our Bundle & Annual Subscription offers and access our analyses at the best available management of business relationships with
price and with great advantages semiconductor leaders and the development
• Status of the Memory Industry 2019 of market research and strategy consulting
• Memory Packaging Market and Technology activities inside the Yole group. Emilie Jolivet
Trends 2017 holds a Master’s degree in Applied Physics
• NAND and DRAM Memory Research specializing in Microelectronics from INSA
Service – Monitor (Toulouse, France).
• Leading-edge 3D NAND Memory
Comparison 2018 - Reverse Costing® –
Structure, Process & Cost Report by System
Plus Consulting
Find all our reports on www.i-micronews.com
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ABOUT YOLE DEVELOPPEMENT

Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 120 collaborators worldwide covering MEMS and image
sensors, Compound semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging,
Manufacturing, Power Electronics, Batteries & Energy Management and Memory.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO, KnowMade and Blumorpho, supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow
technology trends to grow their business.
CONSULTING AND ANALYSIS REPORTS
• Market data & research, marketing analysis • Market & technology reports
• Technology analysis • Patent investigation and patent infringement risk analysis
• Strategy consulting • Structure, process and cost analysis and teardowns
• Reverse engineering & costing • Cost simulation tool
• Patent analysis More information on www.i-micronews.com/reports
• Design and characterization of innovative optical systems
• Financial services (due diligence, M&A with our partner)
More information on www.yole.fr CONTACTS
For more information about :
MEDIA & EVENTS • Consulting & Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• i-Micronews.com website, application & related e-newsletter • Reports & Monitors: David Jourdan (jourdan@yole.fr) & Fayçal Khamassi
• Communication & webcast services (khamassi@yole.fr)
• Events: TechDays, forums… • Marketing & Communication: Camille Veyrier (veyrier@yole.fr)
More information on www.i-Micronews.com • Public Relations: Sandrine Leroy (leroy@yole.fr)
Source: Wikimedia Commons

Yole Développement
From Technologies to Market

© 2019
 YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE

Life Sciences Semiconductor Semiconductor

& Healthcare & Software & Software
o Microfluidics o Package,Assembly & Substrates
o BioMEMS & Medical Microsystems o Semiconductor Manufacturing
o Inkjet and accurate dispensing o Memory
o Solid-State Medical Imaging & BioPhotonics o Software & Computing
o BioTechnologies
Life Photonics,
Sciences & Sensing
Healthcare
& Display

Power Photonics,
& Wireless Sensing & Display
o RF Devices & Technologies o Solid-State Lighting
o Compound Semiconductors & Emerging Materials Power & Wireless o Display
o Power Electronics o MEMS, Sensors & Actuators
o Batteries & Energy Management o Imaging
o Photonics & Optoelectronics

About Yole
©2019 Développement
| www.yole.fr | About| Yole
www.yole.fr | ©2019
Développement 26
 4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,
marketing analysis
• Technology analysis
o Syndicated reports
• Strategy consulting
• Market & technology reports
• Reverse engineering & costing
• Patent investigation and patent
• Patent analysis
infringement risk analysis o Monitors
• Design and characterization
• Teardowns & reverse costing • Monthly and quarterly update
of innovative optical systems
analysis • Excel database covering supply,
• Financial services (due
• Cost simulation tool demand, and technology
diligence, M&A with our o Media
www.i-Micronews.com/reports • Price, market, demand and
partner)
production forecasts • i-Micronews.com website and
www.yole.fr application
• Supplier market shares
• i-Micronews e-newsletter
• Communication & webcast
www.i-Micronews.com/reports
services
• Events: TechDays, forums,…
www.i-Micronews.com

About Yole
©2019 Développement
| www.yole.fr | About| Yole
www.yole.fr | ©2019
Développement 27
6 COMPANIES TO SERVE YOUR BUSINESS
Yole Group of Companies

Market, technology and strategy Manufacturing costs analysis IP analysis

consulting Teardown and reverse engineering Patent assessment
Cost simulation tools
www.yole.fr www.knowmade.fr
www.systemplus.fr

Design and characterization of

Innovation and business maker Due diligence
innovative optical systems
www.bmorpho.com www.yole.fr
www.piseo.fr

About Yole
©2019 Développement
| www.yole.fr | About| Yole
www.yole.fr | ©2019
Développement 28
OUR GLOBAL ACTIVITY
Yole Deutschland
Frankfurt

Paris

Nantes
Yole Korea
HQ in Lyon
Seoul Yole Inc.
Vénissieux
Cornelius
Yole Japan
Tokyo
Nice Palo Alto

40%
Greater
China office
Hsinchu

of our business
30%
30%
of our business

of our business

About Yole Développement | www.yole.fr | ©2019 29

ANALYSIS SERVICES - CONTENT COMPARISON
High

Technology
and Market
Report
Breadth of the analysis
Leadership
Meeting

Q&A Meet the Custom

Service Analyst Analysis

Low

Depth of the analysis ©2019

High
About Yole Développement
| www.yole.fr | About| Yole
www.yole.fr | ©2019
Développement 30
 SERVING THE ENTIRE SUPPLY CHAIN

Integrators, end-
users and software
developers

Our analysts Device manufacturers

provide
market
analysis,
technology
evaluation, Suppliers: material,
and business
plans along
equipment, OSAT, foundries…
the entire
supply chain

Financial investors, R&D centers

About Yole
©2019 Développement
| www.yole.fr | About| Yole
www.yole.fr | ©2019
Développement 31
 SERVING MULTIPLE INDUSTRIAL FIELDS

Industrial Medical
We work and defense systems
across
multiples
industries to
understand Energy
the impact of management Automotive
More-than-
Moore
technologies
from device Mobile phone
to system Transportation and
makers consumer
electronics
From A to Z…

About Yole
©2019 Développement
| www.yole.fr | About| Yole
www.yole.fr | ©2019
Développement 32
REPORTS COLLECTION
o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now
provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as
intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports,
10 new monitors and 120 teardowns. Combining respective expertise and methodologies from the three companies, they cover:

• MEMS & Sensors • Power electronics

• RF devices & technologies • Compound semiconductors
• Medical technologies • Solid state lighting
• Semiconductor Manufacturing • Displays
• Advanced packaging • Software
• Memory • Imaging
• Batteries and energy management • Photonics
o If you are looking for:
• An analysis of your product market and technology
• A review of how your competitors are evolving
• An understanding of your manufacturing and production costs
• An understanding of your industry’s technology roadmap and related IPs
• A clear view supply chain evolution
Our reports and monitors are for you!
www.i-Micronews.com
o Our team of over 70 analysts, including PhD and MBA qualified industry veterans from Yole Développement, System Plus Consulting and KnowMade, collect information,
identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’s
landscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the main
players of their industries and realized more than 5,000 interviews per year.
WHAT TO EXPECT IN 2019?
In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also building
on and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software and
hardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Last but not least,
System Plus Consulting is developing its teardowns service providing 120+ offers related to phones, smart home, wearables and connected devices. Discover our 2019
program right now, and ensure you get a true vision of the industry. Stay tuned!

About Yole Développement | www.yole.fr | ©2019 33

OUR 2019 REPORTS COLLECTION (1/4)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

Market – Technology – Strategy – by Yole Développement

Yole Développement (Yole) offers market reports including quantitative market forecasts,
technology trends, company strategy evaluation and indepth application analyses. Yole will The markets targeted are :
publish more than 55 reports in 2019, with our partner PISEO contributing to some of
the lighting reports. • Mobile & Consumer
Reverse Costing® – Structure, Process and Cost Analysis – by • Automotive & Transportation
System Plus Consulting
The Reverse Costing® report developed by System Plus Consulting provides full • Medical
teardowns, including detailed photos, precise measurements, material analyses,
manufacturing process flows, supply chain evaluations, manufacturing cost analyses and • Industrial
selling price estimations. The reports listed below are comparisons of several analyzed
components from System Plus Consulting. More reports are however available, and over
60 reports will be released in 2019.The complete list is available at www.systemplus.fr.
• Telecom & Infrastructure

Patent Reports – by KnowMade • Defense & Aerospace

More than describing the status of the IP situation, these analyses provide a missing link
between patented technologies and market, technological and business trends. They offer
• Linked reports are dealing with the same topic to provide
an understanding of the competitive landscape and technology developments from a
patent perspective. They include key insights into key IP players, key patents and future
• a more detailed analysis.
technology trends. For 2019 KnowMade will release over 15 reports.

About Yole Développement | www.yole.fr | ©2019 34

OUR 2019 REPORTS COLLECTION (1/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
MEMS & SENSORS RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Status of the MEMS Industry 2019 - Update • RF GaN Market: Applications, Players, Technology,
• Status of the Audio Industry 2019 - New and Substrates 2019 - Update
• Uncooled Infrared Imagers and Detectors 2019 – Update • 5G’s Impact on RF Front-End Module and Connectivity
• Consumer Biometrics:Technologies and Market Trends 2018 for Cell Phones 2019 – Update
• MEMS Pressure Sensor Market and Technologies 2018 • 5G Impact on Telecom Infrastructure 2019 - New
• Gas & Particle Sensors 2018 • Radar and Wireless for Automotive: Market and Technology
Trends 2019 - Update
o STRUCTURE, PROCESS & COST REPORT
• Passive & Active Antenna Systems for Telecom
• MEMS & Sensors Comparison 2019
Infrastructure 2019 - New
• MEMS Pressure Sensor Comparison 2018
• RF Standards and Technologies for Connected Objects 2018
• Particle Sensors Comparison 2019
o STRUCTURE, PROCESS & COST REPORT
• Miniaturized Gas Sensors Comparison 2018
o PATENT REPORT • RF Front-End Module Comparison 2019 - Update
• Automotive Radar RF Chipset Comparison 2018
• MEMS Foundry Business Portfolio 2019 - New
o PATENT REPORT
• Miniaturized Gas Sensors 2019 - New
• Antenna for 5G Wireless Communications 2019 - New
PHOTONIC AND OPTOELECTRONICS • RF Front End Modules for Cellphones 2018
o MARKET AND TECHNOLOGY REPORT • RF Filter for 5G Wireless Communications: Materials and Technologies 2019
• Silicon Photonics and Photonic Integrated Circuits 2019 • RF GaN 2019 – Patent Landscape Analysis
• LiDARs for Automotive and Industrial Applications 2019 - Update
o PATENT REPORT
• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New
• LiDAR for Automotive 2018

Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019 35
OUR 2019 REPORTS COLLECTION (2/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

IMAGING MICROFLUIDICS
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Status of the CIS Industry 2019: Technology • Status of the Microfluidics Industry 2019 - Update
and Foundry Business - Update • Next Generation Sequencing & DNA Synthesis - Technology,
• Imaging for Automotive 2019 - Update Consumables Manufacturing and Market Trends 2019 - New
• Neuromorphic Technologies for Sensing 2019 - Update • Organ-on-a-Chip Market & Technology Landscape 2019 - Update
• Status of the CCM and WLO Industry 2019 – Update • Point-of-Need Testing Application of Microfluidic Technologies 2018
• 3D Imaging & Sensing 2018 • Liquid Biopsy: from Isolation to Downstream Applications 2018
• Machine Vision for Industry and Automation 2018 • Chinese Microfluidics Industry 2018
• Sensors for Robotic Vehicles 2018 o PATENT REPORT
o STRUCTURE, PROCESS & COST REPORT • Microfluidic Manufacturing Technologies 2019 – New
• Compact Camera Modules Comparison 2019 • Nanopore Sequencing 2019 - New
• CMOS Image Sensors Comparison 2019
o PATENT REPORT INKJET AND ACCURATE DISPENSING
• Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New o MARKET AND TECHNOLOGY REPORT
• Apple iPhone X Proximity Sensor & Flood Illuminator 2018 • Inkjet Printheads - Dispensing Technologies
& Market Landscape 2019 - Update
MEDICAL IMAGING AND BIOPHOTONICS • Emerging Printing Technologies
o MARKET AND TECHNOLOGY REPORT for Microsystem Manufacturing 2019 - New
• X-Ray Detectors for Medical, Industrial • Piezoelectric Devices from Bulk to Thin Film 2019 - New
and Security Applications 2019- New • Inkjet Functional and Additive Manufacturing for Electronics 2018
• Microscopy Life Science Cameras: Market and Technology Analysis 2019 o STRUCTURE, PROCESS & COST REPORT
• Ultrasound technologies for Medical, Industrial • Piezoelectric Materials from Bulk to Thin Film Comparison 2019
and Consumer Applications 2018
o PATENT REPORT
• Optical Coherence Tomography Medical Imaging 2018

Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019 36
OUR 2019 REPORTS COLLECTION (3/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
BIOTECHNOLOGIES MEMORY
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• CRISPR-Cas9 Technology: From Lab to Industries 2018 • Status of the Memory Industry 2019 - New
o PATENT REPORT • MRAM Technology and Business 2019 - New
• Personalized Medicine 2019 – New • Emerging Non Volatile Memory 2018
o STRUCTURE, PROCESS & COST REPORT
BIOMEMS & MEDICAL MICROSYSTEMS • Memory Comparison 2019
o MARKET AND TECHNOLOGY REPORT o PATENT REPORT
• Medical Wearables: Market & Technology Analysis 2019 - New • Magnetoresistive Random-Access Memory (MRAM) 2019 - New
• Neurotechnologies and Brain Computer Interface 2018 • 3D Non-Volatile Memory 2018
• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences
& Healthcare 2018 ADVANCED PACKAGING
o PATENT REPORT
o MARKET AND TECHNOLOGY REPORT
• 3D Cell Printing 2019 - New • Fan Out Packaging Technologies and Market Trends 2019 - Update
• Circulating Tumor Cells Isolation 2019 - New • 3D TSV Integration and Monolithic Business Update 2019 - Update
• Advanced RF SiP for Cellphones 2019 - Update
SOFTWARE AND COMPUTING • Status of the Advanced Packaging Industry 2019 - Update
o MARKET AND TECHNOLOGY REPORT • Status of the Advanced Substrates 2019 - Update
• Artificial Intelligence Computing For Automotive 2019 - New
• Panel Level Packaging Trends 2019 - Update
• Hardware and Software for Artificial Intelligence (AI)
• Automotive Packaging Market & Technology Trends 2019 - New
in Consumer Applications 2019 - Update
• Trends in Automotive Packaging 2018
• Image Signal Processor and Vision Processor Market
• Thin-Film Integrated Passive Devices 2018
and Technology Trends 2019
o STRUCTURE, PROCESS & COST REPORT
• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC
and Gaming 2019 – New • Advanced RF SiP for Cellphones Comparison 2019
o PATENT REPORT
• Artificial Intelligence for Medical Diagnostics - New
Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019 37
OUR 2019 REPORTS COLLECTION (4/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
SEMICONDUCTOR MANUFACTURING SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Nano-Imprint Technology Trends for Semiconductor • Status of the Solid State Light Source Industry 2019 - New
Applications 2019 - New • Edge Emitting Lasers (EELS) 2019 - New
• Equipment and Materials for Fan Out Packaging 2019 - Update • Light Shaping Technologies 2019 - New
• Equipment for More than Moore: Thin Film Deposition • Automotive Advanced Front Lighting Systems 2019 - New
& Etching 2019 - New • VCSELs – Market and Technology Trends 2019 - Update
• Wafer Starts for More Than Moore Applications 2018 • IR LEDs and Laser Diodes – Technology, Applications,
• Polymeric Materials at Wafer-Level and Industry Trends 2018
for Advanced Packaging 2018 • Automotive Lighting 2018: Technology, Industry and Market Trends
• Bonding and Lithography Equipment Market • UV LEDs - Technology, Manufacturing and Application Trends 2018
for More than Moore Devices 2018 • LiFi: Technology, Industry and Market Trends 2018
o STRUCTURE, PROCESS & COST REPORT o STRUCTURE, PROCESS & COST REPORT
• Wafer Bonding Comparison 2018 • VCSEL Comparison 2019
o PATENT REPORT o PATENT REPORT
• Hybrid Bonding for 3D Stack 2019 – New • VCSELs 2018

DISPLAY
o MARKET AND TECHNOLOGY REPORT
• Next Generation 3D Displays 2019 - New
• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New
• Micro-and Mini-LED Displays 2019 - Update
• Next Generation TV Panels: New Technologies, Features and
Market Impact 2019
• Displays & Optical Vision Systems for VR, AR & MR 2018
o PATENT REPORT
• MicroLED Displays : Intellectual Property Landscape 2018
Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019 38
OUR 2019 REPORTS COLLECTION (5/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
POWER ELECTRONICS BATTERY & ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Power SiC: Materials, Devices and Applications 2019 - Update • Status of the Rechargeable Li-ion Battery Industry 2019 - New
• Power Electronics for EV/HEV and e-mobility: • Li-ion Battery Packs for Automotive and Stationary Storage
Market, Innovations and Trends 2019 - Update Applications 2019 - Update
• Status of the Power Electronics Industry 2019 - Update o PATENT REPORT
• Discrete Power Packaging : Material Market • Battery Energy Density Increase: Materials
and Technology Trends 2019 - New and Emerging Technologies 2019 - New
• Status of the Power ICs Industry 2019 - Update • Solid-State Batteries 2019 - New
• Status of the Passive Components for the Power Electronics • Status of the Battery Patents 2018
Industry 2019 - Update
• Status of the Inverter Industry 2019 - Update COMPOUND SEMI.
• Status of the Power Module Packaging Industry 2019 - Update o MARKET AND TECHNOLOGY REPORT
• Wireless Charging Market Expectations • Emerging Semiconductor Substrates:
and Technology Trends 2018 Market & Technology Trends 2019- New
• Power GaN 2018: Epitaxy, Devices, Applications • Status of the Compound Semiconductor Industry 2019 - New
and Technology Trends • InP Materials, Devices and Applications 2019 - New
o STRUCTURE, PROCESS & COST REPORT • GaAs Wafer and Epiwafer Market: RF, Photonics,
• Automotive Power Module Packaging Comparison 2018 LED and PV Applications 2018
• GaN-on-Silicon Transistor Comparison 2019 o PATENT REPORT
• SiC Transistor Comparison 2019 • GaN-on-Silicon Substrate: Materials, Devices
o PATENT REPORT and Applications 2019 - Update
• Power SiC : Materials, Devices and Modules 2019 - New
• Power GaN : Materials, Devices and Modules 2019 – Update

Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019 39
OUR 2019 MONITORS COLLECTION (1/2)
Get the most updated overview of your market to monitor your strategy
Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to
provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can
benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.
Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.

MARKET MONITOR by Yole Développement o COMPOUND SEMI. – NEW

This monitor will describe how the compound semiconductor industry is evolving. It
A FULL PACKAGE: will offer a close look at GaAs, InP, SiC, GaN and other compounds of interest
The monitors will provide the evolution of the market in units, wafer area and revenues. providing wafer volumes, revenues, application breakdowns and momentum.
They will also offer insights into what is driving the business and a close look at what is Frequency: Quarterly, starting from Q3 2019
happening will also be covered in it.
o CAMERA MODULE – NEW
The following deliverables will be included in the monitors: This monitor will provide the evolution of the imaging industry, with a close look at
• An Excel database with all historical and forecast data image sensor, camera module, lens and VCM. Volumes, revenues and momentum of
companies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.
• A PDF slide deck with graphs and comments/analyses covering the expected Frequency: Quarterly, starting from Q3 2019
evolutions
o MEMORY – UPDATE
o ADVANCED PACKAGING – NEW For the memory industry you can have access to a quaterly monitor, as well as an
This monitor will provide the evolution of the advanced packaging platforms. It will additional service, a monthly pricing. Both services can be bought seprately:
cover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),
• DRAM Service: Including a quarterly monitor and monthly pricing.
Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5D
and 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q3 • NAND Service: Including a quarterly monitor and monthly pricing.
2019

REVERSE TECHNOLOGY MONITOR by System Plus Consulting

o SMARTPHONES – NEW
To stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone Reverse
Technology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at the
beginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.

About Yole Développement | www.yole.fr | ©2019 40

OUR 2019 MONITORS COLLECTION (2/2)
Get the most updated overview of your market to monitor your strategy
PATENT MONITOR by KnowMade o Li-ion Batteries
Anodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made of
A FULL PACKAGE: Lithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium Nickel
Starting at the beginning of the year, the KnowMade monitors include the following Cobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), Lithium
deliverables: Metal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytes
including liquid, polymer/gel, and solid inorganics; ceramic and other separators;
• An Excel file including the monthly IP database of: battery cells including thin film/microbattery, flexible, cylindrical and prismatic; and
• New patent applications battery packs and systems.
• Newly granted patents o Post Li-ion Batteries
• Expired or abandoned patents Battery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-
• Transfer of IP rights through re-assignment and licensing air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,
• Patent litigation and opposition battery cells and battery packs/systems.

• Quarterly report including a PDF slide deck with the key facts & figures of the
quarter: IP trends over the three last months, with a close look to key IP players and
key patented technologies.
o GaN for Power & RF Electronics
Wafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductor
devices such as transistors, and diodes, devices and applications including converters,
rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits
(MMICs), packaging, modules and systems.
o GaN for Optoelectronics & Photonics
Wafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices such
as LEDs and lasers; and applications including lighting, display, visible communication,
photonics, packaging, modules and systems.
o Solid-State Batteries
Supply chain including electrodes, battery cells, battery packs/systems and
electrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,
including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,
sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.
o RF Acoustic Wave Filters
Including Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, Bulk
Acoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-
Mounted Resonator (BAW-SMR), and Packaging.
o RF Power Amplifiers
Including Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wave
technology.
o RF Front-End Modules
o Microfluidics
From components to chips and systems, including all applications.

About Yole Développement | www.yole.fr | ©2019 41

I-MICRONEWS MEDIA
To meet the growing demand for market, ONLINE
technological and business information,
i-Micronews Media integrates several tools i-Micronews e-newsletter
i-Micronews.com
able to reach each individual contact within its FreeFullPDF.com
network.
Brand visibility, networking
We will ensure your company benefits from
Unique, cost-effective ways
this to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
increasing your brand/product
#15,800+ monthly unique visitors
on i-Micronews.com
#7+ key events planned for 2019
#10,900+ weekly readers
of i-Micronews e-newsletter
Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Director
ONSITE
Events
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
visibility.
#110 attendees on average
on different topics
About Yole Développement | www.yole.fr | ©2019
INPERSON
Webcasts
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience. Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
#380 registrants per webcast on
average to gain new leads for
your business
42
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US & Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Chris Youman, Senior Sales Director for Eastern US & Canada
Email: chris.youman@yole.fr – +1 919 607 9839
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager, Asia Business Development
(India & ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Ohtake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan & Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Korea: Peter Ok, Business Development Director
Email: peter.ok@yole.fr - +82 10 4089 0233
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership with Woodside Capital
Partners)
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar, Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• Camille Veyrier, Director, Marketing & Communication
Email: veyrier@yole.fr - +33 472 83 01 01
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: info@yole.fr - +33 4 72 83 01 80
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