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Keywords: The cooling capacity of the mini-channel heat sink can be increased by making the flow distribution uniform
Heat sink through all the parallel mini-channels. The present study proposes a minichannel heat sink with modified novel
Maldistribution factor inlet/outlet arrangement with different flow inlet angle such as (θ = 90°, θ = 105°, and θ = 120°) for better flow
Header distribution and heat transfer performance. This proposed minichannel heat sink has been analyzed numerically
Thermal resistance
with the help of ANSYS-Fluent. Water is used as a working fluid and aluminum is selected as a heat sink material.
Flow inlet angle
Total 28 numbers of parallel mini channels are considered having the hydraulic diameter of 1.5 mm. It is found
that flow distribution changes with this flow inlet angle and minimum flow maldistribution is observed for
proposed inlet/outlet arrangement with θ = 105° and results in better and uniform cooling of the heat sink.
Further increment in flow inlet angle increases the non-uniformity of flow. The thermal performance also has
been found best for θ = 105° and the value of maximum base temperature was also lowest for this configuration.
It is suggested that the performance of mini channel heat sink can be improved if coolant enters the distributor
header with flow inlet angle θ = 105° and exit from the middle of the collector header.
∗
Corresponding author.
E-mail address: pawan@iitism.ac.in (P.K. Singh).
https://doi.org/10.1016/j.ijthermalsci.2019.01.014
Received 20 February 2018; Received in revised form 11 January 2019; Accepted 13 January 2019
Available online 21 January 2019
1290-0729/ © 2019 Elsevier Masson SAS. All rights reserved.
S. Kumar, P.K. Singh International Journal of Thermal Sciences 138 (2019) 504–511
Fig. 1. (a) Mini-channel heat sink (b) Conventional inlet/outlet arrangement with rectangular headers (c) Proposed inlet/outlet arrangement with rectangular
headers.
header). It is found that flow distribution is better for I-type and poor with the smallest channel width is proven to have the best heat transfer
for Z-type. Among rectangular, trapezoidal and triangular headers, it is performance. Yang et al. [15] developed an optimization process for the
found that uniform flow distribution has been achieved with a rectan- flow and thermal performance of micro/mini-channel heat sink using
gular header. Siva et al. [8] carried out an experimental study on flow water and liquid metal cooling. They found that liquid metal based
maldistribution and its effect on the thermal performance of parallel minichannel heat sink has better thermal performance. Pistoresi et al.
microchannel cooling systems. Experimental results show that flow [16] numerically analyzed that flow maldistribution can be minimized
distribution among the channel improves with decrease in hydraulic by changing the angle of a triangular header and decreasing the number
diameter due to higher pressure drop. Chein and Chen [9] performed a of channels. Hao et al. [17] carried out a numerical analysis to in-
numerical study of the inlet/outlet arrangement effect on microchannel vestigate the flow distribution and heat transfer of a U-type parallel
heat sink performance and found that because of velocity mal- heat sink. They found that the flow distribution is not only a function of
distribution, the flow rate in each heat sink channel is different. As a the flow condition but also the geometric size of the header. Mu et al.
result, temperature non-uniformity is more serious in the heat sink with [18] analyzed temperature uniformity in a novel mini-channel heat sink
horizontally fluid supply and collection as compared to vertically fluid numerically. They found that the temperature uniformity and thermal
supply. Nielsen et al. [10] found that the degradation of the perfor- resistance are highly dependent on flow distribution. Cho et al. [19,20]
mance of microchannel heat exchangers is due to flow maldistribution. experimentally and numerically investigated the effects of channel and
Liu and Yu [11] performed a numerical study on performances of the header geometry under non-uniform heat flux condition.
mini-channel heat sink with non-uniform inlet baffles and found that Literature review suggests that plenty of research has been carried
flow distribution in channels is more uniform with non-uniform inlet out on flow maldistribution and it can be concluded that the perfor-
baffles. Jajja et al. [12] and Saeed and Kim [13] performed an ex- mance of water-cooled minichannel heat sink is affected by flow mal-
perimental and numerical study respectively to investigate the sys- distribution. Different parameters such as header design, flow inlet
tematic effect of heat sink geometry (by reducing fin spacing) with condition, flow and fluid properties all are important parameters, which
water as cooling fluid on the microprocessor base temperature and can affect the flow maldistribution. Flow maldistribution in mini-
found that the fin spacing has a significant effect on heat transfer. Luo channel heat sink can be minimized either by proper header design [6]
and Liu [14] performed an experimental and numerical study on the or by changing inlet and outlet positions of distributor and collector
working performance of mini-channel heat exchangers with different header [9] respectively. It can be inferred here that changing in flow
channel widths using liquid metal as a coolant. Based on the result, it is condition will be a better alternative than changing the heat sink geo-
found that the mean heat transfer coefficients for heat exchangers in- metry (straight, triangular, wavy etc.) because changing the heat sink
crease as the mass flow rate of coolant increases, and the exchanger geometry increases the fabrication cost of the heat sink. In the present
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S. Kumar, P.K. Singh International Journal of Thermal Sciences 138 (2019) 504–511
study, a novel approach of changing flow inlet angle at the inlet of Table 1
distributor header has been proposed to take the advantage of direc- Geometrical parameters of the mini-channel heat sink.
tional inertia. The computational study is performed using a full do- Parameter Value
main simulation approach to include the edge effect. The result will
show that a careful optimization of flow inlet condition can sig- Heat sink length, Lhs 47 mm
Heat sink width, Whs 55 mm
nificantly reduce the flow maldistribution.
Channel length, lch 45 mm
Channel width, wch 1 mm
2. Minichannel heat sink geometric configurations Channel depth, dch 3 mm
Header length, lh 55 mm
A three-dimensional model of the minichannel heat sink is created Header depth, dh 3 mm
with the help of Solidworks 16. Dimensions of heat sink are taken si- Header width, wh 10 mm
Number of channels, N 28
milar to the heat sink used by Gigabyte 3D Galaxy liquid cooling system
to realize the practical importance of this study. A minichannel heat
sink with different fin spacing such as (0.2, 0.5, 1.0, and 1.5 mm) has (2) Properties of water and aluminium are independent of temperature
been used by Jajja et al. [12]. In this study, a mini channel heat sink and pressure.
with 1.0 mm fin spacing is considered. Total 28 mini channel having (3) Interface losses between fluid (water) and solid (aluminium) are
hydraulic diameter 1.5 mm is considered as shown in Fig. 1 (a). Hy- negligible thus ignored.
draulic diameter of the channel is given by Eq. (1).
2wch dch According to above-mentioned assumptions, the governing equa-
Dh =
wch + dch (1) tions for the fluid domain are Continuity, momentum and energy
equation.
A conventional and proposed inlet/outlet arrangements with dif-
ferent flow inlet angle are considered. Conventional inlet/outlet ar- .V =0 (2)
rangement as shown in Fig. 1 (b) is used by Jajja et al. [12] in their
experimental work and by Saeed and Kim [6] in their numerical work. (V . V) = p+µ 2V
(3)
The proposed inlet/outlet arrangement with different flow inlet angle is
shown in Fig. 1 (c). The rectangular headers have been used for both Cp ( V . T ) = kf 2T
(4)
arrangements. In a conventional arrangement, water enters in dis-
Energy equation for solid domain:
tributor header vertically upward and getting out vertically downward
from the outlet. In proposed inlet/outlet arrangement, water entered ks 2T =0 (5)
distributor header horizontally with different flow inlet angle such as
All the governing equations (2)–(5) are solved with the help of
(θ = 90°, θ = 105° and θ = 120°) as shown in Fig. 2. The fluid is dis-
ANSYS-Fluent using finite volume method (FVM). A segregated implicit
tributed to all the mini-channels through distributor header and col-
solver with SIMPLE pressure correction algorithm has been considered
lected by the collector header. The length of distributor and collector
to compute the flow field in mini-channels. Momentum and energy
header is same as heat sink width while the width of the header is
equations are discretized by second-order upwind scheme. Based on the
10 mm. The depth of header is considered same as the depth of mini-
governing equations and operating conditions, inlet velocity and outlet
channels. All dimensions of the heat sink with headers are given in
pressure boundary conditions are applied to inlet and outlet respec-
Table 1. All the dimensions of the minichannel heat sink are same for all
tively.
type of flow arrangements. Only the inlet/outlet positions have been
At inlet,
changed.
V = uin and T = Tin (298 K) (6)
3. Governing equations and boundary conditions
At outlet,
To investigate the effect of changing flow inlet angle of the inlet of P = Pout (atm) (7)
distributor header on flow maldistribution and heat transfer perfor-
mance of heat sink the following assumptions are taken: At fluid-solid interface,
TS Tf
(1) Fluid flow is in steady state, single phase, laminar, incompressible u = 0, Ts = Tf , and ks = kf
Sn Sn (8)
and three dimensional.
In this present numerical study, the solid aluminium is considered as
Fig. 2. Flow inlet angle at the inlet of distributor header (a) θ = 90° (b) θ = 105° (c) θ = 120°.
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S. Kumar, P.K. Singh International Journal of Thermal Sciences 138 (2019) 504–511
the heat sink material and water was used as the cold fluid. The of the fluid domain and the solid domain is shown in Fig. 3. To ensure
properties of water are ρ = 998.2 kg/m3, Cp = 4182 J/kg-K, node to node connectivity, the same approach is applied to both fluid
kf = 0.6 W/m-K, ν = 1.0 × 10−6 m2/s, and for solid aluminium are and solid domain. Node to node connectivity of solid and fluid domain
ks = 202.4 W/m-K, respectively. The inlet temperature of the water is minimizes interpolation losses.
fixed at 298 K, and the inlet velocity of water is varied from 0.1390 to Numerical results have been validated with experimental results of
0.5555 m/s. The Reynolds number in this study is ranged from 300 to Jajja et al. [12] as shown in Fig. 4 (b). Jajja et al. [12] used copper as
1000 and flow can be assumed laminar. A constant heat flux (15 W/ heat sink material. For validation of numerical results, copper and
cm2) is given to the base of the heat sink for all cases by assuming most aluminium both are set as heat sink material while for all other simu-
of the electronic components generate heat flux between 10 W/cm2 to lation, aluminum is set as heat sink material to investigate the flow
50 W/cm2. All walls others than the interface and base are assigned maldistribution. Fig. 4 (b) shows that numerical results with both ma-
with adiabatic and no-slip boundary conditions. When the residual terial i.e. copper and aluminum are in close agreement and following
values become less than 10−6 for the continuity, x-velocity, y-velocity, the same trend with experimental results. A slightly higher value of
and z-velocity and 10−9 for the energy, the solutions are considered to thermal resistance is obtained with aluminium as compared to copper
be converged. due to the lower thermal conductivity of aluminium.
Numerical results of present study are also validated with results of
Saeed and Kim [13]. They used copper as heat sink material with
3.1. Grid independence and validations
conventional flow arrangement. Numerical results of present study are
in close agreement with results of Saeed and Kim [13] for thermal re-
Both solid and fluid domain is discretized using ANSYS Fluent with
sistance as shown in Fig. 4 (b). Velocity profile is also validated for
fine hexahedral control volumes. Computational cells with 14 × 105,
conventional heat sink with velocity profile of Saeed and Kim [13] for
44 × 105, 70 × 105 and 100 × 105 nodes are considered to test the grid
(1.0-1.0-3.0) fin spacing and 0.5 LPM. Maximum velocity in mini-
independence of the solution. In Fig. 4 (a), the velocity distribution
channels is also in close agreement with Saeed and Kim [13] as shown
variations in the 28 channels in the proposed arrangement heat sink are
in Fig. 4 (c).
shown using four grid systems under same volumetric flow rate and
same boundary conditions. It is observed that 70 × 105 nodes and
4. Results and discussion
100 × 105 nodes have the almost same velocity in parallel mini-
channels. 70 × 105 nodes are considered for all the simulation due to
This study is aimed to minimize flow maldistribution by designing
less computing time and less allocated memory by the solver. The mesh
Fig. 4a. Grid independence. Fig. 4b. Validation of numerical results with experimental results.
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S. Kumar, P.K. Singh International Journal of Thermal Sciences 138 (2019) 504–511
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S. Kumar, P.K. Singh International Journal of Thermal Sciences 138 (2019) 504–511
Fig. 5. Velocity contour of the proposed mini channel heat sink for fixed mass flow rate.
Fig. 7. Mass flow rate in the parallel mini-channels along the width of the heat Fig. 8. Maldistribution factor vs. volumetric flow rate for different flow inlet
sink. angle.
to conventional flow arrangement. The maximum base temperature for inlet/outlet flow arrangement with flow inlet angle θ = 105° and
all arrangement for a fixed volumetric flow rate (0.5 LPM) is shown in higher in conventional flow arrangement due to lower base tempera-
Fig. 12. ture and higher base temperature of heat sink respectively. It is found
Thermal performance of the heat sink is defined by thermal re- that for higher flow rate, heat transfer rate increases which results in
sistance. The lower value of thermal resistance indicates the better lowering down the base temperature of heat sink. Due to which,
thermal performance of heat sink. The value of thermal resistance can thermal resistance decreases with an increase in volumetric flow rate as
be obtained from Eq. (13). Thermal resistance is lower in the proposed shown in Fig. 13.
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S. Kumar, P.K. Singh International Journal of Thermal Sciences 138 (2019) 504–511
Fig. 9. Maldistribution factor with respect to flow inlet angle for same flow Fig. 12. Maximum base temperature of mini-channel heat sink at 0.5 LPM.
rate.
Fig. 13. Thermal resistances with respect to different flow rate for different
Fig. 10. Total pressure drop in the heat sink with respect to volumetric flow
flow inlet angle.
rate.
Fig. 11. Temperature distribution at the base of mini channel heat sink at 0.5 LPM.
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S. Kumar, P.K. Singh International Journal of Thermal Sciences 138 (2019) 504–511
(1) A minichannel heat sink with proposed inlet/outlet arrangement Greek symbols
with flow inlet angle θ = 105° has more uniform flow distribution
in parallel mini-channels of the heat sink which means less flow ρ density, (kg/m3)
maldistribution as compared to conventional inlet/outlet arrange- μ dynamic viscosity, (Pa-s)
ment. ν kinematic viscosity, (m2/s)
(2) The value of maldistribution factor should be close to zero for the
better performance of heat sink. It is observed that conventional Appendix A. Supplementary data
inlet/outlet arrangement has the highest value of maldistribution
factor while proposed inlet/outlet arrangement with flow inlet Supplementary data to this article can be found online at https://
angle θ = 105° has the lowest value of maldistribution factor. Also, doi.org/10.1016/j.ijthermalsci.2019.01.014.
maldistribution factor increases with volumetric flow rate.
(3) Because of flow maldistribution in parallel mini-channels, non- References
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MF maldistribution Factor
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