2021 10 28 - LECTURE 6 - Thermal Modeling and Simulation

Power Electronics – Control, Synthesis, Applications (CSA)
Thermal Modeling and Simulation
05.11.2021
Dr.-Ing. Christoph H. van der Broeck
Institute for Power Electronics

and Electrical Drives 1
Heat flux density of power devices
© Welt der Physik 2019
© Nasa 2020
© Tristar 2020
© OSRAM 2020
Source: Prof. Dr. Martin März, PeakSeminar
3 05.11.2021 | Dr.-Ing. Christoph H. van der Broeck

Power Electronics (CSA) - Thermal Modeling and Simulation
Outline and objective
■ Fundamental principles of heat transfer

□ Conduction
□ Convection
□ Radiation
■ Thermal modeling of power converters

□ Physics-based thermal models
□ Thermal characterization of power modules
□ Simulating thermal behavior ■ Objective
□ Review thermal modeling concepts
■ Thermal design of power modules □ Apply thermal modeling for power converter, i.e.
white and black box modeling
□ Calculating the power rating of power modules
□ Learn on thermal characterization techniques
□ Pulse-current capability - Short circuit & pulse loads
□ Understand how to simulate and calculate the
□ AC operation at variable base frequency thermal capability and behavior of devices

Conduction heat transfer
Fundamentals
■ Thermal energy Uheat of solid body as a function of

□ Volume V
□ Temperature T
□ Specific heat capacitance Cr
□ Density r
■ Change of thermal energy results from heat flux Qheat or

heat generation Gheat
■ Heat flux Qheat and heat generation Gheat depends on

□ Heat flux density 𝑞Ԧ heat
□ Heat generation density 𝑔Ԧ heat
■ Energy conservation equation

Fundamentals
■ Energy conservation equation
→ Find and replace heat flux in terms of temperature
■ Fourier equation
□ Describes heat conduction
in x-direction only
𝑞Ԧ heat : Heat flux due to conductive heat transfer [W/m2]

l : Thermal conductivity [W/(m2K)]
T : Temperature
■ Heat equation in its integral form

Fundamentals
■ Heat equation in its integral form
■ Assumption that the Volume of the body is infitesimally small
𝑞Ԧ
𝑞Ԧ and
■ Heat transfer equation in its differential form
■ Introducing thermal diffusivity (measure of the thermal inertia)
in x-direction only
Fundamentals
T = T0
Examples
■ Boundary conditions
Tip of a soldering iron
□ Isothermal boundary condition T = T(x)
■ Temperature is given at the boundary
material
x
x0
T(x = x0) = T0 © RS 2019

Fundamentals
T = T0
Examples
material
x
x0
T(x = x0) = T0 qheat= q0 © RS 2019
□ Isoflux boundary condition Heat flux of power device
■ Heat flux density is given at boundary T = T(x)

qheat(x = x0) = q0
→ dT/dx = - q0 /l x
x0

Fundamentals
T = T0
Examples
material
x
x0
T(x = x0) = T0 qheat= q0 © RS 2019
□ Isoflux boundary condition Heat flux of power device
■ Heat flux density is given at boundary T = T(x)

qheat(x = x0) = q0
→ dT/dx = - q0 /l x
T = T0 x
0
T = T0
□ Mixed boundary condition
Convection from solid to coolant
■ Heat flux depends on heat transfer
coefficient h and temperature DT T = T(x)
qheat (x = x0) = h·(T(x0) - Ta )
→ dT/dx = - h·(T(x0) - Ta ) /l qheat= h·(T(x0) - Ta )
x
x0

Example for Isothermal Boundary
General Parameters
■ Peak temperature calculation of a bond wire
Length 2 cm
□ Apply differential equation for steady state
Diameter 400 mm
Current 10 A
Substrate Temp. 90°C

□ Integrate equation twice
Junction Temp. 175°C
Property Aluminum (Al) Copper (Cu)

□ With boundary conditions
Specific resistance 2.7 mWcm 1.8 mWcm
Heat conductivity 235 W/mK 400 W/mK
© Infineon 2017 ECPE Tutorial

Example for Isothermal and Isoflux Boundary
T1 = ?
■ Substrate temperature calculation resulting from device heat dissipation
Device A l1
x1
■ No heat generation gheat = 0 0 T1
Copper l1 l2
x2 T2
□ Integrate equation twice l2
AlN
x3 T3 l3
□ With boundary conditions Copper
l3
x
isothermal T = Ta
isoflux

T1 = ?
Device A l1
x1
■ No heat generation gheat = 0 0 T1
Copper l1 l2
x2 T2
AlN
x3 T3 l3
l3
x
□ Temperature of upper layer isothermal T = Ta
isoflux
■ Temperature decays linearly (as gheat = 0)
■ Decay depends on (constant) heat flux density and heat conductivity
x1 < x < x2
→ Same temperature equation can be derived for all three layers
x2 < x < x3 and x3 < x < xA and

T1 = ?
□ Temperature of upper layer
Device A l1
x1
■ Temperature decays linearly (as gheat = 0) T1
Copper l1 l2
■ Decay depends on heat flux density and thermal conductivity x2 T2
x1 < x < x2 AlN l2
x3 T3 l3
□ Temperature drop over upper layer Copper
l3
x
T = Ta
□ Temperature at the interface between device and substrate x= x1
■ Summation of temperature difference over all layers and Ta
T
DT12
DT23
DT3a Ta
x
x1

Thermal equivalent circuit modeling
T1 = ?
Qheat
■ Thermal equivalent circuits allow modeling conduction
heat transfer in strong analogy to electrical circuits Device A l1
x1
Rth1 T1
Electrical Circuit Thermal Equivalent Copper l1 l2
Voltage U in V Temperature T in K x2 T2
Current I in A Losses/ Heat flux Ploss / Qheat in W Rth2 AlN l2
Resistance R in W Thermal resistance Rth in K/W
Qheat x3 T3 l3
Rth3 Copper
l3
x
Ta T = Ta
T
Rth1 Rth2 Rth3 DT12
DT23
DT3a Ta
x
RthS = Rth1 + Rth2 + Rth3 x1

Example for Isoflux and Mixed Boundary
T1 = ?
■ Substrate temperature calculation resulting from device heat dissipation and convection
Device A l1
x1
■ No heat generation gheat = 0 0
Copper l1 l2
■ Only coolant temperature Tf is known x2 T2
AlN
x3 T3 l3
l3
xa Ta
(1) (2) x h
mixed isoflux
T = Tf

Example for Isoflux and Mixed Boundary
T1 = ?
■ Substrate temperature calculation resulting from device heat dissipation and convection
Device A l1
x1
■ No heat generation gheat = 0 0
Copper l1 l2
■ Only coolant temperature Tf is known x2 T2
AlN
x3 T3 l3
l3
xa Ta
□ Resulting equations using (2) (1) (2) x h
mixed isoflux
T = Tf
for x2 < x < x3 for x2 < x < x3 for x2 < x < x3
□ Temperature at device interface with

□ Determine DTaf based on TL3(x) and (1)

Adding convection resistance to thermal equivalent circuit
T1 = ?
Qheat
■ Substrate temperature calculation resulting
from device heat dissipation and convection Device A l1
x1
□ Temperature at device interface Rth1
Copper l1 l2
x2 T2
Rth2 AlN l2
Qheat x3 T3 l3
Rth3 Copper
l3
xa Ta
Rth1 Rth2 Rth3 x h
Rth conv
Tf T T = Tf
DT12 T1
Rth conv
DT23
DT3a Ta
DTaf
Tf
x
RthS = Rth1 + Rth2 + Rth3 + Rthconv x1
Example for transient heat transfer using thermal capacitance
T = Ta
■ Calculate temperature of a cup of tea that …
□ …cools due to convections (h) h
□ … is heated up with a heater coil Gheat
□ Assume that tea temperature is constant in the cup T ≠ T(x)
□ Initial condition T(t = 0) = T0 T=?

□ Effective heat generation density
© RWTH Aachen 2019

Example for transient heat transfer using thermal capacitance
T = Ta
■ Calculate temperature of a cup of tea that …
□ …cools due to convections (h) h
□ … is heated up with a heater coil Gheat
□ Assume that tea temperature is constant in the cup T ≠ T(x)
□ Initial condition T(t = 0) = T0 T=?

□ Effective heat generation density
© RWTH Aachen 2019
□ Formulate differential equation
Qheat T -Ta
□ Reformulation allows identifying thermal equivalent circuit elements Cth
Rthconv
Ta
Cth Qheat 1/Rthconv

Numerical thermal modeling - Finite Volume Method (FVM)
■ Formulate heat equation in its integral form for each finite

volume
■ Conducted heat flux Qheat,k between a nodes and its

neighbor can be determined via thermal resistances e.g.

Numerical thermal modeling - Finite Volume Method (FVM)
■ Finite volume is represented by thermal equivalent circuit

■ Each node is represented by one differential equation that can
be summarized in state-space model
■ Example
□ Hybridpack 2 power module with 10.000 temperature states
■ State and input vector

05.11.2021

Battery Charger for Catenary-Powered Trucks
or: „How to fit 200 kW into a beer crate?“
“First consultation hour with “Special Lab Session”

When: Friday 5th November 2021, 6:30pm
Where: ISEA, Jägerstraße 17/19, Aachen
■ Prior registration via pe-csa@isea.rwth-aachen.de is

mandatory, if you would like to participate.
■ The Q & A Session will be held in person, i.e., 3G conditions
apply - please make sure to bring a proof/certificate of your Picture: Siemens.com
3G status (vaccinated, recovered, or tested).
■ A mouth-nose cover must be worn throughout the event.

Revision
T1 = ?
Qheat
■ Calculating temperatures of via thermal resistances Rth
□ Device temperature results from the sum of temperature
Device A l1
x1
drops of different layers Rth1
Copper l1 l2
x2 T2
Rth2 AlN l2
Qheat x3 T3 l3
Rth3 Copper
l3
xa Ta
Rth1 Rth2 Rth3 x h
Rth conv
Tf T T = Tf
DT12 T1
Rth conv
DT23
DT3a Ta
DTaf
Tf
x
RthS = Rth1 + Rth2 + Rth3 + Rthconv x1
Revision
■ Finite volume is represented by thermal equivalent circuit

■ Each node is represented by one differential equation that can
be summarized in state-space model
■ Example
□ Hybridpack 2 power module with 10.000 temperature states
■ State and input vector

Convection heat transfer
Fundamentals
■ Convection heat transfer equation
Qconv : Energy transferred via convection [W]

A : Surface area in [m2]
h : Heat transfer coefficient in [W/(Km2)]
T : Temperature of surface exposed to convection [m2]
Tf : coolant temperature
Temperature and velocity distribution
of a laminar convection
■ Definition of convection heat transfer
© Fischer Elektronik 2019
□ Convection heat transfer results from combined heat and mass transport
through the flow of gas or liquids at surfaces of solid bodies
■ Types of convection mechanisms
□ Forced convection (fluid motion is generated by external source)
■ Laminar: Fluid particles following smooth paths in layers
© NVIDIA 2019
■ Turbulent: Fluid motion with chaotic changes in pressure & flow velocity
□ Natural convection (Fluid motion is not generated actively e.g. by fan/pump) Natural convection Turbulent convection

Engineering Approach
Temperature Sensor Resistance
■ General solution of partial differential equations is complex
■ Determine heat sink’s heat transfer coefficient h on the basis of
□ Experiments and FEM Simulations T
■ Use resistance/power device to generate losses Ploss =Qconv
■ Measure temperature of fluid Tf and heat sink T
Tf
■ Determine effective surface area A of heat sink
Experimental setup for extracting Rthconv
■ Use definition of heat transfer coefficient
□ Tables containing models for

heat sinks with typical geometries
■ Utilize convection model
□ Apply as boundary condition
□ Calculate convection resistance Rconv
■ Apply in thermal equivalent circuit
FEM Simulation
→ Convection depends on flow rate! Applying a convection model

Examples of heat sinks for liquid coolants
■ Key design aspects Liquid cooled heatsink with TIM Meander shaped cooling cells
□ Efficient convection is applied closer to device
□ Convection resistance depends strongly on volume flow
□ High performance technologies require high pressure
■ Important to take pumping power into account
Pin-fin milled into the baseplate Impinging liquid jet cooling
© A. Sewergin 2019

Examples of air cooled heat sinks and comparison
■ Air cooled heat sinks

□ Forced convection cooling with radial and axial fans
■ No requirement of fluid coolant
□ Natural convection
■ Requires no fan
□ Heat pipes
■ Enable heat spreading in small spaces
© Distrilec 2019
■ Comparison of liquid and air-based cooling © SEMIKRON 2019

□ Liquid coolant enables better heat dissipation Heat sink for natural convection Forced convection heat sinks
𝐊𝐜𝐦𝟐
Coolant Convection condition 𝑹𝐜𝐨𝐧𝐯 𝐢𝐧
𝐖
Liquid Jet 0,2…1

Forced convection 1…35
Natural convection 35…500
Air Jet 10…45
Forced convection 45…300
Natural convection 300…2000 © SEMIKRON 2019 Heat-pipe based thermal management

Radiation heat transfer
Fundamentals
■ Stefan-Boltzmann Law
Qrad : Radiated energy in [W]

s : Stefan –Boltzmann constant 5.67· 10-8[W/(m2K4)]
e : Emission factor reaching from 0 (no emission) to 1 (full emission)
is equal to absorption factor and material dependent – use table! © Welt der Physik 2019
A : Radiated surface area [m2]
T : Temperature of the radiated surface area in [K]
T0 : Temperature of the radiative surrounding e.g. case in [K]
■ Rules of thumb
□ At 125 °C the maximum radiated power (e = 1) is 100 mW/cm2
□ An average pin-fin heat sink provides 3000 mW/cm2 per 1K
temperature difference
→ Radiation is negligible for many power electronic applications

Radiation heat transfer
When considering radiation is relevant …
■ Use a material table to find the emission factor of ■ The temperature of the radiative surrounding is critical
the radiating component and its environment □ Example
□ The visible color is not relevant - what determines the
emission are the material properties for infrared-light PCB in plastic housing PCB in metal housing
Material Surface Emission e
Silver Polished 0.02 T T
Copper polished 0.05 Tw Tw
Aluminum polished 0.03
Copper oxidized 0.5
Paper - 0.65-0.85
Paints smooth 0.8-0.95
FR-4 - 0.94
Glas smooth 0.9-0.94 e1 = 1 e2 = 1 e1 = 1 e2 = 0
Ice smooth 1
T0 = Tw T0 = T
■ Radiation balance for non-transparent materials
□ The metal housing behaves like a mirror and reflects all
e=1-R radiated energy e = 0 → R = 1
□ Relation between emission and reflection factor ■ No energy is transferred to the outside via radiation

Outline and Objective

□ Conduction
□ Convection
□ Radiation


Physics-based thermal models
Detailed 3-D spatial thermal models
Temperature plot
■ Finite element method (FEM)
□ Use software packages e.g. ANSYS, COMSOL
□ Create mesh for geometry
Temperature in K
□ Software finds solution with minimal error that
satisfies partial differential equation (PDE) on mesh
□ Advantages & Limits
■ Very precise solution of linear/nonlinear problems
■ Coupling of conduction and convection PDEs Heat flux and Isosurface plot
■ Takes long computation time for simulating complex
load profiles
■ Finite volume method (FVM)
□ Develop software-tool e.g. in MATLAB that
formulates FVM for geometry
Temperature in K
□ FVM allows to derive linear models for PDEs
■ Faster simulation times
■ Difficult to include nonlinearities
Finite element modeling Finite volume modeling

Detailed 3-D spatial thermal models
Temperature plot
■ Finite element method (FEM)
□ Use software packages e.g. ANSYS, COMSOL
□ Create mesh for geometry
Temperature in K
□ Software finds solution with minimal error that
satisfies partial differential equation (PDE) on mesh
■ Very precise solution of linear/nonlinear problems
■ Coupling of conduction and convection PDEs Heat flux and Isosurface plot
■ Takes long computation time for simulating complex
load profiles
Finite element and finite volume modeling are excellently
■ Finite volume method (FVM) suited for investigating component behavior (e.g. convection of
□ Develop software-tool e.g. in MATLAB that heat sinks), especially if these exhibit nonlinearities …
formulates FVM for geometry
Temperature in K
□ FVM allows to derive linear models … but their complexity limits their applicability for the design
□ Advantages & Limits and analysis of converters
■ Faster simulation times
■ Difficult to include nonlinearities
Finite element modeling Finite volume modeling

Cauer model
■ Cauer model for fast simulations

□ Compact thermal equivalent circuit model representing
the physical assembly of a power module
■ Thermal resistance model heat transfer between layers
■ Thermal capacitances model heat storage of each layer
■ Heat source models power dissipation of the chip
□ Derivation of parameters of layer i based on physics
Thermal resistance Thermal capacitance

li cri
ri
Ai
Vi
li
i i i
i
□ Including heat spreading is difficult

Cauer Model – Heat Spreading

■ Heat source models power dissipation of the chip bi
□ Derivation of parameters of layer i based on physics li
a
Thermal resistance Thermal capacitance li
li cri
bi
ri
Ai
Vi Example: Calculation of the resistance of a quadratic
pyramid layer
li
i i i
i
■ Approximation of heat-spreading angle ~ 40-45 ° → Heat spreading angle approximation (a = 40-45°) is only valid if
■ Deriving thermal resistances and capacitances via FEM thermal resistance of lower layers are negligible or small


a
li cri
bi
ri
Ai Cauer models reflect the physical structure of a power module
and are well suited to approximate their behavior….
pyramid layer
li
..,however, for increasing accuracy the heat Thermal
Thermal resistance spreading must be
capacitance
i
i i i carefully included and more layers must be added
■ Approximation of heat-spreading angle ~ 40-45 °
■ Deriving thermal resistances and capacitances via FEM

Characterization and behavior modeling
Transient thermal impedance characterization
■ Characterization of thermal response

Forward voltage calibration
❑ Place converter in climate chamber
❑ Apply defined sensing current, e.g. 100 mA
❑ Measure uce voltage over wide temperature range
Thermal impedance Zth(t) characterization

❑ Apply load current to heat up device ( typically ½ Ir)
❑ Gate voltage keeps device turned-on
❑ Apply sensing current used in calibration
❑ Commutate load current to auxiliary device
❑ Fast commutation is critical
❑ Measure forward voltage rise at cooling
uce
Transient thermal impedance Zth(t) calculation
❑ Determine junction temperature based on calibration uce
❑ Reconstruct normalized response to load step → Zth(t)

Transient thermal impedance characterization
■ Characterization of thermal response

Forward voltage calibration
❑ Place converter in climate chamber
❑ Apply defined sensing current, e.g. 100 mA
❑ Measure uce voltage over wide temperature range
Thermal impedance Zth(t) characterization

❑ Apply load current to heat up device ( typically ½ Ir)
❑ Gate voltage keeps device turned-on
❑ Apply sensing current used in calibration
During the design of a power converter,
❑ Commutate load current to auxiliary device
the transient thermal impedance Zth(t) is obtained via
❑ Fast commutation is critical FEM or FVM simulations or from data sheets
❑ Measure forward voltage rise at cooling
uce
Transient thermal impedance Zth(t) calculation
❑ Determine junction temperature based on calibration uce
❑ Reconstruct normalized response to load step → Zth(t)

Which models can represent transient thermal impedance Zth(t)?
■ Cauer Model ■ Foster Model

□ Generalized transmission-line model □ Partial fraction model
□ Mimics physical structure □ No correlation between internal states and structure
■ Thermal resistances and capacitances can be chosen based and physical properties or variables
on the physical assembly properties ■ Every change of the physical system requires a
■ Internal temperatures can reflect physical states recalculation of all model parameters
□ Physical Cauer model can be assembled on the basis of □ Straightforward parametrization and calculations
sub-models, e.g. package and heat sink ■ Zth(jw) and Zth(t) can be explicitly formulated
■ Allows evaluation of packages with different heat sinks ■ Easy parametrization with MATLAB Curve Fitting
→ No explicit formulation of the time response possible

Getting the parameters for a Cauer or Foster Model
■ Parametrization of the thermal resistance and

parameters
□ Fitting e.g. via the MATLAB Curve Fitting/System
Identification Toolbox
□ Deriving the parameters of the Foster model is easy
□ Many data sheets provide Foster parameters
■ Relationship between Foster and
Cauer-model parameters
□ Based on Foster-model parameters one
can calculate Cauer model parameters,
but there exist multiple solutions
■ With the correct parametrization © Infineon 2019
Foster and Cauer models provide the same results

Representation of thermal models – Time and frequency domain
■ Transient thermal impedance ■ Thermal-impedance frequency response function

□ Junction temperature response to step loss with 1 W □ Shows magnitude and phase of the thermal system
□ Shows temperature rise as a function of time □ Allows identifying response to sinusoidal excitation
□ Double-logarithmic plot shows fast and slow properties ■ E.g. at w = 10 Hz Ploss = 1 kW·sin(wt) → Tj = 20 K·sin(wt-48°)
Rth
Steady-state
Rth
Steady-state
Linear plot

Simulating thermal behavior
PLECS based thermal simulation of power converters
■ Electrothermal devices behavior can be

parametrized via data-sheet digitizer
□ Conduction and turn-on/turn-off losses Ploss(T)
□ Thermal impedance Zth(t)
■ Automatic derivation of Foster/Cauer Model
■ Heat-sink
□ Collects losses of encircled devices
□ Provides Isothermal interface
□ Allows connection to thermal
network e.g. Rthconv
■ Simultaneous electrical and
thermal converter simulation To avoid long simulations
□ Evaluation of efficiency and use the PLECS steady-
temperatures at operating points state analysis tool
□ Simulation time step dominated by Device library from manufactures:
electrical models ,i.e. Tsim ≈Tpwm/100 https://www.infineon.com/dgdl/Infineon-
□ Not suited for long term simulation PLECS_Discrete_IGBT_Library-SM-v01_01-
EN.zip?fileId=5546d46261764359016188c7222934a5

Simulating thermal behavior
Determining the peak load capability of converters
■ MATLAB-based simulation Example simulation: Acceleration of an electric vehicle

□ Electrothermal simulation over long term mission cycles
■ Sampling time Ts in typically chosen to the switching frequency
Parametric Loss Model
iabc
dabc
Time in s

Outline and Objective

□ Conduction
□ Convection
□ Radiation


Thermal design of power modules
Calculating the power rating of power modules
■ Maximum junction temperature must not be exceeded, i. e. Tjmax = 150-175°C

□ Steady-state calculation of maximal RMS current Datasheet parameters Heat sink and TIM
of TO247 package thermal characteristics
TIM
Heat sink
■ Current RMS rating for conduction only

□ Data-sheet rating for fsw = 0
Key impact on power capability


□ Steady-state calculation of maximal RMS current © Infineon 2019
TIM
Heat sink
■ Current RMS rating for conduction only

TO247 package with SiC chip
□ Data-sheet rating for fsw = 0 Example
Rds = 113 mW @175°C
Rthjc = 1K/W
Rthconv = 0.5 K/W Heat sink
RthTIM = 0.5 K/W TIM
Tjmax = 175 °C
TA = 80 °C Ambient temperature
_________________
idsmax,dc = 26 A

05.11.2021


a
li cri
bi
ri
Ai
pyramid layer
li
i i i
i
■ Approximation of heat-spreading angle ~ 40-45 ° → Heat spreading angle approximation (a = 40-45°) is only valid if
■ Deriving thermal resistances and capacitances via FEM thermal resistance of lower layers are negligible or small


□ Steady-state calculation of maximal RMS current
© Infineon 2019
ksw hard= 12 mJ/A
TIM ksw soft = 0.6 mJ/A
Heat sink
■ Current RMS rating for conduction only ■ Current rating at switching frequency fpwm
□ Data-sheet rating for fsw = 0 Example □ Rating for PWM operation at fsw with max. duty cycle d → 1
Rds = 60 mW □ Current rating is reduced for growing switching frequencies
Rthjh = 1K/W
Rthconv = 0.5 K/W
RthTIM = 0.5 K/W
Tjmax = 175 °C
TA = 80 °C
_________________
idsmax,dc = 28 A

Pulse-current capability - Short circuit & pulse loads
■ Thermal capacitances store thermal energy and prevent

a fast rise of the junction temperature
□ Fast thermal transients e.g. switching energies are smoothed
as all thermal assemblies act as a low-pass filter
■ Maximal pulse-current capability can be determined with
transient thermal impedance Zth(t)
■ Example
□ Maximal pulse length tpmax of
a current of ids = 80 A
■ Loss calculation
385 W
0.25 K/W
■ Mark thermal impedance

and determine pulse time tpmax
Tpmax = 100 ms

Power modules in AC-applications
■ Operation of three-phase IGBT converter at different load angles

□ Evaluation of the surface temperature distribution
■ Motor operation High IGBT losses & temperatures
■ Regeneration High diode losses & temperature
■ Design converters for application
Operation profile
□ Rectifier needs larger diodes
Vdc Idut f0 fsw
□ Inverter larger IGBTs
□ Compromise for both operation modes 100 V 200 A 30 Hz 6 kHz
Inverter operation Reactive power Rectifier operation
f = 0° f = 90° f = 180° Half-brige surface with devices
53 05.11.2021 | Christoph H. van der Broeck

Power modules in AC-applications
■ Operation of three-phase IGBT converter at different load angles

□ Evaluation of the surface temperature distribution
■ Motor operation High IGBT losses & temperatures
■ Regeneration High diode losses & temperature
■ Design converters for application
Operation profile
□ Rectifier needs larger diodes
Vdc Idut f0 fsw
□ Inverter larger IGBTs
□ Compromise for both operation modes 100 V 200 A 30 Hz 6 kHz
Reactive power
SiC
Rectifier MOSFET-based
operation converters
Inverter operation
are typically operated with synchronous rectification
As MOSFET conducts forward and backwards current all

losses occur in the MOSFET
(Especially true if no external diode is use)
f = 0° f = 90° f = 180° Half-brige surface with devices
54 05.11.2021 | Christoph H. van der Broeck

AC operation at variable frequency
Experimental characterization
■ Thermal impedance decays for higher excitation frequencies f0 of Hybridpack2 power module
due to thermal capacitances of the package over a driving profile of a car
□ Temperature response to a periodic loss excitation depends on f0

■ Thermal design or control must consider peak temperature
□ Occurs at high current and low excitation frequency
□ Temperature pulsation due to current is strong
→ Larger current capability is possible at higher frequency f0
Low f0
■ Opportunity for active thermal management / thermal control
High f0
Low f0
High f0
Low f0
Temperature
Time in s

Summary
■ Fundamental of heat transfer ■ Thermal modeling of converters ■ Thermal design of converters

□ Conduction is described by □ Physics-based modeling with □ Maximal current is limited by losses
■ Heat transfer equation ■ FEM and FVM models and thermal interface
■ Boundary condition ■ Cauer models ■ Calculation of maximal current
based on data-sheet values
□ Behavior models
□ Dynamic operation is strongly affected
■ Transient thermal impedance by thermal capacitances
□ Simplification via thermal equivalent ■ Foster model
circuit elements (Rth, Cth) ■ Smoothing temperature response
□ Simulation
■ PLECS (coupled electric & thermal)
− Analyze operation points
■ MATLAB (parametric + thermal)
− Fast simulation of long mission profiles
□ Convection and radiation modeled via …

05.11.2021


2021 10 28 - LECTURE 6 - Thermal Modeling and Simulation

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2021 10 28 - LECTURE 6 - Thermal Modeling and Simulation

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Power Electronics – Control, Synthesis, Applications (CSA)

Thermal Modeling and Simulation

Institute for Power Electronics

© Welt der Physik 2019

3 05.11.2021 | Dr.-Ing. Christoph H. van der Broeck

■ Fundamental principles of heat transfer

■ Thermal modeling of power converters

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■ Thermal energy Uheat of solid body as a function of

■ Change of thermal energy results from heat flux Qheat or

■ Heat flux Qheat and heat generation Gheat depends on

■ Energy conservation equation

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■ Energy conservation equation

→ Find and replace heat flux in terms of temperature

𝑞Ԧ heat : Heat flux due to conductive heat transfer [W/m2]

■ Heat equation in its integral form

■ Heat equation in its integral form

■ Assumption that the Volume of the body is infitesimally small

■ Heat transfer equation in its differential form

■ Introducing thermal diffusivity (measure of the thermal inertia)

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□ Isoflux boundary condition Heat flux of power device

■ Heat flux density is given at boundary T = T(x)

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□ Isoflux boundary condition Heat flux of power device

■ Heat flux density is given at boundary T = T(x)

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Substrate Temp. 90°C

Property Aluminum (Al) Copper (Cu)

© Infineon 2017 ECPE Tutorial

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→ Same temperature equation can be derived for all three layers

x2 < x < x3 and x3 < x < xA and

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□ Temperature at device interface with

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□ Initial condition T(t = 0) = T0 T=?

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□ Initial condition T(t = 0) = T0 T=?

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■ Formulate heat equation in its integral form for each finite

■ Conducted heat flux Qheat,k between a nodes and its

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■ Finite volume is represented by thermal equivalent circuit

■ State and input vector

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Thermal Modeling and Simulation

Institute for Power Electronics

“First consultation hour with “Special Lab Session”

■ Prior registration via pe-csa@isea.rwth-aachen.de is

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■ Finite volume is represented by thermal equivalent circuit

■ State and input vector

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■ Convection heat transfer equation

Qconv : Energy transferred via convection [W]

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□ Tables containing models for