INTERFLUX®

No residue™ flux ELECTRONICS N.V.

IF 2005M Technical data IF 2005M

Ver: 3.12 15-01-16

Page 1

No clean, halide free, No residue™ soldering flux

Description: More information:

Interflux® IF 2005M is a low solids The flux has very high compatibil- Flux application 2
no-clean flux, designed to evapo- ity with conformal coatings.
rate during the soldering process. Pre heat settings 2
This means also the safest no-clean The IF 2005M is classified OR/L0
flux for high-tech circuits. per IPC J-STD-004. Wave contact 2

With no rosin or resin to create a IF 2005M is also available in refill-

Product handling 3
sticky residue, there is nothing left able flux pens for hand soldering.
after wave soldering to foul test
pins or prevent electrical contact. Test results 3
Machine and carrier pollution is
very little compared to other flux- 4
Packaging
es.

This halide free flux meets all Bell-

core and IPC requirements and is
QPL- listed (approved to MIL-F-
14256F). It is formulated to pro- Key advantages:
vide the best combination of sol-
derability, ease of processing and
 QPL listed
reliability. Great solderability on
HAL, Ni Au, I-Sn, I-Ag and OSP
coated PCB’s.  Absolutely halide free

IF2005M works great with lead-free

alloys. It is resistant to elevated  For lead-free and
preheating temperatures, and to a SnPb soldering
long wave contact time with a high- Products pictured may differ from the product delivered

er working temperature.
 No residue™ technol-
ogy

Physical properties  Very high compatibil-

Appearance Clear colourless liquid ity with conformal
coatings
Solid content 1,85% ± 0,15

Density at 20°C 0,807—0,809 g/ml  High stability in foam

fluxing
Water content 3-4%
Acid number 14 – 16 mg KOH/g

Flash point T.O.C 15°C (59°F)

S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium

tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com
 Page 2

Application of the flux

The IF 2005M is de- ever possible and to piece of cardboard are a sign of excessive
signed to be applied keep the flux pressure through the spray flux and are difficult to
by means of a variety low. The nozzle trav- fluxer. Remove it be- evaporate. Reduce the
of different systems. erse speed is set to a fore the pre heat unit. flux amount until de-
1. Foam fluxing: value which ensures Additionally the spray fects typical for a too
To ensure good foam- that every point on fluxer settings need to low flux amount like,
ing, the level of flux the board is sprayed be checked by passing webbing, flagging,
needs to be at least twice, (once from a glass plate or empty shorts and icicles are
2—3 cm over the each side). Resulting circuit board through observed. From this
porous flux stone. The in a 50% overlap on the fluxer. Remove it point increase the flux
use of an air knife is the spray pattern. from the machine be- level again until de-
imperative. This will give the most fore it reaches the pre fects disappear.
2. Spray fluxing: uniform spray pattern heater unit and check 3. Flux pen:
It is advised to use a coverage. Spray pat- it on flux quantity. For rework and hand
double spray stroke tern coverage can be There may be no soldering operations
during fluxing, when- checked by passing a drops present. Drops

Preheating
The recommended Avoid hot air convec- OSP finished boards pressure on the (first)
preheat temperature tion pre heater set- can benefit with wave to get good
measured on the top- tings above 150°C enough flux, lower through hole filling.
side of the boards is preheat tempera-
80°C-130°C. tures and high solder
Preheat slope:
The flux can have low- typical: 1,5°C/s
temperature (°C)

250
er preheating T° as min: 1,0°C/s
long as the solvent is max: 2,5°C/s
evaporated before 200
wave contact.

150

Wave contact 100

Typical wave contact Solder wetting can be 50

or dwell time value is optimal at lower con-
3-4s when using a tact times however
single solder wave. longer contact times 0

For double wave sol- are recommended to 0 30 60 90 120 time (s)

dering systems the provide total flux wash T° measured on the topside of the PCB on a
values will be 1-2s for off from the boards. lead-free wave soldering machine.
the first wave and 2- The maximum upper
4s for the second limit will be deter- limitations of the
wave. Lower total mined by the level of board and compo-
dwell time limit is 2s. shorts and physical nents.

S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium

tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com

Handling
Storage
Store the flux in the
original packaging,
tightly sealed at a
preferred temperature
of +5° to +25°C
Safety
Please always consult
the safety datasheet
of the product.
Test results
conform EN 61190-1-1(2002) and IPC J-STD-004B
Property
Chemical
Flux designator
Qualitative copper mirror
Qualitative halide
Silver chromate (Cl, Br)
Quantitative halide
Environmental
SIR test
Qualitative corrosion, flux
Electro(chemical) migration
Electro(chemical) migration
Page 3
Density control Titration check Reuse
The density of the IF The solids content val- Do not mix used and
2005M flux shall be ue of the IF 2005M fresh flux.
checked using a suita- flux can be deter-
ble density meter, the mined by titration.
value showed by the The liquids for titra-
density meter should tion are available at
be compared, after Interflux. Adjustments
temperature compen- of the solid content
sation, with the value may only be done by
in the IF 2005M densi- using T 2005M condi-
ty table and may only tioner.
be adjusted with the T
2005M accordingly.
Result Method
OR L0 J-STD-004B
pass J-STD-004B IPC-TM-650 2.3.32
pass J-STD-004B IPC-TM-650 2.3.33
0,00% J-STD-004B IPC-TM-650 2.3.35
pass J-STD-004B IPC-TM-650 2.6.3.7
pass J-STD-004B IPC-TM-650 2.6.15
pass Bellcore GR-78-CORE section 13.1.4
pass Siemens ZT
S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium
tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com
 Page 4

Packaging:

IF 2005M is available in the following packages:

10 litres polyethylene drums

25 litres polyethylene drums
200 litres polyethylene drums

Trade name : IF 2005M No-Clean, Halide Free Soldering Flux

D i s c l a i m e r

Because Interflux® Electronics N.V. cannot anticipate or control the many different conditions under which this information and our products may
be used, we do not guarantee the applicability or the accuracy of this information or the suitability of our products in any given situation.
Users of our products should make their own test to determine the suitability of each such product for their particular purposes. The product
discussed is sold without such warranty, either express or implied.

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INTERFLUX® ELECTRONICS
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S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium

tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com