INTERFLUX®

No-Clean flux ELECTRONICS N.V.

IF 2005C Technical data IF 2005C

Ver: 3.12 15-01-16

Page 1
No-clean, halide free soldering flux

Description:
More information:
Interflux® IF 2005C is a low sol- All flux components can evapo-
ids no-clean flux, especially de- rate during the soldering pro- Flux application 2
veloped for selective soldering in cess. This means also the most
lead-free and SnPb applications. safe no-clean flux for high-end
Preheat settings 2
It is the version of the IF 2005- electronics.
series with the largest process
window in activity. With no rosin nor resin to create Wave contact 2
sticky residue, there is nothing
IF 2005C is also suitable for left behind after soldering to foul White residues and 3
wave soldering but IF 2005K and test pins or prevent electrical cleaning
IF 2005M are the first choice for contact. Product handling 3
respectively lead-free and SnPb
wave soldering. The flux is classified as OR/L0
according to EN and IPC stand- Test results
IF 2005C has excellent soldera- ards.
bility with lead-free alloys and on Packaging 4
virtually all finishes (NiAu, I-Sn,
HAL, Cu-OSP,…). It is resistant to
elevated preheat temperatures, Key advantages:
and to long contact times with a
higher working temperature. This
makes IF 2005C the best choice  Absolutely halide
for selective soldering. free

This absolutely halide free flux

 For lead-free and
meets the EN, Bellcore and IPC
SnPb soldering
requirements. It is formulated to
provide the best combination of
solderability, ease of processing  Excellent for selec-
and highest reliability. tive soldering
Products pictured may differ from the product delivered

 Suitable for spray,

Physical properties drop jet, foam and
dip fluxing
Appearance Clear colourless liquid
Solid content 3,3% ± 0,3
 Very high compati-
Density at 20°C 0,813 g/ml — 0,815 g/ml bility with conformal
coatings
Water content 3-4%
Acid number 26 – 30 mg KOH/g
Flash point T.O.C 15°C (59°F)

S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium

tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com
 Page 2

Application of the flux

1. Drop jet fluxing bigger than the sol- overlap on the spray tity. There can be no
dered area, resulting pattern. This will give drops present. Drops
Because no air is
in flux residues on the the most uniform are a sign of excessive
used, correct position-
area that has not been spray pattern cover- flux and are difficult to
ing of the nozzle un-
soldered. Minimum age. Spray pattern evaporate. Reduce the
derneath the holes is
flux application will coverage can be flux amount until de-
important. To check if
reduce flux residues. checked by passing a fects typical for a too
enough flux has been
2. Spray fluxing: piece of cardboard low flux amount like,
applied on compo-
It is advisable to use a through the spray webbing, flagging,
nents with not enough
double spray stroke fluxer. Remove it be- shorts and icicles are
through hole solder
during fluxing when- fore it reaches the observed. From this
wetting, apply some
ever possible and to preheat unit. Addition- point increase the flux
flux on the top of the
keep the flux pressure ally the spray fluxer level again until de-
hole with a small
low. The nozzle trav- settings need to be fects disappear.
brush. If better
erse speed is set to a checked by passing a
through hole wetting 3. Foam fluxing:
value which ensures glass plate or empty
is achieved, increase To ensure good foam-
that every point on circuit board through
the flux amount. In all ing, the level of flux
the board is sprayed the fluxer. Remove it
cases try to apply the needs to be at least
twice, once from two from the machine be-
minimum flux amount 2—3 cm over the
different sides. When fore it reaches the
that achieves good porous flux stone. The
this condition is met preheat unit and
soldering results. The use of an air knife is
the result is a 50% check it on flux quan-
sprayed area is often imperative.

Preheating
temperature (°C)

The recommended exhaustion. If possi- 250

preheat T° is: 100 - ble, avoid hot air pre-

160°C. This value is heat settings above 200
retrieved from field 150°C. Always take
experience. The flux into account the phys-
can have lower pre- ical properties of the 150
heat T° as long as the board, components
solvent is evaporated and soldering applica-
before wave contact. tion in order to get an 100

Preheat T° above optimal final result .

150°C are to be kept Slope: 1-3°C/s 50
as short as possible in
order to prevent flux
0
0 30 60 90 120 time (s)
Wave contact T° measured on the topside of the PCB on a
lead-free soldering machine.
In selective soldering of PCB and compo-
the wave contact is nent, the wettability of
mostly determined by the finishes, the solid- are between 1s and type, carriers, board
good through hole ification point of the 2s. In wave soldering design, nitrogen,...
wetting. This is influ- used alloy and the the same considera- are important . Typical
enced by the preheat- working temperature. tions apply, but other contact times are be-
ing, the thermal mass Typical contact times parameters like wave tween 2s and 4s.

S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium

tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com
 Page 3

White residues and cleaning

White residues
If white residues ap-
pear after soldering
there can be several
reasons. In selective
soldering or wave sol-
dering with selective
soldering carriers, the
area of flux applica-
tion is often larger
than the area with not sticky and will not dow in activity.
wave contact. This cause contact prob-
Cleaning
might result in white lems. Less flux appli-
residues. Also too cation, more heat or The residues can be
much flux application, more wave contact brushed away or
or condensation of can reduce these resi- evaporated with heat.
flux vapours might dues. IF 2005M/ IF The flux is cleanable
cause white residues. 2005K give less resi- with most convention-
These residues are dues but have a al cleaning agents.
safe. The residues are smaller process win-

Handling
Storage
Store the flux in the
original packaging,
tightly sealed at a
preferred temperature
of +5° to +25°C
Safety
Please always consult
the safety datasheet
of the product.
Density control
The density of the IF
2005C flux shall be
checked using a suita-
ble density meter, the
value showed by the
density meter should
be compared, after
temperature compen-
sation, with the value
in the IF 2005C densi-
ty table and may only
be adjusted with the T
2005M accordingly.
Titration check Reuse
The solids content val- Do not mix used and
ue of the IF 2005C fresh flux.
flux can be deter-
mined by titration.
The liquids for titra-
tion are available at
Interflux. Adjustments
of the solid content
may only be done by
using T 2005M condi-
tioner.

Test results
conform EN 61190-1-1(2002) and IPC J-STD-004B

Property Result Method

Chemical
Flux designator OR L0 J-STD-004B

Qualitative copper mirror pass J-STD-004B IPC-TM-650 2.3.32

Qualitative halide
Silver chromate (Cl, Br) pass J-STD-004B IPC-TM-650 2.3.33

Quantitative halide 0,00% J-STD-004B IPC-TM-650 2.3.35

Environmental
SIR test pass J-STD-004B IPC-TM-650 2.6.3.7

Qualitative corrosion, flux pass J-STD-004B IPC-TM-650 2.6.15

ECM 40°C; 93% RH; 5 VDC pass Siemens Prüfprotokoll (2005)

EM, 50°C; 90% RH; 5VDC pass HP, EL-EN 861-00

S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium

tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com
 Page 4

Packaging:

IF 2005C is available in the following packages:

10 litres polyethylene drums

25 litres polyethylene drums
200 litres polyethylene drums

Trade name : IF 2005C No-Clean, Halide Free Soldering Flux

D i s c l a i m e r

Because Interflux® Electronics N.V. cannot anticipate or control the many different conditions under which this information and our products may
be used, we do not guarantee the applicability or the accuracy of this information or the suitability of our products in any given situation.
Users of our products should make their own test to determine the suitability of each such product for their particular purposes. The product
discussed is sold without such warranty, either express or implied.

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INTERFLUX® ELECTRONICS
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S.A. INTERFLUX® ELECTRONICS N.V - Eddastraat 51 - BE-9042 Gent - Belgium

tel.: +32 9251 49 59 - fax.: +32 9251.4970
www.interflux.com - Info@interflux.com