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Wireless Audio –

Soundbar (Active
Speaker System)
Model Name HW-K360
Model Code HW-K360/ZA

SERVICE MANUAL
Wireless Audio – Soundbar Contents
(Active Speaker System)
1. Precaution

2. Product Specification

3. Disassembly & Reassembly

4. Troubleshooting

HW-K360
5. PCB Diagram

6. Schematic Diagram

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 − 1
1.1. Safety Precautions ................................................................................................................... 1 − 1
1.2. Servicing Precautions ............................................................................................................... 1 − 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4
1.4. Installation Precautions ............................................................................................................. 1 − 5
2. Product Specification ......................................................................................................................... 2 − 1
2.1. Product Feature ....................................................................................................................... 2 − 1
2.2. Specifications.......................................................................................................................... 2 − 2
2.3. Specifications Analysis ............................................................................................................. 2 − 3
2.4. Accessories ............................................................................................................................ 2 − 5
2.4.1. Supplied Accessories ................................................................................................... 2 − 5
3. Disassembly & Reassembly ................................................................................................................ 3 − 1
3.1. Overall Disassembly and Reassembly .......................................................................................... 3 − 1
4. Troubleshooting ................................................................................................................................ 4 − 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 − 1
4.1.1. No Power................................................................................................................... 4 − 2
4.1.2. No Sound Output......................................................................................................... 4 − 3
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 − 7
4.2.1. AMP Pre-Inspection relating to Power Protection .............................................................. 4 − 7
4.3. Initialization & Update ............................................................................................................. 4 − 8
4.3.1. Initialization method .................................................................................................... 4 − 8
4.3.2. How to check the Firmware version ................................................................................ 4 − 8
4.3.3. USB Update procedure ................................................................................................. 4 − 10
5. PCB Diagram ................................................................................................................................... 5 − 1
5.1. Wiring Diagram....................................................................................................................... 5 − 1
5.2. MAIN PCB Top ...................................................................................................................... 5 − 2
5.2.1. Pin Connection ........................................................................................................... 5 − 3
5.3. MAIN PCB Bottom.................................................................................................................. 5 − 4
5.3.1. Pin Connection ........................................................................................................... 5 − 5
5.4. VFD PCB Top......................................................................................................................... 5 − 6
5.5. VFD PCB Bottom.................................................................................................................... 5 − 7
5.6. JACK PCB Top ....................................................................................................................... 5 − 8
5.6.1. Pin Connection ........................................................................................................... 5 − 9
5.6.2. Test Point Wave Form .................................................................................................. 5 − 10
5.7. JACK PCB Bottom .................................................................................................................. 5 − 11
5.7.1. Pin Connection ........................................................................................................... 5 − 12
6. Schematic Diagram ........................................................................................................................... 6 − 1
6.1. Overall Block Diagram ............................................................................................................. 6 − 1

i Copyright© 1995-2016 SAMSUNG. All rights reserved.


Contents

6.2. MAIN-1................................................................................................................................. 6 − 2
6.3. MAIN-2................................................................................................................................. 6 − 3
6.4. MAIN-3................................................................................................................................. 6 − 4
6.5. MAIN-4................................................................................................................................. 6 − 5
6.6. VFD...................................................................................................................................... 6 − 6
6.7. JACK .................................................................................................................................... 6 − 7
6.7.1. Test Point Wave Form .................................................................................................. 6 − 8

Copyright© 1995-2016 SAMSUNG. All rights reserved. ii


1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning:


Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturer’s warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test:

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies.

With the unit completely reassembled, plug the AC cord directly into a AC outlet. With the unit’s power switched from
the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - screwheads, metal cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5mA)
TES T
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC EARTH
ADAPTER P LUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright© 1995-2016 SAMSUNG. All rights reserved.


1. Precaution

5) Insulation Resistance Cold Check:


(1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to the
chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2
Insulation Resistance Test

Ante nna
Term inal

Expo s ed
Meta l P a rt

oh m
Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC
and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage.
Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice:


Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the original—even if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement
components that have the same ratings, especially for flame resistance and dielectric strength specifications. A
replacement part that does not have the same safety characteristics as the original might create shock, fire or other
hazards.

Copyright© 1995-2016 SAMSUNG. All rights reserved. 1-2


1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the unit’s AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :


Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instrument’s ground lead last.

CAUTION

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright© 1995-2016 SAMSUNG. All rights reserved.


1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying power–this is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright© 1995-2016 SAMSUNG. All rights reserved. 1-4


1. Precaution

1.4. Installation Precautions

1) Keep the product away from a heat source such as candle light, mosquito repellent incense, heating equipment, or direct
sunlight. Otherwise, this may cause fire.

2) Do not install the product on a place that is shaking, tilted, unstable, or seriously vibrating. The product may drop to get
damaged or injure a person. If using the product in a highly vibrating place, it may be broken or cause fire.

3) When moving the product, turn off the power switch and unplug all the connected cables with the product such as the
power plug and antenna cable. If the power cord is damaged, this may cause electric shock or fire.

4) Secure room for ventilation. Keep at least 10 cm of distance from the rear wall, and at least 5 cm from either side wall.

5) Installing the product in a special place like below rather than normal environment may cause serious quality concerns
due to its special conditions. If this is the case, make sure to contact a local Samsung service center before installing the
product. (Special places: a place where a large amount of dust is accumulated; where chemical substances are used
or the ambient temperature is too high or low; a place that is full of moisture or water; in transportation vehicles
such as a car; or in public places such as the airport or subway station where the product is supposed to operate
uninterruptedly for a long time)

6) Keep the packaging plastic wrapper out of children's reach. If children play with it improperly, they may get suffocated.

7) If installing the product on a display cabinet, shelf, desk, etc., keep the product from protruding on its lower side. If the
product falls, it may break or cause physical injury. Use only the display cabinet or shelf that fully covers the product.

8) If using lithium batteries, carefully read the following precautions:

NOTE

• Ensure the batteries are inserted in the right direction. Otherwise, they may cause an explosion. Dispose of used batteries
according to the manufacturer's instructions.

• Do not expose the battery to fire.

• Do not disassemble, short - cut, or heat the battery.

• Use only the same type and size of batteries for replacement.

• Do not expose the battery to fire or excessive heat.

1-5 Copyright© 1995-2016 SAMSUNG. All rights reserved.


2. Product Specification

2. Product Specification

2.1. Product Feature

■ HW-K360
• 130 W (Front 35 W x 2 + Woofer 60 W)
• 2.1CH, System
• 1 analog / 1 optical
• USB Host, Bluetooth
• Wireless Subwoofer

Copyright© 1995-2016 SAMSUNG. All rights reserved. 2-1


2. Product Specification

2.2. Specifications

■ Basic Specification
USB 5 V / 0.5 A

Main unit 3.3 Ibs (1.5 kg)


Weight
Subwoofer 6.4 Ibs (2.9 kg)

35.7 x 2.1 x 2.8 inches


Main unit
General Dimensions (907.5 x 53.5 x 70.5 mm)
(W x H x D) 6.1 x 11.8 x 11.5 inches
Subwoofer
(155 x 300 x 293 mm)

Operating temperature range +41F °C to +95 °C

Operating humidity range 10 % to 75 %

Rated output Main unit 30 W/CH, 8 OHM, THD = 10 %, 1 kHz


power Subwoofer 60W, 3 OHM, THD = 10%, 100Hz
Amplifier
S/N ratio (analog input) 65 dB

Separation (1 kHz) 65 dB

NOTE

• S/N ratio, distortion, separation and usable sensitivity are based on measurement using AES (Audio Engineering Society)
guidelines.
• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.

2-2 Copyright© 1995-2016 SAMSUNG. All rights reserved.


2. Product Specification

2.3. Specifications Analysis

Model Name HW-K360 HW-J355

Photo

RMS (10% THD),


Output 130 W 120 W
REF: 1ch
Power
Output Power (ch) 35 W x 2 + 60 W 30 W x 2 + 60 W

Disc playback N/A N/A


Compatible
media iPod Dock
- -
(selected region only)

Wireless Ready - -
Extra
USB HOST O O
Features
Bluetooth O O

3D SOUND - O

ASC - -

DSP Smart Volume - Smart Volume II

Audio Up Scale - -

Power Bass - -

Dolby Digital / Plus Dolby Digital 2ch Dolby Digital 2ch

Audio Dolby True HD N/A N/A


Decoding
DTS / DTS-HD
DST 2.0 DST 2.0
(HR/MA)

Component out - -

Video HDMI Out (CEC) - -

HDMI Input - -

Audio Mini Jack Audio In AUX1 (3.5φ) AUX1 (3.5φ)


In/Out RCA Input - -

Optical
In (Digital In) O (1) O (1)
Jack

Headphone Headphone Jack - -

USB Jack
Jack Type USB 2.0 Micro USB Type B Plug (Male) USB 2.0 Type A Jack (Female)

Type (Sat/Tallboy) Sealed Enclosure Sealed Enclosure


Speaker
Active (Powered) S/W Wireless Active Wireless Active

Copyright© 1995-2016 SAMSUNG. All rights reserved. 2-3


2. Product Specification

TIP

O : Feature Included
X : Not Included

2-4 Copyright© 1995-2016 SAMSUNG. All rights reserved.


2. Product Specification

2.4. Accessories

2.4.1. Supplied Accessories

Accessories Item Item code Remark

Remote Control AH59-02733B

Lithium Battery
4301-001042
(3V : CR2032)

Power Cord : 1EA 3903-000853

DC Adapter BN44-00835A

Optical cable AH39-00779A

Local Samsung Dealer

† r™ž • Š ‡ r™ž• Š

† r ™ ž • Š ee { v { s u ² ²
ˆ ª ³ ¹ ª · e ‘ ®³ ª

ˆ ª ³ ¹ ª · e ‘ ®³ ª
‡ r ™ ž • Š e ex { u s u ² ²
‡ r™ž•Š †r™ž•Š

Wall Mount Guide AH63-04369A

Holder-screw 1 : 2EA AH61-04110A

Holder-screw 2 : 2EA 6001–001961

L : AH61-04106A
Bracket-Wall Mount
R : AH61-04114A

User Manual AH68-02608A

Copyright© 1995-2016 SAMSUNG. All rights reserved. 2-5


3. Disassembly & Reassembly

3. Disassembly & Reassembly

3.1. Overall Disassembly and Reassembly


CAUTION

• Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

• Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

• In order to assemble reverse the order of disassembly.

Description Description Photo

1. Unfasten 5 screws on the Rear


:

CAUTION

Be careful not to make any scratches as you remove them.

2. Remove Cover Rear

3. Disconnect wire 4ea.

4. Unfasten 4 screws on the MAIN.


:

5. Remove the COVER-JACK and take the PBA out, Then


disconnect wire 2ea,remove the main

6. Unfasten 1 screws on the VFD. and remove VFD form the bracket

7. Unfasten 2 screw on the wireless and BT module

3-1 Copyright© 1995-2016 SAMSUNG. All rights reserved.


4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values


Voltage/DIV 1 V/div
TIME/DIV 500 ms/div

Copyright© 1995-2016 SAMSUNG. All rights reserved. 4-1


4. Troubleshooting

4.1.1. No Power

The powe r doe s not turn on.

Che ck if 19V Che ck if 19V is


No No No
is me a s ure d on the ma in pcb me a s ure d a t the Ada pte r Che ck the AC Cord output. Re pla ce the AC Cord.
CN4 P IN #1 pin#1.

Ye s Ye s Ye s

MAIN PC B PC N1 cha nge . Che ck Ada pte r a nd


re pla ce Ada pte r.

Che ck if "H(3.3v)
is m e a s ure d a t the pin #62 No
of the UIC1 whe n Ma in P CB Re pla ce the Micom (UIC1).
powe r is turne d on.

Ye s

Cha nge the MAIN PC B.

4-2 Copyright© 1995-2016 SAMSUNG. All rights reserved.


4. Troubleshooting

4.1.2. No Sound Output

No output

Che ck S P DIF Output.

Check if 3.3V
power is measured a t No
Change MAIN pcb
pin 95 of IC3002 on the
MAIN P CB.

Ye s

Check if 3.3V
power is measured a t No
Change the MAIN PCB.
pin 1 of OP J ACK1 on the
MAIN P CB.

Ye s
Che ck DS P.

(1)
Che ck if s igna l is
me a s ure d a t pin 16 of No No
Replace IC1 Change the MAIN PCB.
IC1 on the Ma in P CB.

* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-1.

(2)
Check if s igna l is
measured a t pin No. 2, 4, 45, 47, No No
Replace IC1 Change the MAIN PCB.
of IC1 on the
MAIN P CB.
* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-2.

S pe a ke r output che ck.

(3)
Check the MAIN P CB No No
ACN1,ACN2 speaker Change speaker connect or. Change the MAIN PCB.
out put s igna l.
* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-3.

Cha nge S pe a ke r L, R.

Copyright© 1995-2016 SAMSUNG. All rights reserved. 4-3


4. Troubleshooting

(1)

IC 3 002
(1)

* 5.3. MAIN P CB Bottom CN3 0 0 3


R31 14 47KOHM
1/16W

1/16W
100NF

1/16W

ADD5
3 4
1/16W

5 6 100OHM DGND
R31 02
10KOHM 1/16W

ADD6
C56

7 8 +-25 0PPM/ C
R45 392OHM

56KOHM
1/10W

ADD7
R4003

1 2 AGND
47KOHM

100NF

ADD8
R31 15

3 4 R132
1/16W

ADD9
ADD11
5 6 100OHM AVD3.3VS VC3.3V D+1.35V
7 8 +-25 0PPM/ C
C57

ADD3 R400 4
DGND 56KOHM
1/16W
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97

R133
100OHM VD3.3VPLL
USB_AGND

PAD_COMP
USB_VCCA

VDDAADC
USB_DM

PAD_RSET
VD33VDAC

VD33AADC
SYSCLK

VS33VDAC
VS33AADC
PAD_REF
VDAC
VDD

VDD

USB_DP
VD33

+-25 0PPM/ C
DMA[2]

DMA[3]

DMA[9]
DMA[8]
DMA[7]
DMA[6]

DMA[5]
DMA[4]
DMA[11]

LINE_IN_R1

LINE_IN_R2

LINE_IN_R3
LINE_IN_L1

LINE_IN_L2

LINE_IN_L3

ADD2
1 2 C30 11 100NF
3 4 1 96 16V
ADD1 DMA[1] VS33PLL
5 6 2 95
ADD0 DMA[0] VD33PLL
ADD10 7 8 3 DMA[10] SPDIF_IN
94 SPDIF_IN1
BA1 R32 100OHM BA1_ST 4 DRAS2_B VD33
93
R33 1/16W BA0_ST 5 92 R50 150OHM
BA0 100OHM DRAS1_B VID_XI 1/16W
6 91 1
1/16W 4 Q3
100KOHM

DCS1_B VID_XO
R51

Q0
100OHM 7 90
1/16W

/DR_CS DCS0_B VDD


R34 1/16W RAS_PLL 2 8 89
/RAS R35 100OHM CAS_PLL 3 9
DRAS0_B MCLK
88
/CAS 1/16W DCAS_B VSS/VS33 3 Q2 Q1
Q1 2 3
R3014
R301 4 DWE_PLL1 10 87 R30 85
/DR_W
/DR_WEE DWE_B SR[05] 10KOHM
R36 100OHM 11 DSCK ES86 80 DSC SR[07]
86 R30 87 C58 X3001 C60
56OHM 1/16W 27PF
1/16W 12 VDD VSS/VS33
85 10KOHM 50V 27MHZ 27PF
50V
R37 DQM_PLL0 13 IC3002 84 C3012
L_UDQM DQM DAC_O6R 100NF 16V
100OHM 14 83
1/16W VD33 VS33ADAC AGND
1 2 15 82
DATA7 DB[7] VD33ADAC
C30 13
DATA6
3 4 R134 16 DB[6] MGND1 DAC_O6L
81 100NF
DATA5
5 6 100OHM 17 DB[5] DAC_O5R
80 16V DGND
7 8 +-25 0PPM/ C 18 79
DGND DATA4 1 2 R135 19
DB[4] DAC_O5L
78 AUD3.3V
DATA3 DB[3] DGND DAC_O4R
3 4 100OHM 20 77
DATA2 +-25 0PPM/ C DB[2] DAC_O4L
DATA1
5 6 21 76 R32 11 100OHM
DB[1] DAC_O3R PWM_SW-
DATA0
7 8 22 DB[0] DAC_O3L
75 R32 10 100OHM
PWM_SW+
23 VDD DAC_O2R
74 100NF 16V R31 10 100OHM
PWM_L-
DATA8
1 2 24 DB[8] VS33ADAC
73 C30 15
3 4 R136 25 72 AGND
DATA9 DB[9] VD33ADAC
DATA10
5 6 100OHM 26 DB[10] DAC_O2L
71 R31 11
PWM_L+
8 +-25 0PPM/ C 100OHM
DATA11
7 27
28
DB[11]
VD33
(1) DAC_O1R
DAC_O1L
70
69 100OHM
R31 12
R31 13
PWM_R-
PWM_R+
1 2 29 68 100OHM R31 08
DATA12 DB[12] SR[06]
100OHM EPROM_WP
DATA13
3 4 30 DB[13] SR[32]
67
DATA14
5 6 31 DB[14] SR[15]
66 R31 09
D_CO _MI
7 8 32 65 100OHM
DATA15
SPDIF_OUT

DB[15] VSS/VS33
100OHM
RESET_B

SPI_CLK
SPI_CS2
SPI_CS3

R50 04
SPI_DO

R137 +-25 0PPM/ C


AUX[7]
AUX[6]
AUX[5]
AUX[4]
AUX[3]

AUX[2]
AUX[1]
AUX[0]

SPI_DI

SR[10]
SR[11]
SR[12]
SR[13]
SP[21]
OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
OP[5]
OP[6]
OP[7]
VD33

VD33

4.7KOHM
VDD

VDD

DGND
62
63
64
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61

VC3.3V VC3.3V
R38
R5005

R39
R5006
R5007
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

C59
100OHM
100OHM

100OHM
100OHM

R3099

1/16W

FROM HDMI RE PE ATER & ARC


10KOHM

1/16W

1/16W
1/16W
SPI _CS3

100OHM
R43

R3101
R42

100NF 16V
R30 97

1/16W

4.7KOHM
1/16W
TP_ REAR

10KOHM

R3023 100 OHM


R30 84
2.2KOHM

VRP_ CTR
R46

R49

2.2KOHM

2.2KOHM

1/16 W
R52

R53

R3022
R30 80
1/16 W

OTW 100 OHM 1/16


1/16W
W 1 8
MICOM_STROBE /CRESCENDO ACK
MST_CAK R3024 2
A0 VCC
7
100OHM

100 OHM 1/16


1/16W
W
R30 86

DATA_MICOM OUT/CRE SCENDO IN R3025 A1 WP


1/16W

D_MO_CI 100 OHM 1/16


1/16W
W
CST_MA K 3 6
A2 SCL
CII_RES ET R3031 100 OHM 1/16
1/16W
W
CRESCENDO_STROBE/MICOM_ACK
4 5
F

* 6.4. MAIN-3

<Fig. 4-1>

4-4 Copyright© 1995-2016 SAMSUNG. All rights reserved.


4. Troubleshooting

(2)

IC4002

(2)

* 5.3. MAIN P CB Bottom


47KOH M
1/10 W
R83

IC400 2
AC25
R81
10UF

10UF
TAS5614LADDV

AC14
100OHM 1/10W
1/10W
25V

25VV
RST_POWER C148

25
1 GVDD_AB 44
BST_A 33 NF 50V
R82 2 VDD 43
1/10W
30KOHM 1/10W 3 OC_ADJ BST_B
42
AC26

AC15
UF
10UF

10UF
GND
C111 100PF 4 /RESE T 41
25V

25V
10

GND
50V 5 INPUT_A 40
OUT_A
6 INPUT_B 39
OUT_A
C112 100NF 16V 7 C_START 38
PVDD_AB
AC3 1UF 16V 8 DVDD 37
PVDD_AB
9 GND 36
10 GND PVDD_AB
35 DGND DGND
OUT_B
11 GND 34
GND
12 GND 33
GND
C113 1UF 16V 13 AVDD (2) 32
OUT_C
14 INPUT_C 31
PVDD_C D
15 INPUT_D 30
PVDD_C D
SD_POW ER AR5 100OHM 1/10W
1/10W 16 /FAULT 29
PVDD_C D
OTW AR6 100OHM 1/10W
1/10W 17 /OTW 28
OUT_D
18 /CLIP 27
10UF
AC5

OUT_D
AC10
10UF

19 M1 26
25 V

25V

GND
AR7 20 M2 25
GND
100OHM 21 M3 24
BST_C
22 GVDD_CD 23
AC11

C124
10UF
AC9

10UF

BST_D
25V

33 NF 50V
25V

FL/FR
50 V
33NF 50V

DGND
C119

* 6.6. MAIN-5

<Fig. 4-2>

Copyright© 1995-2016 SAMSUNG. All rights reserved. 4-5


4-6
50V 50V

DGND DGND
4. Troubleshooting

AC39 AC38

AC N3
100NF 100NF
50V 50V

0 C12
C1299 C12 8 R103
R10 3 R10 2 C22 C19
10NF 10NF 3.3OHM 3.3OHM 10NF 10NF
50V 50V 1/10 W 1/10W 50V 50V
(3)

AC N2

AC44 AC43 AC42 AC41


2.2NF 50V
50V 2.2NF 50V
50V 2.2NF 50V
50V 2.2NF 50V
50V AC N1
AC46 AC45
100NF 50V 100NF 50V
AC48
100NF 50V AC47
100NF 50V
AC55

SPK _FR-
SPK _FL+
3.3NF 50V
50V AC53
(3)
50V

<Fig. 4-3>
3.3NF
AC56
3.3NF 50V
50V AC54

L(-)
3.3NF 50V
50V

R(-)
L(+)
R(+)
* 5.2. MAIN P CB Top

L1(-)
DGND

L1(+)

1
3
1
2

R1(-)
R1(+)
(3)

SMW200-H03G
ACN1
MGND2
MGND1

MGND1
MGND2

DGND
(3)
(3)

ACN2
SMW20 0-H02G

SP_ GND
SP1 _GND

* 6.6. MAIN-5

Copyright© 1995-2016 SAMSUNG. All rights reserved.


4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. AMP Pre-Inspection relating to Power Protection

If you think there are problems at the AMP PCB, you can check the PCB without disassembling the set by following
the test below.

CAUTION

Do not connect the power cord during the test!

Resistance using Tester


F/R CH 137K ohm

• If there is a large difference than the value listed above then the AMP PCB has a problem.

S ET CH AS S I S
S P E AK E R O U T P U T

GND

Copyright© 1995-2016 SAMSUNG. All rights reserved. 4-7


4. Troubleshooting

4.3. Initialization & Update

4.3.1. Initialization method

• Initalization method
- Sound Bar (Remote control use)
1) Prepare the remote control.

2) Turn the unit off.

3) Press the “MUTE” button for 5 seconds in the remote control.

4) OLFD display “ID SET”

5) After the sound bar turns on, the initialization is ends.


- Sub-woofe
1) You can see the ID-set button the rear side of Sub-woofer.

2) When Sub-woofer is turned on, press the ID-set button for 5 seconds.

3) The STANDBY indicator is turned off and the LINK indicator (Blue LED) blinks quickly.

4) The main unit and the sub-woofer will pair automatically.

4.3.2. How to check the Firmware version

• Software check method


- Sound Bar (Remote control use)
1) Prepare the remote control.

2) Turn the unit off.

3) Press the “Sound Effectl” button for 5 seconds in the remote control.

4) OLED display a version like below. (Micom → DSP → HDMI → Tx → Rx → Touch)

4-8 Copyright© 1995-2016 SAMSUNG. All rights reserved.


4. Troubleshooting

HELLOW

M 050

D 050

WGM050

R 0 50

Copyright© 1995-2016 SAMSUNG. All rights reserved. 4-9


4. Troubleshooting

4.3.3. USB Update procedure

1) Power on the device, You can see the following OLED display.

VFD HELLO D-IN


2) Prepare the disk with update files then plug-in to the USB port. You can see the following VFD display.

UP DATE OK
3) Progressing update.
in case Micom, DSP, HDMI and Wireless update, you can see the following OLED display.

Cas e 1 : Micom Upda te .

M UP D M UP D DONE

Cas e 2 : DS P Upda te .

D 0% D 1 00% DONE

Cas e 3 : Wireles s U pda te.

W 0% W 1 00% DONE

4-10 Copyright© 1995-2016 SAMSUNG. All rights reserved.


5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram

Copyright© 1995-2016 SAMSUNG. All rights reserved. 5-1


5. PCB Diagram

5.2. MAIN PCB Top

P IC 1

(1) CN2 0 1
CN4

AC N 2
IC 1
(6)
CN6

AC N 1
(5)
CN1 4
CN3 0 0 4 CN1 0 2
(4)

5-2 Copyright© 1995-2016 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2.1. Pin Connection

1) CN201
VFD CONTROL

Pin No. Signal


1 D+12V
2 D+12V
3 D+12V
4 ECO
5 D+3.3V
6 D+5V
7 D+5V
8 DGND
9 VFD_DATA
10 VFD_CLK
11 DGND
12 VFD_CE
13 VFD_RST
14 DGND

4) CN14
KEY CONTROL

Pin No. Signal


1 KEY_PWR
2 KEY_FUNC
3 GND
4 KEY_VOL+
5 KEY_VOL-

5) ACN1
SPEAKER L

Pin No. Signal


1 FULL RANGE L+
2 FULL RANGE L-

6) ACN2
SPEAKER R

Pin No. Signal


1 FULL RANGE R+
2 FULL RANGE R-

Copyright© 1995-2016 SAMSUNG. All rights reserved. 5-3


5. PCB Diagram

5.3. MAIN PCB Bottom

(3)
(2)

WC N 1
CN3 0 0 3

5-4 Copyright© 1995-2016 SAMSUNG. All rights reserved.


5. PCB Diagram

5.3.1. Pin Connection

2) CN3003
BT Module Control

Pin No. Signal


1 BT_RST
2 D3.3V
3 BT_TX
4 BT_RX
5 DGND
6 EP_SCL
7 EP_SDA
8 DGND

3) WCN1
Wireless Module Control

Pin No. Signal


1 GND
2 WP
3 NC
4 NC
5 NC
6 NC
7 NC
8 NC
9 W_SDATA
10 X_SDATA
11 LRCK
12 BCK
13 GND
14 GND
15 NC
16 NC
17 W_SDA
18 W_CLK
19 DARR_RST
20 NC
21 NC
22 NC
23 D+5V_PW
24 D+5V_PW

Copyright© 1995-2016 SAMSUNG. All rights reserved. 5-5


5. PCB Diagram

5.4. VFD PCB Top

5-6 Copyright© 1995-2016 SAMSUNG. All rights reserved.


5. PCB Diagram

5.5. VFD PCB Bottom

CN1

Copyright© 1995-2016 SAMSUNG. All rights reserved. 5-7


5. PCB Diagram

5.6. JACK PCB Top

AN 4 0 0 (3)
TP3

O P J AC K 1
AU X1

(1) (2)

5-8 Copyright© 1995-2016 SAMSUNG. All rights reserved.


5. PCB Diagram

5.6.1. Pin Connection

1) AUX1 2) OPJACK1 3) AN400


AUX Signal Optical Signal Touch CON

Pin No. Signal Pin No. Signal Pin No. Signal


1 DGND 1 HM3.3V 1 HDGND
2 AUX_L 2 HDGND 2 HDGND
3 NC 3 OPTICAL_0_H 3 K_PWR
4 AUX_R 4 K_FUNC
5 DGND 5 K_VOL-
6 AUX_SENS_H 6 K_VOL+
7 DGND 7 HDGND
8 HDGND

Copyright© 1995-2016 SAMSUNG. All rights reserved. 5-9


5. PCB Diagram

5.6.2. Test Point Wave Form

TP3

5-10 Copyright© 1995-2016 SAMSUNG. All rights reserved.


5. PCB Diagram

5.7. JACK PCB Bottom

K IC 100

(1)

HCN 4

Copyright© 1995-2016 SAMSUNG. All rights reserved. 5-11


5. PCB Diagram

5.7.1. Pin Connection

1) HCN4
MAIN ASSY

Pin No. Signal


1 DGND
2 DGND
3 DGND
4 DGND
5 DGND
6 DGND
7 DGND
8 DGND
9 DGND
10 DGND
11 DGND
12 DGND
13 DGND
14 AUX_L
15 AUX_SENS
16 DGND
17 T_SDA
18 AUX_R
19 T_SCL
20 DGND
21 T_RST
22 SPDIF_IN1
23 M3.3V

5-12 Copyright© 1995-2016 SAMSUNG. All rights reserved.


6. Schematic Diagram

6. Schematic Diagram

6.1. Overall Block Diagram

• Main System Digital Signal Processor which is ESS (ES8680D).


• All display is registered by VFD.
• Serial Interface between I2C is operated with various protocol over the whole system.
• DSP(SDP1207) implement DSP AUDIO DECODING function by I2S.
• Power On/Off by Micom port is possible.
• Function and sound field can be controlled by remote controller and keys.
• The active subwoofer operate with wireless system.

Copyright© 1995-2016 SAMSUNG. All rights reserved. 6-1


6. Schematic Diagram

6.2. MAIN-1
D+5V_PW
POWER 0467003.N R
PBD15 UNDEFINED
UNDEFINED
AUDIO 0.01OHM
F4

WIRELESS_5V
USB_5V
HDMI_5V

D+3.3V_PW
GVDD+12V_PW PBD11

AP1117E33GZ -13-89
0.01OHM AP7361- Y
1126 D+12V_PW D+12V_PW PIC5 A+3.3V_PW A+1.35V_PW
1130 PBD4
PIC 7 PBD7
2.2UH PBD5 PBD6
1020 10UH 10UF 10UF 10UF 10UF 10UF PL2 1 OUT 3 1 5
PL1 0467003.N R

3.3KOHM
25V 25V 25V 225V
5 V 225V
5V IN OUT EN OUT
F2 2

120KOHM 4.7KOHM

47UF 6.3V
47UF 6.3V
GND
0.01OHM

PR29
0.01OHM 0.01OHM 0.01OHM
100NF
PIC1

10KOHM
UNDEF INED 3 4

PR22
PR10
SS3040-HE
GND

1OHM
PC4 PR7

PC5

PC7

PC8

PC9

PC10
PSD3
ADJ/NC IN

PR3
PVDD+19V_PW TPS 54331D

100NF
UNDEF INED 100 KOHM1/16W

40

MGND1

100NF
1 8

100NF
2
47PF
BOOT

50V

47UF/6.3V X 2
PC49

PC24
PH

PC20
100NF
2 7

PC29
47UF
10UF 10V
10UF
VIN
TPS54327DDAR

PC21
10V
GND 39PF

4.7KOHM
3 6

PC45
2015.09. 14 PC54

PR9
EN COMP 50V PIC2

PR6
PC50
4 5

10UF
8 1

1/16W
PC23
SS VSENSE VIN EN
22UF

22UF

C87
C11
C12

C89
7 2
25V

25V

PC22
PC56 PR13 PR14 VBST VFB
PC53 820PF 51KOHM 1.2 KOHM
6 3

0V
0V
0V
0V
10UF 10V
0 UF 110V
0 UF 110V
0 UF 110V
0 UF 110V
10UF 10V
1/16W 1/16W

22UF 10V
22UF 10V
22UF 10V
15NF 50V SW VREG5
VREG5
C85

C91

DGND_GND

47KOHM
5 4

MGND1
50V GND SS
SS

10UF
FOR EOS 140207

PC12
PR4

110UF
110UF
110UF
110UF
1UF
22UF

22UF

4.7NF
680OHM DGND_GND
25V

25V

DGND_GND 1/10W
POWER_ON DGND_GND

22KOHM
PR8
C86

C92

PR2 1110

PR5
R8 470OHM 1/10W
20OHM

10UF

PC13

PC16
PC17
PC18
PC19
PC46
PC47
C1
C2
C3
10KOHM

PR12
1/16W

PC11

100NF
1/16W

PC15
PC14
DGND_GND
DGND_GND DGND_GND FOR EOS 131122
DGND_GND 1213
DGND_GND
STBY +3.3V 1020
PL4
10UH 10UF 10UF 10UF 100NF
M+3.3V_PW

25V 225V
5 V 25V
2 5 V 50V

D5V_1
0467003.N R
PC66

PIC3
100NF

F3
PC69

PC71

PC72
PC70
SS3040-HE
PSD4

PVDD+19V_PW TPS 54331D UNDEF INED


40

D+5V_PW
1 8 UNDEF INED WBD1

22UF 10V
BOOT
2 VIN
PH
7 PR64
10KOHM

10NF 16V
PR61 3 GND
6 PC67 47PF
EN COMP 50V 1/10W 0.01OHM

50V
1 NF 50V
220K OHM 4
1/16W 5 MGND3 MGND1

100NF
SS VSENSE

WC6
WC5

WC7
PC68 PR62 PR63

16V
1NF
PC65 1.8 NF 36KOHM 1KOHM
15NF 1/16W 1/16W 1126

WR1
50V DGND_GND

470KOHM
22UF

22UF

DGND_GND 24

WC4
50V
25V
C8325V

23

1/16W
PR65
C88

3KOHM 22
DGND_GND 1/10W 21
22UF

25V 22UF
25V

W_IRQ WR2 33OHM 20


PR66 WR3 33OHM
PR69 0OHM DARR_RST 19
C84

C90

WIRELESS CONNECTOR
47KOHM WR4 33OHM
2015.09. 14 1/16W 1/16W W_SCL 18
W_SDA WR5 33OHM 17
WC8
100NF 16V 16
DGND_GND DELETE 11.22 15
DGND_GND
DGND_GND 14
13
BCK WR8 33OHM 12
LRCK WR9 33OHM 11
X_SDATA WR11 33OHM 10
1213 WR10 33OHM 9
W_SDATA
8
D+1.35V_PW 7
UNDEFINED 6

W_MCLK
W_BCK

W_SDA
W_LRCK
2.2UH

W_SDATA

W_SCL
DARR_RST
W_RDATA

W_IRQ
CMI-SSP5L20F H-2R2M BD1001 WP 5
PL23 4
R9
0.01OHM 33OHM 3

15KOHM 2KOHM
PR25
PR23 /WP 2
100 KOHM1/16W
1

10PF

10PF
50V
PC7347PF
PC28
100NF

TPS54327DDAR
PIC6 MGND4 MGND2

PR24

D5V_2
8 1

WC9
WC10
WC11
WC12
WC13
WC14
WC15
VIN EN
7 VBST VFB 2 DGND_GND WCN1

6.3V
6.3V
6.3V
6 3 05005H S-H24J3(G)

0V
0V
0V
10V
110V
110V
110V
SW VREG5
VREG5
DEVIDE GND DGND_GND

47KOHM
MGND1

5 GND SS
SS 4
4.7NF
10UF

OPEN
OPEN

OPEN
OPEN
OPEN
PC26

110UF
110UF
22UF

0 UF
0 UF
22UF
22UF
10UF
110UF
0 UF
1UF

22KOHM
PR28

PR26
PC40
PC39

DGND_GND
10UF

PC27

PC41
PC42
PC43
PC44
C4
C5
C6
PC25

100NF

1213 FOR EOS 131122


DGND_GND DGND_GND

CHANGE T O 3722-0 03205

PVDD+19V_PW
FGND1
+19V4
+19V3 MGND1
451005
GCD01-0087
UNDEFINED

+19V1 F1
1
+19V2
3
2
4
MGND2
FGND2
FGND3 CN4
FGND4

DGND_GND

6-2 Copyright© 1995-2016 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.3. MAIN-2

POWER
AUDIO
AMP AUX & DIN
D+3.3V_PW AMP1_3.3V_PW
AMP1_3.3V_PW
1/10W
BD5 R51 750KOHM R+ R1+
1% 50V
0.0 1OHM 1/10W 4.7UH
1UF L1 SP_GND SP1_GND
R50 150KOHMC37
MCLK GI2
GI2 GI1 G
GI1 I0
GI0 1%

50V
4.7NF
100NF
BCK A_SCL A_SDA MGND2

50V

SMW200-H02G
2

C69

C76
DGND_GND
C50 220NF 1
R30 33OHM 50V SPK IMPED ENCE : 8OHM
AMP_SDA_I2C
D.IN

2.2UF

2.2UF
R31 33OHM

25V

25V

25V
DGND_ GND

1UF
AMP_SCL_I2C DGND_GND 4.7UH
C51 220NF L2 MGND1ACN2
R32 33OHM
BCK 50V

18 10KOHM
R33 33OHM PVDD+19V_PW

50V
AMP_DATA0

4.7NF
100NF
15 C25
13 C29
11 C33

50V
R34 33OHM
LRCK R- R1-

C70

C77
R48

100NF
DGND_ GND

24
23
22
21
20
19
17
16
14
12
10

22UF

22UF
M+3.3V_PW

50V
9
8
7
6
5
4
3
2
1

25V

25V
OPJACK1
A_DATA LRCK RFR-4112HP

GVDD_REG
DGND_ GND

DAC_OUTA

SPK_OUTA+
AGND

AGND

PGND

C57

C61
MCLK

AVDD

PVDD
PVDD
OPBD100

BSTRPA+
SDA
SCLK

SPK_OUTA-
ADR1

SCL

SPK_GAIN/FREQ

BSTRPA-
GPIO2

GPIO1
GPIO0
SDIN

SPK_INA+
SPK_INA-
DGND_GND MGND1 1

22UF

22UF

OPC101
VCC

C53
IC1

25V

25V

OPR100 OPC100

16V
0.01OHM

MGND1

10V
100NF
2

10UF
SPK_OUTB+
SPK_FAULT

SPK_OUTB-
/SPK_MUTE
DVDD_REG

DAC_OUTB
CHANGE TO TAS880021 DGND_GND

C58

C62
SPK_INB+

BSTRPB+
SPK_INB-
GND

BSTRPB-
LRCK/FS

CPVDD

CPVSS
DGND

PGND

PGND
DVDD

PVDD
PVDD
PVDD
ADR0
3

GND
MGND2

CN
CP
AMP1_3.3V_PW VOUT
DGND_GND L- L1-
D+3.3V_PW

33OHM
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
TAS880021

1/10W
DGND_GND DGND_GND
C44 220NF 4.7U H

2.2UF
2.2UF
10KOHM

1UF

1UF
25V
1UF
25V

1UF
25V
10KOHM

10KOHM
MGND2

25V

25V
50V

25V
L3
DGND_GND
NC

SMW200-H03G
50V
4.7NF
*

100NF
220NF 3

50V
C45
R35

R42

R44

R46
R26 33OHM

C19

C21
C23

C27

C31
C34
AMP_MUTE 50V 2

C71

C78
SPK IMPED ENCE : 8OHM

SPDIF_IN1
R27 MGND1
AMP_FAULT 1
PVDD+19V_PW
1KOHM 1/16W 4.7UH DGND_ GND
DGND_GND DGND_GND DGND_GND L4 ACN1
DGND_GND

22UF

22UF
100NF

50V
4.7NF
100NF
25V

25V
50V

50V
C41

C46

C72

C79
L+ L1+

22UF

22UF
DGND_ GND

25V

25V
C39
DGND_ GND

C42

C47
DGND_GND

USB D+5V_PW

MGND4

0V

0V
0 UF 110V

0 UF 110V
CN6
MGND6 MGND2

110UF

110UF
C4004
C4003
1

MUC68-547702
USB_5V 2 USB_CON_DM
USB_DM 3
AUX USB_DP 4
USB_CON_DP IC4001
TPS2069CDBVR

MGND3
MGND1

6
5
4
USB_GND

10UF
10UF
5

22UF
22UF
1 5

C3001
L3001 OUT
IN DGND_GND

RCLAMP0504F
UNDEFINED 2.2U H 2 GND
GCC02- 0164 MGND5 3 /FLT 4

D300
EN/EN# USB_EN

0
7

220UF
USB_FAULT

C3044
C3045

C3046
C4005
C4006
16V
AAR1

22UF
6
AUX_SENS
5 470 OHM AAR2 330 OHM
1/16W DGND_GND
4 1/16W
AUX_R

1
2
3
3
AUX_L
2 AAR3
11

11

1 330 OHM DGND_GND DGND_GND


1/16W
VT8

VT9
MLVS-0603-E08

MLVS-0603-E08

AAC6

131127 10N F 16V -> 220UF 16V


330PF

AAC8
16V

AABD2
330PF
50V
100NF
AAC5
100NF

50V
AAC4

AUX1 0.0 1OHM FOR USB3.0 PROBLEM


16V

AAR4

AAC10
AAR5

AAC9
50V
220KOHM

220KOHM

50V
1/16W

1/16W

330PF

330PF

HAGND DGND_GND

HAGND

Copyright© 1995-2016 SAMSUNG. All rights reserved. 6-3


6. Schematic Diagram

6.4. MAIN-3

KEY_FUNC
KEY_VOL+
KEY_VOL-
KEY_PWR
POWER 10031H R-H05

AUDIO TACK KEY CN14

MGND1
KEY_PWR KR9 33OHM 5
M+3.3V_PW POWER
KEY_VOL- 4 VOL-
1/10W 10KOHM KR10 33OHM 3 KEY_GND
KR5 KEY_VOL+ KR11 2

ASES12U030R2

ASES12U030R2
VOL+
1/10W 10KOHM 33OHM 1

ASES12U030R2
100O HM 1/1
1/16
6WW KR6 KEY_FUNC FUNC
PR1 MGND2
POWER_ON 1/10W 10KOHM KR12 33OHM
KR7

KC3 100NF
M+3.3V_PW 1/10W 10KOHM
KR8

KC2
KC1

KC4
12

12

100NF 16V12

12
10KOHM
R139

100NF 16V

100NF 16V
KVT1

KVT4
KVT3
10KOHM
R136
1/10W
CN102

KVT2
ECO

16V
MGND1 D+3.3V_PW
1 DEBUG_RX_TX
D+3.3V_PW

ASES12U030R2
2

C_INT
4.7KOHM
3

1/16W
UPDATE_RESET DGND_GND

R149

10KOHM
4

R121

1/10W
MGND2
AUX_SENS
/WP

33OHM
33OHM
33OHM
33OHM

33OHM
DGND_GND DARR_RST
AMP_FAULT

2
4
6
8
100OHM
R205
T_64

7
1
3
5
KR1
KR2
KR3
KR4

R184
M+3.3V_PW
M+3.3V_PW

47OHM
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49

1/16W
10KOHM
UPDATE_RESET FOR EOS_140207

R2
R104

1/10W

P130
P01/TO00

P21/ANI1/AVREFM
+-200PPM/C

P22/ANI2
P23/ANI3
P24/ANI4
P25/ANI5
P26/ANI6
P27/ANI7
P140/PCLBUZ0/INTP6
P141/PCLBUZ1/INTP7

P20/ANI0/AVREFP
P04/SCK10-/SCL10
P00/TI00

P02/ANI17/SO10/TxD1
P03/ANI16/SI10/RxD1/SDA10
M+3.3V_PW 33OHM C2019
VFD_CE R1381 2 1 P12 0/ANI19 48 R158 33OHM
P14 7/ANI18 AMP_MUTE
VFD_RST 3 4 2 P43 47 R2101 100OHM
10KOHM

P14 6 FANET_CTL 100NF IC2004


M_RST VFD_DATA 5 6 3 P42 /TI04/TO04 46 16V
1/10W

6 1 R2097
R102

P10 /SCK 00-/S CL00


M+3.3V_PW
RT9818C-29PV VFD_CLK 7 8 4 P41 /TI07/TO07 P11 /SI0 0/RxD 0/TOOLRxD/SDA00
45 R2073 33OHM
DEBUG_MR_DT DGND_GND 5
S B2
2 33OHM USB_DM
UIC2 R103 DEBUG_RX_TX
R146 100O HM 5 P40 /TOOL0 P12 /SO00/T xD0/TOOLTxD
44 R2074 33OHM
DEBUG_MT_DR 4
VCC GND
3 R2098
3 VDD
/RESET,RESET 1 1/1 6W
6 /RESET P13 /TxD2/SO20
43 USB_CON_DM A B1
33OHM DEBUG_MT_DR
1129 0OHM M+3.3V_PW 7 P12 4/XT2/E XCLKS P14 /RxD2/SI 20/SD A20
42 D_MT
GND
8 P12 3/XT1 R5F100L GAFB 41
R101

P15 /SCK 20-/S CL20


9 P13 7/INTP0 40 IC2005
1/16W

UIC1
0OHM

R145 100O HM
W_IRQ 1/16 W P16 /TI01/TO01/INTP5
10 P12 2/X2/EXCLK 39 6 1
ASES12U030R2

R2099
VT2001
100NF
2

R94 100OHM
P17 /TI02/TO02 REM_DATA S B2 USB_DP
11 P12 1/X1 38 5 2 33OHM
C102

R162 100OHM
16V

12

USB_FAULT VCC GND

32 P30/INTP3/RTC1HZ/SCK11-/SCL11
P55
12 REGC 37 4 3 R2100
R107

R163 100OHM
1MOHM

C105 1UF USB_EN DEBUG_MR_DT


USB_CON_DP A B1

24 P75/KR5/INTP9/SCK01-/SCL01
P54
1/10W
100NF

25V 13 VSS 36 33OHM

25 P74/KR4/INTP8/SI01/SDA01
1018 FANET_CTL
C101

P53
14 EVSS0 35
16V

R164 100OHM

29 P70/KR0/SCK21-/SCL21
P52 OPT _DET1 D_MR

21 P31/TI03/TO03/INTP4
100NF

28 P71/KR1/SI21/SDA21
C107 16V 15 VDD P51 /INTP2/ SO11
34
16 EVDD0 33

22 P77/KR7/INTP11
23 P76/KR6/INTP10
DGND_GND

26 P73/KR3/SO01
27 P72/KR2/SO21

30 P06/TI06/TO06
31 P05/TI05/TO05
C106 100NF P50 /INTP1/ SI11/ SDA11

10KOHM
10KOHM
P61/SDAA0
18 P60/SCLA0
16V M+3.3V_PW
C108 10UF R115
10V

19 P62
20 P63
4.7KOHM

05005HS-H14J1
DGND_GND

17
M+3.3V_PW D+3.3V_PW
DGND_GND

R105
R106
D+3.3V_PW

100OHM
1 1
4.7KOHM

R143

R202
100OHM
R108

GND
4.7KOHM

1/16W
1/16W

D+3.3V_PW 1011
NC *DGND_GND

R20
R21
1/16W
R109

47OHM
2
OP1

5 R5

3
R110

7
5
1
VS 100OHM
AO-R123C6E-SS(S)

1/16 W D+12V_PW
100OHM

100OHM 1/16W

4.7KOHM

ECO
3

R902
R4 W_SCL

4.7KOHM

MGND4
1/16W
REM_DATA OUT

1/16W
R901
GND1
R2001
W_SDA

8
6
4
2
4 R111
3 4 CN201
ADMC5M03200

100OHM 1/16W
GND 100OHM
6 1/16 W 100NF 50V MGND2
VB1 VC1 1
MLVS-0603-E08
5.6

CII_RESET
10UF

10UF

D+5V_PW
C7003

VT2

12V
10V

10V

DATA_MICOM OUT/CRESCENDO IN D_MO_CI D+3.3V_PW 2


VT3

0.01OHM
11

DATA_CRESCENDO OUT/MICOM IN D_CO_MI 3


C7004

MICOM_STROBE/CRESCENDO ACK CST_MAK


4 ECO
M+3.3V_PW VB2 0.01OHM
CRE SCE NDO_ST ROBE/MICOM_ACK MST_CAK 5 3.3V
ADD 5.0V
AMP_SCL_I 2C 2012.08. 13 0.01OHM 6
VB3
AMP_SDA_I2C 7
REMOCON1 8

R113
4.7KOHM
DGND_GND R114 VFD_DATA V_DATA

* NC
9
VFD_CLK 10 V_CLK
11
VFD_CE 12 V_CE

MGND3
AMP_SCLL
AMP_SC AMP_SDA
AMP_SDA
VFD_RST 13 V_RST
R142 NC
R141
4.7KOHM

14

VC3

VC2
MGND1
*

100NF 16V

100NF 16V
GND

DGND_GND DGND_GND

R113 R114 R115 R141 R142 R143 P7.3 P7.2 P0.6


J250 X 4.7 K X 4.7 K X 4.7 K 0 1 0
J450 X X 4.7 K 4.7 K 4.7 K 0 0 0 DGND_GND
J550 4.7 K X X X 4.7 K 4.7 K 1 0 0
J550 0 4.7 K 4.7 K X X X 4.7 K 1 1 01
J370 4.7 K X 4.7 K X 4.7 K X 1 0 1
TBD X X 4.7 K 4.7 K 4.7 K X 0 0 1
J350 X 4.7 K 4.7K
4.7 K 4.7 K X X 0 1 1
TBD 4.7 K 4.7 K 4.7 K X X X 1 1 1

OPR3 OPC2 OPR4 OPT_DET1


OPR1 270 OHM 100 NF 4.7 KOHM
0OHM 1/16W 16V 1/16W C SBT42
SPDIF_IN1 B OPQ1
E
100PF 50V

5V
1N4148WS

0 NF 225V

47KOHM
22KOHM

75

1/16W
1/16W

OPD1

OPR5
110NF
OPR2

OPC3
OPC1

DGND_GND

6-4 Copyright© 1995-2016 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.5. MAIN-4
D+3.3V_PW

POWER
CRE SCEN DO 2+ BLUETOOTH

BD3007

0.01OHM
AUDIO 12507W S-H08G

8 MGND2
R4016
EP_SDA
33OHM 7 BT_SDA
EP_SCL R4017 6 BT_SCL
R4018
33OHM 5 BT_GND
VC3.3V_PW 4
33OHM
BT_RX BT_RX
TP3002 C202 C203 C204 C205 C206 R4007 3 BT_TX
UNDEFINEDUNDEFINED
UNDEFINEDUNDEFINED BT_TX 33OHM 2
A+1.35V_PW IDSMT-W-5-7.5-6-H
IDSMT-W-5-7.5-6-H B5V
R4008 1

100NF

100NF

100NF

100NF

100NF

100NF
C201
VC_USB_3.3V_PW X1 X2 BT_RST BT_RST

100NF
33OHM

16V

16V

16V

16V

16V

16V
R3033

10UF
100NF
MGND1

10PF

10PF
10PF
USB_DM
75O HM

16V
USB_DP
C4002
110UF
0 UF 110V
0V CN3 003
1121

50V
10PF
1
2

1
2
14, 28, 45, 64, 93, 117
1/10W
C3002

C127

C8004
C8003
C126
1
2

1
2
DGND_GND

C122
100 NF

C8001
C8002
D+1.35V_PW DGND_GND

R3106

R3105
33OHM

33OHM
DGND_GND

1/16W

1/16W
C208 C209 C210 C211 C212 C213
C1020
VD3.3V_PW
VC3.3V_PW DGND_GND 10UF

100NF

100NF

100NF

100NF

100NF

100NF

100NF
C207
DGND_GND

R3114 47KOHM
AUX_R DGND_GND
DGND_GND
DGND_GND

16V

16V

16V

16V

16V

16V

16V
1/16W
AUX_L
ADD4
1 2 C1021

100NF
ADD5
3 4 R3007 10UF

C3003

56KOHM
10KOHM 1/16W
5 6 33O HM AVD3.3VS

R3102

R4003
12, 23, 48, 58, 90, 116, 127
ADD6

R3032 392OHM

1/16W
7 8 1/16W

1/10W

100NF
ADD7 VC3.3V_PW
1 2 DGND_GND

C3004
47KOHM

56KOHM
ADD8

R3115

R4004
3 4 R3008

1/16W

1/16W
ADD9
ADD11
5 6 33O HM D+1.35V_PW D+3.3V_PW VC3.3V_PW
ADD3
7 8 1/16W VC_USB_3.3V_PW
DGND_GND BD3004

10UF
100NF
0.01OHM

C3018

C3019
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
VC3.3V_PW

R3074
10KOHM
10KOHM
IC3009

R3071
R3009 BD3003 W25Q32FVSSIG
33O HM VD3.3VPLL DGND_GND

USB_AGND

PAD_COMP
USB_VCCA

VDDAADC
USB_DM

PAD_RSET
VD33VDAC

VD33AADC
SYSCLK

VS33VDAC
VS33AADC
PAD_REF
VDAC
VDD

VDD

USB_DP
VD33
1/16W
DMA[2]

DMA[3]

DMA[9]
DMA[8]
DMA[7]
DMA[6]

DMA[5]
DMA[4]
DMA[11]
1 8

LINE_IN_R1

LINE_IN_R2

LINE_IN_R3
LINE_IN_L1

LINE_IN_L2

LINE_IN_L3
ADD2
1 2 C3011 100NF VD3.3V_PW SF_CS /CS
3 4 1 96 16V
0.01OHM
BD3005 SF_DI
2 DO(IO1)
DO(IO1)
VCC
7
ADD1 DMA[1] VS33PLL 3 /HOLD(IO3)
6
ADD0
5 6 2 95 SF_WP /WP(IO2) SF_CK
DMA[0] VD33PLL 4 CLK
5

VDAC
7 8 3 94 SF_DO

PAD_COMP
GND

PAD_RSET
SPDIF_IN1

10UF
100NF
USB_VDDA
USB_RREF
ADD10

C3021
VS33VDAC
PAD_REF
VD33VDAC
DI(IO0)
DMA[10] SPDIF_IN 0.01OHM

VDDAADC
4 93

C3020
R3010 33O HM 1130 R3089

VS33AADC
BA1_ST /FLASH_WP
BA1 E3SB27.0000F 18E35

R3073
DRAS2_B VD33
1/16W 0OH M

LINE_IN_R1

10KOHM
92

C3041
5

LINE_IN_R2
R3011

LINE_IN_L1
R3045 150OHM X3001

LINE_IN_L2
BA0_ST 0 PROTECTED

100NF
C3038
BA0 33O HM DRAS1_B VID_XI 1/16W 1/16W
91

10NF
6 27MHZ 1 WRITE ENABLE

16V
4 1

100KOHM
1/16W

R3052
DCS 1_B VID_XO Q3 Q0
33O HM 7 90

1/16W
/DR_C S DCS 0_B VDD TSD5
R3012 1/16W RAS_PLL2 8 89
/RAS DRAS0_B MCLK DGND_GND
VD3.3VPLL
/CAS
R3013 33O HM CAS_PLL3 9 DCAS_B VSS/VS33
88 R3085
10KOHM R3088 3 2 BD3006
1/16W R3087 Q2 Q1
Q1
R3014 DWE_PLL1 10 87 1/16W 4.7KOHM
DGND_GND
DR_SCK /DR_WE DWE_B SR[05]
R3015 33O HM 11 ES8680DSC 86 33O HM SF_WP

10UF
47O HM DSCK SR[07] C3014 0.01OHM
1/16W 12 85 C3009

C3025
27PF
12PF 50V

1/16W VDD VSS/VS33 27PF IC3006

DGND_GND
R3016 13 IC3002 84 1110 50V
C3062

DQM_P LL0 50V


L_UDQM DQM DAC_O6R C3012 TSD4 VC3.3V_PW M12L128168A-6TG2N VC3.3V_PW
33O HM 14 83 100NF 16V
1/16W VD33 VS33ADAC
1 2 15 82 1 54
DATA7 DB[7] VD33ADAC
C3013 VDD VSS
3 4 R3003 16 81 2 53
DATA6 DB[6] MGND1 DAC_O6L 100NF DGND_GND A+3.3V_PW AUD3.3V_PW DGND_ GND DATA0 DQ0 DQ15 DATA15
5 6 33O HM 17 80 16V 3 52
DATA5 1/16W DB[5] DAC_O5R BD1003 VDDQ VSSQ
DATA4
7 8 18 79 4 51
DGND_GND DB[4] DAC_O5L AUD3.3V_PW TSD3 DATA1 DQ1 DQ14 DATA14
DATA3
1 2 R3004 19 DGND_GND 78 5 50
33O HM DB[3] DAC_O4R TSD2 DATA2 DQ2 DQ13 DATA13
DATA2
3 4 20 DB[2] DAC_O4L
77 0.01OHM 6
VSSQ VDDQ
49
5 6 1/16W 21 76 TSD1 7 48
DATA1 DB[1] DAC_O3R AVD3.3VS DATA3 DQ3 DQ12 DATA12
DATA0
7 8 22 75 8 47
DB[0] DAC_O3L C3015 BD3009 DATA4 DQ4 DQ11 DATA11

DGND_GND
23 VDD DAC_O2R
74 100NF TSD0 9
VDDQ VSSQ
46
1 2 24 73 16V 10 45
DATA8 DB[8] VS33ADAC TBCK DATA5 DQ5 DQ10 DATA10

10UF
100NF
3 4 R3005 25 72 0.01OHM 11 44

C3029
TWS

C3028
DATA9 DB[9] VD33ADAC DATA6 DQ6 DQ9 DATA9
DATA10
5 6 33O HM 26 DB[10] DAC_O2L
71 12
VSSQ VDDQ
43

DATA11
7 8 1/16W 27 DB[11] DAC_O1R
70 DATA7
13
DQ7 DQ8
42
DATA8
28 VD33 DAC_O1L
69 14
VDD VSS
41

DATA12
1 2 29 DB[12] SR[06]
68 R3108
EPROM_WP L_UDQM
15
LDQM NC
40 VC3.3V_PW
3 4 R3006 30 67 33O HM 16 39
DATA13 33O HM DB[13] SR[32]
DGND_GND /DR_WE /WE UDQM L_UDQM
DATA14
5 6 31 DB[14] SR[15]
66 R3109
D_CO_MI DATA_CRESCENDO OUT/MICOM IN /CAS
17
/CAS CLK
38
DR_SCK
7 8 1/16W 32 65 33O HM 18 37
DATA15 /RAS
SPDIF_OUT

DB[15] VSS/VS33 /RAS CKE


R3075 4.7KOHM
RESET_B

19 36
SPI_CLK
SPI_CS2
SPI_CS3

R5004 /DR_CS
SPI_DO

/CS NC 1/16W
AUX[7]
AUX[6]
AUX[5]
AUX[4]
AUX[3]

AUX[2]
AUX[1]
AUX[0]

SPI_DI

SR[10]
SR[11]
SR[12]
SR[13]
SP[21]
OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
OP[5]
OP[6]
OP[7]
VD33

VD33

4.7 KOHM 20 35
VDD

VDD

VC3.3V_PW VC3.3V_PW BA0 ADD11


DGND_GND A13 A11
DGND_GND 21 34
BA1 A12 A9 ADD9
22 33
QRX QTX
QTX VC3.3V_PW ADD10 A10/AP A8 ADD8
54
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
55
56
57
58
59
60
61
62
63
64

23 32
ADD0 A0 A7 ADD7
R5005
R5001
R5002
R5006
R5007
R5008
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

DQM_PLL0 R3058 24 31
VC3.3V_PW 4.7KOHM ADD1 A1 A6 ADD6
T3.3 V
TGNDT3.3
TGND 25 30
R3029

R3030

DWE_PLL1 R3059 ADD2 A2 A5 ADD5


33OHM

33OHM
33OHM

R3101

4.7KOHM 26 29
1/16W

1/16W

1/16W

ADD3 ADD4
SPI_CS3

A3 A4
33OHM

1110 C3016 RAS_PLL2 R3060 27 28


1/16W

R5003
4.7KOHM

VDD VSS

10KOHM
R3023 33OHM
R4002

100N F 16V 4.7KOHM

R3053

R3054
R3084
VRP_CTR
33OHM

2.2KOHM
R3080

2.2KOHM
1/16W

1/16W R3061

2.2KOHM
R3022 1 8 GPIO17
OTW 4.7KOHM
MICOM_STROBE/CRESCENDO ACK
MST_CAK R3024 33OHM 1/16W
2
A0 VCC
7 SPI_CS3 R3062 VC3.3V_PW DGND_GND DGND_GND
R3099
R3086
33OHM

R3025 33OHM 1/16W A1 WP


4.7KOHM
1/16W

D_MO_CI CST_MAK 3 6
DATA_MICOM OUT/CRESCENDO IN A2 SCL EP_SCL
C_INT 33OHM
CRE SCE NDO_ST ROBE/MICOM_ACK
4 5
1/16W R3031 GND SDA EP_SDA
C125 470PF

1121

100NF

100NF

100NF

100NF

100NF

100NF

100NF
R3063
100NF

CAS_PLL3
100NF

CII_RE SET
50V
16V

C3030

C3031

C3033

C3035

C3036

C3039

C3043
4.7KOHM
16V

100OHM IC3007
R30261/16W R3065 BA1_ST
100NF 16V
VT3001

C2_RST 33OHM S-24C02DI-J800


DGND_GND 4.7KOHM
GPIO17

EP_ SCL
SF_DO
C123

C124

SF_CK

1/16W EPROM_WP
SF_DI

BA0_ST
C121
ASES12U030R2

R3064
SPI_CS3

EP_ SDA VC3.3V_PW


SPI_CS2

R3027 4.7KOHM 1,3,9,14,27,43,49


33OHM DGND_GND
1/16W TO FLAS H R3100 R3055
10KOHM DGND_GND
1121 BT_REST DGND_GND 1/16W SPI_CS2 BOOT STRAP(148MHZ)
BT_RST * NC CN3 004
BT_RX UART_RX R3017
DGND_GND UART_TX 4.7KOHM
SF_CS SMW200-H06G
BT_TX
R3056 MGND1
33OHM 1/10W 1
R3042 SPI_CS3 2
100OHM
100OH M1/16W
1/16W BCK SF_CK 3
R3043 SF_DI 4
100OH
100OHMM1/16W
1/16W LRCK SF_DO 5
VC3.3V_PW 6
R3039 W_SDATA R3057 C3023

MGND2
33OH
33OHMM 1/16W
1/16W 10KOHM 100NF 16V
R3069 X_SDATA
33OHM 1/16W
R3037 AMP_DATA0 DGND_GND
33OHM
33OH M 1/16W
1/16W

Copyright© 1995-2016 SAMSUNG. All rights reserved. 6-5


6. Schematic Diagram

6.6. VFD
006M D004I NK
POWER
VFD+

FVFD1

/RESET

PGND
LGND
SCK

OSC
VDD
STB
TSA
TSB

VIN
SW
VH

F+
F+
SI
F-
F-
VFD+5
MGND2 D+12V_PW

1
2

3
4
5
6
7
8
9
10
11
12
13
14
15

16
17
DGND

1/4W

1/4W

1/4W

1/4W
GND1
14

50V
100NF

100NF
V_RST DGND

50V
13 VFD_R ST
VFD_RST

68OHM

68OHM

68OHM

68OHM
V_CE 12 VFD_C E
VFD_CE

FC17

FC19
11
10 VFD_C LK
VFD_CLK D3.3V_1
V_CLK VFD-

47KOHM
V_DATA 9 VFD_DATA 100NF
50V OSC
8 100NF
7 VH
50V D+12V_PW

FC7
FC8
5.0V 6 D+5.0V SW

FR21

FR22

FR23

FR24
5 3.3V DGND
3.3V 3.3V

FR8
ECO 4 ECO 0.01OHM
12V 3 FBD2
2 DGND

NC
50V 100NF

FC30 NC

22UF

22UF
25V 22UF

25V 22UF
FC33
MGND1

22UF
VFD_DATA FR4 100OHM

VFD_CLK FR5 100OHM VFD_DATA_1

-
FC31

FC34

FC35

FC36
CN1 VFD_CLK_1

25V 22UF

50V 100NF
VFD_CE FR6 100OHM
-

25V
FR7 VFD_CE_1

6.3V
VFD_RS T 100OHM
VFD_RST_1

FC40
FC22

VH
SW

FC42
FVD2 FC15
FC9 10V 100NF
68PF FC13 16V
DGND 50V 100NF
DGND

FC14
16V

10UF
68PF
68PF
100NF
DGND

FC10
FC11
FC12
16V
DGND DGND

D+12V_PW

DO NOT PLACE UNDER VFD


D+5.0V
CLOSE TO VFD * VFD+5V
SW
NC
1/8W 1/8W FR2 0
10O HM 10O HM
FR11 FR12
VH
FQ5
Q1

5 V 22UF
2 2 UF

D
D1
50V

C
D4

S
50V

B FC25
50V 50V 100NF 25V
VC02

G
E 1/10W
1UF 1UF FC2 20
FC50 1UF

2 UF 225V
50V 1UF C1006
33KOHM
FC54 1UF

FR110

10UF
1/10W

5 V 222UF 25V
FC51 FC53
E
D2

FR220
10KOHM FR1 90
VC01

B
225V

C Q2 10KOHM
D3

FQ6
FC52
DGND
1UF C
50V DGND ECO B
DGND E

DGND

6-6 Copyright© 1995-2016 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.7. JACK
AN400
POWER 10022HS -08C00

8
7
K_VOL+ 6
AUX1
GCC02-0139R TP 3 K_VOL-
K_FUNC
K_PWR
5
4
3
2
7 T_SDA
AAR1 1
6 AUX_SENS_H
T_SCL
5 AAR2 330OHM

K_V+
K_V-
470OHM

K_F
K_P
1/16W 1/16W
4 AUX_R_H
3 AUX_L_H KD100
2 RCLAMP0 502B.TCT GND_K
AAR3

11

11
1 330OHM
1/16W
VT1

VT2
MLVS-0603-E 08

MLVS-0603-E 08

AAC6
330P F
HDGND

AAC8
330P F
16V

AAC5

50V
100NF
100NF

50V
AAC4

16V
HDGND

AAR4

AAC10
AAR5

AAC9
50V
R116 220O HM 1/10W

220KOHM

220KOHM

50V
HM3.3V

330P F

330P F
1/16W

1/16W
K_FUNC
R118 220O HM 1/10W
K_VOL-
R119 220O HM 1/10W
K_VOL+

KIC100 16 15 14
14 13
13 TOUCHCORE350-ML16I

4.7KOHM
R107

VDDIO

P2.2

P2.1

P1.5
HDGND 1 I2C1_SDA 12 R120
K_PWR
2 I2C1_SCL MGND1P1. 3/PWM1.3 11
P1. 4
220O HM
3 RES ETB 1/10W
P1. 2/PWM1.2 10
T_RST
4 VDDINT P0. 5/PWM0.5
9

5.6

PWM0.4/P0.4
HDGND

INT3/P3.3

VDDINTS

VSS
100NF 16V

UDZ5V6B
6V
UF 116V
5 6 7 8 7 6 5

KD102
C131
11UF
C133

4.7KOHM
6V
UF 116V
6V
UF 116V

C135

R111
KD101

C134
RCLAMP0 502B.TCT

11UF
11UF
HM3.3V
OPJ ACK1 HDGND
RFR-4112HP OPB D100
MGND1 1
OP C101

VCC
OP R100 OP C100

16V

0.01O HM
10V
2
100NF

10UF

GND
MGND2 3
VOUT
33OHM
1/10W

HDGND HDGND
HCN4
20043WS-H2413C

1 2 1
3 4 3
5 6 5
OP TICAL_0_H

7 8 7
9 10
11 12
13 AUX_SENS
14 15 AUX_SENS_H
AUX_L_H 16 17 T_SDA HM3.3V
AUX_R_H
18 19 T_SCL
20 21 T_RS T
OPTICAL_0_H 22 23
AUX_L T_RS T
AUX_R T_SCL
OPTIC AL_0 H3.3V T_SDA
HA_GND HD_GN D

HDGND HDGND

Copyright© 1995-2016 SAMSUNG. All rights reserved. 6-7


6. Schematic Diagram

6.7.1. Test Point Wave Form

TP3

6-8 Copyright© 1995-2016 SAMSUNG. All rights reserved.


GSPN (GLOBAL SERVICE PARTNER NETWORK)
Area Web Site

Europe, MENA,
https://gspn1.samsungcsportal.com
CIS, Africa
E.Asia, W.Asia,
https://gspn2.samsungcsportal.com
China, Japan
N.America, S.America https://gspn3.samsungcsportal.com

This Service Manual is a property of Samsung Electronics


Co.,Ltd.
© 2016 Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under
All rights reserved.
applicable International and/or domestic law.
Printed in Korea

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