You are on page 1of 21

Agilent 0.

6 Amp Output Current IGBT


Gate Drive Optocoupler
Data Sheet

Features
• 0.6 A maximum peak output
current
• 0.5 A minimum peak output
HCPL-3150 (Single Channel) current
• 15 kV/µs minimum Common Mode
HCPL-315J (Dual Channel) Rejection (CMR) at VCM = 1500 V
• 1.0 V maximum low level output
Description voltages required by gate voltage (VOL) eliminates need for
The HCPL-315X consists of a LED controlled devices. The voltage negative gate drive
optically coupled to an integrated and current supplied by this • ICC = 5 mA maximum supply
circuit with a power output stage. optocoupler makes it ideally current
This optocoupler is ideally suited suited for directly driving IGBTs • Under Voltage Lock-Out protection
for driving power IGBTs and with ratings up to 1200 V/50 A. (UVLO) with hysteresis
MOSFETs used in motor control For IGBTs with higher ratings, the • Wide operating VCC range:
inverter applications. The high HCPL-3150/315J can be used to 15 to 30 Volts
operating voltage range of the drive a discrete power stage • 0.5 µs maximum propagation delay
output stage provides the drive which drives the IGBT gate. • ± 0.35 µs maximum delay between
devices/channels
• Industrial temperature range:
Functional Diagram
-40°C to 100°C
N/C 1 16 VCC • HCPL-315J: Channel One to
N/C 1 8 VCC Channel Two output isolation =
ANODE 2 15 VO
1500 Vrms/1 min.
ANODE 2 7 VO
CATHODE 3
SHIELD
14 VEE • Safety and Regulatory Approval:
UL Recognized (UL1577)
CATHODE 3 6 VO 3750 Vrms/1 min.
ANODE 6 11 VCC
IEC/EN/DIN EN 60747-5-2
N/C 4
SHIELD
5 VEE CATHODE 7 10 VO Approved
N/C 8 9 VEE VIORM = 630 Vpeak
SHIELD
HCPL-3150 (HCPL-3150 Option 060 only)
HCPL-315J
VIORM = 891 Vpeak (HCPL-315J)
TRUTH TABLE
CSA Certified
VCC - VEE VCC - VEE
“Positive Going” “Negative-Going”
LED (i.e., Turn-On) (i.e., Turn-Off) VO
Applications
• Isolated IGBT/MOSFET gate drive
OFF 0 - 30 V 0 - 30 V LOW • AC and brushless DC motor drives
ON 0 - 11 V 0 - 9.5 V LOW • Industrial inverters
ON 11 - 13.5 V 9.5 - 12 V TRANSITION
ON 13.5 - 30 V 12 - 30 V HIGH
• Switch Mode Power Supplies
(SMPS)
• Uninterruptable Power Supplies
A 0.1 µF bypass capacitor must be connected between the VCC and
(UPS)
VEE pins for each channel.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide: Invertor Gate Drive Optoisolators
Widebody
Package Type 8-Pin DIP (300 mil) (400 mil) Small Outline SO-16
Part Number HCPL-3150 HCPL-3120 HCPL-J312 HCPL-J314 HCNW-3120 HCPL-315J HCPL-316J HCPL-314J
Number of Channels 1 1 1 1 1 2 1 2
IEC/EN/DIN EN VIORM VIORM VIORM VIORM
60747-5-2 630 Vpeak 891Vpeak 1414 Vpeak 891 Vpeak
Approvals Option 060
UL Approval 3750 3750 5000 3750
Vrms/1 min. Vrms/1 min. Vrms/1min. Vrms/1 min.
Output Peak Current 0.6A 2.5A 2.5A 0.6A 2.5A 0.6A 2.5A 0.6A
CMR (minimum) 15 kV/µs 10 kV/µs 15 kV/µs 10 kV/µs
UVLO Yes No Yes No
Fault Status No Yes No

Ordering Information
Specify Part Number followed by Option Number (if desired)
Example
HCPL-315Y#XXXX
No Option = Standard DIP package, 50 per tube.
060 = IEC/EN/DIN EN 60747-5-2 VIORM = 630 Vpeak Option, 50 per tube.
(HCPL-3150 only)
300 = Gull Wing Surface Mount Option, 50 per tube. (HCPL-3150 only)
500 = Tape and Reel Packaging Option. HCPL-3150; 1000 per reel.
HCPL-315J; 850 per reel.
XXXE = Lead Free Option
f = Single Channel, 8-pin PDIP.
J = Dual Channel, SO16.
Option data sheets available. Contact Agilent sales representative or authorized distributor.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option
will use “–”.

Package Outline Drawings


Standard DIP Package
9.40 (0.370)
9.90 (0.390)

8 7 6 5
OPTION CODE* 0.20 (0.008)
6.10 (0.240) 0.33 (0.013)
A 3150 Z DATE CODE
6.60 (0.260)
YYWW 7.36 (0.290)
7.88 (0.310) 5° TYP.

PIN ONE 1 2 3 4

1.78 (0.070) MAX.


1.19 (0.047) MAX.

3.56 ± 0.13 4.70 (0.185) MAX.


(0.140 ± 0.005)
DIMENSIONS PIN
IN MILLIMETERS
DIAGRAM AND (INCHES).
PIN ONE
0.51 (0.020) MIN. * MARKING1 CODE
VDD1LETTER
VDD2FOR
8 OPTION NUMBERS.
2.92 (0.115) MIN. "V" = OPTION 060.
OPTION NUMBERS
2 VIN+ 300 AND 500
VOUT+ 7 NOT MARKED.

0.76 (0.030) 0.65 (0.025) MAX. NOTE: FLOATING


1.40 (0.055) 3 V LEAD
V PROTRUSION
IN–6 OUT–
IS 0.25 mm (10 mils) MAX.
2.28 (0.090)
2.80 (0.110) 4 GND1 GND2 5

2
Package Outline Drawings Gull-Wing
Surface-Mount Option 300 LAND PATTERN RECOMMENDATION
9.65 ± 0.25 OPTION
(0.380 ± 0.010) 1.016 (0.040)
CODE*

8 7 6 5

A 3150 Z
6.350 ± 0.25
10.9 (0.430)
YYWW (0.250 ± 0.010)

1 2 3 4
MOLDED

2.0 (0.080)
1.27 (0.050)

1.780 9.65 ± 0.25


(0.070) (0.380 ± 0.010)
1.19 MAX.
(0.047) 7.62 ± 0.25
MAX. (0.300 ± 0.010)
0.20 (0.008)
3.56 ± 0.13 0.33 (0.013)
(0.140 ± 0.005)

1.080 ± 0.320 0.635 ± 0.25


(0.043 ± 0.013) (0.025 ± 0.010)
0.635 ± 0.130
2.540 (0.025 ± 0.005) 12° NOM.
(0.100)
BSC

DIMENSIONS IN MILLIMETERS (INCHES). *MARKING CODE LETTER FOR OPTION


TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01 NUMBERS.
xx.xxx = 0.005 "V" = OPTION 060.
LEAD COPLANARITY OPTION NUMBERS 300 AND 500 NOT MARKED.
MAXIMUM: 0.102 (0.004)

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

16 - Lead Surface Mount


LAND PATTERN RECOMMENDATION

16 15 14 11 10 9
VCC1
VO1
GND1

VCC2
VO2
GND2

10.36 ± 0.20 HCPL-315J (0.295 ± 0.004) (0.458) 11.63


(0.408 ± 0.008) 7.49 ± 0.10
VIN1

VIN2
NC

NC
V1

V2

1 2 3 6 7 8
(0.085) 2.16

(0.025) 0.64

(0.004 – 0.011)
0.10 – 0.30 (0.345 ± 0.008)
STANDOFF 8.76 ± 0.20

VIEW
FROM
PIN 16
0 - 8°

(0.025 MIN.) (0.0091 – 0.0125)
0.64 0.23 – 0.32
VIEW (0.138 ± 0.005) (0.408 ± 0.008)
FROM 3.51 ± 0.13 10.36 ± 0.20
PIN 1

ALL LEADS TO BE COPLANAR ± (0.002 INCHES) 0.05 mm.


(0.018) (0.050)
0.457 1.27 DIMENSIONS IN (INCHES) AND MILLIMETERS.
(0.406 ± 0.007)
10.31 ± 0.18 NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

3
Solder Reflow Thermal Profile Regulatory Information
The HCPL-3150 and HCPL-315J
300
have been approved by the
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. following organizations:
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK
PEAK
TEMP.
TEMP.
245°C
240°C
PEAK
UL
TEMP.
230°C
Recognized under UL 1577,
TEMPERATURE (°C)

200
2.5°C ± 0.5°C/SEC.
SOLDERING Component Recognition
TIME
160°C 30
SEC. 200°C Program, File E55361.
150°C
140°C
30
3°C + 1°C/–0.5°C SEC.
CSA
100
PREHEATING TIME
Approved under CSA
50 SEC.
150°C, 90 + 30 SEC. Component Acceptance Notice
TIGHT
TYPICAL
#5, File CA 88324.
ROOM
TEMPERATURE LOOSE

0
0 50 100 150 200 250
IEC/EN/DIN EN 60747-5-2
TIME (SECONDS)
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
Recommended Pb-Free IR Profile (Option 060 and HCPL-315J
only)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
tp
20-40 SEC.
260 +0/-5 °C
Tp
217 °C
TL
RAMP-UP
TEMPERATURE

3 °C/SEC. MAX. RAMP-DOWN


150 - 200 °C 6 °C/SEC. MAX.
Tsmax
Tsmin
ts tL
PREHEAT 60 to 150 SEC.
60 to 180 SEC.

25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C

4
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics
Description Symbol HCPL-3150#060 HCPL-315J** Unit
Installation classification per DIN VDE
0110/1.89, Table 1
for rated mains voltage ≤ 150 Vrms I-IV
for rated mains voltage ≤ 300 Vrms I-IV I-III
for rated mains voltage ≤ 600 Vrms I-III I-II
Climatic Classification 55/100/21 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2 2
Maximum Working Insulation Voltage VIORM 630 891 Vpeak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with VPR 1181 1670 Vpeak
tm = 1 sec, Partial discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and Sample Test, VPR 945 1336 Vpeak
tm = 60 sec, Partial discharge < 5 pC
Highest Allowable Overvoltage* VIOTM 6000 6000 Vpeak
(Transient Overvoltage tini = 10 sec)
Safety-Limiting Values – Maximum Values Allowed
in the Event of a Failure, also see Figure 37,
Thermal Derating Curve.
Case Temperature TS 175 175 °C
Input Current IS, INPUT 230 400 mA
Output Power PS, OUTPUT 600 1200 mW
Insulation Resistance at TS, VIO = 500 V RS ≥ 109 ≥ 109 Ω

**Approval Pending.
*Refer to the front of the optocoupler section of the current Catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a
detailed description of Method a and Method b partial discharge test profiles.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.

5
Insulation and Safety Related Specifications
Parameter Symbol HCPL-3150 HCPL-315J Units Conditions
Minimum External Air Gap L(101) 7.1 8.3 mm Measured from input terminals to
(External Clearance) output terminals, shortest distance
through air.
Minimum External Tracking L(102) 7.4 8.3 mm Measured from input terminals to
(External Creepage) output erminals, shortest distance
path along body.
Minimum Internal Plastic 0.08 ≥0.5 mm Through insulation distance conductor
Gap (Internal Clearance) to conductor.
Tracking Resistance CTI ≥175 ≥175 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking
Index)
Isolation Group IIIa IIIa Material Group (DIN VDE 0110, 1/89,
Table 1)

Option 300 - surface mount classification is Class A in accordance wtih CECC 00802.

Absolute Maximum Ratings


Parameter Symbol Min. Max. Units Note
Storage Temperature TS -55 125 °C
Operating Temperature TA -40 100 °C
Average Input Current IF(AVG) 25 mA 1, 16
Peak Transient Input Current IF(TRAN) 1.0 A
(<1 µs pulse width, 300 pps)
Reverse Input Voltage VR 5 Volts
“High” Peak Output Current IOH(PEAK) 0.6 A 2, 16
“Low” Peak Output Current IOL(PEAK) 0.6 A 2, 16
Supply Voltage (VCC - VEE) 0 35 Volts
Output Voltage VO(PEAK) 0 VCC Volts
Output Power Dissipation PO 250 mW 3, 16
Total Power Dissipation PT 295 mW 4, 16
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile See Package Outline Drawings Section

Recommended Operating Conditions


Parameter Symbol Min. Max. Units
Power Supply Voltage (VCC - VEE) 15 30 Volts
Input Current (ON) IF(ON) 7 16 mA
Input Voltage (OFF) VF(OFF) -3.0 0.8 V
Operating Temperature TA -40 100 °C

6
Electrical Specifications (DC)
Over recommended operating conditions (TA = -40 to 100°C, IF(ON) = 7 to 16 mA, VF(OFF) = -3.0 to 0.8 V, VCC = 15 to 30 V,
VEE = Ground, each channel) unless otherwise specified.
Parameter Symbol Min. Typ.* Max. Units Test Conditions Fig. Note
High Level Output IOH 0.1 0.4 A VO = (VCC - 4 V) 2, 3, 5
Current 0.5 VO = (VCC - 15 V) 17 2
Low Level Output IOL 0.1 0.6 A VO = (VEE + 2.5 V) 5, 6, 5
Current 0.5 VO = (VEE + 15 V) 18 2
High Level Output VOH (VCC - 4) (VCC - 3) V IO = -100 mA 1, 3, 6, 7
Voltage 19
Low Level Output VOL 0.4 1.0 V IO = 100 mA 4, 6,
Voltage 20
High Level Supply ICCH 2.5 5.0 mA Output Open, 7, 8 16
Current IF = 7 to 16 mA
Low Level Supply ICCL 2.7 5.0 mA Output Open,
Current VF = -3.0 to +0.8 V
Threshold Input IFLH 2.2 5.0 mA HCPL-3150 I O = 0 mA, 9, 15,
Current Low to High 2.6 6.4 HCPL-315J VO > 5 V 21
Threshold Input VFHL 0.8 V
Voltage High to Low
Input Forward Voltage VF 1.2 1.5 1.8 V HCPL-3150 I F = 10 mA 16
1.6 1.95 HCPL-315J
Temperature Coefficient ∆VF/∆TA -1.6 mV/°C IF = 10 mA
of Forward Voltage
Input Reverse BVR 5 V HCPL-3150 I R = 10 µA
Breakdown Voltage 3 HCPL-315J IR = 10 µA
Input Capacitance CIN 70 pF f = 1 MHz, VF = 0 V
UVLO Threshold VUVLO+ 11.0 12.3 13.5 V VO > 5 V, 22,
VUVLO- 9.5 10.7 12.0 IF = 10 mA 36
UVLO Hysteresis UVLOHYS 1.6 V

*All typical values at TA = 25°C and VCC - VEE = 30 V, unless otherwise noted.

7
Switching Specifications (AC)
Over recommended operating conditions (TA = -40 to 100°C, I F(ON) = 7 to 16 mA, V F(OFF) = -3.0 to 0.8 V, VCC = 15 to 30 V,
VEE = Ground) unless otherwise specified.
Parameter Symbol Min. Typ.* Max. Units Test Conditions Fig. Note
Propagation Delay Time tPLH 0.10 0.30 0.50 µs Rg = 47 Ω, 10, 11, 14
to High Output Level Cg = 3 nF, 12, 13,
Propagation Delay Time tPHL 0.10 0.30 0.50 µs f = 10 kHz, 14, 23
to Low Output Level Duty Cycle = 50%
Pulse Width Distortion PWD 0.3 µs 15
Propagation Delay PDD -0.35 0.35 µs 34, 36 10
Difference Between Any (tPHL - tPLH)
Two Parts or Channels
Rise Time tr 0.1 µs 23
Fall Time tf 0.1 µs
UVLO Turn On Delay tUVLO ON 0.8 µs VO > 5 V, IF = 10 mA 22
UVLO Turn Off Delay tUVLO OFF 0.6 VO < 5 V, IF = 10 mA
Output High Level |CMH| 15 30 kV/µs TA = 25°C, 24 11, 12
Common Mode Transient IF = 10 to 16 mA,
Immunity VCM = 1500 V,
VCC = 30 V
Output Low Level |CML| 15 30 kV/µs TA = 25°C, 11, 13
Common Mode Transient VCM = 1500 V,
Immunity VF = 0 V, V CC = 30 V

8
Package Characteristics (each channel, unless otherwise specified)
Parameter Symbol Device Min. Typ. Max. Units Test Conditions Fig. Note
Input-Output Momentary V ISO HCPL-3150 3750 V RMS RH < 50%, t = 1 min., 8, 9
Withstand Voltage** HCPL-315J 3750 TA = 25°C
Output-Output Momentary V O-O HCPL-315J 1500 Vrms RH < 50%, t = 1 min., 17
Withstand Voltage** TA = 25°C
Resistance (Input-Output) RI-O 1012 Ω V I-O = 500 V DC 9
Capacitance (Input-Output) CI-O HCPL-3150 0.6 pF f = 1 MHz
HCPL-315J 1.3
LED-to-Case Thermal qLC HCPL-3150 391 °C/W Thermocouple 28 18
Resistance located at center
LED-to-Detector Thermal qLD HCPL-3150 439 °C/W underside of package
Resistance
Detector-to-Case Thermal qDC HCPL-3150 119 °C/W
Resistance

*All typical values at T A = 25°C and VCC - VEE = 30 V, unless otherwise noted.
**The Input-Output/Output-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output/
output-output continuous voltage rating. For the continuous voltage rating refer to your equipment level safety specification or Agilent Application
Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”

Notes:
1. Derate linearly above 70° C free-air 7. Maximum pulse width = 1 ms, 12. The difference between tPHL and t PLH
temperature at a rate of 0.3 mA/ ° C. maximum duty cycle = 20%. between any two HCPL-3120 parts
2. Maximum pulse width = 10 µs, 8. In accordance with UL1577, each under the same test condition.
maximum duty cycle = 0.2%. This optocoupler is proof tested by 13. Pins 1 and 4 need to be connected to
value is intended to allow for applying an insulation test voltage LED common.
component tolerances for designs ≥4500 Vrms for 1 second (leakage 14. Common mode transient immunity
with I O peak minimum = 2.0 A. See detection current limit, II-O ≤ 5 µA). in the high state is the maximum
Applications section for additional 9. In accordance with UL1577, each tolerable dVCM /dt of the common
details on limiting IOH peak. optocoupler is proof tested by mode pulse, VCM, to assure that the
3. Derate linearly above 70° C free-air applying an insulation test voltage output will remain in the high state
temperature at a rate of 4.8 mW/ ° C. ≥4500 Vrms for 1 second (leakage (i.e., VO > 15.0 V).
4. Derate linearly above 70° C free-air detection current limit, II-O ≤ 5 µA). 15. Common mode transient immunity
temperature at a rate of 5.4 mW/ °C. 10. In accordance with UL1577, each in a low state is the maximum
The maximum LED junction tem- optocoupler is proof tested by tolerable dVCM/dt of the common
perature should not exceed 125° C. applying an insulation test voltage mode pulse, VCM, to assure that the
5. Maximum pulse width = 50 µs, ≥6000 Vrms for 1 second (leakage output will remain in a low state (i.e.,
maximum duty cycle = 0.5%. detection current limit, II-O ≤ 5 µA). VO < 1.0 V).
6. In this test VOH is measured with a dc 11. Device considered a two-terminal 16. This load condition approximates
load current. When driving device: pins 1, 2, 3, and 4 shorted the gate load of a 1200 V/75A IGBT.
capacitive loads VOH will approach together and pins 5, 6, 7, and 8 17. Pulse Width Distortion (PWD) is
VCC as IOH approaches zero amps. shorted together. defined as |tPHL-tPLH| for any given
device.

9
(VOH - VCC ) – HIGH OUTPUT VOLTAGE DROP – V

(VOH - VCC ) – OUTPUT HIGH VOLTAGE DROP – V


0 0.50 -1
IF = 7 to 16 mA IF = 7 to 16 mA

IOH – OUTPUT HIGH CURRENT – A


IOUT = -100 mA VOUT = VCC - 4 V 100 °C
VCC = 15 to 30 V 0.45 VCC = 15 to 30 V -2 25 °C
-1 VEE = 0 V VEE = 0 V -40 °C

0.40 -3
-2

0.35 -4

-3 IF = 7 to 16 mA
0.30 -5 VCC = 15 to 30 V
VEE = 0 V

-4 0.25 -6
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1.0
TA – TEMPERATURE – °C TA – TEMPERATURE – °C IOH – OUTPUT HIGH CURRENT – A

Figure 1. VOH vs. Temperature. Figure 2. IOH vs. Temperature. Figure 3. VOH vs. I OH.

1.0 1.0 5
VF(OFF) = -3.0 to 0.8 V
IOL – OUTPUT LOW CURRENT – A

VOL – OUTPUT LOW VOLTAGE – V


VF(OFF) = -3.0 to 0.8 V
VOL – OUTPUT LOW VOLTAGE – V

IOUT = 100 mA VCC = 15 to 30 V


0.8 VCC = 15 to 30 V 0.8 4 VEE = 0 V
VEE = 0 V

0.6 0.6 3

0.4 0.4 2
VF(OFF) = -3.0 to 0.8 V
VOUT = 2.5 V
0.2 0.2 1 100 °C
VCC = 15 to 30 V
VEE = 0 V 25 °C
-40 °C
0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1.0
TA – TEMPERATURE – °C TA – TEMPERATURE – °C IOL – OUTPUT LOW CURRENT – A

Figure 4. VOL vs. Temperature. Figure 5. IOL vs. Temperature. Figure 6. VOL vs. I OL.
IFLH – LOW TO HIGH CURRENT THRESHOLD – mA

3.5 3.5 5
ICCH ICCH VCC = 15 TO 30 V
ICC – SUPPLY CURRENT – mA
ICC – SUPPLY CURRENT – mA

ICCL ICCL VEE = 0 V


4 OUTPUT = OPEN
3.0 3.0

3
2.5 2.5
2
VCC = 30 V IF = 10 mA for ICCH
2.0 VEE = 0 V 2.0 IF = 0 mA for ICCL
IF = 10 mA for ICCH 1
TA = 25 °C
IF = 0 mA for ICCL VEE = 0 V
1.5 1.5 0
-40 -20 0 20 40 60 80 100 15 20 25 30 -40 -20 0 20 40 60 80 100
TA – TEMPERATURE – °C VCC – SUPPLY VOLTAGE – V TA – TEMPERATURE – °C

Figure 7. ICC vs. Temperature. Figure 8. ICC vs. VCC. Figure 9. IFLH vs. Temperature.

10
500 500 500
IF = 10 mA VCC = 30 V, VEE = 0 V IF(ON) = 10 mA
TPLH
Tp – PROPAGATION DELAY – ns

Tp – PROPAGATION DELAY – ns

Tp – PROPAGATION DELAY – ns
TA = 25 °C
TPHL Rg = 47 Ω, Cg = 3 nF IF(OFF) = 0 mA
Rg = 47 Ω TA = 25 °C VCC = 30 V, VEE = 0 V
400 Cg = 3 nF 400 DUTY CYCLE = 50% 400 Rg = 47 Ω, Cg = 3 nF
DUTY CYCLE = 50% f = 10 kHz DUTY CYCLE = 50%
f = 10 kHz f = 10 kHz

300 300 300

200 200 200


TPLH TPLH
TPHL TPHL
100 100 100
15 20 25 30 6 8 10 12 14 16 -40 -20 0 20 40 60 80 100
VCC – SUPPLY VOLTAGE – V IF – FORWARD LED CURRENT – mA TA – TEMPERATURE – °C

Figure 10. Propagation Delay vs. VCC. Figure 11. Propagation Delay vs. I F. Figure 12. Propagation Delay vs.
Temperature.

500 500 30
VCC = 30 V, VEE = 0 V VCC = 30 V, VEE = 0 V
Tp – PROPAGATION DELAY – ns

Tp – PROPAGATION DELAY – ns

TA = 25 °C TA = 25 °C

VO – OUTPUT VOLTAGE – V
IF = 10 mA IF = 10 mA 25
400 Cg = 3 nF 400 Rg = 47 Ω
DUTY CYCLE = 50% DUTY CYCLE = 50% 20
f = 10 kHz f = 10 kHz
300 300 15

10
200 200
TPLH TPLH 5
TPHL TPHL
100 100 0
0 50 100 150 200 0 20 40 60 80 100 0 1 2 3 4 5
Rg – SERIES LOAD RESISTANCE – Ω Cg – LOAD CAPACITANCE – nF IF – FORWARD LED CURRENT – mA

Figure 13. Propagation Delay vs. Rg. Figure 14. Propagation Delay vs. Cg. Figure 15. Transfer Characteristics.

1000
TA = 25°C
IF – FORWARD CURRENT – mA

100
IF

10 +
VF

1.0

0.1

0.01

0.001
1.10 1.20 1.30 1.40 1.50 1.60
VF – FORWARD VOLTAGE – V

Figure 16. Input Current vs. Forward Voltage.

11
1 8 1 8
0.1 µF 0.1 µF
IOL
+ 4V
2 7 – 2 7
+ VCC = 15
IF = 7 to + VCC = 15 – to 30 V
16 mA – to 30 V
3 6 3 6 2.5 V +

IOH

4 5 4 5

Figure 17. IOH Test Circuit. Figure 18. IOL Test Circuit.

1 8 1 8
0.1 µF 0.1 µF
100 mA
VOH
2 7 2 7
IF = 7 to + VCC = 15 + VCC = 15
16 mA – to 30 V – to 30 V
3 6 3 6
VOL
100 mA

4 5 4 5

Figure 19. VOH Test Circuit. Figure 20. VOL Test Circuit.

1 8 1 8
0.1 µF 0.1 µF

2 7 2 7

IF + VCC = 15 IF = 10 mA + VCC
VO > 5 V – to 30 V VO > 5 V –
3 6 3 6

4 5 4 5

Figure 21. IFLH Test Circuit. Figure 22. UVLO Test Circuit.

12
1 8
0.1 µF IF
IF = 7 to 16 mA VCC = 15
+ to 30 V
2 7 –
500 Ω tr tf
+ VO
10 KHz – 90%
50% DUTY 3 6 47 Ω
CYCLE 50%
3 nF VOUT 10%
4 5
tPLH tPHL

Figure 23. tPLH, t PHL, tr , and tf Test Circuit and Waveforms.

VCM
δV VCM
1 8 =
IF δt ∆t
A 0.1 µF
0V
2 7
B
+ + ∆t
5V VO –

VCC = 30 V
3 6 VOH
VO

SWITCH AT A: IF = 10 mA
4 5
VO VOL

SWITCH AT B: IF = 0 mA
+

VCM = 1500 V

Figure 24. CMR Test Circuit and Waveforms.

Applications Information the emitter by Rg + 4 Ω. or emitter traces close to the


Eliminating Negative IGBT Gate Minimizing Rg and the lead HCPL-3150/315J input as this
Drive inductance from the HCPL-3150/ can result in unwanted coupling
To keep the IGBT firmly off, the 315J to the IGBT gate and of transient signals into the
HCPL-3150/315J has a very low emitter (possibly by mounting HCPL-3150/315J and degrade
maximum VOL specification of the HCPL-3150/315J on a small performance. (If the IGBT drain
1.0 V. The HCPL-3150/315J PC board directly above the must be routed near the HCPL-
realizes this very low VOL by IGBT) can eliminate the need for 3150/315J input, then the LED
using a DMOS transistor with negative IGBT gate drive in should be reverse-biased when
4 Ω (typical) on resistance in its many applications as shown in in the off state, to prevent the
pull down circuit. When the Figure 25. Care should be taken transient signals coupled from
HCPL-3150/315J is in the low with such a PC board design to the IGBT drain from turning on
state, the IGBT gate is shorted to avoid routing the IGBT collector the HCPL-3150/315J.)

+5 V HCPL-3150
1 8
VCC = 18 V + HVDC
270 Ω 0.1 µF +

2 7
Rg

CONTROL Q1 3-PHASE
INPUT 3 6 AC

74XXX
OPEN 4 5
COLLECTOR
Q2 - HVDC

Figure 25a. Recommended LED Drive and Application Circuit.

13
HCPL-315J + HVDC
+5 V FLOATING
1 16 SUPPLY
270 Ω VCC = 18 V
CONTROL 0.1 µF +
INPUT –
2 15
74XX Rg
OPEN
COLLECTOR
3 14

GND 1 3-PHASE
AC
+5 V
6 11
VCC = 18 V
270 Ω 0.1 µF +
CONTROL –
INPUT 7 10
Rg
74XX
OPEN
8 9
COLLECTOR

GND 1 - HVDC

Figure 25b. Recommended LED Drive and Application Circuit (HCPL-315J).

Selecting the Gate Resistor (Rg) to The VOL value of 2 V in the pre- PT = PE + PO
Minimize IGBT Switching Losses. vious equation is a conservative PE = I F • VF • Duty Cycle
(Discussion applies to HCPL-3120, value of VOL at the peak current PO = PO(BIAS) + PO (SWITCHING)
HCPL-J312 and HCNW3120) of 0.6A (see Figure 6). At lower = ICC • (VCC - VEE)
Step 1: Calculate Rg Minimum Rg values the voltage supplied + ESW(RG, QG) • f
from the IOL Peak by the HCPL-3150/315J is not an
Specification. The IGBT and Rg ideal voltage step. This results in For the circuit in Figure 26 with
in Figure 26 can be analyzed as a lower peak currents (more IF (worst case) = 16 mA,
simple RC circuit with a voltage margin) than predicted by this Rg = 30.5 Ω, Max Duty
supplied by the analysis. When negative gate Cycle = 80%, Qg = 500 nC,
HCPL-3150/315J. drive is not used VEE in the f = 20 kHz and TA
previous equation is equal to max = 90°C:
(V CC – VEE - VOL) zero volts.
Rg ≥ ————————————
IOLPEAK PE = 16 mA • 1.8 V • 0.8 = 23 mW
Step 2: Check the HCPL-3150/
(V CC – VEE - 1.7 V) 315J Power Dissipation and PO = 4.25 mA • 20 V
= —————————————
IOLPEAK Increase Rg if Necessary. The + 4.0 µJ• 20 kHz
HCPL-3150/315J total power = 85 mW + 80 mW
(15 V + 5 V - 1.7 V) dissipation (PT ) is equal to the = 165 mW
= —————————————
2.5 A sum of the emitter power (PE) > 154 mW (PO(MAX) @ 90°C
and the output power (PO): = 250 mW-20C• 4.8 mW/C)
= 30.5 Ω

14
+5 V HCPL-3150
1 8
VCC = 15 V + HVDC
270 Ω 0.1 µF +

2 7
Rg

CONTROL Q1 3-PHASE
3 6 AC
INPUT VEE = -5 V

+
74XXX
OPEN 4 5
COLLECTOR
Q2 - HVDC

Figure 26a. HCPL-3150 Typical Application Circuit with Negative IGBT Gate Drive.

HCPL-315J + HVDC
+5 V FLOATING
1 16 SUPPLY
270 Ω VCC = 15 V
CONTROL 0.1 µF +
INPUT –
2 15
74XX Rg
OPEN
COLLECTOR
3 14 –
+
VEE = -5 V
GND 1 3-PHASE
AC
+5 V
6 11
VCC = 15 V
270 Ω 0.1 µF +
CONTROL –
INPUT 7 10
Rg
74XX
OPEN
8 9 –
COLLECTOR +
VCC = -5 V
GND 1 - HVDC

Figure 26b. HCPL-315J Typical Application Circuit with Negative IGBT Gate Drive.

PE Parameter Description P O Parameter Description


IF LED Current I CC Supply Current
VF LED On Voltage V CC Positive Supply Voltage
Duty Cycle Maximum LED V EE Negative Supply Voltage
Duty Cycle E SW(Rg,Qg) Energy Dissipated in the HCPL-3150/315J for each IGBT
Switching Cycle (See Figure 27)
f Switching Frequency

15
The value of 4.25 mA for I CC in value of qCA depends on the TJE = PE • (230°C/W + qCA )
the previous equation was conditions of the board design + PD • (49° C/W + qCA) + TA
obtained by derating the ICC max and is, therefore, determined by TJD = PE • (49° C/W + qCA)
of 5 mA (which occurs at -40°C) the designer. The value of qCA = + PD • (104° C/W + qCA) + TA
to ICC max at 90°C (see 83°C/W was obtained from
Figure 7). thermal measurements using a For example, given PE = 45 mW,
2.5 x 2.5 inch PC board, with PO = 250 mW, TA = 70°C and qCA
Since P O for this case is greater small traces (no ground plane), a = 83°C/W:
than P O(MAX), Rg must be single HCPL-3150 soldered into
increased to reduce the HCPL- the center of the board and still TJE = PE• 313°C/W + PD• 132°C/W + TA
3150 power dissipation. air. The absolute maximum = 45 mW• 313°C/W + 250 mW
power dissipation derating • 132°C/W + 70° C = 117° C

PO(SWITCHING MAX) specifications assume a qCAvalue


= PO(MAX) - PO(BIAS) of 83°C/W. TJD = PE• 132°C/W + PD• 187°C/W + TA
= 154 mW - 85 mW = 45 mW• 132°C/W + 250 mW
= 69 mW From the thermal mode in • 187°C/W + 70° C = 123° C

PO(SWITCHINGMAX) Figure 28a the LED and detector


ESW(MAX) = ——————————— IC junction temperatures can be TJE and TJD should be limited to
f
expressed as: 125° C based on the board layout
69 mW = 3.45
= ————— µJ and part placement (qCA) specific
20 kHz TJE = PE • (qLC||(qLD + qDC) + qCA) to the application.
qLC • qDC
For Qg = 500 nC, from Figure 27, + PD • (——————————— + qCA) + TA
a value of ESW = 3.45 µJ gives a qLC + qDC + qLD
Rg = 41 Ω.
qLC • qDC
TJD = PE (—————————— +q )
Thermal Model qLC + qDC + qLD CA
(HCPL-3150)
The steady state thermal model
+ PD• (qDC||(qLD + qLC) + qCA) + TA
for the HCPL-3150 is shown in
Figure 28a. The thermal
resistance values given in this Inserting the values for qLC and
model can be used to calculate qDC shown in Figure 28 gives:
the temperatures at each node
for a given operating condition.
As shown by the model, all heat
generated flows through qCA
which raises the case
temperature TC accordingly. The

θLD = 439°C/W TJE = LED junction temperature


TJE TJD TJD = detector IC junction temperature
TC = case temperature measured at the center of the package bottom
θLC = 391°C/W θDC = 119°C/W
qLC = LED-to-case thermal resistance
TC
qLD = LED-to-detector thermal resistance
θCA = 83°C/W* qDC = detector-to-case thermal resistance
qCA = case-to-ambient thermal resistance
*qCA will depend on the board design and the placement of the part.
TA

Figure 28a. Thermal Model.

16
θ1
Thermal Model Dual-Channel LED 1 LED 2

(SOIC-16) HCPL-315J Optoisolator θ2 θ3


Definitions
q1, q2, q3, q4, q5, q6, q7, q8, q9, θ4 θ5
q10: Thermal impedances
between nodes as shown in
Figure 28b. Ambient DETECTOR 1 DETECTOR 2

Temperature: Measured θ7 θ10 θ6


approximately 1.25 cm above the θ8 θ9
optocoupler with no forced air.

Description
This thermal model assumes
that a 16-pin dual-channel
(SOIC-16) optocoupler is
AMBIENT
soldered into an 8.5 cm x 8.1 cm
printed circuit board (PCB).
These optocouplers are hybrid
Figure 28b. Thermal Impedance Model for HCPL-315J.
devices with four die: two LEDs
and two detectors. The
temperature at the LED and the
detector of the optocoupler can
be calculated by using the
PE1 PD1
equations below.

DT E1A = A 11P E1 + A12 PE2 +A13 PD1+A 14PD2


DT E2A = A 21P E1 + A22 PE2 +A23 PD1+A 24PD2
DT D1A = A 31P E1 + A32 PE2 +A33P D1+A34 PD2
PE2 PD2
DT D2A = A 41P E1 + A42 PE2 +A43P D1+A44 PD2

where:
DT E1A = Temperature difference between ambient and LED 1
DT E2A = Temperature difference between ambient and LED 2
DT D1A = Temperature difference between ambient and detector 1
DT D2A = Temperature difference between ambient and detector 2
PE1 = Power dissipation from LED 1;
PE2 = Power dissipation from LED 2;
PD1 = Power dissipation from detector 1;
PD2 = Power dissipation from detector 2
Axy thermal coefficient (units in °C/W) is a function of thermal
impedances q1 through q10 .

Thermal Coefficient Data (units in °C/W)


Part Number A11, A 22 A12, A 21 A13, A 31 A24, A 42 A14, A 41 A23, A 32 A33, A 44 A34, A 43
HCPL-315J 198 64 62 64 83 90 137 69

Note: Maximum junction temperature for above part: 125°C.

17
Esw – ENERGY PER SWITCHING CYCLE – µJ
LED Drive Circuit Considerations for 7
not recommended for applica-
Ultra High CMR Performance Qg = 100 nC tions requiring ultra high CMRL
6 Qg = 250 nC performance. Figure 33 is an
Without a detector shield, the Qg = 500 nC
dominant cause of optocoupler 5 alternative drive circuit which,
CMR failure is capacitive VCC = 19 V like the recommended
4
coupling from the input side of VEE = -9 V application circuit (Figure 25),
the optocoupler, through the 3 does achieve ultra high CMR
package, to the detector IC as performance by shunting the
2
shown in Figure 29. The HCPL- LED in the off state.
1
3150/315J improves CMR
performance by using a detector 0 Under Voltage Lockout Feature
0 20 40 60 80 100
IC with an optically transparent The HCPL-3150/315J contains
Rg – GATE RESISTANCE – Ω
Faraday shield, which diverts an under voltage lockout (UVLO)
the capacitively coupled current feature that is designed to
Figure 27. Energy Dissipated in the HCPL- protect the IGBT under fault
away from the sensitive IC 3150 for Each IGBT Switching Cycle.
circuitry. How ever, this shield conditions which cause the
does not eliminate the capacitive HCPL-3150/315J supply voltage
coupling between the LED and (equivalent to the fully-charged
optocoupler pins 5-8 as shown below the threshold during a IGBT gate voltage) to drop below
in Figure 30. This capacitive transient. A minimum LED cur- a level necessary to keep the
coupling causes perturbations in rent of 10 mA provides adequate IGBT in a low resistance state.
the LED current during common margin over the maximum IFLH When the HCPL-3150/315J
mode transients and becomes of 5 mA to achieve 15 kV/µs output is in the high state and
the major source of CMR failures CMR. the supply voltage drops below
for a shielded optocoupler. The the HCPL-3150/315J VUVLO-
main design objective of a high CMR with the LED Off (CMRL) threshold (9.5 <VUVLO- <12.0),
CMR LED drive circuit becomes A high CMR LED drive circuit the optocoupler output will go
keeping the LED in the proper must keep the LED off into the low state with a typical
state (on or off) during common (VF ≤ VF(OFF)) during common delay, UVLO Turn Off Delay, of
mode transients. For example, mode transients. For example, 0.6 µs. When the HCPL-3150/
the recommended application during a -dVCM /dt transient in 315J output is in the low state
circuit (Figure 25), can achieve Figure 31, the current flowing and the supply voltage rises
15 kV/µs CMR while minimizing through CLEDP also flows above the HCPL-3150/315J
component complexity. through the RSAT and VSAT of VUVLO+ threshold
the logic gate. As long as the low (11.0 < VUVLO+ < 13.5), the
Techniques to keep the LED in state voltage developed across optocoupler will go into the high
the proper state are discussed in the logic gate is less than state (assuming LED is “ON”)
the next two sections. VF(OFF), the LED will remain off with a typical delay, UVLO
and no common mode failure TURN On Delay, of 0.8 µs.
will occur.
CMR with the LED On (CMRH) IPM Dead Time and Propagation
A high CMR LED drive circuit The open collector drive circuit, Delay Specifications
must keep the LED on during shown in Figure 32, cannot keep The HCPL-3150/315J includes a
common mode transients. This is the LED off during a +dVCM/dt Propagation Delay Difference
achieved by overdriving the LED transient, since all the current (PDD) specification intended to
current beyond the input flowing through CLEDN must be help designers minimize “dead
threshold so that it is not pulled supplied by the LED, and it is time” in their power inverter

18
designs. Dead time is the time 34. The amount of delay minimum propagation delay
period during which both the necessary to achieve this condi- difference specifications as
high and low side power tions is equal to the maximum shown in Figure 35. The
transistors (Q1 and Q2 in Figure value of the propagation delay maximum dead time for the
25) are off. Any overlap in Q1 difference specification, HCPL-3150/315J is 700 ns
and Q2 conduction will result in PDDMAX, which is specified to be (= 350 ns - (-350 ns)) over an
large currents flowing through 350 ns over the operating operating temperature range of
the power devices from the high- temperature range of -40° C to -40° C to 100°C.
to the low-voltage motor rails. 100°C.
Note that the propagation delays
To minimize dead time in a Delaying the LED signal by the used to calculate PDD and dead
given design, the turn on of maximum propagation delay time are taken at equal tempera-
LED2 should be delayed difference ensures that the tures and test conditions since
(relative to the turn off of LED1) minimum dead time is zero, but the optocouplers under
so that under worst-case it does not tell a designer what consideration are typically
conditions, transistor Q1 has the maximum dead time will be. mounted in close proximity to
just turned off when transistor The maximum dead time is each other and are switching
Q2 turns on, as shown in Figure equivalent to the difference identical IGBTs.
between the maximum and

1 8 1 CLEDO1 8

CLEDP CLEDP
2 7 2 7

CLEDO2

3 6 3 6
CLEDN CLEDN

4 5 4 5
SHIELD

Figure 29. Optocoupler Input to Output Capacitance Model Figure 30. Optocoupler Input to Output Capacitance Model
for Unshielded Optocouplers. for Shielded Optocouplers.

+5 V 1 8
0.1
CLEDP µF +
– VCC = 18 V
+ 2 7
ILEDP
VSAT

3 6 •••
CLEDN
Rg

4 5 •••
SHIELD

* THE ARROWS INDICATE THE DIRECTION


OF CURRENT FLOW DURING –dVCM/dt.

+ –
VCM

Figure 31. Equivalent Circuit for Figure 25 During Common Mode Transient.

19
1 8 1 8
+5 V +5 V
CLEDP CLEDP
2 7 2 7

3 6 3 6
Q1 CLEDN CLEDN

ILEDN

4 5 4 5
SHIELD SHIELD

Figure 32. Not Recommended Open Collector Drive Figure 33. Recommended LED Drive Circuit for Ultra-
Circuit. High CMR.

ILED1 ILED1

VOUT1 VOUT1
Q1 ON Q1 ON
Q1 OFF Q1 OFF

Q2 ON Q2 ON
Q2 OFF VOUT2 Q2 OFF
VOUT2

ILED2 ILED2
tPHL MAX tPHL MIN
tPLH MIN tPHL MAX
PDD* MAX = (tPHL- tPLH)MAX = tPHL MAX - tPLH MIN tPLH
MIN
*PDD = PROPAGATION DELAY DIFFERENCE tPLH MAX
NOTE: FOR PDD CALCULATIONS THE PROPAGATION DELAYS
(tPHL-tPLH) MAX
ARE TAKEN AT THE SAME TEMPERATURE AND TEST CONDITIONS.
= PDD* MAX

Figure 34. Minimum LED Skew for Zero Dead Time. MAXIMUM DEAD TIME
(DUE TO OPTOCOUPLER)
= (tPHL MAX - tPHL MIN) + (tPLH MAX - tPLH MIN)
= (tPHL MAX - tPLH MIN) – (tPHL MIN - tPLH MAX)
= PDD* MAX – PDD* MIN

*PDD = PROPAGATION DELAY DIFFERENCE


NOTE: FOR DEAD TIME AND PDD CALCULATIONS ALL PROPAGATION
DELAYS ARE TAKEN AT THE SAME TEMPERATURE AND TEST CONDITIONS.

Figure 35. Waveforms for Dead Time.


OUTPUT POWER – PS, INPUT CURRENT – IS
14 800
PS (mW)
12 700
IS (mA)
VO – OUTPUT VOLTAGE – V

(12.3, 10.8) 600


10
(10.7, 9.2)
500
8
400
6
300
4
200
2 100
(10.7, 0.1) (12.3, 0.1)
0 0
0 5 10 15 20 0 25 50 75 100 125 150 175 200
(VCC - VEE ) – SUPPLY VOLTAGE – V TS – CASE TEMPERATURE – °C

Figure 36. Under Voltage Lock Out. Figure 37a. HCPL-3150: Thermal Derating Curve,
Dependence of Safety Limiting Value with Case
Temperature per IEC/EN/DIN EN 60747-5-2.

1400
PSI OUTPUT
1200 PSI INPUT
PSI – POWER – mW

1000

800

600

400

200

0
0 25 50 75 100 125 150 175 200
TS – CASE TEMPERATURE – °C

Figure 37b. HCPL-315J: Thermal Derating Curve, Dependence of Safety


Limiting Value with Case Temperature per IEC/EN/DIN EN 60747-5-2.

www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/Interna-
tional), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
Obsoletes 5989-2142EN
April 24, 2005
5989-2944EN

You might also like