Saitel DP: M583A0000y / SM - DI32

Saitel DP
M583A0000y / SM_DI32
User Manual
This manual provides information for the assembly, wiring, configuration and
maintenance of the SM_DI32 module.
SE-USR-M583
Publication Date (09/2019)

Read carefully the information contained in this manual before assembly, installation and use of the
equipment.
www.schneider-electric.com
26/09/2019 User Manual – SM_DI32
Change control
Rev Date Description
01 26-09-2019 Initial edition.
General Information
The Saitel platform and all its components have been developed in accordance to the requirements for a quality
management system, complying with the ISO 9001:2015 Norm.
Document nº: SE-USR-M583

Revision/Date: 00 / 26-09-2019
File: SM_DI32 – User Manual_EN_01.pdf
Retention period: Permanent throughout its validation period + 3 years after
its cancellation.
Reference Documents
User Manual Document Code
Easergy Builder User Manual FTE-MSS-S856
SM_CPU866e User Manual SE-USR-M578
webApp User Manual FTE-WPP-S856
EOL Instructions SE-EOLI-M583
Application note AN010 (Mounting a Saitel FTE-AN010-F700

DP module in a backplane)
Software Versions:
The information in this manual is valid for the software versions listed below. This information is also valid for later
versions, although some parameters may change slightly:
RTU Software Easergy Builder (Plugin)

Module
Module Version Plugin Version
Baseline 11.06.08
Linux Lnx 18.07.17.10.42.53
Easergy Builder Tool 1.4.7
Software SM_DI32 C0_01.00.04
Page 2
User Manual – SM_DI32 26/09/2019
Content
1 SAFETY & HEALTH .................................................................................................. 4
2 GENERAL DESCRIPTION ...................................................................................... 14
3 PHYSICAL MOUNTING & INSTALLING ................................................................ 24
4 MAINTENANCE & CONFIGURATION .................................................................... 40
5 TECHNICAL SPECIFICATION TABLE ................................................................... 60
Page 3
1 Safety & Health
Page 4
Content
1 SAFETY & HEALTH ................................................................................................... 4
1.1 INTRODUCTION ........................................................................................................ 6

1.1.1 INFORMATION OF SECURITY .............................................................................. 6
1.1.2 PRESENTATION ................................................................................................ 6
1.2 INTRODUCTION TO SAFETY ....................................................................................... 7
1.3 SYMBOLS AND LABELS ON THE EQUIPMENT............................................................... 8
1.4 INSTALLATION, SETUP AND OPERATION .................................................................... 8
1.5 EARTHING.............................................................................................................. 10
1.5.1 ELECTRICAL SAFETY ...................................................................................... 10
1.5.2 FUNCTIONAL EARTH (EMC) ............................................................................ 11
1.6 HANDLING ELECTRONIC COMPONENTS ................................................................... 11
1.7 TECHNICAL SPECIFICATIONS FOR SAFETY ............................................................... 11
1.7.1 PROTECTIVE ELEMENTS ................................................................................. 11
1.7.2 ENVIRONMENTAL CONDITIONS ........................................................................ 12
1.7.3 STORAGE CONDITIONS ................................................................................... 12
1.8 TECHNICAL LABEL .................................................................................................. 12
1.9 PACKING AND UNPACKING ...................................................................................... 13
1.10 DECOMMISSIONING AND DISPOSAL ....................................................................... 13
1.11 NORMS AND STANDARDS / CE MARK .................................................................... 13
Page 5
1.1 Introduction
1.1.1 Information of Security

Important information
Read these instructions carefully and look at the equipment to become familiar with the device
before trying to install, operate, service or maintain it. In this manual you can find different types of
messages associated with situations that have different level of risk for people and / or for the
equipment.
This symbol indicates "DANGER" or "WARNING". This symbol informs of an

electrical risk that will cause personal injuries if the instructions are not followed.
This symbol is associated to a safety alert. It is used to warn of possible personal

injury hazards. The user must follow all instructions or messages associated to this
symbol to avoid possible injuries.
DANGER
DANGER indicates a hazardous situation which, if not avoided, will result in death or serious
injury.
WARNING
WARNING indicates a hazardous situation which, if not avoided, could result in death or
serious injury.
INFORMATION
INFORMATION is used to address practices not related to physical injury. The safety alert
symbol shall not be used with this signal word.
To Keep in Mind
Electrical equipment should be installed, operated, serviced, and maintained only by qualified
personnel. No responsibility is assumed by Schneider Electric for any consequences arising out of
the use of this material.
A qualified person is who fulfill with requirements in paragraph 1.2 .
1.1.2 Presentation
This manual provides information for a safe handling, commissioning and testing. This Safety
chapter also includes descriptions of the labels on the equipment.
Documentation for equipment ordered from Schneider Electric is dispatched separately from
manufactured goods and may not be received at the same time. Therefore, this guide is provided
to ensure that printed information which may be present on the equipment is fully understood by
the recipient.
Page 6
The technical data in this safety guide is typical only, see the technical data section of the user
manual for specific details of a particular equipment.
Before carrying out any work on the equipment the user should be familiar with the
contents of this Safety chapter and the ratings on the equipment’s rating label.
THE SAFETY SECTION MUST BE READ BEFORE STARTING ANY WORK ON
THE EQUIPMENT.
1.2 Introduction to Safety
The information in this section is intended to get that equipment is properly installed and handled in
order to maintain it in safety conditions. It is assumed that everyone who will be associated with the
equipment will be familiar with the contents of that Safety section.
When electrical equipment is in operation, dangerous voltages will be present in certain parts of the
equipment. Failure to observe warning notices, an incorrect or improper use may endanger
personnel and equipment and also cause personal injury or physical damage.
WARNING
Before working with the terminal of connection, the device must be turned off and disconnected
of the feeding.
Proper and safe operation of the equipment depends on appropriate shipping and handling, proper
storage, installation and commissioning, and on careful operation, maintenance and servicing. For
this reason, only qualified operator may work on or operate the equipment.
Qualified operator are individuals who:
• Have read and understood the information on the device and its user manual.
• Are familiar with the installation, commissioning, and operation of the equipment and of the
system to which it is being connected.
• Are able to safely perform switching operations in accordance with accepted safety engineering
practices and are authorized to energize and de-energize equipment and to isolate, ground,
and label it.
• Are trained in the care and use of safety apparatus in accordance with safety engineering
practices.
• Are trained in emergency procedures (first aid).

It is necessary to consider that the documentation of the device collects the instructions for its
installation, set up and operation. However, the manuals could not cover all the possible
circumstances neither include specific information on all the details.
In case of questions or specific problems, contact with his office of sales Schneider Electric or with
the center of attention to the customer and request the necessary information.
Page 7
1.3 Symbols and Labels on the Equipment
Before the equipment is installed or commissioned, the user must understand the following
symbols, which may be used on the equipment or referred to in the user documentation.
Table 1 – Symbols
Symbol Associated Text Description
International Electrotechnical Commission (IEC)
symbol associated to a DANGER or WARNING
Possibility of electric
message indicating that there is an electrical
chock
risk. Failure to follow these instructions could
cause damage to people or death.
Symbol associated with a risk alert. The user
Caution, read the
must read the manual before handling the
manual.
equipment.
American National Standards Institute (ANSI)
symbol associated to a DANGER or WARNING
Possibility of electric
message indicating that there is an electrical
chock
risk. Failure to follow these instructions could
cause damage to people or death.
Protective earth Associated symbol to the protective ground

connection connection. See paragraph 1.5.1 in this manual.
This symbol indicates that the equipment has

CE Mark been developed in compliance with all
applicable European Directives.
Electronic device. This symbol indicates that, at the end of its life,
Special instructions this module must be discarded according to the
must be follow for WEEE Directive (Waste Electrical and Electronic
discard it. Equipment).
The equipment has been designed and
Compliant with
manufactured according to RoHS Directive
RoHS.
(Restriction of Hazardous Substances).
Direct Voltage Symbol of direct voltage (VDC).
Alternate Voltage Symbol of alternate voltage (VAC).
1.4 Installation, Setup and Operation
This equipment uses high voltages (> 50 V). The user is responsible to check that the device is
adequate for the installation where it will be mounted. The user should read the instructions of
installation before proceeding to the use or maintenance of the device.
Not following these instructions can be dangerous for the people and the devices.
DANGER
All SM_DI32 modules are marked with a sticker on the front label (size: 12,5 mm). This label
must be visible all the time while the module is installed on the backplane.
Page 8
It is recommended to install the RTU inside a cabinet with a key. This cabinet only should be
opened by a qualified person.
WARNING
If this type of cabinet isn't available, a barrier must be installed in order to avoid an accidental
contact with these dangerous elements. This barrier only should can be removed using a
special tool.
If the barrier has to be removed in order to access to equipment, personnel responsible for the
task must be sure that the barrier is installed again when the task is finished.
While the RTU is accessible for a user, all people must follow all instructions to prevent
electrical risk or discharges.
Not following these instructions can give like result that the device do not work properly
or even can damage to the people or devices.
An electrical risk symbol with enough size must be included on the cabinet’s door or
on the barrier.
The following image shows an example:

Figure 1 - Barrier of protection for elements with dangerous voltages.
INFORMATION
Terminals will not be accessible to the user directly once it has made the installation of the
device. The cabinet will have to remain closed with key or the screen of installed protection.
The cabinet or installation must have a general switch placed just in the cable entry of the
installation (see paragraph 1.7.1 ).
For the cleaning of the equipment, it is recommended to remove the power and to use only a dry
cloth by the surface when it detects excessive presence of dust or any element deposited on the
surface.
WARNING
Don’t use liquid products of cleanliness due to the presence of active parts.
Because of the variety of uses of the product, the managers of the application and use of this
device of control will have to take the measures to ensure the fulfillment of all the requests of
security and provision of each application. The requests do reference to the applicable laws,
regulations, codes and standard.
Page 9
1.5 Earthing
WARNING
Before energizer the device, it has to be placed to earth properly such as it indicates in sections
1.5.1 and 1.5.2 .
When installing the device, ground is the first thing that should be connected and the last one
that should be disconnected.
Saitel can need put to earth for two distinct needs:
• For purposes of electrical safety (Protective Earth, PE).
• Improve the behavior in Electromagnetic Compatibility (EMC) and derive perturbations to earth
(functional Earth).
1.5.1 Electrical Safety

Only qualified personnel, with knowledge about hazards associate with electrical equipment is
allowed to install Saitel DP. In general, the installation will be following IEC 61010-1
recommendations in order to be compliant with this norm.
When Saitel DP is mounted on back-panel, the metallic enclosure of the backplane

must be connected to the ground of the cabinet or installation according to the norm
IEC 61010-1. When Saitel DP is mounted on a chassis, this chassis must be
connected to the ground of the installation.
Saitel DP modules have a plastic enclosure offering protection for isolation faults. Earthing
WARNING
All devices with high voltage must be disconnected before dismount a module.
In the cabinet where the SM_DI32 module is mounted, a dedicated connection with green/yellow
wire should be used to have electric continuity to the installation protective earth. Use a wire with
adequate section according to IEC 61010.
Figure 2 - Example of yellow/green cable for earthing.
The design and installation of the cabinet is responsible for compliance with all the existing
international and national electrical codes concerning protective grounding of any device.
WARNING
According to the electrical safety standards:
• The screw for ground must be exclusive for this use.

• The power voltage must be supplied by a power supply that offers double or reinforced
insulation against dangerous voltages.
Page 10
1.5.2 Functional Earth (EMC)

A rear connector available in each module allows the bus connection and it offers protection in
case of electric derive. The EMC grounding is implemented via three pins of this connector.
WARNING
Never connect modules on the backplanes if the power supply hasn’t been disconnected of all
circuits with high voltages.
The only modules with a ground connection are the power supplies (SM_PS and SM_PS40). Both
must be connected to the ground of the cabinet.
1.6 Handling Electronic Components
Saitel is susceptible to receive electrostatic discharges during the handling. It is necessary to take
the usual measures to minimize this risk, since serious damage to the equipment can be caused,
which may not be detected immediately but which may affect the reliability of the product.
WARNING
The enclosure ONLY should be removed when is strictly necessary, because this action has a
risk for the equipment:
• Before removing the enclosure, the operator must be equipotential with the equipment.
• Avoid touching the electronic. The board must be always manipulated for the edges.
• If the equipment has to be passed between two persons, both must be equipotential.
• Put the module always on an antistatic surface or on a surface equipotential with you.
• During the storage and transport, the module will remain in the packaging.
Not following these instructions can give like result that the equipment do not work
properly or even can damage the people or equipment.
1.7 Technical Specifications for Safety
1.7.1 Protective Elements

The cabinet's engineering and installation must include a general automatic switch next to the
cables' input in the cabinet; once the door is opened, high voltages must be interrupted inside. This
switch must be located at a place which is not accessible by a third person while the operator is
using the boards in the cabinet.
Moreover, the installation will incorporate a circuit breaker of 5A next to the cabinet protecting it
from possible overcurrent in the power supply.
Both switches will be labeled with the symbol O as "Off" and I as “On”.
WARNING
The connection / disconnection switch must be installed in a fixed element (for example the wall
of the cabinet) and it mustn’t break any earthing wire.
Page 11
1.7.2 Environmental Conditions

The protection degree of the device is IP20.
WARNING
This equipment has been designed ONLY for indoor use.
It is designed only for indoor use. If necessary for use in an outdoor environment, it must be
mounted in a specific cabinet providing an IP54 degree of protection (typical and minimum for
ATEX conditions), that is, protected against dust and water splashes.
The electronic cards of the modules will be able to be tropicalized or no according to the option of
setting chosen. The tropicalized used is the AVR80, of the company ABchimie. It can consult all the
technical information of this type of finishing in http://www.abchimie.com/.
Other data to take into account about the environmental are:
• Altitude until 2000 m.
• Operation temperature range: Between -40 ºC and 70 ºC. (IEC 60068-2-1 and IEC 60068-2-2).
• Maximum relative humidity of 95%. (IEC 60068-2-30)
• Degree of pollution II. (IEC 60255-5)
• Overvoltage transitory until levels of Category III. (IEC 60255-5)
1.7.3 Storage Conditions

The continuous exhibition to some high levels of humidity during the storage can cause damages
to the electronic components and reduce the useful life of the device.
We recommend that, in the enclosure of storage, the relative humidity do not exceed 50%.
Before the installation of an electrical equipment, it is recommended to leave the necessary time for
the acclimatization of the environmental temperature.
1.8 Technical Label
Each Saitel product includes a technical label with the following information:
Figure 3 - Technical label.
INFORMATION
On the “Technical data” zone, you can see relevant information about the input and output
voltage in the module. Any voltage greater than 50 V must be consider as a high voltage.
Page 12
1.9 Packing and Unpacking
All Saitel modules are packaged separately in their own carton box and shipped inside outer
packaging. Use special care when unpacking the device. Don’t use force.
The design revision and manufacturing options can be determined using the P/N included in the
packaging label on packaging.
After unpacking the device, inspect it visually to be sure it is in proper mechanical condition.
If the product needs to be shipped, the original packaging must be used, including foams and the
carton box. If the original packaging is no longer available, make sure that the packaging used is
according to ISO 2248 specifications for a drop height 1 m.
1.10 Decommissioning and Disposal
SM_DI32 is marked with this symbol, it means that, at the end of its life cycle, you
mustn't dispose the product together with habitual residues. To avoid possible
damage to the environment or to the human health that represents the uncontrolled
elimination of residues, please follow the instructions in EOLI document for SM_DI32.
1.11 Norms and Standards / CE Mark
Saitel has been designed and manufactured in compliance with the following Directives.
• LVD: Low voltage (2014/35/UE).
• EMC: Electromagnetic compatibility (2014/30/UE).
• RoHS 2: Restriction of Hazardous Substances (2011/65/EU).
• WEEE: Waste Electrical and Electronic Equipment (2012/19/UE).
Page 13
2 General Description
Page 14
Content
2 GENERAL DESCRIPTION ...................................................................................... 14
2.1 GENERAL DESCRIPTION OF SAITEL DP................................................................... 16

2.2 SM_DI32 MODULE ................................................................................................ 17
2.2.1 INTERFACES & FUNCTIONS ............................................................................. 17
2.3 SOFTWARE PROCESSING ....................................................................................... 18
2.3.1 DIGITAL FILTERING ......................................................................................... 19
2.3.2 CHANGE MEMORY .......................................................................................... 20
2.3.3 INPUT FUNCTIONAL ALLOCATION ..................................................................... 20
2.4 LED INDICATORS ................................................................................................... 22
Page 15
2.1 General Description of Saitel DP
The Saitel DP platform is a complete set of devices provided by Schneider Electric for real-time
control applications and power line automation. It is a high-technology platform which gives a
solution to the business areas of Schneider Electric.
The following figures show a Saitel DP in chassis (left) and in backplane (right).
Saitel DP’s design has been optimized to meet the most demanding requirements of multiple
sectors:
• Cost-efficiency, minimum downtime, and compliance with electrical safety, electromagnetic

compatibility and environmental standards.
• Safety and reliability requirements for power, gas, water, residual water supply, etc.
• Centralized monitoring and control of geographically-distributed systems which support

hierarchical data acquisition and redundant networks.
• Local monitoring and control with data sharing capabilities of plant-distributed devices.
• Quick troubleshooting by means of programmable automation execution.
• One of the most remarkable features of Saitel DP is its modular design. All I/O, CPU, power
supply and communication modules have an identical format, sharing the same enclosure.
Figure 4 – Saitel DP architecture
Page 16
2.2 SM_DI32 Module
2.2.1 Interfaces & Functions

DANGER
The module SM_DI32 has hazard of electric chock, electric arc or burns. For any of these
cases, follow these instructions:
• Only qualified operator should install this equipment. Such work should be performed only
after reading this entire set of instructions and checking the technical characteristics of the
device.
• NEVER work alone.
• Turn off all power supplying this equipment before working on or inside it. Consider all
sources of power, including the possibility of back feeding.
• Always use a properly rated voltage sensing device to confirm that all power is off.
• Start by connecting the device to the protective ground and to the functional ground.
• Screw tight all terminals, even those not in use.
Failure to follow these instructions will result in death or serious injury.
Internally, all modules are electrically connected to the backplane using a 48-pin connector on the
rear side. In relation to the field connection (external devices), two connectors are located on the
front side.
According the SM’DI32 P/N, two ordering options are available for field connection:
• Option A1  P/N: M58310000y-XX: Terminal connection.
• Option A2  P/N: M58320000y-XX: Flat-ribbon connection, using additional terminal

blocks.
Figure 5 - SM_DI32’s P/N description
The modules integrate a 12-position switch on the rear side which are used to set the addresses
and communication rate in the bus.
The main features of this module are:
• 32 configurable and high-precision digital input, distributed in two 16-signal blocks.
• Each digital input can be configured as: Single / Double / Slow counter.
• Filtering the information before transmitting it to the CPU.
• Advanced processing of digital inputs, including the management of simple or processed inputs
with chronological register and time stamping.
• The parameter “change memory time” can be set for each signal.
• The module is synchronized via a message received from the CPU.
• 36 light indicators are available on the front side.
Page 17
• Input protection against electromagnetic disturbance.
• External polarization (with automatic polarization test).
• Two commons per block.
• Galvanic isolation using optocouplers.

The diagram below illustrates the functional blocks integrated in the SM_DI32 module:
Figure 6 - Functional block diagram
• I/O to the bus: Connection to the bus in the backplane to share information with the CPU.
• LEDs: There are 36 LED indicators on the module’s front side which provide information about
the module and the input signals.
• Synchronization: SM_DI32 is synchronized via a message received from the CPU that
includes information about the time. Therefore, the module will be synchronized with the
synchronization source accuracy used for the CPU.
• Controller block: SM_DI32 does a previous processong of the information before it is

transmitted to the CPU. Additionally, every time the signal changes, it is transmitted to the CPU
as an event which includes the value change and the timestamp.
• Digital inputs: SM_DI32 mounts two connectors (flat ribbon or terminal connections
depending on the P/N) labeled as J1 and J2 which allow the 32 digital inputs to be connected
from field. Each digital input can be configured as: Single, Double or Slow counter
2.3 Software Processing
SM_DI32 can manage digital inputs with or without timestamp. In both cases, the values are 0 and
1. The module transmits the signal’s value to the CPU whenever it changes; it also attaches a
timestamp if using this type of signals.
The quality values associated to the signal’s values are:
• Invalid value due to a polarization failure.
• Locked signal.
• Invalid time: the module is not synchronized (only for signals with timestamp).
The types of points managed by coreDb and that are defined in function of these digital inputs are:
• Single digital.
• Double digital.
• Slow counter.
Page 18
INFORMATION
A maximum of 25 inputs can be configured as slow counters.
Before to send the information to the CPU, each SM_DI32 module process the information
received for each digital input (depending on the type).
This processing includes:
• Filtering time: The changes that take less than the user-specified time are rejected (Filtering
time- TF). The aim of this filtering is to prevent changes caused by transients.
• Change memory: It applies to the signals set to "event". After an event, the signal's value is
retained for a brief period of time (Change in memory- TM) before another event occurs. It
must assure the correct detection by the logic.
• Inversion: The input can be configured as enabled when the value is “1” or disabled when the
value is “0”.
• Settling Time - TS: It applies to the signals configured as double signals and it is controlled by
the CPU, not by the SM_DI32. In digital signals defined as double signals, the stand-by time
intends to create a time frame in which the deactivation of the active input is not detected until
the other input is activated
• Chronological record: This feature is applicable to the inputs configured as indications or

numeric values. The inputs configured with chronological record generate an input with time
marking when a status change is made to the inputs.
2.3.1 Digital Filtering

Digital filtering allows eliminating the changes made to the inputs if these changes are not retained
for a minimum amount of time “Filtering Time” or TF.
The filtering response from a digital input is shown in the following figures:
Figure 7 - Digital filtering in digital inputs
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2.3.2 Change Memory

The memory for changes can store the changes made to the inputs for predefined period “Memory
Time” or TM.
The change memory response from a digital input is shown in the following figure:
Figure 8 - Change memory in digital inputs
INFORMATION
Does not apply in counter mode.
2.3.3 Input Functional Allocation

With respect to the functional allocation of digital inputs, the available types of signals are:
• Simple indication.
• Double indication.
2.3.3.1 Simple Indication
It takes a module's input and represents a boolean value (YES/N0). The next figure shows its
processing:
Figure 9 - Simple indication
The diagram shows that inversion, digital filtering, change memory, and chronological treatments
are allocated to the input.
Hardware diagnostics are available, which indicates whether the value is invalid when detecting a
malfunction after a module’s internal test.
2.3.3.2 Double Indication (IDOB)
It takes two module's inputs and represents a status with four possible values. The next figure
shows its processing:
Page 20
Figure 10 - Double indication
The diagram shows that inversion, digital filtering, change memory, and chronological treatments
are allocated to the inputs.
The state validation is controlled by the “Settling Time” or TS. It is defined as the time delay
required after a change to accept a new signal status. The two inputs need to be fixed for that
period. Otherwise, the time counter will resume operation.
Processed inputs take one or more inputs of the module and represent a slow counter type analog
value.
2.3.3.3 Slow Counter (ICNT)
The processed inputs take one or more inputs in the module and represent an analog value (slow
counter). It is used to acquire counting pulses from an external generator. The next figure shows its
processing:
Figure 11 - Slow counter
The diagram shows that inversion is associated to the inputs. It also shows that the counter
supports a physical input. This input accumulates the values from the module’s slow counter. This
input always exists.
Inversion Memory Filter and Simple/Double Edge are configurable.
The capture performed by the CPU can be set using the “Filter Time” or TF. This time indicates
the writing period of the counter's value into the data tables which are accessible for the CPU.
Page 21
2.4 LED Indicators

The module integrates an input verification mechanism to detect hardware malfunctions. The
verification is performed when powering the module or when resetting the field polarization after a
polarization interruption.
This verification system monitors polarization voltages, the general status of the module and
communications.
Figure 12 - SM_SER LED indicators.
The information by the LED indicators includes:
• Acquisition and system status (Run and DIA)
• Polarization status (ST1 and ST2)
• Status for each digital input (DIx).

SM_DI32’s LED provide the following information to the operator:
Table 1 – Led indicators meaning
ST1 Recommended action

DIA RUN DIx Description
ST2
Polarization and configuration OK. The
module is in service.
Digital input x is deactivated.
The Profibus slave number assigned to the Check the type of the module and the
module is 0 or greater than 96. The CPU selected address with the rear switches
may have detected a problem into the
configuration, for example, the type of the
module is different.
Module not configured or disconnected. If Check that the module is properly
the module is connected, the address is inserted in the bus and that the
between 1 and 96 but this address haven’t assigned address is correct.
been configured.
Digital input x is active.
It lights briefly during startup. If it remains Contact the support service.

on, an error has been detected in the
firmware or during the startup process.
Page 22
ST1 Recommended action

DIA RUN DIx Description
ST2
Polarization fault in block x. If the ST1 or ST2 indicator is
flashing, the polarization voltage is
lower than the minimum required.
In this case, the LED DIA is also
flashing.
Malfunction detected in the verification If any of the DIn indicator is
mechanism for the digital input x. flashing, it means the input self-
verification system has detected a
malfunction in the associated input.
In this case, DIA is flashing too. (*)
This verification mechanism
requires cabling to be performed as
indicated in paragraph 3.3 . If the
wiring is correct but a DIx flashs,
contact the support service.
(*) The verification test is done every 3 seconds. If the problem was solved, the module must return
to a normal state. While the problem is present, the signal remains flashing.
Page 23
3 Physical Mounting & Installing
Page 24
Content
3 PHYSICAL MOUNTING & INSTALLING ................................................................ 24
3.1 INSTALLATION ....................................................................................................... 26

3.1.1 LIMITS ............................................................................................................ 26
3.1.2 HANDING........................................................................................................ 26
3.1.3 MODULE LOCATION WITHIN THE CHASSIS OR BACKPLANE ................................ 26
3.1.4 POWER SUPPLY REQUIREMENTS .................................................................... 27
3.1.5 CONFIGURATION SWITCHES ............................................................................ 27
3.1.6 MOUNTING PROCEDURE ................................................................................. 28
3.2 WIRING RECOMMENDATIONS FOR SAITEL DP ......................................................... 29
3.2.1 GROUP 1 (ANALOG SIGNALS).......................................................................... 29
3.2.2 GROUP 3 (COMMUNICATIONS) ........................................................................ 30
3.2.3 GROUP 4 (POWER SUPPLY AND POLARIZATION) .............................................. 31
3.2.4 GROUP 5 (GROUND CONNECTION).................................................................. 32
3.3 WIRING SM_DI32 .................................................................................................. 33
3.3.1 TERMINAL CONNECTION (A1) .......................................................................... 34
3.3.2 FLAT RIBBON CONNECTION (OPTION A2) ........................................................ 36
3.3.3 POLARIZATION................................................................................................ 37
3.3.4 COMMONS ..................................................................................................... 37
3.3.5 TERMINAL BLOCKS ......................................................................................... 38
Page 25
3.1 Installation
3.1.1 Limits
The maximum number of I/O modules connected to a CPU is 96.
3.1.2 Handing
DANGER
The module SM_DI32 has hazard of electric chock, electric arc or burns. Follow these
instructions:
• Only qualified personnel should install this equipment. Such work should be performed
only after reading this entire set of instructions and checking the technical characteristics
of the device.
• NEVER work alone.
• Turn off all power supplying this equipment before working on or inside it. Consider all
sources of power, including the possibility of backfeeding.
• Always use a properly rated voltage sensing device to confirm that all power is off.
• Start by connecting the device to the protective ground and to the functional ground.
• Screw tight all terminals, even those not in use.
Failure to follow these instructions will result in death or serious injury.
Please note the following precautions to avoid electrostatic damages:
• You should handle the module from the front side, as far as possible from the backplane
connectors.
• You should never touch the pins of the backplane connector.
• You should keep the module in its antistatic bag or packaging box, when unused.
WARNING
Electrostatic discharges may damage semi-conducive devices within the module.
3.1.3 Module Location within the Chassis or Backplane

All modules must be installed always in vertical position.
Figure 13 - Backplane`s positions
The user must follow some considerations regarding the where is placed each type of Saitel DP
module:
Page 26
• When using a Saitel DP power supply (SM_PS or SM_PS40), it must be in the slot 1. In
redundant-power supply configurations, there must be two reserved positions, slots 1 for PS1
and slot 2 for PS2.
• Modules must be grouped to minimize the adverse effects caused by noise and heat.
• CPU modules must be placed as far as possible from the modules which operate at alternating
currents or high currents.
• In CPU redundant systems, both control modules must be put together in the backplane.
3.1.4 Power Supply Requirements

WARNING
The voltage input for the backplane is 5.4 ± 0.2 VDC. The external voltage input isn't protected
against overvoltage nor polarity inversion, so an incorrect wiring or an incorrect adjustment of
the supply voltage could damage electronic.
The SM_PS and SM_PS40 modules (power-supplies) are scalable to supply power to the modules
connected to the backplane, as required. When using auxiliary power supplies, it is necessary to
scale them depending on the installed Saitel DP modules.
The consumption of all modules will be added plus a safety margin (between 20% and 50% of the
full power). The power supply efficiency typically, 70 - 90% shall also be considered, to protect the
chassis and power supply from overloading.
A polarization source is required for digital inputs.
The maximum power requirement for each SM_DI32 module is:
• Main power supply: Basic consumption 1
• Polarization supply 2: 32 * Max. polarization voltage per signal * Max. current per signal.
3.1.5 Configuration Switches

The module’s identification and Profibus communication speed must be set using the
microswitches on the module's rear panel. Each microswitch has the following functions:
Figure 14 - Profibus switches for module configuration
The module’s identification must be unique, selecting between 1 and 96 using microswitches 1 to
7. The address 0 and from 97 to 127 are reserved and never can be assigned. In other case,
several messages are generated when the system boot.
The address definition will be as follows:
P1*20 + P2*21 + P3*22 + P4*23 + P5*24 + P6*25 + P7*26
1
Basic consumption value is indicated in the technical specifications table at the end of this manual.
2
Polarization voltage and maximum current per signal are included in the technical specifications table.
Page 27
Assuming Px is the value assigned to the position of microswitch x (0 is OFF and 1 is ON). For
example, if switches 2, 4 and 5 are in the ON position, the Profibus address of the module is 26.
The Profibus communication speed must be the same for all Saitel DP modules, which is
determined by the speed of the master, configured by software, in the control module. The speed is
set using microswitches 9, 10 and 11 as shown in the following table:
Table 2 – Position switches
Position 11 Position 10 Position 9 Profibus Rate
OFF OFF OFF 19.2 kbaud
OFF OFF ON 93.75 kbaud
OFF ON OFF 187.5 kbaud
OFF ON ON 500 kbaud
ON OFF OFF 1.5 Mbaud
ON OFF ON Not available
ON ON OFF Not available
ON ON ON Not available
INFORMATION
Microswitches 8 and 12 are reserved and must be set to OFF, except for older version of the
SM_DI32 module (P/N: M520XX000y-ZZ).
3.1.6 Mounting Procedure

Saitel DP modules can be installed in a 19-inch chassis (SM_CHX) or a backplane SM_BPX.
When SM_BPX module is used, some problems with the installation of the modules are detected.
On the other hand, there are some configurations working correctly but the modules haven´t been
mounted correctly. This situation produces a mechanical instability and might cause serious
problems.
Following picture shows three modules inserted on the backplane. One of them has been inserted
incorrectly in spite of it is functional totally.
Figure 15 - Saitel DP module inserted incorrectly
Consult application note FTE-AN010-F700 for more information about:
• How the user should mount a Saitel DP module on a panel-mounted backplane.
• How the user should verify the installation.
• Actions that the user should do when an incorrect mounting is detected.
Page 28
To mount the module in the chassis or backplane, please follow the following instructions:
• Switch off the power supply.
• Mount the module at the desired position, and if you are using a backplane mounting,
verify that the rear rails are properly mounted using the pre-drilled holes on the
backplane.
• Firmly press the module to assure the connector fits in the connector properly. Check
whether the module is correctly mounted to the backplane base.
• Fix the module using the screw located at the top.
• Insert the terminal (mounting option A1) or flat ribbon (mounting option A2) connectors.
3.2 Wiring Recommendations for Saitel DP
In order to avoid EMC disturbances, the following considerations must be follow.

Considering the wiring types which could be used, there are five different groups:
Table 3 – Wiring groups
Group Connection type

1 Analog signals field cabling.
2 Digital signals field cabling.
3 Communications signals cabling.
4 Power supply cabling (electronic, signal polarization and auxiliary).
5 Protection cabling (earth, human protection and EMC).
To improve the EMC behavior of the equipment, it is recommended to follow the following
recommendations:
• Whenever possible, the cables from different groups should be wired separately. That is,
analog signals, digital signals and communication signals require three separate conduits.
• If separate wiring is not possible and the number of signals is reduced, this conduit can be
exceptionally shared. In this case, as analog and communication signals are the most
sensitive, these two signals should be wired through the same conduit, whereas digital signals
should be wired separately.
• If separate conduit is not possible, it is extremely important to prevent analog, digital and
communication signals to be wired in parallel.
• If there are some sections in which parallel wiring cannot be avoided, these sections should be
as short as possible.
• If cable needs to be crossed, these crossings should be perpendicular to each other.
INFORMATION
Analog, digital and communication signals should never share the conduit with the power supply
cables of the electronic and auxiliary components.
Field input signal cables must never be laid jointly with cables for filtered signals.
3.2.1 Group 1 (Analog Signals)

In the case of analog signals, always shielded cables should be used for the connection of the
analog module to the resistor and protection terminal block. The cable shield corresponding to the
terminal block connection must be grounded using a DIN-rail terminal.
Page 29
Figure 16 - Analog signal wiring
3.2.2 Group 3 (Communications)

The communication bus can be installed using 2-wire communication or 4-wire communication. In
order to increase the immunity to electromagnetic interference (EMC), the use of a shielded twisted
pair is recommended.
WARNING
Particular care must be taken when connecting the shielding to make sure it is effective.
The shield connection depends on the equipotentiality between the connected devices:
• Guaranteed equipotentiality: Both devices are connected to an ground system, so that the
same potential level is guaranteed The shield must be connected at both ends.
• Limited equipotentiality: Both devices are connected to ground but not to the same ground
system. To limit the difference of potential that can be produced among them a cable with the
appropriate cross-section will be installed between the grounding of both. The shield must be
connected at one end.
• No guaranteed equipotentiality: Ground connection of both devices can’t be guaranteed

(both devices must be connected to an ground system). Copper mustn’t be used in this case.
DANGER
Connecting NOT equipotential devices could be hazardous for persons and equipment.
RS-485 Communications
For RS-485 the pairs are shielded individually or all together by a copper braid. The
recommendations for the cable are:
• Resistance: < 100 Ω/km.
• Section: 0.22 mm2 (24 AWG)
• Characteristic impedance: 120 Ω.
• Maximum length: 1200 m.

RS-422 Communications
For RS-422 the pairs must be shielded individually. The recommendations for the cable are:
• Resistance: < 100 Ω/km.
• Section: 0.22 mm2 (24 AWG)
• Characteristic impedance: 100 Ω.
• Maximum length: 1200 m.
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3.2.3 Group 4 (Power Supply and Polarization)
Electronic Power Supply

The power supply for the electronic elements is the main barrier between the existing disturbances
in the power supply line and the system. That is the reason why, this power supply is equipped with
some additional filters to achieve a good EMC behavior of the system. It is extremely important to
keep the filter’s input wiring independent from the output wiring.
Polarization.
The output of the polarizing power supplies follows the same route in the field as the digital signals
in which they are used, so the treatment is the same as for a field input/output signal. In some
projects, supplementary filters are installed. In these cases, the wiring should be independent for
the filter’s input and output.
Figure 17 - Polarizing power supply output
Auxiliary
The auxiliary power supply and its wirings do not have any galvanic connection to Saitel DP, so
they should be sufficiently separated from each other (independent gutters and layout) in order to
avoid possible disturbances to reach the Saitel DP wiring itself. In some projects, supplementary
filters are installed. In these cases, the wiring should be independent for the filter’s input and
output.
Filtering
Generally, a filter will be included as a means to reinforce the protection of the power supply of the
electronic elements. The use of filters for the polarizing power supply is optional.
The polarizing power supply should never be combined with the power supply for electric elements.
The filter cannot be shared in any case, as the polarizing power supply goes to field with the rest of
inputs/outputs. As shown in the figures, an incorrect connection of the polarization power supply
reduces the effect of the protection barriers.
Figure 18 - Example of incorrect connections of the polarization power supply
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3.2.4 Group 5 (Ground Connection)
General Recommendations
• The cable section used should be have the appropriate size for each installation, and
grounding braid should be used whenever possible.
• The equipment or cabinet need to have a ground wire in a given point in order to achieve a low
impedance for the rest of the elements. Horizontal copper bars, as well as vertical cooper bars
(whenever possible) should be assembled. All metal pieces of the equipment shall be
connected to the ground protection. If metal cabinets are used, the cabinet's walls can also be
used to distribute the EMC ground.
Figure 19 - General scheme of a CORRECT ground connection
Ground Connection for Human Protection

• All metal elements need to be connected to the ground protection.
• All connections must be established through a dedicated cable and connected to the main
ground connection bar of the cabinet.
• A “cascading” ground connection of the elements is not allowed, as the ground disconnection
of one element would leave other elements within the cabinets without a ground connection.
Figure 25 shows a correct connection, in which all metal elements are connected through a
dedicated cable to the ground-connection bar. In Figure 20 the two ground connection cables
are joined together to simplify the connections, resulting in an incorrect ground connection.
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Figure 20 - General scheme of an INCORRECT ground connection
Ground Connection to avoid Electromagnetic Disturbances (EMC)

• The connections to metal parts (which are ground connected) must be rather short.
• Ground distribution will be done using the shortest cable lengths as possible. It is very relevant
that EMC ground-connection cables are as short as possible, therefore the entire cabinet metal
surface will be used for the connection.
• The electronic elements with metal coating, such as power supplies, must be ground
connected in two points. Firstly, they are connected to the ground protection using a cable with
section enough, linking the ground terminal and the ground-connection bar. Secondly, there is
a second cable linking the ground terminal to the closest metal surface (as shown in the
previous figures through the power supply elements).
• It is recommended to use flexible grounding braid for mobile earth parts (such as the cabinet’s
doors). The grounding braid must be short but with a wide surface (the surface is an essential
value in order to reduce high-frequency disturbances).
3.3 Wiring SM_DI32

There are two options to connect field signals to SM_DI32 module, option A1 (terminal connection),
and option A2 (flat-ribbon connection).
• A1: Terminal connection or Direct connection. It is used when the length of the field cabling is
short. For example, when interconnections and assemblies are done within the cabinet, signals are
generated in a close site or proceed from an interface cabinet located at the same site, etc.
• A2: Flat-ribbon connection through terminal blocks. It is used when the distance between the
module and the signal source is long or when the cable gauge needs to be bigger than 0.5 mm2
due to the cabling layout.
A module can be easily replaced by disconnecting the two field-connectors and removing the
module from its slot, in both direct and terminal-block connections. This section provides
information about: signals field connection, polarization, commons and terminal blocks.
Page 33
3.3.1 Terminal Connection (A1)

DANGER
SM_DI32 presents hazard of electric chock touching any terminal.
SM_DI32 option A1 mounts Eurostyle ™ 20-way and 3.81 mm connectors, allowing the user to use
multiple solutions to your needs header connector (terminal screw, spring, small screw ...).
An example is shown in the following figure:
The following figure shows the pin allocation of the connectors for option A1.
The connector J1 is located at the top and connector J2 at the bottom.
Figure 21 - Terminal connection (option A1).
Where:
• DIxx: Digital input xx.

• COMn: Common terminal for Jn connector.
• +V1 and +V2: Terminal for polarization positive.
• -V1 and -V2: Terminal for polarization negative.
Figure 22 - Field connection schematics for option A1.
Page 34
For ordering option A1 (terminal connection), the following recommendations must be follow before
wiring this module:
• Type of cable: Low voltage computer 20 x 0.14” (Brand: EMELEC).

Figure 23 – Recommended cable for field connection.
• To make the connection, the cable end must be stripped between 8 and 10 cm, protecting the
cut with an insulating material, as shown in the following figure:
Figure 15 – Prepared cable for field connection.
• The shield at the end of each individual cable should be removed for a distance of 0.5 cm,
which will be the part of copper to introduce in the terminal.
Figure 15 – Wiring a module with terminals.
A free space at the bottom is enough to the door can be closed:
Page 35
Figure 15 – Position of the cables when they are installed.
To avoid jerking and the weight of the cable doesn't fall on the terminal, when the module is
installed in the cabinet, both wires will be joined with a plastic bracket, and they should be fixed to
the cabinet or chassis too.
The following image shows an example:
Figure 15 – Mounting cables to the cabinet or chassis.
3.3.2 Flat Ribbon Connection (Option A2)
When the connection is established through terminal blocks, they can be simple connecting
interfaces made up by a flat ribbon and terminals. These spring-type terminals with capacity for 2.5
mm2 gauge cables have a DIN 35 rail mounting base. The flat ribbon cable has 20 ways, so two
terminal blocks for each module are required.
The following figure shows the pin allocation of the connectors for option A2.
The connector J1 is located at the top and connector J2 at the bottom.
Figure 24 - Flat ribbon pinout (option A2).
Field connection must be done as follow:
Page 36
Figure 25 - Field connection schematics for option A2.
3.3.3 Polarization
The digital inputs need a polarization voltage for operation.
The 32 inputs of the SM_DI32 module are divided into two 16-input polarization blocks. Each block
can be polarized independently but both must have the same value.
The polarization of V1 and V2 voltages is supplied externally from the module. Even in case there
are two power supplies available, it is possible to use only one power supply by bridging the
terminals, depending on the chosen connection option, that is, A1 or A2.
• For option A1, the +V1 terminal (in J1) must be interconnected with the +V2 terminal (in J2)
and -V1 terminal (in J1) with the -V2 terminal (in J2).
• For option A2, the +V and -V terminals of the power supply must be interconnected with
the +V and -V terminals of the terminal block.
INFORMATION
For option A2, check operation of the jumpers S1 and S2 in section 0
3.3.4 Commons
Field receivers are powered with the positive of the polarization voltage (V1 and V2). The best way
of doing this is through the common outputs of the module's connectors.
• For A1 ordering option (Figure 21), these commons are identified with the name COMx for
each connector (terminals 9 and 18).
• In option A2, the common terminals will depend on the type of terminal block used. Please,
consult the adequate electrical schematic in following section.
WARNING
The commons wiring should be independent for each connector J1 and J2. This means that the
commons of the different blocks can’t be joined, and they must be assigned to the correct
connector.
If the signal polarization is given correctly through the commons, the module may to do a
comprehensive test of the input signals.
Page 37
3.3.5 Terminal Blocks

DANGER
SM_DI32 presents hazard of electric chock touching any terminal of the terminal blocks
while the module is powered.
Some terminal blocks within the Saitel DP platform have been specifically designed to be used with
the SM_DI32 module. These terminal blocks can help to simplify wiring because they use thicker
cables for field signals.
Terminal blocks are connected to the module using two 20-way flat-ribbon cables. The module is
polarized through the terminal block.
These terminal blocks have two jumpers S1 and S2, one for each block of signals, which allow the
following:
• S1 and/or S2 to the left: This is the normal position of the jumpers. In this case the
common of the corresponding block is polarized by the voltage that reaches the module
through the flat ribbon. The module controls the inputs polarization through internal wiring.
• S1 and/or S2 to the right: The common of the corresponding block receives the supply
voltage directly, so that the module is not involved in the digital inputs polarization.
Electrical diagrams below show the normal position of these jumpers for each type of terminal
block.
TB_DI32/N - Phöenix Contact - Normalized Terminal Block
Figure 26 - TB_DI32/N Phöenix Contact - Normalized terminal block.
Table 4 – Technical specification of TB_DI32/N Phöenix Contact.
TB_DI32/N - Technical data

Manufacturer Phöenix Contact
Reference (code) T_UM 45/TELVENT/32DI (0625773)
Assembly DIN rail
Rated voltage UN SM_DI32 voltage.
Maximum current capacity per branch SM_DI32 voltage.
Number of connection terminals 40
Dimensions (width x height) 235 x 45 mm
Module connectors (type) 2x20-way flat-ribbon cable (pluggable).
Field connectors Knife disconnect terminals with fixing screws.
Min / Max wire cross section (rigid) 0.2 / 4 mm2
Min / Max wire cross section (flexible) 0.2 / 2.5 mm2
Min / Max wire cross section AWG/kcmil 24 / 12
Page 38
Electrical diagram
Figure 27 - TB_DI32/N Phoenix Contact - Electrical diagram.
TB_DI32/N - Weidmüller - Normalized Terminal Block

Figure 28 - TB_DI32/N Weidmüller - Normalized terminal block.
Table 5 – Technical specification of TB_DI32/N Weidmüller.
TB_DI32/N - Technical data

Manufacturer Weidmüller
Reference (code) TB_DI32N (7508000581)
Assembly DIN rail
Rated voltage UN SM_DI32 voltage.
Maximum current capacity per branch SM_DI32 voltage.
Number of connection terminals 40
Dimensions (width x height) 245 x 45 mm
Module connectors (type) 2x20-way flat-ribbon cable (pluggable).
Field connectors Knife disconnect terminals with fixing screws.
Min / Max wire cross section (rigid) 0.5 / 6 mm2
Min / Max wire cross section (flexible) 0.5 / 4 mm2
Min / Max wire cross section AWG/kcmil 20 / 10
Electrical diagram
Figure 29 - TB_DI32/N Weidmüller - Electrical diagram.
Page 39
4 Maintenance & Configuration
Page 40
Content
4 MAINTENANCE & CONFIGURATION .................................................................... 40
4.1 BACKPLANE CONFIGURATION ................................................................................ 42

4.2 SM_DI32 CONFIGURATION .................................................................................... 44
4.2.1 INFORMATION OF LOCAL ACQUISITION ............................................................. 45
4.2.2 SM_DI32 SIGNALS......................................................................................... 45
4.2.3 LOCAL ACQUISITION COORDINATES ................................................................ 46
4.2.4 INFORMATION IN THE TABLE STATUS ............................................................... 47
4.3 MAINTENANCE OF MODULE VIA WEB ..................................................................... 49
4.3.1 WEBAPP VS WEBTOOL ................................................................................... 49
4.4 USING WEBAPP ..................................................................................................... 49
4.4.1 HOME TAB ...................................................................................................... 50
4.5 USING WEBTOOL................................................................................................... 54
4.5.1 INFORMATION ................................................................................................. 55
4.5.2 MONITORING .................................................................................................. 55
4.5.3 BINS .............................................................................................................. 57
4.5.4 NETWORK CONFIGURATION ............................................................................ 57
4.6 FIRMWARE UPGRADE ............................................................................................. 58
Page 41
4.1 Backplane Configuration
INFORMATION
To perform the operations described in this chapter, the user must be familiar with the
configuration tool. Otherwise, please consult the user manual of Easergy Builder.
In the Workspace of Easergy Builder, create a new RTU using button or pressing right button
of the mouse in an empty area of the RTU tree:
Figure 30 - Adding a new RTU
Pressing button next to the picture, you can add, remove or change the I/O modules included on
the default configuration.
Each I/O module is allocated to a unique and identifying number in the bus (Profibus address). This
number is assigned using the switches available in the rear panel of the module (see paragraph
3.1.5 3.1.5 ).
The CPU needs to know the address and the types of I/O modules installed in the bus in order to
initialize and switch to data acquisition mode properly.
All examples in this chapter are made using an SM_CPU866e CPU but all operation is similar for
SM_CPU866.
Figure 31 - Acquisition modules in the default configuration
This window allows:
• Add or remove module in the backplane. Use button to add new modules and to
remove a module.
Page 42
Figure 32 - Adding one or several I/O modules.
• The address for each module is displayed under its picture and it can be changed using the
button . The address for each module must be the same that is indicated with its rear
switches.
• Use button to configure the time parameters of the polling and digital filtering:
Figure 33 - Configuration parameters.
To create a new configuration, select your RTU in the tree and pulse right button of the mouse or
use the button .

Figure 34 - Add configuration.
If the field "Create acquisition points defined in the RTU" is marked, all points of the local
acquisition of the acquisition blocks included in the default acquisition configuration associated with
the RTU will be included in coreDb.
For example, if a SM_CPU866e has a backplane with a SM_DI32 module, if "Create acquisition
points defined in the RTU", following points are generated:
• 32 digital inputs in the Status table.
• SM_DI32 supervision points in the Status table.
• System supervision points by default in the Status and Analog table: WARN_PS1, FAIL_RTU,
DOING_WELL….
Page 43
At the end of the operation, the new configuration will appear in the RTUs tree. Double-click on it
and the Configuration mode is activated.
Figure 35 - Configuration mode.
Double click on the laq Device and the backplane configuration window allows to modify the
acquisition configuration.
Selecting the module SM_DI32, you can configure each field signal
Figure 36 - Configuration mode.
Other buttons in this window are explained in the user manual of Easergy Builder.
4.2 SM_DI32 Configuration
The local acquisition Device for Saitel DP is named “Local Acquisition Device” (laq) and it is
created by default for each Saitel DP configuration.
The first step to configure the acquisition settings is to assure that the configured backplane in the
graphical interface is according to the system. Each module must be addressed according the
position of its microswitches. See paragraph 3.1.5
Figure 37 - Configuring local acquisition for Saitel DP
Page 44
The laq Device supports communication between inputs and the outputs managed by the
acquisition blocks and coreDb points. The first step to configure the acquisition settings is including
all I/O modules in the backplane.
INFORMATION
The graphical interface does not show if the modules are mounted in one or multiple backplanes.
Communication and power supplies modules aren’t included in the graphical schematic.
4.2.1 Information of Local Acquisition

The following figure shows the relationship between the field information received by the SM_DI32
module and the related points in coreDb:
Figure 38 - Field signals and points in coreDb
All signals in this picture are simple. If a signal is configured as double or counter its default name
will be different.
4.2.2 SM_DI32 Signals

The following figure shows the configuration panel when the backplane is composed by a CPU
SM_CPU866e and one SM_DI32 module with address 1:
Figure 39 - Input signals.
Page 45
Select the module in the graphical scheme and all its field signals are shown (marked in red).
The first position of each row corresponds with the signal’s description (DI_ISIM_1 .. DI_ISIM_16).
In coreDb, each signal will be identified using its coordinate.
For each signal, the following parameters can be changed:
• Type of signal: The signal is configured as: Simple digital (DI_ISIM), double digital (DI_IDOB)
or slow counter (DI_ICNT32).
The associated specific parameters will depend on the type of signal. A simple digital signal
has the associated parameters shown in the figure above.
If a signal is configured as double, the following signal will disappear automatically and the
associated parameters are the following:
Figure 40 - Configuration input signals.
• ChgEvt: It indicates whether changes may generate events. The “Y” value will generate
events, whereas “N” value will not generate them.
• DbICnt: Flange counter. This field is available for DI_ICNT32 signals; the value “Y” indicates
that the two flanges of each pulse are counted, whereas the value “N” indicates that only one
flange is counted.
• Invert: Inversion flag. The signal is inverted (Y) or not inverted (N).
• TF: (ms): Filtering time. All changes that take less than this time are rejected.
• TM: (ms*10): It applies to the signals set to "event". After an event, the signal's value is
retained for this time before another event occurs. It must assure the correct detection by the
logic.
• TS: (ms*100): It applies only for double signals. The stand-by time intends to create a time
frame in which the deactivation of the active input is not detected until the other input is
activated.
If any signal is set a double digital signal, the next signal available will be disabled, since a double
signal takes two signals:
Figure 1 – Configuration double input signal.
Finally, the button “Next” is used to access the rest of digital inputs of the module, that is, from 17
to 32.
4.2.3 Local Acquisition Coordinates

Each digital input is identified in coreDb by a name (it is stored in the field Description), but this
name is only used for information purpose. coreDb uses the signal’s coordinate in order to identify
a field signal.
Page 46
The following picture shows some digital inputs in the status table.
The coordinate is a unique identifier of a signal within a Device. Its definition is different for each
Device and the local acquisition is defined with ten digits with the following format:
2 BBB CC DDDD
• 2: The first number of its coordinate for all Saitel DP local acquisition signals will be 2.
• BBB: Three digits to indicate the point address according to the previous communication
protocol. In the case of Profibus-DP, the address range is from 000 to 125.
• CC: Type of signal, which includes:

o 00: Diagnostic signals of the acquisition modules.
o 02: Simple digital input (1 bit).
o 03: Counter (32 bits).
o 07: Double digital input (2 bits).
o 10: Digital input (1 bit) (Inputs table of Profibus).
o 11: Digital input (2 bits) (Inputs table of Profibus).
DDDD: Number of the signal within each type, that is, it does not need to match the physical
position. The first signal of a type will be 0000, the second will be 0001 ..., with all the types of the
previous point.
For example, if a coreDb point has associated the signal 2003020002 as source, then it means that
this point of coreDb takes it’s the same value that the signal (0002) of the DI_ISIM (02) type, in the
module with address 003, according to Profibus-DP (2) protocol.
4.2.4 Information in the Table Status

The following point are included in coreDb when the field “Create defined RTU acquisition points” is
marked (see Figure 34):
• 32 points for information from field. A coreDb point will be included in the Status table for each
field signal. The default name is: D00x_00000 ... D00x_00015, where 00x is the module’s
address.
• The following diagnostic points are created for each module D00x:
o STS_COMM: Signal 0000. Module offline. Value 1 indicates that there is not
communication with the module.
o STS_DIAG: Signal 0001.Module with diagnostics. Value 1 indicates a
diagnostic. Usually correspond to a polarization failure in the module.
o STS_FAILBUS1: Signal 0003. Value 1 indicates a communication failure in
Profibus1.
o STS_FAILBUS2: Signal 0004. Value 1 indicates a communication failure in
Profibus2.
Page 47
Figure 41 - LAQ diagnostic points
If you need to include a point manually, please create a new point, select laq as Source Device,
click right-button on the field Source Coordinates and select Launch Point wizard:
Figure 2 – Open Launch Point Wizard.
Figure 42 - Launch Point Wizard.
Select the module in which it wants to create these points and then select the point to be created.
INFORMATION
Only not created point will be shown in the list.
You can include these points directly in coreDb. For example:

If a coreDb point has assigned the signal 2003000000 as source, the value of this point indicates
the communication status of the module 003 (address).
The value of the signal 2007000004 changes to 1 when the communication with the module 007 is
lost.
For additional information regarding coreDb and operation with signals, please, consult the
Easergy Builder user manual.
Page 48
4.3 Maintenance of Module via WEB

4.3.1 webApp Vs WebTool
webApp and Webtool are remote user interfaces for consulting, monitoring and maintenance tasks.
Once the username and password have been entered, you can access to the main window and,
depending on the web tool, several sections are available.
INFORMATION
webApp has been designed to work only with the Cybersecurity brick. At now, it can be only
used with SM_CPU866e V2. SM_CPU866e V1 and SM_CPU866 use Webtool.
When use webApp, the following message is shown previously to access the tool:
Figure 43 - Disclaimer information
Please, read this information and take it into account.

In this manual, only the information about SM_DI32 is shown. For more information about webApp
and Webtool, please, consult the user manual for each one.
4.4 Using webApp
Saitel webApp includes an access management allowing to control users who can login in the tool.
To access webApp, write https://< CPU IP address> in the navigation address bar, where <CPU
IP address> must be changed for the correct IP address:
Figure 3 – Access screen.
Write the Username and Password in order to access the webApp’s main window:
Page 49
This screen contains 5 menus:
• Home
• Monitoring & Control
• Diagnostic
• Maintenance
• Settings
4.4.1 Home tab

Select Home in the main toolbar and the following information is shown:
Figure 44 – Home tab
Some of this information can be filled in by the user.
• Device Information. It is possible to add the names of the operators who have used or
configured the equipment or a specific custom note that can be viewed each time a connection
is established to this RTU. This information can be changed using button “Edit”, next to “Device
information”.
• Location. The GPS coordinates for the RTU location (place, latitude, longitude, and altitude)
should be entered here by the installer. Location is not set automatically. The image must be
included manually by clicking button on the map.
Page 50
• Image associated to the RTU. It could be useful to include a location map corresponding to the
GPS coordinates. Use button on the graphic zone to do it.
• Notes. This zone allows the user to include notes that are shown to other users. Use button
too add new notes.
• Factory information: This zone shows the manufacturer, model and the version of the
software loaded on the HU module. Using button next to the text “Factory Information”, it is
also possible to include an image of the particular RTU or CPU for identification purposes.
Monitoring and Control
This menu is used to monitor and control the information regarding to system status and coreDb
points.
Select “Monitoring & control  System information” and the following information the system is
displayed or not depending on whether the corresponding monitoring point was included or not in
coreDb. In the following image, for each data, the supervision point that must be included in coreDb
is indicated in a blue square.
Figure 45 – Monitoring and control view - System information
On the other hand, the “Monitoring and control  Data” allows to monitor the information of each
coreDb table:
• Status page: For viewing the status of the digital data
• Command page: For sending change of state commands based on the digital data.
• Analog page: For viewing measurement values.
• Setpoint page: For forcing parameter values.

For example, the following information is shown for Status:
Page 51
Figure 46 – Monitoring and control – Status information.
If Locking field is marked for a signal then buttons are available and they can be used to
change the value or associated quality flags for this signal.
Figure 47 – Changing the signal value.
Figure 48 – Changing associated quality flags.
For each signal, its quality information is shown in the table through icons in the column Quality. In
coreDb, this information is stored in hexadecimal format.
The quality information associated with a signal could include one or more of the following
messages:
Page 52
Table 6 – Local quality information
Values (Hexadecimal) Description
0x00000000 OK
0x00000001 There has been an overflow
0x00000002 There has been a carry on a counter or a roll-over.
0x00000004 There has been a counter adjustment.
0x00000008 Excessive changes in a digital input.
0x00000010 Locked Point (blocked)
0x00000020 Point manually replaced (manual)
0x00000040 The point has not yet been written into the database (No refresh)
0x00000080 Invalid value (Error)
0x00000100 The value of the item has exceeded Highest Limit Alarm.
0x00000200 The value of the item has exceeded High Limit Alarm.
0x00000400 The value of the point has fallen down of Low Limit Alarm.
0x00000800 The value of the point has fallen down of Lowest Limit Alarm.
0x00001000 Invalid time.
Table 7 – Device quality information
0x00000000 OK
0x00010000 There has been an overflow.
0x00100000 Locked Point.
0x00200000 Point manually replaced.
0x00400000 The point has not yet been written into the database.
0x00800000 Invalid value.
INFORMATION
If more than one error is detected for a signal, the hexadecimal value monitored for quality bits
will result from the sum of all. For example:
0x00000001 indicates that an overflow has occurred and 0x00000002 indicates that there has
been a carry on a counter or a roll-over. The value 0x00000003 would appear monitored.
Page 53
4.5 Using WebTool
Saitel Webtool is used for maintenance and monitoring of Saitel RTUs which are supplied with the
baseline software platform but without Cybersecurity brick, SM_CPU866 and SM_CPU866e V1.
Like webApp, Webtool allows to monitor and to change the real-time value and associated quality
information for each coreDb signal.
Saitel Webtool includes an access control allowing to identify and manage the users who are able
to connect.
Please, write https://< CPU IP address> in the navigation address. If the browser was correctly
configured and the CPU is connected to the PC via ethernet, the login window will prompt:
Figure 49 – Saitel Webtool login window.
Once the username and the password are introduced in the login window, the main workspace is
displayed:
Figure 4 - Initial screen of Saitel Webtool
This window shows:
• User who is logged in the session (user target in the previous picture).
• The button “Exit” allows to close the current session.
• Active language for the session. Use the pull-down field “Language” to change it.
• The main menu is located on the left side of the window. It allows you to access all information
of the RTU:
o Information: General information about the CPU configuration.
o Monitoring: Gives access to the coreDb tables and the values for each
register and field.
o Bins: Gives access to the devices that have been configured in the RTU.
o Network configuration: Gives information about the physical devices and
rooters.
Page 54
4.5.1 Information
Clicking Information on the main menu, you can see general information about the system.
The following real-time information can be monitored on this menu:
• System’s Configuration
• Hardware Status
• Synchronization Status
• Software Versions
Figure 5 - Information section
4.5.2 Monitoring
The top area of the screen includes the following information for any signal type (go to “Monitoring
 Status”, “Monitoring  Command”, “Monitoring  Analog” or “Monitoring  Setpoint”):
Figure 6 - Status monitoring screen
The information available for all types of signals is the following:

• Point name: Signal's name in coreDb.
• Value: Current value of the signal. This value is retrieved from the signal’s source and it is
updated in Saitel Webtool according to the refresh period specified in the RT field.
• QF: Current quality flags of the value displayed for this signal
Page 55
INFORMATION
If the value of the quality bit associated to the signal is “Unrefreshed” (0x00000040) or “Invalid”
(0x00000080), the signal value will be “???”.
Clinking in “Set”, the value and the quality flag can be modified.
Figure 7 - Set Value screen
Each code of quality bit has a different meaning. See next tables to know the description of each
one.
Table 2 - Local quality bits
0x00000000 OK
0x00000001 There has been an overflow
0x00000010 Locked Point (blocked)
0x00000020 Point manually replaced (manual)
0x00000040 The point has not yet been written into the database (No refresh)
0x00000080 Invalid value (Error)
0x00000100 The value of the item has exceeded Highest Limit Alarm.
0x00000200 The value of the item has exceeded High Limit Alarm.
0x00000400 The value of the point has fallen down of Low Limit Alarm.
0x00000800 The value of the point has fallen down of Lowest Limit Alarm.
Page 56
Table 3 - Quality bits from the Device
0x00000000 OK
0x00010000 There has been an overflow.
0x00100000 Locked Point.
0x00200000 Point manually replaced.
0x00400000 The point has not yet been written into the database.
0x00800000 Invalid value.
INFORMATION
If more than one error is detected for a signal, the hexadecimal value monitored for quality bits
will result from the sum of all. For example:
0x00000001 indicates that an overflow has occurred and 0x00000002 indicates that there has
been a carry on a counter or a roll-over. The value 0x00000003 would appear monitored.
• Blocked: This checkbox indicates whether the signal’s source is blocked or not, that is, if the
signal’s value is refreshed with the changes made to the source’s value. If blocked, the number
displayed in the VALUE field can be edited. This change can be sent to the CPU using the SET
button. Therefore, the signal’s value in coreDb will be modified. If it is unblocked, the value can
also be changed, although it will be a temporary change as it will be restored automatically in
the next refresh.
• For security reasons, the sources of command and setpoint signals cannot be blocked, so this
field is not included in the corresponding screens.
4.5.3 Bins
Clicking Bins, you can view all the Devices configured in the RTU. This screen can be used to
calibrate the analog signals. For more details, go to section 2.4 Error! Reference source not
found..
4.5.4 Network Configuration

Information about the network devices and the routers configured in the system. For more details
about these elements, please refer to the WebTool manual.
Page 57
4.6 Firmware Upgrade

Once the backplane is configured, the CPU module (866 or 866e) already knows the type of
acquisition blocks that are been installed and their corresponding addresses.
To update the software of the SM_DI32 module, you need:
• A console connection with the CPU.
• SM_DI32 module must be correctly addressed and working fine in the backplane (LED Run
must be blinking).
• ST_DI32.bin file with the new version. This file must be available in the flash folder of the CPU.
If not, you can contact Schneider Electric in order to ask for it. Use an SFTP client and transfer
this binary file into the CPU flash folder.
The console tool can be executed using any commercial tool for serial or SSH connection. In this
manual, PuTTy software is used.
Open a serial connection as follow:
Figure 8 - PuTTY configuration
SSH connection via Ethernet can be used too. More information about the console use in the CPU
user manual. In the following picture, CPU866e is used:
Figure 9 - SSH connection
Page 58
INFORMATION
If the baseline includes the cybersecurity brick, you need to login in the console with Installer.
No other user has permissions to execute this operation. Please, consult the CPU user manual
for more information.
If the file ST_DI32_C0.bin is available in the flash folder, use one of the following commands to
upgrade the software of SM_DI32 modules:
Table 4 – Upgrading SM_DI32’s software.
File Command SM_CPU866 Command SM_CPU866e

ST_DI32_C0.bin dpUpgrade <nº of slave>, “<software file>” dpUpgrade <n º of slave> <software file>
INFORMATION
Console commands are case-sensitive, and quotation marks must be included.
After running the command, the console will show some messages indicating the process status.
Finally, if no problem is found, we will have updated the firmware of the modules.
Page 59
5 Technical Specification Table
Page 60
SM_DI32 - 32 Digital Inputs
Hardware Specifications
Number of inputs. 32
Inputs per common 16
Inputs per polarization block. 16
DI polarization (PV). Auto-range: 12 - 24 VDC / 48 -60 VDC / 110 - 125 VDC / 220 VDC
Polarization range. From ±25% of PV for each range.
Input current 1 mA / signal (at nominal polarization)
Nominal value for ACTIVE signal. ±25% of PV for each range.
Nominal value for DEACTIVE signal. From 0 to -15% and +15% of the minimum value for each range of PV.
Polarization blocks isolation. By optocoupler 2.5 kVRMS.
Input test. Signals are checked when polarization is supplied.
Transient voltage protection (polarization and inputs) Protected with MOV (varistor) 17 J @ 2 ms on 8/20 µs waveform.
Field connection. Terminal/Flat ribbon

Consumption 1W
Weight 580 g
Dimensions 245 x 180 x 45 mm
Software Specifications
Digital input types. Status indication, single and double.

Slow pulse counters 32 bits, 40 Hz (single and double edge).
Maximum inputs as slow counters 25
Time stamping. 1 ms resolution.

Filtering time (TF). 0 – 255 ms.
Settling time (TS). 0 – 25500 ms.
Change memory time (TM) 0 – 2550 ms.
Standard Compliance
CE Mark
Low voltage. LVD Directive 2014/35/UE.

Electromagnetic compatibility EMC Directive 2014/30/UE.
Restriction of Hazardous Substances. RoHS II Directive 2011/65/EU.
Waste Electrical and Electronic Equipment (2012/19/UE). WEEE Directive 2012/19/UE.
Electromagnetic Compatibility (EMC) – Emission Tests according to EN 61000-6-4 (2007) / A1 (2011)
Radiated emission (Class A): From 30 MHz to 1000 MHz (Class A)

Conducted emission (Class A): From 150 kHz to 30 MHz (Class A)
Discontinuous disturbance (clicks) on AC power leads: From 150 kHz to 30 MHz
Electromagnetic Compatibility (EMC) – Immunity Tests according to EN 61000-6-5 (2015)
Radiated RF electromagnetic field (Class A) – 61000-4-3 10 V/m from 80 MHz to 1000 MHz
3 V/m from 1000 MHz to 2700 MHz
1 V/m from 2700 MHz to 6000 MHz
Common mode RF (Class A) – 61000-4-6 (2014) 10 VRMS from 150 kHz to 80 MHz
EFT burst (Class B) - 61000-4-4 (2012) ±4 kV in AC, DC and I/O lines
Surge (Class B) - 61000-4-5 (2014) ±4 kV in AC / ±2 kV in DC and I/O lines
Electrostatic discharges (Class B) - 61000-4-2 (2009) ±6 kV direct and indirect by contact.
Air discharge N/A.
Voltage drops and power faults (Class B/C) - 61000-4-11 (2004)
AC ports: 100% during 100ms / 30% during 20 ms
DC ports: 100% during 50ms / 60% during 100 ms / 30% during 100 ms
Magnetic field (Class A) - 61000-4-8 (2010) 100 A/m (continuous) and 1kA/M for 1s at 50 Hz
Common mode disturbances in range 0 to 150 kHz (Class B) - 61000-4-16 30 V continuous / 300 V 1 s
Damped oscillatory wave (Class B) – 61000-4-18 1 kV differential mode / 2.5 kV common mode
Ripple on DC Power supply (Class B) – 61000-4-17 10% Un at 100 Hz, 150 Hz and 300 Hz
Page 61
SM_DI32 - 32 Digital Inputs
Electrical Safety
General requirements (IEC 61010-1 and IEC 60255-27). Compliant with all the standard's requirements.
Dielectric rigidity (IEC 60255-27). Isolation >100 MΩ, 2 kVRMS.
Impulse voltage (IEC 60255-27) ±5 kV in AC or DC power and ±4 kV in I/O lines.
Environmental
Cold test (IEC 60068-2-1). From -40 ºC during 16 h.

Dry heat test (IEC 60068-2-2). +85º C during 16 h.
Vibration test (IEC 60068-2-6). @ 2 g, From 9 to 350 Hz.
Mechanical chock test (IEC 60068-2-27). @ 15 g, 11 ms.
Cyclic humid heat (IEC 60068-2-30). From 25 ºC to 55 ºC with 95% RH, 2 cycles of 24 h.
Ordering Options
Page 62
Index of Figures
Figure 1 - Barrier of protection for elements with dangerous voltages. ........................................................................9
Figure 2 - Example of yellow/green cable for earthing. ..............................................................................................10
Figure 3 - Technical label. ..........................................................................................................................................12
Figure 4 – Saitel DP architecture ................................................................................................................................16
Figure 5 - SM_DI32’s P/N description ........................................................................................................................17
Figure 6 - Functional block diagram ...........................................................................................................................18
Figure 7 - Digital filtering in digital inputs ....................................................................................................................19
Figure 8 - Change memory in digital inputs ................................................................................................................20
Figure 9 - Simple indication ........................................................................................................................................20
Figure 10 - Double indication ......................................................................................................................................21
Figure 11 - Slow counter .............................................................................................................................................21
Figure 12 - SM_SER LED indicators. .........................................................................................................................22
Figure 13 - Backplane`s positions ..............................................................................................................................26
Figure 14 - Profibus switches for module configuration .............................................................................................27
Figure 15 - Saitel DP module inserted incorrectly ......................................................................................................28
Figure 16 - Analog signal wiring .................................................................................................................................30
Figure 17 - Polarizing power supply output ................................................................................................................31
Figure 18 - Example of incorrect connections of the polarization power supply ........................................................31
Figure 19 - General scheme of a CORRECT ground connection ..............................................................................32
Figure 20 - General scheme of an INCORRECT ground connection.........................................................................33
Figure 21 - Terminal connection (option A1). .............................................................................................................34
Figure 22 - Field connection schematics for option A1...............................................................................................34
Figure 23 – Recommended cable for field connection. ..............................................................................................35
Figure 24 - Flat ribbon pinout (option A2). ..................................................................................................................36
Figure 25 - Field connection schematics for option A2...............................................................................................37
Figure 26 - TB_DI32/N Phöenix Contact - Normalized terminal block. ......................................................................38
Figure 27 - TB_DI32/N Phoenix Contact - Electrical diagram. ...................................................................................39
Figure 28 - TB_DI32/N Weidmüller - Normalized terminal block................................................................................39
Figure 29 - TB_DI32/N Weidmüller - Electrical diagram.............................................................................................39
Figure 30 - Adding a new RTU ...................................................................................................................................42
Figure 31 - Acquisition modules in the default configuration ......................................................................................42
Figure 32 - Adding one or several I/O modules. .........................................................................................................43
Figure 33 - Configuration parameters. ........................................................................................................................43
Figure 34 - Add configuration. ....................................................................................................................................43
Figure 35 - Configuration mode. .................................................................................................................................44
Figure 36 - Configuration mode. .................................................................................................................................44
Figure 37 - Configuring local acquisition for Saitel DP ...............................................................................................44
Figure 38 - Field signals and points in coreDb ...........................................................................................................45
Figure 39 - Input signals. ............................................................................................................................................45
Page 63
Figure 40 - Configuration input signals. ......................................................................................................................46

Figure 41 - LAQ diagnostic points ..............................................................................................................................48
Figure 42 - Launch Point Wizard. ...............................................................................................................................48
Figure 43 - Disclaimer information ..............................................................................................................................49
Figure 44 – Home tab .................................................................................................................................................50
Figure 45 – Monitoring and control view - System information ..................................................................................51
Figure 46 – Monitoring and control – Status information. ...........................................................................................52
Figure 47 – Changing the signal value. ......................................................................................................................52
Figure 48 – Changing associated quality flags. ..........................................................................................................52
Figure 49 – Saitel Webtool login window....................................................................................................................54
Page 64
Index of Tables
Table 1 – Led indicators meaning...............................................................................................................................22
Table 2 - Local quality bits ..........................................................................................................................................56
Table 3 - Quality bits from the Device ........................................................................................................................57
Table 4 – Upgrading SM_DI32’s software. .................................................................................................................59
Page 65
Glossary
A
A: Ampere.
AC: Alternate Current.
AI: Analog Input.
AO: Analog Output.
AWG: American Wire Gauge.
C
ºC: Celsius degree.
COM: Puerto de comunicaciones.
CPU: Central Processing Unit.
D
DC: Direct Current.
DI: Digital Input.
DO: Digital Output.
E
EMC: ElectroMagnetic Compatibility.
G
g: Gram.
GPS: Global Positioning System.
H
Hz: Hertz.
I
IED: Intelligent Electronic Device.
I/O: Input / Output.
ISO 9001: International standard for Quality Systems.
K
kHz: Kilohertz.
L
LED: Light Emitting Diode.
M
mA: Milliampere.
MHz: Megahertz.
Page 66
m: Meter.
mm: Millimeter.
ms: Millisecond.
N
N/A: Non-Application.
P
PC: Personal Computer.
PS: Power Supply.
R
RTDB: Real Time DataBase.
RTU: Remote Terminal Unit.
S
s: Second.
SFTP: Secure File Transfer Protocol.
SM_AI16: Analog Inputs module.
SM_AI8AO4: Analog Inputs and Outputs module.
SM_DI32: Digital Inputs module.
SM_DO16R: Digital Outputs to Relay module.
SM_DO32T: Digital Outputs to Transistor.
SM_PS: Power supply module.
SM_PS40: Power supply module.
SM_SER: Communication module for expansion.
V
VAC: Volt of Alternate Current.
VDC: Volt of Direct Current.
W
W: Watt.
Page 67
Printed in:
Thursday, September 26, 2019
Schneider Electric
C/ Charles Darwin s/n
Parque Científico y Tecnológico de la Cartuja
Seville, Spain
©2019 All rights reserved. The information contained in this document is

confidential and is owned by Schneider Electric. It cannot be copied or distributed
in any way, unless there is express written authorization by Schneider Electric.
Although this information was verified at the time of publication, may be subject to change without notice.
FTE-M583-USR-00 09/2019
Page 68

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Publication Date (09/2019)

Document nº: SE-USR-M583

SM_CPU866e User Manual SE-USR-M578

webApp User Manual FTE-WPP-S856

EOL Instructions SE-EOLI-M583

Application note AN010 (Mounting a Saitel FTE-AN010-F700

RTU Software Easergy Builder (Plugin)

Linux Lnx 18.07.17.10.42.53

Easergy Builder Tool 1.4.7

Software SM_DI32 C0_01.00.04

2 GENERAL DESCRIPTION ...................................................................................... 14

3 PHYSICAL MOUNTING & INSTALLING ................................................................ 24

4 MAINTENANCE & CONFIGURATION .................................................................... 40

5 TECHNICAL SPECIFICATION TABLE ................................................................... 60

1 Safety & Health

1 SAFETY & HEALTH ................................................................................................... 4

1.1 INTRODUCTION ........................................................................................................ 6

1.1.1 Information of Security

This symbol indicates "DANGER" or "WARNING". This symbol informs of an

This symbol is associated to a safety alert. It is used to warn of possible personal

1.2 Introduction to Safety

• Are trained in emergency procedures (first aid).

1.3 Symbols and Labels on the Equipment

Protective earth Associated symbol to the protective ground

This symbol indicates that the equipment has

Direct Voltage Symbol of direct voltage (VDC).

Alternate Voltage Symbol of alternate voltage (VAC).

1.4 Installation, Setup and Operation

The following image shows an example:

Saitel can need put to earth for two distinct needs:

• For purposes of electrical safety (Protective Earth, PE).

1.5.1 Electrical Safety

When Saitel DP is mounted on back-panel, the metallic enclosure of the backplane

• The screw for ground must be exclusive for this use.

1.5.2 Functional Earth (EMC)

1.6 Handling Electronic Components

1.7 Technical Specifications for Safety

1.7.1 Protective Elements

1.7.2 Environmental Conditions

• Altitude until 2000 m.

• Maximum relative humidity of 95%. (IEC 60068-2-30)

• Degree of pollution II. (IEC 60255-5)

• Overvoltage transitory until levels of Category III. (IEC 60255-5)

1.7.3 Storage Conditions

1.8 Technical Label

1.9 Packing and Unpacking

1.10 Decommissioning and Disposal

1.11 Norms and Standards / CE Mark

• LVD: Low voltage (2014/35/UE).

• EMC: Electromagnetic compatibility (2014/30/UE).

• RoHS 2: Restriction of Hazardous Substances (2011/65/EU).

• WEEE: Waste Electrical and Electronic Equipment (2012/19/UE).

2.1 GENERAL DESCRIPTION OF SAITEL DP................................................................... 16

2.1 General Description of Saitel DP

• Cost-efficiency, minimum downtime, and compliance with electrical safety, electromagnetic

• Centralized monitoring and control of geographically-distributed systems which support

• Quick troubleshooting by means of programmable automation execution.

2.2 SM_DI32 Module

2.2.1 Interfaces & Functions

• Option A1  P/N: M58310000y-XX: Terminal connection.

• Option A2  P/N: M58320000y-XX: Flat-ribbon connection, using additional terminal

• 32 configurable and high-precision digital input, distributed in two 16-signal blocks.