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Pulsed Laser Deposition with High Energy UV Excimer Lasers

Summary:
Find the Laser Solution that Fits
Excimer laser based Pulsed Laser Deposition (PLD) has become the fastest and most versatile method for growing a wide
your Application Needs.
range of complex materials (HTSC , semiconductors, polymers, ferroelectrics, ceramics, etc.). The interaction of a laser beam
with a solid target inside a vacuum chamber produces a highly oriented stream of material that deposits onto appropriate
Search Applications Notes substrates positioned in front of the target. This interaction results in homogeneous deposition of thin films with tailored surface
properties (“smart films”), which are of potential interest to various industries.

Search by material Laser Used:

and/or process.
C OMPexPro Series
-- SELEC T MATER IAL --
C e ram ic
Process:
C om posite The laser beam path in a PLD setup is relatively simple. Usually, it consists of an aperture to cut off the fuzzy edges of the
Diam ond excimer laser beam, two 45° mirrors for x,y-alignment and a single plano-convex lens with a typical focal length of 200 to 700
Fabric and Le athe r mm. A homogeneous flat-top excimer laser beam is ideal for PLD. The quality of the PLD grown thin films is very sensitive to
Glass shot-to-shot energy density fluctuations of the laser, and because deposition time in a lab takes up to one hour, both spatial
-- SELEC T PR O C ESS -- (beam profile) and temporal (shot-to-shot) energy stability are essential in order to obtain reproducible results.
Ablation-Mate rial R e m oval
Results:
C ladding
C utting and Scribing The shorter the wavelength, the smaller the penetration depth of the laser radiation into the material. For excimer lasers at 193
Drilling nm and 248 nm, the ablation depth is in the 100 nm range and results in very controlled layer-by-layer ablation and deposition
He at Tre ating with virtually no volume heating, thus eliminating the unwanted ejection of larger particulates. C OMPexPro can be used for
deposition of materials like ZnO, GaN or diamond films at a high repetition rate. The ample pulse energy of the C OMPexPro
Se e R e sults
eliminates the need for ablating the target material using the fuzzy focal plane of a short focal length lens.

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Fig. 1 - C omparis on of ablation c raters with Fig. 2 - T ypic al lens imaging is us ed in

N d:Y A G and exc imer beam profiles . s tandard P L D apparatus and requires good
beam homogeneity.

Comments:
C OMPexPro excimer lasers yield typical 0.5% rms pulse-to-pulse stability. Such stable operation conditions push the limits of
PLD grown thin films and are not achieved by frequency converted lasers.

Keywords:

Material C omposite
Glass
Plastic
Semiconductor

Process Ablation-Material Removal

( CO H R) 50.62 5/ 9/ 2012 4:00pm E S T

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