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General Description
• N channel vertical power FET with charge pump, ground referenced CMOS compatible input, monolithically
integrated in Smart SIPMOS® technology.
• Providing embedded protective functions.
Application
• µC compatible power switch for 5V, 12 V and 24 V DC applications
• All types of resistive, inductive and capacitve loads
• Most suitable for loads with high inrush currents, so as lamps
• Replaces electromechanical relays, fuses and discrete circuits
Basic Funktions
• Very low standby current
• Optimized static electromagnetic compatibility (EMC)
• µC and CMOS compatible
• Fast demagnetization of inductive loads
• Stable behaviour at undervoltage
Protection Functions
Vbb
• Short circuit protection
• Current limitation
• Overload protection
• Thermal shutdown
• Overvoltage protection (including load dump) with external
GND-resistor Logic
• Reverse battery protection with external GND-resistor IN with
• Loss of ground and loss of Vbb protection protection
• Electrostatic discharge (ESD) protection functions OUT
Load
PROFET
GND
Functional diagram
GND
PROFET
Tab = VBB
1 GND Logic ground
1) Supply voltages higher than Vbb(AZ) require an external current limit for the GND pin, e.g. with a 150 Ω
resistor in the GND connection. A resistor for the protection of the input is integrated.
2) RI = internal resistance of the load dump test pulse generator
3) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
4) EAS is the maximum inductive switch off energy
5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air.
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj =-40...+150°C, Vbb = 12 V unless otherwise specified min typ max
Operating Parameters
Operating voltage Tj =-40°C Vbb(on) 4.75 -- 41 V
Tj =+25°C 4.75 -- 43
Tj =+105°C6) 4.75 -- 43
Tj =+150°C 5.0 -- 43
Overvoltage protection7) Tj =-40°C: Vbb(AZ) 41 -- -- V
I bb = 40 mA Tj =+25...+150°C: 43 47 52
Standby current (pin 3) 8) Tj=-40...+25°C: Ibb(off) -- 5 10 µA
Tj=+105°C6): -- -- 10
VIN=0 see diagram page 9 Tj=+150°C: -- -- 25
Off-State output current (included in Ibb(off)) IL(off) -- 1.5 10 µA
VIN=0
Operating current (Pin 1)9), VIN=5 V, IGND -- 2 4 mA
10) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not
designed for continuous repetitive operation.
11) not subject to production test, specified by design
12) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for V
bb
connection. PCB is vertical without blown air.
13) Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 1 and circuit page 7).
Input14)
Input resistance RI
see circuit page 7 2.5 3.8 6.5 kΩ
Input turn-on threshold voltage VIN(T+) 1.2 -- 2.2 V
Input turn-off threshold voltage VIN(T-) 0.8 -- -- V
Input threshold hysteresis ∆ VIN(T) -- 0.3 -- V
Off state input current (pin 2) VIN = 0.4 V: IIN(off) 1 -- 15 µA
On state input current (pin 2) VIN = 5 V: IIN(on) 4.5 12 24 µA
14) If a ground resistor RGND is used, add the voltage drop across this resistor.
Ibb
V Leadframe, 3 V
Z2
bb
Vbb R IN RI
IN IN
I IL VON Logic
IN
PROFET OUT
2 5 OUT
V
IN V
GND Z1 PROFET
1 GND
IGND VOUT R Load
R R GND
GND
Signal GND Load GND
ESD-ZD I
GND disconnect
I
I
GND
Vbb
The use of ESD zener diodes as voltage clamp at DC
conditions is not recommended.
IN PROFET OUT
OUT
GND PROFET
Vbb
IN PROFET OUT
GND
V V
V IN GND
bb
Any kind of load. If VGND > VIN - VIN(T+) device stays off
E AS
Vbb
ELoad
high Vbb
IN PROFET OUT
IN PROFET OUT
GND L
=
{
EL
GND
ZL
V
bb ER
R
L
For inductive load currents up to the limits defined by ZL
(max. ratings and diagram on page 8) each switch is
protected against loss of Vbb.
Energy stored in load inductance:
Consider at your PCB layout that in the case of Vbb dis- 2
connection with energized inductive load all the load current EL = 1/2·L·I L
flows through the GND connection.
While demagnetizing load inductance, the energy
dissipated in PROFET is
EAS= Ebb + EL - ER= VON(CL)·iL(t) dt,
L [mH]
1000
100
10
0.1
0 5 10 15 20 25 30 35
IL [A]
RON [mΩ]
40
Tj = 150°C
35
30
25
20
25°C
15
-40°C
10
5
3 5 7 9 30 40
Vbb [V]
Typ. standby current
Ibb(off) = f (Tj ); Vbb = 9...34 V, IN1,2 = low
Ibb(off) [µA]
20
15
10
0
-50 0 50 100 150 200
Tj [°C]
V bb
I
L
t
V
OUT
VOUT
t t
off(SC)
90% Heating up may require several milliseconds, depending on
t on dV/dtoff external conditions
V
OUT
T
J
1)
15.65 ±0.3
2.8 ±0.2
13.4
17±0.3
3.7-0.15
9.25 ±0.2
1.27 ±0.1 0.05
1)
15.65 ±0.3
2.8 ±0.2
11±0.5
13 ±0.5
13.4
17±0.3
C
0.05 9.25 ±0.2
C 1.7
0.25 M A B C
0...0.15 0.5 ±0.1
0.8 ±0.1 2.4 Typical
1.7 3.9 ±0.4 1) All metal surfaces tin plated, except area of cut.
0.25 M A C
8.4 ±0.4
Published by Infineon Technoligies AG,
1)
Typical St.-Martin-Strasse 53, D-81669 München
All metal surfaces tin plated, except area of cut. © Infineon Technologies AG 2001. All Rights Reserved
Attention please!
The information herein is given to describe certain components and
shall not be considered as a guarantee of characteristics.
SMD: P-TO263-5-2 (tape&reel) Terms of delivery and rights to technical change reserved.
Sales code BTS441T G We hereby disclaim any and all warranties, including but not limited
to warranties of non-infringement, regarding circuits, descriptions
Ordering code: Q67060-S6112-A3 and charts stated herein.
Information
10 ±0.2 4.4 For further information on technology, delivery terms and conditions
9.8 ±0.15 1.27 ±0.1 and prices please contact your nearest Infineon Technologies Office
A B in Germany or our Infineon Technologies Representatives worldwide
(see address ist).
8.5 1) 0.1
0.05
1±0.3
Warnings
2.4 Due to technical requirements components may contain dangerous
9.25 ±0.2
1.3 ±0.3
8 1)
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