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  • 02 The Printing

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    Syed
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    This document discusses important parameters for accurate solder paste stencil printing. It emphasizes that the snap off should be at "zero" to avoid trapping solderpaste on the stencil. The dwell height and lift height should be 10-14mm to transfer forces properly. Blade height is important to avoid solderpaste sticking to holders. Down stop setting on MPM printers of 1.9-2.2mm helps achieve good apertures filling. Printing and release speeds need to match the solderpaste rheology. Well centering the stencil is crucial for accurate printing results on joints.

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    02 the Printing

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    This document discusses important parameters for accurate solder paste stencil printing. It emphasizes that the snap off should be at "zero" to avoid trapping solderpaste on the stencil. The dwell height and lift height should be 10-14mm to transfer forces properly. Blade height is important to avoid solderpaste sticking to holders. Down stop setting on MPM printers of 1.9-2.2mm helps achieve good apertures filling. Printing and release speeds need to match the solderpaste rheology. Well centering the stencil is crucial for accurate printing results on joints.

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
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    6 views25 pages

    02 The Printing

    Uploaded by

    Syed
    This document discusses important parameters for accurate solder paste stencil printing. It emphasizes that the snap off should be at "zero" to avoid trapping solderpaste on the stencil. The dwell height and lift height should be 10-14mm to transfer forces properly. Blade height is important to avoid solderpaste sticking to holders. Down stop setting on MPM printers of 1.9-2.2mm helps achieve good apertures filling. Printing and release speeds need to match the solderpaste rheology. Well centering the stencil is crucial for accurate printing results on joints.

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    of 25

    The Printing’s

    Gilbert Renaud
    Technical Manager Asia Pacific
    Important Parameters...
    Snap Off
    Dwell Height & Lift Height
    Blade Height
    Down stop on MPM’s
    Printing Speed
    Release Speed
    Well Centred
    The Snap Off at “Zero”!

    After Release...
    The Snap Off not at “Zero”
    Stencil

    Solderpaste trapped

    Deposit… wider
    Dwell Height & Lift Height
    The principle: to transfer the forces on the stencil.

    Printing Stopping
    status: Solderpaste
    Status: forces on the
    stencil!

    10-14 mm

    The lift height or Dwell height should be within 10-14 mm

    Good Curtain… No adding.

    30mm 14 mm
    Good help for Operator Processing.

    Good curtain : no adding


    Some holes : adding to do
    Blade Height…?

    Process Window wider

    More solderpaste on the stencil

    No Solderpaste stuck to the Holders


    The Printers Issue...
    On MPM’s

    18 mm
    Strong Plateau

    Teknis’s

    Cookson’s

    Cookson Squeegees 30 mm
    Solderpaste: 700 grams

    (No Sticky on Blades’)


    On DEK’s

    Roll Diameter > 1.5 cm

    15 mm

    Solderpaste roll < 1.5 cm

    Roll Diameter > 1.5 cm… Sticky on Blades.


    Cookson Blades

    DEK’s

    Cookson’s
    > 25 mm

    700 grams
    The cause of the smear.
    Down-stop on MPM printers
    • Normal Setting: 1.9 - 2.2 mm

    #45°

    Down-stop: 1.9 mm

    • Bad Downstop

    < 45°
    Down-stop: 1.9 mm
    Down-stop: 4 mm
    Bad Down-stop Effect...

    Poor Solderpaste rolling

    Bad apertures filling

    Insufficient deposit in small apertures.

    Sticky on blades phenomenon with short height’s


    Printing Speed…?

    In Function of the Solderpaste Rheology


    (0.5 k/inch, Print faster and faster… to the smear)
    Alpha Lead free Solderpastes…?

    OM 310 OM 338 Series

    RO L0
    RO L0 80 à 150 mm/s at 0.5 kg/inch
    40- 100 mm/s at 0.5 kg/inch Release’s: 5- 20 mm/s or no release
    Release’s: 1-3 mm/s Pin testable’s: OM 338 PT
    Pin Testable residues J-STD 004 & Bellcore requests
    J-STD 004 & Bellcore requests Voiding: IPC 7095 Class III
    Automotive’s Nokia, Infineon, Panasonic…etc
    On 0.4 mm pitch.
    OM 338T Experiences...

    0.5 mm’s

    0.8 mm’s
    0.5 mm

    100 mm/s

    Perfect deposit.. no dog ear


    (120 mm/s)
    Release Speed…?

    Solderpaste Behaviour
    Stencil Quality
    Snap off setting.
    The target… No dog Ear.
    Dog Ears

    Bad Release Speed Good Release’s

    Release at 3 No release
    Release at 6
    On BGA’s
    Good Release’s
    Bad Release’s
    Solderpaste On Chips’

    Bad Release’s Good Release’s


    Accurate Printing

    Sn/Pb
    Pb Free

    Pre Reflow Post Reflow


    No issue on over- printing...
    But Less or No Spreading on Lead Free’s
    Printing Status...

    Miss- alignment Well Centred


    Results on Joints

    Not well centred Well centred


    To Get a Good Printing…?

    Microscope Near the Printers


    Good Off Set for Line Starting...

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