A. Haddi, A. Imad, G.

Vega,
Analysis of temperature and speed effects on the drawing stress for improving the
wire drawing process,
Materials & Design,
Volume 32, Issues 8–9,
2011,
Pages 4310-4315,
ISSN 0261-3069,
https://doi.org/10.1016/j.matdes.2011.04.010.
(https://www.sciencedirect.com/science/article/pii/S0261306911002652)
Abstract: This paper deals with experimental investigations in order to study the
influence of drawing conditions on temperature rise and drawing stress in cold
drawn copper wires. In the multipass drawing machine, the temperature rise and
drawing stress are measured with thermocouples and load cell systems, respectively,
for different drawing speeds. The results obtained show that the drawing stress and
temperature rise vary during the drawing process. This certainly comes from the
variation of the friction coefficient and the flow stress of the material depending
on the drawing speed. From the experimental results, a relationship between
temperature rise, drawing stress and friction coefficient is built. Based on this,
a modification of Avitzur’s model is presented. This new model can help to select
the process parameters which satisfy the conditions of minimum drawing stress for
copper material.
Keywords: A. Non-ferrous metals and alloys; C. Drawing; G. Thermal analysis