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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP2952-N, LP2952A, LP2953, LP2953A
SNVS095F – MAY 2004 – REVISED MARCH 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 15
2 Applications ........................................................... 1 7.4 Device Functional Mode ......................................... 16
3 Description ............................................................. 1 8 Application and Implementation ........................ 17
4 Revision History..................................................... 2 8.1 Application Information............................................ 17
8.2 Typical Applications ................................................ 21
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 30
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 31
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 31
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 31
6.4 Thermal Information .................................................. 5 10.3 Power Dissipation: Heatsink Requirements
(Industrial Temperature Range Devices) ................. 32
6.5 Electrical Characteristics: 3.3-V Versions ................. 5
6.6 Electrical Characteristics: 5-V Versions .................... 5
11 Device and Documentation Support ................. 34
11.1 Related Links ........................................................ 34
6.7 Electrical Characteristics: All Voltage Options .......... 6
11.2 Trademarks ........................................................... 34
6.8 Typical Characteristics .............................................. 9
11.3 Electrostatic Discharge Caution ............................ 34
7 Detailed Description ............................................ 14
11.4 Glossary ................................................................ 34
7.1 Overview ................................................................. 14
7.2 Functional Block Diagrams ..................................... 14
12 Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated
Thermal Information values; deleted obsolete LP2953AM references .................................................................................. 1
16 Pins 16 Pins
LP2952 SOIC (D) Package LP2953 SOIC (D) Package
Top View Top View
16 Pins
LP2953 PDIP (NBG) Package
Top View
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Power dissipation (2) Internally Limited
Input supply voltage −20 30 V
(3)
FEEDBACK input voltage −0.3 5 V
Comparator input voltage (4) −0.3 30 V
SHUTDOWN input voltage (4) −0.3 30 V
(4)
Comparator output voltage −0.3 30 V
Maximum junction temperature 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
using the equation for P(MAX): P(MAX) = (TJ(MAX) – TA) / RθJA.
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal
shutdown. See Power Supply Recommendations for additional information on heatsinking and thermal resistance.
(3) When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped
to ground.
(4) May exceed the input supply voltage.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1) Drive SHUTDOWN pin with TTL or CMOS low level to shut off regulator, high level to turn on regulator.
(2) Output or reference voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.
(3) Load regulation is measured at constant junction temperature using low duty-cycle pulse testing. Two separate tests are performed, one
for the range of IOUT = 100 μA to 1 mA and one for the range of IOUT =1 mA to 250 mA. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
(4) Dropout voltage is defined as the input-to-output differential at which the output voltage drops 100 mV below the value measured with a
1-V differential. At very low values of programmed output voltage, the input voltage minimum of 2 V (2.3 V over temperature) must be
observed.
(5) Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum of the ground pin current,
output load current, and current through the external resistive divider (if used).
(6) Thermal regulation is the change in output voltage at a time t after a change in power dissipation, excluding load or line regulation
effects. Specifications are for a 200-mA load pulse at VIN = VOUT(NOM) + 15 V (3-W pulse) for t = 10 ms.
6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated
(7) Connect a 0.1-μF capacitor from the OUT pin to the FEEDBACK pin.
(8) VREF ≤ VOUT ≤ (VIN − 1 V), 2.3 V ≤ VIN ≤ 30 V, 100 μA ≤ IOUT ≤ 250 mA.
(9) Two separate tests are performed, one covering 2.5 V ≤ VIN ≤ VOUT(NOM)) + 1 V and the other test for VOUT(NOM) + 1 V ≤ VIN ≤ 30 V.
(10) VSHUTDOWN ≤ 1.1 V, VOUT = VOUT(NOM)
(11) Comparator thresholds are expressed in terms of a voltage differential at the FEEDBACK pin below the nominal reference voltage
measured at VIN = VOUT(NOM) + 1 V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain,
which is VOUT / VREF = (R1 + R2) / R2 (see Figure 31).
(12) Drive SHUTDOWN pin with TTL or CMOS-low level to shut regulator OFF, high level to turn regulator ON.
Figure 13. Load Transient Response Figure 14. Load Transient Response
Figure 17. Enable Transient Figure 18. Short-Circuit Output Current and Maximum
Output Current
Figure 19. Feedback Bias Current Figure 20. FEEDBACK Pin Current
Figure 23. Divider Resistance Figure 24. Dropout Detection Comparator Threshold
Voltages
7 Detailed Description
7.1 Overview
The LP2952 and LP2953 are very high accuracy micropower voltage regulators with low quiescent current (130
μA, typical) and low dropout voltage (typically 60 mV at light loads and 490 mV at 250 mA). They are ideally
suited for use in battery-powered systems.
The LP2952 and LP2953 block diagram contains several features, including:
• Very high accuracy 1.23-V reference.
• Internal protection circuitry, such as thermal foldback current limit, thermal shutdown protection, and reverse
battery-input protection.
• Fixed 5-V and 3.3-V versions.
• Error flag output which may be used for a power-on reset.
• Shutdown input, allowing turn off the regulator when the SHUTDOWN pin is pulled low.
LP2953 versions only:
• An auxiliary comparator is designed for customer special purpose when shutdown is activated, this is a
CMOS- or TTL-compatible output level.
• Automatic output discharge when the SHUTDOWN pin is pulled low.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
where
• VREF is the 1.23-V reference and IFB is the FEEDBACK pin bias current (−20 nA, typical). (1)
The minimum recommended load current of 1 μA sets an upper limit of 1.2 MΩ on the value of R2 in cases
where the regulator must work with no load (see Minimum Load). IFB will produce a typical 2% error in VOUT
which can be eliminated at room temperature by trimming R1. For better accuracy, choosing R2 = 100 kΩ will
reduce this error to 0.17% while increasing the resistor program current to 12 μA. Because the typical quiescent
current is 120 μA, this added current is negligible.
* In shutdown mode, ERROR will go high if it has been pulled up to an external supply. To avoid this invalid
response, pull up to regulator output.
** Exact value depends on dropout voltage. (See Power Supply Recommendations)
(2)
This gives a value of about 0.1 μF. When this is used, the output capacitor must be 6.8 μF (or greater) to
maintain stability. The 0.1-μF capacitor reduces the high-frequency gain of the circuit to unity, lowering the output
noise from 260 μV to 80 μV using a 10-Hz to 100-kHz bandwidth. Also, noise is no longer proportional to the
output voltage, so improvements are more pronounced at high output voltages.
NOTE
Because the Absolute Maximum Ratings state that the SHUTDOWN input can not go
more than 0.3 V below ground, the reverse battery-input protection feature which protects
the regulator input is sacrificed if the SHUTDOWN input is tied directly to the regulator
input.
If reverse-battery input protection is required in an application, the pullup resistor between the SHUTDOWN input
and the regulator input must be used.
Figure 34. Line Transient Response Figure 35. Load Transient Response
8.2.4 5-V Regulator With Error Flags for Low Battery and Out of Regulation
Figure 38 is the example circuit for 5-V regulator with error flags for low battery and out of regulation, it has the
following features:
• Connect to logic or microprocessor control inputs.
• LOW BATT flag warns the user that the battery has discharged down to about 5.8 V, giving the user time to
recharge the battery or power down some hardware with high power requirements. The output is still in
regulation at this time.
• OUT OF REGULATION flag indicates when the battery is almost completely discharged, and can be used to
initiate a power-down sequence.
Figure 38. 5-V Regulator With Error Flags for Low Battery and Out of Regulation
8.2.5 5-V Battery Powered Supply With Backup and Low Battery Flag
Figure 39 is the example circuit for 5-V battery powered supply with backup and low battery flag, it has the
following features:
• The circuit switches to the NI-CAD backup battery when the main battery voltage drops below about 5.6 V
and returns to the main battery when its voltage is recharged to about 6 V.
• The 5-V MAIN output powers circuitry which requires no backup, and the 5-V MEMORY output powers critical
circuitry which cannot be allowed to lose power.
• The BATTERY LOW flag goes low whenever the circuit switches to the NI-CAD backup battery.
Figure 39. 5-V Battery Powered Supply With Backup and Low Battery Flag
* RT = 1 MΩ, CT = 0.1 μF
8.2.7 5-V Regulator With Snap-ON and Snap-OFF Features and Hysteresis
Figure 42 is the circuit designed to generate 5-V regulator with snap-ON and snap-OFF features and hysteresis.
The output turns on at VIN = 5.87 V and turns off at VIN = 5.64 V.
Figure 42. 5-V Regulator With Snap-ON and Snap-OFF Features and Hysteresis
8.2.8 5-V Regulator With Error Flags for Low Battery and Out of Regulation With Snap-ON or Snap-OFF
Output
Figure 43 is the circuit as 5-V regulator with error flags for low battery and out of regulation with Snap-ON/Snap-
OFF output. It has the following features:
• Connect to logic or microprocessor control inputs.
• LOW BATT flag warns the user that the battery has discharged down to about 5.8 V, giving the user time to
recharge the battery or shutdown hardware with high power requirements. The output is still in regulation at
this time.
• OUT OF REGULATION flag goes low if the output goes below about 4.7 V, which could occur from a load
fault.
• OUTPUT has Snap-ON or Snap-OFF feature. Regulator snaps ON at about 5.7-V input, and OFF at about
5.6 V.
Figure 43. 5-V Regulator With Error Flags for Low Battery and Out of Regulation With Snap-ON or Snap-
OFF Output
8.2.9 5-V Regulator With Timed Power-On Reset, Snap-ON and Snap-OFF Features, and Hysteresis
Figure 44 is the circuit designed for 5-V regulator with timed power-on reset, Snap-ON and Snap-OFF features,
and hysteresis. Its timing diagram shows as Figure 45.
Figure 44. 5-V Regulator With Timed Power-On Reset, Snap-ON or Snap-OFF Feature, and Hysteresis
10 Layout
GND GROUND
Input
Capacitor
NC IN
VIN
Output
Capacitor
OUT FEEDBACK
VOUT
SENSE VTAP
Ground
SHUTDOWN REFERENCE
Error Pullup
Resistor
Vout ERROR NC
NC NC
GROUND GROUND
To determine if a heatsink is required, the maximum power dissipated by the regulator, P(MAX), must be
calculated. It is important to remember that if the regulator is powered from a transformer connected to the AC
line, the maximum specified AC input voltage must be used (because this produces the maximum DC input
voltage to the regulator). Figure 48 shows the voltages and currents which are present in the circuit. The formula
for calculating the power dissipated in the regulator is also shown in Figure 48:
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX). This is
calculated by using the formula:
TR(MAX) = TJ(MAX) − TA(MAX) = RθJA × P(MAX)
where:
• TJ(MAX) is the maximum allowable junction temperature
• TA(MAX) is the maximum ambient temperature (3)
Using the calculated values for TR(MAX) and P(MAX), the required value for junction-to-ambient thermal resistance,
RθJA, can now be found.
Figure 49 shows copper patterns which may be used to dissipate heat from the LP2952 and LP2953.
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 11-Jan-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LP2952AIMX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LP2952AIM
LP2952IMX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LP2952IM
LP2953AIM/NOPB ACTIVE SOIC D 16 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LP2953AIM
LP2953AIMX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LP2953AIM
LP2953IM/NOPB ACTIVE SOIC D 16 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LP2953IM
LP2953IMX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LP2953IM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Oct-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Oct-2016
Pack Materials-Page 2
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