BT1308W 400D NXP

BT1308W-400D
23
T2
SO 4Q Triac
20 August 2013 Product data sheet
1. General description
Planar passivated four quadrant triac in a SOT223 surface-mountable plastic package.
This very sensitive gate "series D" triac is intended to be interfaced directly to
microcontrollers, logic integrated circuits and other low power gate trigger circuits.
2. Features and benefits

• Direct interfacing to logic level ICs
• Direct interfacing to low power gate drivers and microcontrollers
• Medium blocking voltage capability
• Planar passivated for voltage ruggedness and reliability
• Surface-mountable package
• Triggering in all four quadrants
• Very sensitive gate
3. Applications
• AC Fan controller
• General purpose low power phase control
• General purpose low power switching
4. Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off- - - 400 V
state voltage
ITSM non-repetitive peak on- full sine wave; Tj(init) = 25 °C; - - 9 A
state current tp = 20 ms; Fig. 4; Fig. 5
IT(RMS) RMS on-state current full sine wave; Tsp ≤ 107 °C; Fig. 1; - - 0.8 A
Fig. 2; Fig. 3
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; - 1 5 mA
Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2+ G-; - 2 5 mA

Tj = 25 °C; Fig. 9
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NXP Semiconductors BT1308W-400D
4Q Triac

VD = 12 V; IT = 0.1 A; T2- G-; - 2 5 mA
Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2- G+; - 4 7 mA

Tj = 25 °C; Fig. 9
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 T1 main terminal 1 4
T2 T1
2 T2 main terminal 2 G
sym051
3 G gate
1 2 3
4 T2 main terminal 2
SC-73 (SOT223)
6. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BT1308W-400D SC-73 plastic surface-mounted package with increased heatsink; 4 SOT223
leads
BT1308W-400D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 20 August 2013 2 / 15

4Q Triac
7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 400 V
IT(RMS) RMS on-state current full sine wave; Tsp ≤ 107 °C; Fig. 1; - 0.8 A
Fig. 2; Fig. 3
ITSM non-repetitive peak on-state full sine wave; Tj(init) = 25 °C; - 9 A
current tp = 20 ms; Fig. 4; Fig. 5
full sine wave; Tj(init) = 25 °C; - 10 A

tp = 16.7 ms
2
I t I2t for fusing tp = 10 ms; SIN - 0.32 2
A s
dIT/dt rate of rise of on-state current IT = 1 A; IG = 20 mA; dIG/dt = 0.2 A/µs; - 50 A/µs
T2+ G+
IT = 1 A; IG = 20 mA; dIG/dt = 0.2 A/µs; - 50 A/µs
T2+ G-
T2- G-
T2- G+
IGM peak gate current - 1 A
PGM peak gate power - 5 W
PG(AV) average gate power over any 20 ms period - 0.1 W
Tstg storage temperature -40 150 °C
Tj junction temperature - 125 °C

4Q Triac
003aab489 003aab487
6 1
IT(RMS)
IT(RMS) (A)
(A)
0.8
4
0.6
0.4
2
0.2
0 0
10-2 10-1 1 10 -50 0 50 100 150
surge duration (s) Tsp (°C)
f = 50 Hz; Tsp = 107 °C Fig. 2. RMS on-state current as a function of solder

Fig. 1. RMS on-state current as a function of surge point temperature; maximum values
duration; maximum values
003aac209
1.2
conduction form α = 180°
angle factor
Ptot (degrees) a 120°
(W)
30 4
90°
60 2.8
α
90 2.2 60°
0.8
120 1.9
180 1.57
30°
0.4
0.0
0 0.2 0.4 0.6 0.8 1
IT(RMS) (A)
α = conduction angle
a = form factor = IT(RMS) / IT(AV)
Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values

4Q Triac
003aac207
12
ITSM
(A)
IT ITSM
4
1/f
Tj(init) = 25 °C max
0
1 10 102 103
number of cycles
f = 50 Hz
Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
003aac208
103
ITSM IT ITSM
(A)
t
tp
Tj(init) = 25 °C max
102
(1)
(2)
10
10-5 10-4 10-3 10-2 10-1
tp (s)
tp ≤ 20 ms
(1) dIT/dt limit
(2) T2- G+ quadrant limit
Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values

4Q Triac
8. Thermal characteristics
Table 5. Thermal characteristics
Rth(j-sp) thermal resistance full cycle; Fig. 8 - - 15 K/W
from junction to solder
point
Rth(j-a) thermal resistance full cycle; for minimum footprint; Fig. 6 - 156 - K/W
from junction to full cycle; for pad area; Fig. 7 - 70 - K/W
ambient
3.8 min
36
1.5
min
18
6.3 60 4.6 4.5

9
1.5
2.3
min
(3×) 10
1.5
min
4.6
001aab508
7
All dimensions are in mm 15
Fig. 6. Minimum footprint SOT223 50
001aab509
All dimensions are in mm

Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Fig. 7. Printed circuit board pad area: SOT223

4Q Triac
003aac210
102
Z th(j-sp)
(K/W)
10
P
10-1
tp t
10-2
10-5 10-4 10-3 10-2 10-1 1 10
tp (s)
Fig. 8. Transient thermal impedance from junction to solder point as a function of pulse width

4Q Triac
9. Characteristics
Table 6. Characteristics
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; - 1 5 mA
Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2+ G-; - 2 5 mA

Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2- G-; - 2 5 mA

Tj = 25 °C; Fig. 9
VD = 12 V; IT = 0.1 A; T2- G+; - 4 7 mA

Tj = 25 °C; Fig. 9
IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; - 5 10 mA

Tj = 25 °C; Fig. 10
VD = 12 V; IG = 0.1 A; T2+ G-; - 1 10 mA

Tj = 25 °C; Fig. 10
VD = 12 V; IG = 0.1 A; T2- G-; - 1 10 mA

Tj = 25 °C; Fig. 10
VD = 12 V; IG = 0.1 A; T2- G+; - 2 10 mA

Tj = 25 °C; Fig. 10
IH holding current VD = 12 V; Tj = 25 °C; Fig. 11 - 1 10 mA
VT on-state voltage IT = 0.85 A; Tj = 25 °C; Fig. 12 - 1.35 1.6 V
VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.9 1.5 V

Fig. 13
VD = 400 V; IT = 0.1 A; Tj = 110 °C; 0.1 0.7 - V
Fig. 13
ID off-state current VD = 400 V; Tj = 125 °C - 0.1 0.5 mA
Dynamic characteristics
dVD/dt rate of rise of off-state VDM = 268 V; Tj = 110 °C; (VDM = 67% 30 45 - V/µs
voltage of VDRM); exponential waveform; gate
open circuit
dVcom/dt rate of change of VD = 400 V; Tj = 50 °C; dIcom/dt = 0.3 A/ - 5 - V/µs
commutating voltage ms; IT = 0.84 A; gate open circuit
tgt gate-controlled turn-on ITM = 1 A; VD = 400 V; IG = 25 mA; dIG/ - 2 - µs

time dt = 5 A/µs

4Q Triac
003aaa030 003aaa031
3 3
IGT IL
IGT(25°C) IL(25°C)
(1)
(2)
2 2
(3)
(4)
(1)
(2)
(3)
1 1
(4)
0 0
-60 -10 40 90 140 -60 -10 40 90 140
Tj (°C) Tj (°C)
(1) T2+ G+ Fig. 10. Normalized latching current as a function of

(2) T2- G+ junction temperature
(3) T2- G-
(4) T2+ G-
Fig. 9. Normalized gate trigger current as a function of
junction temperature
003aaa032 003aab486
2.0 1.6
IH IT
IH(25°C) (A)
1.5 1.2
1.0 0.8
(1) (2) (3)

0.5 0.4
0 0
-60 -10 40 90 140 0 0.4 0.8 1.2 1.6 2
Tj (°C) VT (V)
Fig. 11. Normalized holding current as a function of Vo = 1.171 V; Rs = 0.5125 Ω

junction temperature (1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 12. On-state current as a function of on-state
voltage

4Q Triac
003aaa039
1.6
VGT
VGT(25°C)
1.2
0.8
0.4
0
-60 -10 40 90 140
Tj (°C)
Fig. 13. Normalized gate trigger voltage as a function of junction temperature

4Q Triac
10. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads SOT223
D B E A X
y
HE v M A
b1
A1
1 2 3 Lp
e1 bp w M B detail X
0 2 4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y
1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95
mm 4.6 2.3 0.2 0.1 0.1
1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85
OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
04-11-10
SOT223 SC-73
06-03-16
Fig. 14. Package outline SC-73 (SOT223)


4Q Triac
11. Soldering
7
3.85
3.6
3.5
0.3
1.3 1.2
(4×) (4×)
4 solder lands
solder resist
3.9 6.1 7.65 solder paste
occupied area
1 2 3
Dimensions in mm
2.3 2.3
1.2
(3×)
1.3
(3×)
6.15 sot223_fr
Fig. 15. Reflow soldering footprint for SC-73 (SOT223)

8.9
6.7
1.9
4
solder lands
solder resist
6.2 8.7
occupied area
Dimensions in mm
1 2 3
preferred transport
1.9 direction during soldering
(3×)
2.7 2.7
1.9
1.1
(2×) sot223_fw
Fig. 16. Wave soldering footprint for SC-73 (SOT223)

4Q Triac
In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -
12. Legal information lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
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whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
Document Product Definition customer for the products described herein shall be limited in accordance
status [1][2] status [3] with the Terms and conditions of commercial sale of NXP Semiconductors.
Objective Development This document contains data from Right to make changes — NXP Semiconductors reserves the right to
[short] data the objective specification for product make changes to information published in this document, including without
sheet development. limitation specifications and product descriptions, at any time and without
Preliminary Qualification This document contains data from the notice. This document supersedes and replaces all information supplied prior
[short] data preliminary specification. to the publication hereof.
sheet
Suitability for use — NXP Semiconductors products are not designed,
Product Production This document contains the product authorized or warranted to be suitable for use in life support, life-critical or
[short] data specification. safety-critical systems or equipment, nor in applications where failure or
sheet malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
[1] Please consult the most recently issued document before initiating or damage. NXP Semiconductors and its suppliers accept no liability for
completing a design. inclusion and/or use of NXP Semiconductors products in such equipment or
[2] The term 'short data sheet' is explained in section "Definitions". applications and therefore such inclusion and/or use is at the customer’s own
[3] The product status of device(s) described in this document may have risk.
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on Quick reference data — The Quick reference data is an extract of the
the Internet at URL http://www.nxp.com. product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these

12.2 Definitions products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
Preview — The document is a preview version only. The document is still specified use without further testing or modification.
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to Customers are responsible for the design and operation of their
the accuracy or completeness of information included herein and shall have applications and products using NXP Semiconductors products, and NXP
no liability for the consequences of use of such information. Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
Draft — The document is a draft version only. The content is still under whether the NXP Semiconductors product is suitable and fit for the
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information included herein and shall have no liability for the consequences associated with their applications and products.
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Short data sheet — A short data sheet is an extract from a full data sheet damage, costs or problem which is based on any weakness or default
with the same product type number(s) and title. A short data sheet is in the customer’s applications or products, or the application or use by
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Product specification — The information and data provided in a Product Limiting values — Stress above one or more limiting values (as defined in
data sheet shall define the specification of the product as agreed between the Absolute Maximum Ratings System of IEC 60134) will cause permanent
NXP Semiconductors and its customer, unless NXP Semiconductors and damage to the device. Limiting values are stress ratings only and (proper)
customer have explicitly agreed otherwise in writing. In no event however, operation of the device at these or any other conditions above those
shall an agreement be valid in which the NXP Semiconductors product given in the Recommended operating conditions section (if present) or the
is deemed to offer functions and qualities beyond those described in the Characteristics sections of this document is not warranted. Constant or
Product data sheet. repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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12.3 Disclaimers products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Limited warranty and liability — Information in this document is believed agreed in a valid written individual agreement. In case an individual
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responsibility for the content in this document if provided by an information
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No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the

4Q Triac
grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
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NXP Semiconductors accepts no liability for inclusion and/or use of non-
automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
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reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
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trademarks are the property of their respective owners.
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FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
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TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

4Q Triac
13. Contents
1 General description ............................................... 1
2 Features and benefits ............................................1
3 Applications ........................................................... 1
4 Quick reference data ............................................. 1
5 Pinning information ............................................... 2
6 Ordering information ............................................. 2
7 Limiting values .......................................................3
8 Thermal characteristics .........................................6
9 Characteristics ....................................................... 8
10 Package outline ................................................... 11
11 Soldering .............................................................. 12
12 Legal information .................................................13
12.1 Data sheet status ............................................... 13
12.2 Definitions ...........................................................13
12.3 Disclaimers .........................................................13
12.4 Trademarks ........................................................ 14
© NXP N.V. 2013. All rights reserved

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 August 2013

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2. Features and benefits

4. Quick reference data

VD = 12 V; IT = 0.1 A; T2+ G-; - 2 5 mA

Symbol Parameter Conditions Min Typ Max Unit

VD = 12 V; IT = 0.1 A; T2- G+; - 4 7 mA

Product data sheet 20 August 2013 2 / 15

full sine wave; Tj(init) = 25 °C; - 10 A

PGM peak gate power - 5 W

PG(AV) average gate power over any 20 ms period - 0.1 W

Tstg storage temperature -40 150 °C

Tj junction temperature - 125 °C

Product data sheet 20 August 2013 3 / 15

f = 50 Hz; Tsp = 107 °C Fig. 2. RMS on-state current as a function of solder

Product data sheet 20 August 2013 4 / 15

Product data sheet 20 August 2013 5 / 15

6.3 60 4.6 4.5

All dimensions are in mm

Product data sheet 20 August 2013 6 / 15

Product data sheet 20 August 2013 7 / 15

VD = 12 V; IT = 0.1 A; T2+ G-; - 2 5 mA

VD = 12 V; IT = 0.1 A; T2- G-; - 2 5 mA

VD = 12 V; IT = 0.1 A; T2- G+; - 4 7 mA

IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; - 5 10 mA

VD = 12 V; IG = 0.1 A; T2+ G-; - 1 10 mA

VD = 12 V; IG = 0.1 A; T2- G-; - 1 10 mA

VD = 12 V; IG = 0.1 A; T2- G+; - 2 10 mA

IH holding current VD = 12 V; Tj = 25 °C; Fig. 11 - 1 10 mA

VT on-state voltage IT = 0.85 A; Tj = 25 °C; Fig. 12 - 1.35 1.6 V

VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.9 1.5 V

tgt gate-controlled turn-on ITM = 1 A; VD = 400 V; IG = 25 mA; dIG/ - 2 - µs

Product data sheet 20 August 2013 8 / 15

(1) T2+ G+ Fig. 10. Normalized latching current as a function of

(1) (2) (3)

Fig. 11. Normalized holding current as a function of Vo = 1.171 V; Rs = 0.5125 Ω

Product data sheet 20 August 2013 9 / 15

Fig. 13. Normalized gate trigger voltage as a function of junction temperature

Product data sheet 20 August 2013 10 / 15

10. Package outline

Plastic surface-mounted package with increased heatsink; 4 leads SOT223

DIMENSIONS (mm are the original dimensions)

OUTLINE REFERENCES EUROPEAN

Fig. 14. Package outline SC-73 (SOT223)

Product data sheet 20 August 2013 11 / 15

3.9 6.1 7.65 solder paste

Fig. 15. Reflow soldering footprint for SC-73 (SOT223)

Fig. 16. Wave soldering footprint for SC-73 (SOT223)

Product data sheet 20 August 2013 12 / 15

In no event shall NXP Semiconductors be liable for any indirect, incidental,

Applications — Applications that are described herein for any of these

Terms and conditions of commercial sale — NXP Semiconductors

Product data sheet 20 August 2013 13 / 15

grant, conveyance or implication of any license under any copyrights, patents

Export control — This document as well as the item(s) described herein

Non-automotive qualified products — Unless this data sheet expressly

Translations — A non-English (translated) version of a document is for

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Product data sheet 20 August 2013 14 / 15

© NXP N.V. 2013. All rights reserved

Product data sheet 20 August 2013 15 / 15

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