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+5V +5V
Input R1
Signal 50W DNC(1) 1 8 DNC(1)
0V to 4V OPA365 +IN VDD
VIN 2 7 NC(2)
ADS8326 REF50xx
C1
-IN TEMP 3 6 VOUT
1.2nF REF GND
GND 4 5 TRIM
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
REF5020,, REF5025
REF5030, REF5040
REF5045, REF5050 www.ti.com
SBOS410 – JUNE 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) MSOP-8 (DGK) package available Q3, 2007.
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
TYPICAL CHARACTERISTICS
At TA = +25°C, ILOAD = 0, and VS = VOUT + 0.2V, unless otherwise noted. For VOUT ≤ 2.5V, the minimum supply voltage is 2.7V.
Population (%)
0
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
6.00
6.50
7.00
7.50
8.00
0.25
0.75
1.25
1.75
2.25
2.75
3.25
3.75
4.25
4.75
0
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
4.50
5.00
Drift (ppm/°C) Drift (ppm/°C)
Figure 1. Figure 2.
0.03
0.02
Population (%)
0.01
0
-0.01
-0.02
-0.03
-0.04
-0.05
-0.01
0.01
-0.03
-0.02
0.02
0.03
-0.05
0.05
-0.04
0.04
0
Figure 3. Figure 4.
120 0.6
Dropout Voltage (V)
+25°C
100 0.5
PSRR (dB)
-40°C
80 0.4
60 0.3
40 0.2
20 0.1
0 0
10 100 1k 10k 100k -15 -10 -5 0 5 10 15
Frequency (Hz) Load Current (mA)
Figure 5. Figure 6.
2.50050
0.7
2.50025
+25°C
2.50000 0.6
2.49975
0.5
2.49950
-40°C
2.49925
0.4
+125°C
2.49900
2.49875 0.3
-10 -5 0 5 10 -50 -25 0 25 50 75 100 125
Load Current (mA) Temperature (°C)
Figure 7. Figure 8.
1000 0.4
950 0.3
Line Regulation (ppm/V)
Quiescent Current (mA)
0.2
900
0.1
850
0
800
-0.1
750
-0.2
700 -0.3
650 -0.4
600 -0.5
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
Figure 9. Figure 10.
SHORT-CIRCUIT CURRENT
vs TEMPERATURE NOISE
35
Sourcing
30
Short-Circuit Current (mA)
25
1mV/div
20
Sinking
15
10
0
-50 -25 0 25 50 75 100 125 1s/div
Temperature (°C)
Figure 11. Figure 12.
STARTUP STARTUP
(REF5025, CL = 1μF) (REF5025, CL = 10μF)
VIN
5V/div
VIN
2V/div
VOUT
VOUT 1V/div
1V/div
40ms/div 400ms/div
Figure 13. Figure 14.
+1mA ILOAD
+10mA +10mA
ILOAD 10mA/div
-1mA -1mA
1mA/div
-10mA
VOUT VOUT
5mV/div 2mV/div
20ms/div 20ms/div
Figure 15. Figure 16.
VOUT VOUT
5mV/div 2mV/div
100ms/div 100ms/div
Figure 17. Figure 18.
VIN
500mV/div
VIN
500mV/div
VOUT
5mV/div
VOUT
5mV/div
20ms/div 100ms/div
Figure 19. Figure 20.
APPLICATION INFORMATION
REF50xx
Figure 21. REF50xx Simplified Block Diagram DNC DNC
VIN NC
BASIC CONNECTIONS TEMP VOUT
GND TRIM
Figure 22 shows the typical connections for the 10kW
470W
REF50xx. A supply bypass capacitor ranging
between 1μF to 10μF is recommended. A 1μF to 1kW
50μF, low-ESR output capacitor (CL) must be
connected to VOUT.
+VSUPPLY
Figure 23. VOUT Adjustment Using the TRIM Pin
REF50xx
DNC DNC
TEMPERATURE DRIFT
VIN NC
CBYPASS
TEMP VOUT VOUT The REF50xx is designed for minimal drift error,
1mF to 10mF
GND CL
which is defined as the change in output voltage over
TRIM
1mF to 50mF temperature. The drift is calculated using the box
method, as described by the following equation:
REF50xx
DNC DNC
VTEMP (1) VIN NC
OPA
2.6mV/°C
TEMP VOUT
GND TRIM
NOTE: (1) Low drift op amp, such as the OPA333, OPA335, or OPA376.
APPLICATION CIRCUITS
OPA735 -2.5V
-5V
NOTE: Bypass capacitors not shown.
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
REF5020AID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5020AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5020AIDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5020AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5020ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5020IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5020IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5020IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025AID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025AIDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5025IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030AID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030AIDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5030IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5040AID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 23-Jul-2007
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
REF5040AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5040AIDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5040AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5040ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5040IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5040IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5040IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045AID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045AIDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5045IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050AID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050AIDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
REF5050IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 23-Jul-2007
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
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