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STMicroelectronics-STM32H743IIT6 C89597
STMicroelectronics-STM32H743IIT6 C89597
Features FBGA
Core
• 32-bit Arm® Cortex®-M7 core with double- TFBGA240+25 (14x14 mm)
TFBGA100 (8x8 mm)(1) LQFP208
precision FPU and L1 cache: 16 Kbytes of data (28x28 mm)
and 16 Kbytes of instruction cache allowing FBGA
LQFP176
(24x24 mm)
one cache line to be filled in a single access LQFP144
from the 256-bit embedded Flash memory; (20x20 mm)
frequency up to 400 MHz, MPU, 856 DMIPS/ UFBGA176+25 (10x10 mm) LQFP100
UFBGA169 (7x7 mm)(1) (14x14 mm)
2.14 DMIPS/MHz (Dhrystone 2.1), and DSP
1. Package under development.
instructions
– D1: high-performance capabilities for high
Memories bandwidth peripherals
• Up to 2 Mbytes of Flash memory with read- – D2: communication peripherals and timers
while-write support – D3: reset/clock control/power management
• 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. • 1.62 to 3.6 V application supply and I/Os
64 Kbytes of ITCM RAM + 128 Kbytes of • POR, PDR, PVD and BOR
DTCM RAM for time critical routines),
864 Kbytes of user SRAM, and 4 Kbytes of • Dedicated USB power embedding a 3.3 V
SRAM in Backup domain internal regulator to supply the internal PHYs
• Dual mode Quad-SPI memory interface • Embedded regulator (LDO) with configurable
running up to 133 MHz scalable output to supply the digital circuitry
• Flexible external memory controller with up to • Voltage scaling in Run and Stop mode (5
32-bit data bus: SRAM, PSRAM, configurable ranges)
SDRAM/LPSDR SDRAM, NOR/NAND Flash • Backup regulator (~0.9 V)
clocked up to 133 MHz in synchronous mode • Voltage reference for analog peripheral/VREF+
• CRC calculation unit • Low-power modes: Sleep, Stop, Standby and
VBAT supporting battery charging
Security
• ROP, PC-ROP, active tamper Low-power consumption
• Total current consumption down to 4 µA
General-purpose input/outputs
• Up to 168 I/O ports with interrupt capability Clock management
– Fast I/Os capable of up to 133 MHz • Internal oscillators: 64 MHz HSI, 48 MHz
– Up to 164 5 V-tolerant I/Os HSI48, 4 MHz CSI, 40 kHz LSI
• External oscillators: 4-48 MHz HSE,
Reset and power management 32.768 kHz LSE
• 3 separate power domains which can be • 3× PLLs (1 for the system clock, 2 for kernel
independently clock gated or switched off to clocks) with fractional mode
maximize power efficiency:
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 Arm® Cortex®-M7 with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2 Memory protection unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3.1 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3.2 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5 Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5.1 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.5.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.6 Low-power strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.7 Reset and clock controller (RCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.7.1 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.7.2 System reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.8 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.9 Bus-interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.10 DMA controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.11 Chrom-ART Accelerator™ (DMA2D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.12 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 27
3.13 Extended interrupt and event controller (EXTI) . . . . . . . . . . . . . . . . . . . . 27
3.14 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 27
3.15 Flexible memory controller (FMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.16 Quad-SPI memory interface (QUADSPI) . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.17 Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.18 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.19 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.20 Digital-to-analog converters (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
5 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
6.3.2 VCAP1/VCAP2/VCAP3 external capacitor . . . . . . . . . . . . . . . . . . . . . . 99
6.3.3 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 99
6.3.4 Embedded reset and power control block characteristics . . . . . . . . . . 100
6.3.5 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
6.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
6.3.7 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . 115
6.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 116
6.3.9 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 120
6.3.10 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
6.3.11 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
6.3.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
6.3.13 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 126
6.3.14 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
6.3.15 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
6.3.16 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
6.3.17 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
6.3.18 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
6.3.19 Delay block (DLYB) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
6.3.20 16-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
6.3.21 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
6.3.22 Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 166
6.3.23 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
6.3.24 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
List of tables
List of figures
1 Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32H743xI microcontrollers.
This document should be read in conjunction with the STM32H743xI reference manual
(RM0433). The reference manual is available from the STMicroelectronics website
www.st.com.
For information on the Arm® Cortex®-M7 core, please refer to the Cortex®-M7 Technical
Reference Manual, available from the www.arm.com website.
2 Description
STM32H743xI devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC
core operating at up to 400 MHz. The Cortex® -M7 core features a floating point unit (FPU)
which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-
processing instructions and data types. STM32H743xI devices support a full set of DSP
instructions and a memory protection unit (MPU) to enhance application security.
STM32H743xI devices incorporate high-speed embedded memories with a dual-bank Flash
memory up to 2 Mbytes, 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, 864 Kbytes of
user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced
I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix
and a multi layer AXI interconnect supporting internal and external memory access.
All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power
RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor
control, five low-power timers and a true random number generator (RNG). The devices
support four digital filters for external sigma-delta modulators (DFSDM). They also feature
standard and advanced communication interfaces.
• Standard peripherals
– Four I2Cs
– Four USARTs, four UARTs and one LPUART
– Six SPIs, three I2Ss in half-duplex mode. To achieve audio class accuracy, the I2S
peripherals can be clocked by a dedicated internal audio PLL or by an external
clock to allow synchronization.
– Four SAI serial audio interfaces
– One SPDIFRX interface
– One SWPMI (Single Wire Protocol Master Interface)
– Management Data Input/Output (MDIO) slaves
– Two SDMMC interfaces
– A USB OTG full-speed and a USB OTG high-speed interface with full-speed
capability (with the ULPI)
– One FDCAN plus one TT-CAN interface
– An Ethernet interface
– Chrom-ART Accelerator™
– HDMI-CEC
• Advanced peripherals including
– A flexible memory control (FMC) interface
– A Quad-SPI Flash memory interface
– A camera interface for CMOS sensors
– An LCD-TFT display controller
– A JPEG hardware compressor/decompressor
Refer to Table 2: STM32H743xI features and peripheral counts for the list of peripherals
available on each part number.
STM32H743xI devices operate in the –40 to +85 °C temperature range from a 1.62 to 3.6 V
power supply. The supply voltage can drop down to 1.62 V by using an external power
supervisor (see Section 3.5.2: Power supply supervisor) and connecting the PDR_ON pin to
VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power
voltage detector enabled.
Dedicated supply inputs for USB (OTG_FS and OTG_HS) are available on all packages
except LQFP100 to allow a greater power supply choice.
A comprehensive set of power-saving modes allows the design of low-power applications.
STM32H743xI devices are offered in 8 packages ranging from 100 pins to 240 pins/balls.
The set of included peripherals changes with the device chosen.
These features make STM32H743xI microcontrollers suitable for a wide range of
applications:
• Motor drive and application control
• Medical equipment
• Industrial applications: PLC, inverters, circuit breakers
• Printers, and scanners
• Alarm systems, video intercom, and HVAC
• Home audio appliances
• Mobile applications, Internet of Things
• Wearable devices: smart watches.
Figure 1 shows the general block diagram of the device family.
High-resolution 1
General-purpose 10
Advanced-control
Timers 2
(PWM)
Basic 2
Low-power 5
Random number generator Yes
2S
SPI / I 6/3(1)
I2C 4
USART/UART/ 4/4
LPUART /1
SAI 4
SPDIFRX 4 inputs
Communicati
on interfaces SWPMI Yes
MDIO Yes
SDMMC 2
FDCAN/TT-CAN 1/1
USB OTG_FS Yes
USB OTG_HS Yes
Ethernet and camera interface Yes
LCD-TFT Yes
JPEG Codec Yes
Chrom-ART Accelerator™ (DMA2D) Yes
GPIOs 82 114 131 140 168
8 to 16-bit ADCs 3
Number of channels 20
12-bit DAC Yes
Number of channels 2
Comparators 2
Operational amplifiers 2
DFSDM Yes
Maximum CPU frequency 400 MHz
1.71 to
Operating voltage 1.62 to 3.6 V(3)
3.6 V(2)
AHB1 (200MHz)
I-TCM D-TCM D-TCM
64KB 64KB 64KB PHY PHY
ETHER
DMA1 DMA2 SDMMC2 OTG_HS OTG_FS
MAC
AHBP
Arm CPU
8 Stream 8 Stream DMA/ DMA/ DMA/
JTRST, JTDI, Cortex-M7 AXI/AHB12 (200MHz) FIFO
FIFOs FIFOs FIFO FIFO FIFO
JTCK/SWCLK JTAG/SW 400 MHz
JTDO/SWD, JTDO AXIM 1 MB FLASH
TRACECK ETM 1 MB FLASH 32-bit AHB BUS-MATRIX
TRACED[3:0] I-Cache D-Cache
512 KB AXI
AHB1 (200MHz)
16KB 16KB DMA
AHBS SRAM SRAM1 SRAM2 SRAM3
Mux1
128 KB 128 KB 32 KB
AHB4 (200MHz)
AHB2 (200MHz)
16 Streams FMC
MDMA
TIM14 1 channel as AF
HSYNC, VSYNC, PIXCLK, D[13:0] DCMI 16b
AHB/APB smcard
HRTIM1_CH[A..E]x RX, TX, SCK, CTS,
USART2
HRTIM1_FLT[5:1], HRTIM1 irDA RTS as AF
HRTIM1_FLT[5:1]_in, SYSFLT smcard RX, TX, SCK
DFSDM_CKOUT, USART3 CTS, RTS as AF
DFSDM_DATAIN[0:7], DFSDM irDA
DFSDM_CKIN[0:7] UART4 RX, TX as AF
FIFO FIFO FIFO
MOSI, MISO, SCK, NSS as AF SPI2/I2S2 SDO, SDI, CK, WS, MCK, as AF
1 compl. chan.(TIM17_CH1N), MOSI, MISO, SCK, NSS /
TIM17 SPI3/I2S3
APB1 100 MHz (max)
Digital filter
2 compl. chan.(TIM15_CH1[1:2]N), TIM15 DMA
AHB4
smcard
RX, TX, SCK, CTS, RTS as AF
irDA USART6 32-bit AHB BUS-MATRIX RAM TT-FDCAN1 TX, RX
FIFO
smcard I/F
RX, TX, SCK, CTS, RTS as AF
irDA USART1 FDCAN2 TX, RX
AHB4 (200MHz)
OPAMPx_VINM
control OPAMP1&2
OPAMPx_VINP
@VDD33 OPAMPx_VOUT as AF
SD, SCK, FS, MCLK,
D[3;1], CK[2:1] as AF
SAI4 VDD12 BBgen + POWER MNGT
VDDMMC33 = 1.8 to 3.6V
PWRCTRL
COMPx_INP, COMPx_INM,
COMP1&2 Voltage VDDUSB33 = 3.0 to 3.6 V
COMPx_OUT as AF VDD = 1.8 to 3.6 V
Tamper monitor regulator VSS
LPTIM5_OUT as AF LPTIM5 3.3 to 1.2V VCAP1/2/3
VREF AHB/APB
LPTIM4_OUT as AF LPTIM4 @VSW
SYSCFG
APB4 100 MHz (max)
RTC
(max)
Temperature RTC_REFIN
MHz
sensor
100100
@VDD
SUPPLY SUPERVISION
POR VDDA, VSSA
reset POR/PDR/BOR NRESET
Int WKUP[4:0]
PVD
MSv41922V8
3 Functional overview
3.3 Memories
STM32H743xI
AHBS
CPU ITCM
Cortex-M7 64 Kbyte
I$ D$ DTCM Ethernet SDMMC2 USBHS1
16KB 16KB 128 Kbyte DMA1 DMA2 USBHS2
MAC
AXIM
AHBP
DMA1_PERIPH
DMA2_PERIPH
DMA1_MEM
DMA2_MEM
SDMMC1 MDMA DMA2D LTDC
D1-to-D2 AHB
SRAM1 128
APB3 Kbyte
SRAM2 128
AHB3 Kbyte
SRAM3
32 Kbyte
Flash A
DocID030538 Rev 3
1 Mbyte
AHB1
Flash B
1 Mbyte
AHB2
AXI SRAM
512 Kbyte
APB1
QSPI
APB2
FMC
D2-to-D1 AHB
D2-to-D3 AHB
D1-to-D3 AHB
BDMA
32-bit AHB bus matrix
Functional overview
D3 domain
Legend
AHB4 APB4
TCM AHB
32-bit bus AXI APB SRAM4
64-bit bus Master interface 64 Kbyte
SRAM
4 Kbyte
MSv46613V1
Functional overview STM32H743xI
In addition, an analog watchdog feature can accurately monitor the converted voltage of
one, some or all selected channels. An interrupt is generated when the converted voltage is
outside the programmed thresholds.
To synchronize A/D conversion and timers, the ADCs could be triggered by any of TIM1,
TIM2, TIM3, TIM4, TIM6, TIM8, TIM15, HRTIM1 and LPTIM1 timer.
The devices embeds two operational amplifiers (OPAMP1 and OPAMP2) with two inputs
and one output each. These three I/Os can be connected to the external pins, thus enabling
any type of external interconnections. The operational amplifiers can be configured
internally as a follower, as an amplifier with a non-inverting gain ranging from 2 to 16 or with
inverting gain ranging from -1 to -15.
• short circuit detector to detect saturated analog input values (bottom and top range):
– up to 8-bit counter to detect 1..256 consecutive 0’s or 1’s on serial data stream
– monitoring continuously each input serial channel
• break signal generation on analog watchdog event or on short circuit detector event
• extremes detector:
– storage of minimum and maximum values of final conversion data
– refreshed by software
• DMA capability to read the final conversion data
• interrupts: end of conversion, overrun, analog watchdog, short circuit, input serial
channel clock absence
• “regular” or “injected” conversions:
– “regular” conversions can be requested at any time or even in continuous mode
without having any impact on the timing of “injected” conversions
– “injected” conversions for precise timing and with high conversion priority
Number of filters 4
Number of input
8
transceivers/channels
Internal ADC parallel input X
Number of external triggers 16
Regular channel information in
X
identification register
/1 /2 /4
High-
(x2 x4 x8
resolution HRTIM1 16-bit Up Yes 10 Yes 400 400
x16 x32,
timer
with DLL)
Any
Up, integer
Advanced TIM1,
16-bit Down, between 1 Yes 4 Yes 100 200
-control TIM8
Up/down and
65536
Any
Up, integer
TIM2,
32-bit Down, between 1 Yes 4 No 100 200
TIM5
Up/down and
65536
Any
Up, integer
TIM3,
16-bit Down, between 1 Yes 4 No 100 200
TIM4
Up/down and
65536
Any
integer
TIM12 16-bit Up between 1 No 2 No 100 200
and
General 65536
purpose Any
integer
TIM13,
16-bit Up between 1 No 1 No 100 200
TIM14
and
65536
Any
integer
TIM15 16-bit Up between 1 Yes 2 1 100 200
and
65536
Any
integer
TIM16,
16-bit Up between 1 Yes 1 1 100 200
TIM17
and
65536
Any
integer
TIM6,
Basic 16-bit Up between 1 Yes 0 No 100 200
TIM7
and
65536
LPTIM1,
Low- LPTIM2, 1, 2, 4, 8,
power LPTIM3, 16-bit Up 16, 32, 64, No 0 No 100 200
timer LPTIM4, 128
LPTIM5
1. The maximum timer clock is up to 400 MHz depending on TIMPRE bit in the RCC_CFGR register and D2PRE1/2 bits in
RCC_D2CFGR register.
All USART have a clock domain independent from the CPU clock, allowing the USARTx to
wake up the MCU from Stop mode.The wakeup from Stop mode are programmable and can
be done on:
• Start bit detection
• Any received data frame
• A specific programmed data frame
• Specific TXFIFO/RXFIFO status when FIFO mode is enabled.
All USART interfaces can be served by the DMA controller.
The LPUART has a clock domain independent from the CPU clock, and can wakeup the
system from Stop mode. The wakeup from Stop mode are programmable and can be done
on:
• Start bit detection
• Any received data frame
• A specific programmed data frame
• Specific TXFIFO/RXFIFO status when FIFO mode is enabled.
Only a 32.768 kHz clock (LSE) is needed to allow LPUART communication up to
9600 baud. Therefore, even in Stop mode, the LPUART can wait for an incoming frame
while having an extremely low energy consumption. Higher speed clock can be used to
reach higher baudrates.
LPUART interface can be served by the DMA controller.
4 Memory mapping
Refer to the product line reference manual for details on the memory mapping as well as the
boundary addresses for all peripherals.
5 Pin descriptions
BOOT0
PC12
PC10
PC11
PA15
PA14
VDD
VSS
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PE1
PE0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
PE2 1 75 VDD
PE3 2 74 VSS
PE4 3 73 VCAP2
PE5 4 72 PA13
PE6 5 71 PA12
VBAT 6 70 PA11
PC13 7 69 PA10
PC14-OSC32_IN 8 68 PA9
PC15-OSC32_OUT 9 67 PA8
VSS 10 66 PC9
VDD 11 65 PC8
PH0-OSC_IN 12 64 PC7
PH1-OSC_OUT 13 100-pins 63 PC6
NRST 14 62 PD15
PC0 15 61 PD14
PC1 16 60 PD13
PC2_C 17 59 PD12
PC3_C 18 58 PD11
VSSA 19 57 PD10
VREF+ 20 56 PD9
VDDA 21 55 PD8
PA0-WKUP 22 54 PB15
PA1 23 53 PB14
PA2 24 52 PB13
PA3 25 51 PB12
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
VSS
VDD
PC4
PC5
PB0
PB1
PB2
PE7
PE8
PE9
PE10
PE12
PE13
PE14
PE15
PB10
VCAP1
VSS
VDD
PA4
PA5
PA6
PA7
PE11
PB11
MSv41918V3
1 2 3 4 5 6 7 8 9 10
PC14-
PB4 PB3(JTDO/ PA14(JTCK- PA13(JTMS-
A OSC32_IN PC13 PE2 PB9 PB7 PA15(JTDI)
(NJTRST) TRACESWO) SWCLK) SWDIO)
(PC14)
PC15-
B OSC32_OUT VBAT PE3 PB8 PB6 PD5 PD2 PC11 PC10 PA12
(PC15)
PH0-
C VSS PE4 PE1 PB5 PD6 PD3 PC12 PA9 PA11
OSC_IN(PH0)
PH1-
D OSC_OUT VDD PE5 PE0 BOOT0 PD7 PD4 PD0 PA8 PA10
(PH1)
E NRST PC2_C PE6 VSS VSS VSS VCAP2 PD1 PC9 PC7
F PC0 PC1 PC3_C VDDLDO3 VDD VDD33USB PDR_ON VCAP1 PC8 PC6
PA0-
G VSSA PA4 PC4 PB2 PE10 PE14 PD15 PD11 PB15
WKUP(PA0)
H VDDA PA1 PA5 PC5 PE7 PE11 PE15 PD14 PD10 PB14
J VSS PA2 PA6 PB0 PE8 PE12 PB10 PB13 PD9 PD13
K VDD PA3 PA7 PB1 PE9 PE13 PB11 PB12 PD8 PD12
MSv46177V1
PDR_ON
BOOT0
PG15
PG14
PG13
PG12
PG10
PC12
PC10
PG11
PC11
PA15
PA14
VDD
VDD
VDD
VSS
PG9
VSS
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PE1
PE0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
109
119
118
117
116
115
114
113
112
110
111
PE2 1 108 VDD
PE3 2 107 VSS
PE4 3 106 VCAP2
PE5 4 105 PA13
PE6 5 104 PA12
VBAT 6 103 PA11
PC13 7 102 PA10
PC14-OSC32_IN 8 101 PA9
PC15-OSC32_OUT 9 100 PA8
PF0 10 99 PC9
PF1 11 98 PC8
PF2 12 97 PC7
PF3 13 96 PC6
PF4 14 95 VDD33USB
PF5 15 94 VSS
VSS 16 93 PG8
VDD 17 92 PG7
PF6 18 144-pins 91 PG6
PF7 19 90 PG5
PF8 20 89 PG4
PF9 21 88 PG3
PF10 22 87 PG2
PH0-OSC_IN 23 86 PD15
PH1-OSC_OUT 24 85 PD14
NRST 25 84 VDD
PC0 26 83 VSS
PC1 27 82 PD13
PC2_C 28 81 PD12
PC3_C 29 80 PD11
VDD 30 79 PD10
VSSA 31 78 PD9
VREF+ 32 77 PD8
VDDA 33 76 PB15
PA0-WKUP 34 75 PB14
PA1 35 74 PB13
PA2 36 73 PB12
37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72
VSS
VDD
PC4
PC5
PB0
PB1
PB2
PF12
VSS
VDD
PF13
PF14
PF15
PG0
PG1
PE7
PE8
PE9
VSS
VDD
PE10
PE12
PE13
PE14
PE15
PB10
VCAP1
VDD
PA3
PA4
PA5
PA6
PA7
PF11
PE11
PB11
MSv41917V3
1 2 3 4 5 6 7 8 9 10 11 12 13
A PE4 PE2 VDD PI6 PB6 PI2 VDD PG10 PD5 VDD PC12 PC10 PI0
PC15-
B OSC32_ PE3 VSS VDDLDO3 PB8 PB4 PI3 PG11 PD6 VSS PC11 PA14 PI1
OUT
PC14-
C OSC32_ PE6 PE5 PDR_ON PB9 PB5 PG14 PG9 PD4 PD1 PA15 VSS VDD
IN
D VDD VSS PC13 PE1 PE0 PB7 PG13 PD7 PD3 PD0 PA13 VDDLDO2 VCAP2
E PI11 PI7 VBAT PF1 PF3 BOOT0 PG15 PG12 PD2 PA10 PA9 PA8 PA12
F PI13 PI12 PF0 PF2 PF5 PF7 PB3 PG4 PC6 PC7 PC9 PC8 PA11
G VDD50_ VDD33_
VDD VSS PF4 PF6 PF9 NRST PF13 PE7 PG6 PG7 PG8
USB USB
J PC0 PC1 VSSA PJ0 PA0- PA7 PF15 PE9 PE14 PD11 PD13 PD15 PD14
WKUP
K PC3_C PC2_C PH4 PA1 PA6 PC4 PG0 PE13 PH10 PH12 PD9 PD10 PD12
L VDDA VREF+ PH5 PA5 PB1 PB2 PG1 PE12 PB10 PH11 PB13 VSS VDD
M VDD VSS PH3 PB0 PF11 VSS PE10 PB11 VDDLDO1 VSS PD8 PB15
VSS
N PA2 PH2 PA3 VDD PC5 PF12 VDD PE11 PE15 VCAP1 VDD PB12 PB14
MSv45339V3
PDR_ON
BOOT0
PG15
PG14
PG13
PG12
PG10
PC12
PC10
PG11
PC11
PA15
PA14
VDD
VDD
VDD
VDD
VSS
PG9
VSS
VSS
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PE1
PE0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
PI7
PI6
PI5
PI4
PI3
PI2
PINOUT UNDER DEVELOPMENT
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
PE2 1 132 PI1
PE3 2 131 PI0
PE4 3 130 PH15
PE5 4 129 PH14
PE6 5 128 PH13
VBAT 6 127 VDD
PI8 7 126 VSS
PC13 8 125 VCAP2
PC14-OSC32_IN 9 124 PA13
PC15-OSC32_OUT 10 123 PA12
PI9 11 122 PA11
PI10 12 121 PA10
PI11 13 120 PA9
VSS 14 119 PA8
VDD 15 118 PC9
PF0 16 117 PC8
PF1 17 116 PC7
PF2 18 115 PC6
PF3 19 114 VDD33USB
PF4 20 113 VSS
PF5 21 112 PG8
VSS 22 176-pins 111 PG7
VDD 23 110 PG6
PF6 24 109 PG5
PF7 25 108 PG4
PF8 26 107 PG3
PF9 27 106 PG2
PF10 28 105 PD15
PH0-OSC_IN 29 104 PD14
PH1-OSC_OUT 30 103 VDD
NRST 31 102 VSS
PC0 32 101 PD13
PC1 33 100 PD12
PC2_C 34 99 PD11
PC3_C 35 98 PD10
VDD 36 97 PD9
VSSA 37 96 PD8
VREF+ 38 95 PB15
VDDA 39 94 PB14
PA0-WKUP 40 93 PB13
PA1 41 92 PB12
PA2 42 91 VDD
PH2 43 90 VSS
PH3 44 89 PH12
45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88
PH4
PH5
VSS
VDD
PC4
PC5
PB0
PB1
PB2
PF12
VSS
VDD
PF13
PF14
PF15
PG0
PG1
PE7
PE8
PE9
VSS
VDD
PE10
PE12
PE13
PE14
PE15
PB10
VCAP1
VDD
PH6
PH7
PH8
PH9
PH10
PA3
PA4
PA5
PA6
PA7
PF11
PE11
PB11
PH11
MSv41916V4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
A PE3 PE2 PE1 PE0 PB8 PB5 PG14 PG13 PB4 PB3 PD7 PC12 PA15 PA14 PA13
B PE4 PE5 PE6 PB9 PB7 PB6 PG15 PG12 PG11 PG10 PD6 PD0 PC11 PC10 PA12
C VBAT PI7 PI6 PI5 VDD PDR_ON VDD VDD VDD PG9 PD5 PD1 PI3 PI2 PA11
D PC13 PI8 PI9 PI4 VSS BOOT0 VSS VSS VSS PD4 PD3 PD2 PH15 PI1 PA10
PC14-
E OSC32_ PF0 PI10 PI11 PH13 PH14 PI0 PA9
IN
PC15-
F OSC32_ VSS VDD PH2 VSS VSS VSS VSS VSS VSS VCAP2 PC9 PA8
OUT
PH0-
G VSS VDD PH3 VSS VSS VSS VSS VSS VSS VDD PC8 PC7
OSC_IN
PH1- VDD
H OSC_ PF2 PF1 PH4 VSS VSS VSS VSS VSS VSS PG8 PC6
33USB
OUT
J NRST PF3 PF4 PH5 VSS VSS VSS VSS VSS VDD VDD PG7 PG6
K PF7 PF6 PF5 VDD VSS VSS VSS VSS VSS PH12 PG5 PG4 PG3
M VSSA PC0 PC1 PC2_C PC3_C PB2 PG1 VSS VSS VCAP1 PH6 PH8 PH9 PD14 PD13
N VREF- PA1 PA0 PA4 PC4 PF13 PG0 VDD VDD VDD PE13 PH7 PD12 PD11 PD10
P VREF+ PA2 PA6 PA5 PC5 PF12 PF15 PE8 PE9 PE11 PE14 PB12 PB13 PD9 PD8
R VDDA PA3 PA7 PB1 PB0 PF11 PF14 PE7 PE10 PE12 PE15 PB10 PB11 PB14 PB15
MSv41912V3
PDR_ON
BOOT0
PG15
PG14
PG13
PG12
PG10
PC12
PC10
PG11
PC11
PA15
PA14
PJ15
PJ14
PJ13
PJ12
VDD
VDD
VDD
VDD
VSS
VSS
PG9
VSS
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PE1
PE0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
PK7
PK6
PK5
PK4
PK3
PI7
PI6
PI5
PI4
PI3
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
PE2 1 156 PI2
PE3 2 155 PI1
PE4 3 154 PI0
PE5 4 153 PH15
PE6 5 152 PH14
VBAT 6 151 PH13
PI8 7 150 VDD
PC13 8 149 VSS
PC14-OSC32_IN 9 148 VCAP2
PC15-OSC32_OUT 10 147 PA13
PI9 11 146 PA12
PI10 12 145 PA11
PI11 13 144 PA10
VSS 14 143 PA9
VDD 15 142 PA8
PF0 16 141 PC9
PF1 17 140 PC8
PF2 18 139 PC7
PI12 19 138 PC6
PI13 20 137 VDD33USB
PI14 21 136 VSS
PF3 22 135 PG8
PF4 23 134 PG7
PF5 24 133 PG6
VSS 25 208-pins 132 PG5
VDD 26 131 PG4
PF6 27 130 PG3
PF7 28 129 PG2
PF8 29 128 PK2
PF9 30 127 PK1
PF10 31 126 PK0
PH0-OSC_IN 32 125 VSS
PH1-OSC_OUT 33 124 VDD
NRST 34 123 PJ11
PC0 35 122 PJ10
PC1 36 121 PJ9
PC2_C 37 120 PJ8
PC3_C 38 119 PJ7
VDD 39 118 PJ6
VSSA 40 117 PD15
VREF+ 41 116 PD14
VDDA 42 115 VDD
PA0-WKUP 43 114 VSS
PA1 44 113 PD13
PA2 45 112 PD12
PH2 46 111 PD11
PH3 47 110 PD10
PH4 48 109 PD9
PH5 49 108 PD8
PA3 50 107 PB15
VSS 51 106 PB14
100
101
102
103
104
VDD 52 105 PB13
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
PJ2
PJ3
PJ4
PC4
PC5
VDD
VSS
PJ0
PJ1
PB0
PB1
PB2
PI15
PF12
VSS
VDD
PF13
PF14
PF15
PG0
PG1
PE7
PE8
PE9
VSS
VDD
VSS
VDD
PJ5
PE10
PE12
PE13
PE14
PE15
PB10
VCAP1
PH6
PH7
PH8
PH9
PH10
PH12
VDD
PB12
PA4
PA5
PA6
PA7
PF11
PE11
PB11
PH11
MSv41915V2
B VBAT VSS PI7 PE1 PB6 VSS PB4 PK4 PG11 PJ15 PD6 PD3 PC11 PA14 PI2 PH15 PH14
PC15- PC14-
VDD
C OSC32_ OSC32_ PE2 PE0 PB7 PB3 PK6 PK3 PG12 VSS PD7 PC12 VSS PI3 PA13 VSS
LDO2
OUT IN
D PE5 PE4 PE3 PB9 PB8 PG15 PK7 PG14 PG13 PJ14 PJ12 PD2 PD0 PA10 PA9 PH13 VCAP2
PDR_ BOO
E NC PI9 PC13 PI8 PE6 VDD VDD PJ13 VDD PD1 PC8 PC9 PA8 PA12 PA11
ON T0
VDD33
F NC NC PI10 PI11 VDD PC7 PC6 PG8 PG7
USB
VDD50
G PF2 NC PF1 PF0 VDD VSS VSS VSS VSS VSS VDD PG5 PG6 VSS
USB
H PI12 PI13 PI14 PF3 VDD VSS VSS VSS VSS VSS VDD PG4 PG3 PG2 PK2
PH0-
PH0- VSS VSS VSS VSS VSS
J OSC_
OSC_IN
VSS PF5 PF4 VDD PK0 PK1 VSS VSS
OUT
K NRST PF6 PF7 PF8 VDD VSS VSS VSS VSS VSS VDD PJ11 VSS NC NC
L VDDA PC0 PF10 PF9 VDD VSS VSS VSS VSS VSS VDD PJ10 VSS NC NC
N VREF- PH2 PA2 PA1 PA0 PJ0 VDD VDD PE10 VDD VDD VDD PJ8 PJ7 PJ6 VSS NC
P VSSA PH3 PH4 PH5 PI15 PJ1 PF13 PF14 PE9 PE11 PB10 PB11 PH10 PH11 PD15 PD14 VDD
R PC2_C PC3_C PA6 VSS PA7 PB2 PF12 VSS PF15 PE12 PE15 PJ5 PH9 PH12 PD11 PD12 PD13
T PA0_C PA1_C PA5 PC4 PB1 PJ2 PF11 PG0 PE8 PE13 PH6 VSS PH8 PB12 PB15 PD10 PD9
VCAP1 VDD
U VSS PA3 PA4 PC5 PB0 PJ3 PJ4 PG1 PE7 PE14
LDO1
PH7 PB13 PB14 PD8 VSS
MSv41911V1
Unless otherwise specified in brackets below the pin name, the pin function during
Pin name
and after reset is the same as the actual pin name
S Supply pin
I Input only pin
Pin type
I/O Input / output pin
ANA Analog-only Input
FT 5 V tolerant I/O
TT 3.3 V tolerant I/O
B Dedicated BOOT0 pin
RST Bidirectional reset pin with embedded weak pull-up resistor
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TRACECLK, SAI1_CK1,
SPI4_SCK,
SAI1_MCLK_A,
SAI4_MCLK_A,
1 A3 1 A2 A2 1 1 C3 PE2 I/O FT_h - -
QUADSPI_BK1_IO2,
SAI4_CK1,
ETH_MII_TXD3,
FMC_A23, EVENTOUT
TRACED0, TIM15_BKIN,
2 B3 2 B2 A1 2 2 D3 PE3 I/O FT_h - SAI1_SD_B, SAI4_SD_B, -
FMC_A19, EVENTOUT
TRACED1, SAI1_D2,
DFSDM_DATIN3,
TIM15_CH1N,
3 C3 3 A1 B1 3 3 D2 PE4 I/O FT_h - SPI4_NSS, SAI1_FS_A, -
SAI4_FS_A, SAI4_D2,
FMC_A20, DCMI_D4,
LCD_B0, EVENTOUT
TRACED2, SAI1_CK2,
DFSDM_CKIN3,
TIM15_CH1, SPI4_MISO,
4 D3 4 C3 B2 4 4 D1 PE5 I/O FT_h - SAI1_SCK_A, -
SAI4_SCK_A, SAI4_CK2,
FMC_A21, DCMI_D6,
LCD_G0, EVENTOUT
TRACED3, TIM1_BKIN2,
SAI1_D1, TIM15_CH2,
SPI4_MOSI, SAI1_SD_A,
SAI4_SD_A, SAI4_D1,
5 E3 5 C2 B3 5 5 E5 PE6 I/O FT_h - -
SAI2_MCK_B,
TIM1_BKIN2_COMP12,
FMC_A22, DCMI_D7,
LCD_G1, EVENTOUT
- - - M4 H10 - - A1 VSS S - - - -
- - - A3 - - - - VDD S - - - -
6 B2 6 E3 C1 6 6 B1 VBAT S - - - -
- - - - J6 - - B2 VSS - - - - -
RTC_TAMP_2/
- - - - D2 7 7 E4 PI8 I/O FT - EVENTOUT RTC_TS/
WKUP3
RTC_TAMP_1/
7 A2 7 D3 D1 8 8 E3 PC13 I/O FT - EVENTOUT RTC_TS/
WKUP2
- - - - J7 - - B6 VSS - - - - -
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
PC14-
8 A1 8 C1 E1 9 9 C2 OSC32_ I/O FT - EVENTOUT OSC32_IN
IN(PC14)
PC15-
OSC32_ OSC32_
9 B1 9 B1 F1 10 10 C1 I/O FT - EVENTOUT
OUT(PC1 OUT
5)
UART4_RX, CAN1_RX,
- - - - D3 11 11 E2 PI9 I/O FT_h - FMC_D30, LCD_VSYNC, -
EVENTOUT
CAN1_RXFD,
ETH_MII_RX_ER,
- - - - E3 12 12 F3 PI10 I/O FT_h -
FMC_D31, LCD_HSYNC,
EVENTOUT
LCD_G6,
- - - E1 E4 13 13 F4 PI11 I/O FT - OTG_HS_ULPI_DIR, WKUP4
EVENTOUT
- C2 - D2 F2 14 14 A17 VSS S - - - -
- D2 - D1 F3 15 15 E6 VDD S - - - -
(1)
- - - - - - - E1 NC - - - - -
- - - - - - - F1(2) NC - - - - -
(3)
- - - - - - - G2 NC - - - - -
I2C2_SDA, FMC_A0,
- - 10 F3 E2 16 16 G4 PF0 I/O FT_f - -
EVENTOUT
I2C2_SCL, FMC_A1,
- - 11 E4 H3 17 17 G3 PF1 I/O FT_f - -
EVENTOUT
I2C2_SMBA, FMC_A2,
- - 12 F4 H2 18 18 G1 PF2 I/O FT - -
EVENTOUT
ETH_TX_ER,
- - - F2 - - 19 H1 PI12 I/O FT - LCD_HSYNC, -
EVENTOUT
LCD_VSYNC,
- - - F1 - - 20 H2 PI13 I/O FT - -
EVENTOUT
FT_
- - 13 E5 J2 19 22 H4 PF3 I/O - FMC_A3, EVENTOUT ADC3_INP5
ha
FT_ ADC3_INN5,
- - 14 G3 J3 20 23 J5 PF4 I/O - FMC_A4, EVENTOUT
ha ADC3_INP9
FT_
- - 15 F5 K3 21 24 J4 PF5 I/O - FMC_A5, EVENTOUT ADC3_INP4
ha
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
11 - 17 G1 G3 23 26 E9 VDD S - - - -
TIM16_CH1, SPI5_NSS,
SAI1_SD_B, UART7_RX,
FT_ ADC3_INN4,
- - 18 G4 K2 24 27 K2 PF6 I/O - SAI4_SD_B,
ha ADC3_INP8
QUADSPI_BK1_IO3,
EVENTOUT
TIM17_CH1, SPI5_SCK,
SAI1_MCLK_B,
FT_ UART7_TX,
- - 19 F6 K1 25 28 K3 PF7 I/O - ADC3_INP3
ha SAI4_MCLK_B,
QUADSPI_BK1_IO2,
EVENTOUT
TIM16_CH1N,
SPI5_MISO,
SAI1_SCK_B,
FT_ UART7_RTS, ADC3_INN3,
- - 20 H4 L3 26 29 K4 PF8 I/O -
ha SAI4_SCK_B, ADC3_INP7
TIM13_CH1,
QUADSPI_BK1_IO0,
EVENTOUT
TIM17_CH1N,
SPI5_MOSI, SAI1_FS_B,
FT_ UART7_CTS,
- - 21 G5 L2 27 30 L4 PF9 I/O - ADC3_INP2
ha SAI4_FS_B, TIM14_CH1,
QUADSPI_BK1_IO1,
EVENTOUT
TIM16_BKIN, SAI1_D3,
FT_ QUADSPI_CLK, ADC3_INN2,
- - 22 H3 L1 28 31 L3 PF10 I/O -
ha SAI4_D3, DCMI_D11, ADC3_INP6
LCD_DE, EVENTOUT
PH0-
12 C1 23 H1 G1 29 32 J2 OSC_IN I/O FT - EVENTOUT OSC_IN
(PH0)
PH1-
13 D1 24 H2 H1 30 33 J1 OSC_OUT I/O FT - EVENTOUT OSC_OUT
(PH1)
DFSDM_CKIN0,
DFSDM_DATIN4,
SAI2_FS_B, ADC123_
15 F1 26 J1 M2 32 35 L2 PC0 I/O FT_a -
OTG_HS_ULPI_STP, INP10
FMC_SDNWE, LCD_R5,
EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TRACED0, SAI1_D1,
DFSDM_DATIN0,
ADC123_
DFSDM_CKIN4,
INN10,
SPI2_MOSI/I2S2_SDO,
FT_ ADC123_
16 F2 27 J2 M3 33 36 M2 PC1 I/O - SAI1_SD_A, SAI4_SD_A,
ha INP11,
SDMMC2_CK, SAI4_D1,
RTC_TAMP_3/
ETH_MDC,
WKUP5
MDIOS_MDC,
EVENTOUT
DFSDM_CKIN1,
SPI2_MISO/I2S2_SDI,
ADC123_
DFSDM_CKOUT,
(4) INN11,
- - - - - - - M3 PC2 I/O FT_a - OTG_HS_ULPI_DIR,
ADC123_
ETH_MII_TXD2,
INP12
FMC_SDNE0,
EVENTOUT
17 ADC3_INN1,
(5) E2(5) 28(5) K2(5) M4(5) 34(5) 37(5) R1(4) PC2_C ANA TT_a - -
ADC3_INP0
DFSDM_DATIN1,
SPI2_MOSI/I2S2_SDO,
OTG_HS_ULPI_NXT, ADC12_INN12,
- - - - - - - M4(4) PC3 I/O FT_a -
ETH_MII_TX_CLK, ADC12_INP13
FMC_SDCKE0,
EVENTOUT
18
(5) F3(5) 29(5) K1(5) M5(5) 35(5) 38(5) R2(4) PC3_C ANA TT_a - - ADC3_INP1
- F5 30 - G3 36 39 E11 VDD S - - - -
19 G1 31 J3 M1 37 40 P1 VSSA S - - - -
- - - - N1 - - N1 VREF- S - - - -
(6)
20 - 32 L2 P1 38 41 M1 VREF+ S - - - -
21 H1 33 L1 R1 39 42 L1 VDDA S - - - -
TIM2_CH1/TIM2_ETR,
TIM5_CH1, TIM8_ETR,
TIM15_BKIN,
PA0- USART2_CTS_NSS,
ADC1_INP16,
22 G2 34 J5 N3 40 43 N5(4) WKUP I/O FT_a - UART4_TX,
WKUP0
(PA0) SDMMC2_CMD,
SAI2_SD_B,
ETH_MII_CRS,
EVENTOUT
ADC12_INN1,
- - - - - - - T1(4) PA0_C ANA TT_a - -
ADC12_INP0
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM2_CH2, TIM5_CH2,
LPTIM3_OUT,
TIM15_CH1N,
USART2_RTS,
FT_ UART4_RX, ADC1_INN16,
23 H2 35 K4 N2 41 44 N4(4) PA1 I/O -
ha QUADSPI_BK1_IO3, ADC1_INP17
SAI2_MCK_B,
ETH_MII_RX_CLK/ETH_
RMII_REF_CLK,
LCD_R2, EVENTOUT
LPTIM1_IN2,
QUADSPI_BK2_IO0,
FT_ SAI2_SCK_B,
- - - N2 F4 43 46 N2 PH2 I/O - ADC3_INP13
ha ETH_MII_CRS,
FMC_SDCKE0, LCD_R0,
EVENTOUT
- K1 - M1 - - - F5 VDD S - - - -
- J1 - M7 J8 - - C16 VSS S - - - -
QUADSPI_BK2_IO1,
SAI2_MCK_B,
FT_ ADC3_INN13,
- - - M3 G4 44 47 P2 PH3 I/O - ETH_MII_COL,
ha ADC3_INP14
FMC_SDNE0, LCD_R1,
EVENTOUT
I2C2_SCL, LCD_G5,
ADC3_INN14,
- - - K3 H4 45 48 P3 PH4 I/O FT_fa - OTG_HS_ULPI_NXT,
ADC3_INP15
LCD_G4, EVENTOUT
I2C2_SDA, SPI5_NSS,
ADC3_INN15,
- - - L3 J4 46 49 P4 PH5 I/O FT_fa - FMC_SDNWE,
ADC3_INP16
EVENTOUT
TIM2_CH4, TIM5_CH4,
LPTIM5_OUT,
TIM15_CH2,
FT_
25 K2 37 N3 R2 47 50 U2 PA3 I/O - USART2_RX, LCD_B2, ADC12_INP15
ha
OTG_HS_ULPI_D0,
ETH_MII_COL, LCD_B5,
EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
26 - 38 G2 K6 - 51 F2(3) VSS S - - - -
- - - - L4 48 - - VSS S - - - -
27 - 39 - K4 49 52 G5 VDD S - - - -
TIM5_ETR,
SPI1_NSS/I2S1_WS,
SPI3_NSS/I2S3_WS,
USART2_CK, SPI6_NSS, ADC12_INP18,
28 G3 40 H6 N4 50 53 U3 PA4 I/O TT_a -
OTG_HS_SOF, DAC1_OUT1
DCMI_HSYNC,
LCD_VSYNC,
EVENTOUT
TIM2_CH1/TIM2_ETR,
TIM8_CH1N,
ADC12_INN18,
TT_ SPI1_SCK/I2S1_CK,
29 H3 41 L4 P4 51 54 T3 PA5 I/O - ADC12_INP19,
ha SPI6_SCK,
DAC1_OUT2
OTG_HS_ULPI_CK,
LCD_R4, EVENTOUT
TIM1_BKIN, TIM3_CH1,
TIM8_BKIN,
SPI1_MISO/I2S1_SDI,
SPI6_MISO, TIM13_CH1,
30 J3 42 K5 P3 52 55 R3 PA6 I/O FT_a - TIM8_BKIN_COMP12, ADC12_INP3
MDIOS_MDC,
TIM1_BKIN_COMP12,
DCMI_PIXCLK, LCD_G2,
EVENTOUT
TIM1_CH1N, TIM3_CH2,
TIM8_CH1N,
SPI1_MOSI/I2S1_SDO,
ADC12_INN3,
SPI6_MOSI, TIM14_CH1,
31 K3 43 J6 R3 53 56 R5 PA7 I/O TT_a - ADC12_INP7,
ETH_MII_RX_DV/ETH_R
OPAMP1_VINM
MII_CRS_DV,
FMC_SDNWE,
EVENTOUT
DFSDM_CKIN2,
I2S1_MCK, ADC12_INP4,
SPDIFRX_IN2, OPAMP1_
32 G4 44 K6 N5 54 57 T4 PC4 I/O TT_a -
ETH_MII_RXD0/ETH_R VOUT,
MII_RXD0, FMC_SDNE0, COMP_1_INM
EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
SAI1_D3,
DFSDM_DATIN2,
SPDIFRX_IN3, SAI4_D3, ADC12_INN4,
ETH_MII_RXD1/ETH_R ADC12_INP8,
33 H4 45 N5 P5 55 58 U4 PC5 I/O TT_a -
MII_RXD1, OPAMP1_
FMC_SDCKE0, VINM
COMP_1_OUT,
EVENTOUT
- - - N4 - - 59 G13 VDD S - - - -
TIM1_CH2N, TIM3_CH3,
TIM8_CH2N,
ADC12_INN5,
DFSDM_CKOUT,
ADC12_INP9,
34 J4 46 M5 R5 56 61 U5 PB0 I/O FT_a - UART4_CTS, LCD_R3,
OPAMP1_VINP,
OTG_HS_ULPI_D1,
COMP_1_INP
ETH_MII_RXD2,
LCD_G1, EVENTOUT
TIM1_CH3N, TIM3_CH4,
TIM8_CH3N,
DFSDM_DATIN1,
ADC12_INP5,
35 K4 47 L5 R4 57 62 T5 PB1 I/O TT_u - LCD_R6,
COMP_1_INM
OTG_HS_ULPI_D2,
ETH_MII_RXD3,
LCD_G0, EVENTOUT
SAI1_D1,
DFSDM_CKIN1,
SAI1_SD_A,
FT_ SPI3_MOSI/I2S3_SDO, COMP_1_INP,
36 G5 48 L6 M6 58 63 R6 PB2 I/O -
ha SAI4_SD_A, RTC_OUT
QUADSPI_CLK,
SAI4_D1, ETH_TX_ER,
EVENTOUT
LCD_G2, LCD_R0,
- - - - - - 64 P5 PI15 I/O FT - -
EVENTOUT
LCD_R7, LCD_R1,
- - - J4 - - 65 N6 PJ0 I/O FT - -
EVENTOUT
SPI5_MOSI, SAI2_SD_B,
- - 49 M6 R6 59 70 T7 PF11 I/O FT_a - FMC_SDNRAS, ADC1_INP2
DCMI_D12, EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
FT_ ADC1_INN2,
- - 50 N6 P6 60 71 R7 PF12 I/O - FMC_A6, EVENTOUT
ha ADC1_INP6
- - 51 M11 M8 61 72 J3 VSS S - - - -
- - 52 - N8 62 73 H5 VDD S - - - -
DFSDM_DATIN6,
FT_
- - 53 G7 N6 63 74 P7 PF13 I/O - I2C4_SMBA, FMC_A7, ADC2_INP2
ha
EVENTOUT
DFSDM_CKIN6,
FT_ ADC2_INN2,
- - 54 H7 R7 64 75 P8 PF14 I/O - I2C4_SCL, FMC_A8,
fha ADC2_INP6
EVENTOUT
I2C4_SDA, FMC_A9,
- - 55 J7 P7 65 76 R9 PF15 I/O FT_fh - -
EVENTOUT
- - - M2 F6 - - J16 VSS S - - - -
OPAMP2_
- - 57 L7 M7 67 78 U8 PG1 I/O TT_h - FMC_A11, EVENTOUT
VINM
TIM1_ETR,
DFSDM_DATIN2,
OPAMP2_
TT_ UART7_RX,
37 H5 58 G8 R8 68 79 U9 PE7 I/O - VOUT,
ha QUADSPI_BK2_IO0,
COMP_2_INM
FMC_D4/FMC_DA4,
EVENTOUT
TIM1_CH1N,
DFSDM_CKIN2,
UART7_TX,
TT_ OPAMP2_
38 J5 59 H8 P8 69 80 T9 PE8 I/O - QUADSPI_BK2_IO1,
ha VINM
FMC_D5/FMC_DA5,
COMP_2_OUT,
EVENTOUT
TIM1_CH1,
DFSDM_CKOUT,
TT_ UART7_RTS, OPAMP2_VINP,
39 K5 60 J8 P9 70 81 P9 PE9 I/O -
ha QUADSPI_BK2_IO2, COMP_2_INP
FMC_D6/FMC_DA6,
EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM1_CH2N,
DFSDM_DATIN4,
FT_ UART7_CTS,
40 G6 63 M8 R9 73 84 N9 PE10 I/O - COMP_2_INM
ha QUADSPI_BK2_IO3,
FMC_D7/FMC_DA7,
EVENTOUT
TIM1_CH2,
DFSDM_CKIN4,
FT_
41 H6 64 N8 P10 74 85 P10 PE11 I/O - SPI4_NSS, SAI2_SD_B, COMP_2_INP
ha
FMC_D8/FMC_DA8,
LCD_G3, EVENTOUT
TIM1_CH3N,
DFSDM_DATIN5,
SPI4_SCK,
42 J6 65 L8 R10 75 86 R10 PE12 I/O FT_h - SAI2_SCK_B, -
FMC_D9/FMC_DA9,
COMP_1_OUT, LCD_B4,
EVENTOUT
TIM1_CH3,
DFSDM_CKIN5,
SPI4_MISO, SAI2_FS_B,
43 K6 66 K8 N11 76 87 T10 PE13 I/O FT_h - -
FMC_D10/FMC_DA10,
COMP_2_OUT, LCD_DE,
EVENTOUT
TIM1_CH4, SPI4_MOSI,
SAI2_MCK_B,
44 G7 67 J9 P11 77 88 U10 PE14 I/O FT_h - -
FMC_D11/FMC_DA11,
LCD_CLK, EVENTOUT
TIM1_BKIN,
HDMI__TIM1_BKIN,
45 H7 68 N9 R11 78 89 R11 PE15 I/O FT_h - FMC_D12/FMC_DA12, -
TIM1_BKIN_COMP12,
LCD_R7, EVENTOUT
TIM2_CH3,
HRTIM_SCOUT,
LPTIM2_IN1, I2C2_SCL,
SPI2_SCK/I2S2_CK,
DFSDM_DATIN7,
46 J7 69 L9 R12 79 90 P11 PB10 I/O FT_f - -
USART3_TX,
QUADSPI_BK1_NCS,
OTG_HS_ULPI_D3,
ETH_MII_RX_ER,
LCD_G4, EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM2_CH4,
HRTIM_SCIN,
LPTIM2_ETR,
I2C2_SDA,
DFSDM_CKIN7,
47 K7 70 M9 R13 80 91 P12 PB11 I/O FT_f - -
USART3_RX,
OTG_HS_ULPI_D4,
ETH_MII_TX_EN/ETH_R
MII_TX_EN, LCD_G5,
EVENTOUT
TIM12_CH1,
I2C2_SMBA, SPI5_SCK,
- - - - M11 83 96 T11 PH6 I/O FT - ETH_MII_RXD2, -
FMC_SDNE1, DCMI_D8,
EVENTOUT
I2C3_SCL, SPI5_MISO,
ETH_MII_RXD3,
- - - - N12 84 97 U13 PH7 I/O FT_fa - -
FMC_SDCKE1,
DCMI_D9, EVENTOUT
TIM5_ETR, I2C3_SDA,
FT_fh FMC_D16,
- - - - M12 85 98 T13 PH8 I/O - -
a DCMI_HSYNC, LCD_R2,
EVENTOUT
- - - - F8 - - M15 VSS S - - - -
TIM5_CH1, I2C4_SMBA,
- - - K9 L13 87 100 P13 PH10 I/O FT_h - FMC_D18, DCMI_D1, -
LCD_R4, EVENTOUT
TIM5_CH2, I2C4_SCL,
- - - L10 L12 88 101 P14 PH11 I/O FT_fh - FMC_D19, DCMI_D2, -
LCD_R5, EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM5_CH3, I2C4_SDA,
- - - K10 K12 89 102 R14 PH12 I/O FT_fh - FMC_D20, DCMI_D3, -
LCD_R6, EVENTOUT
TIM1_BKIN, I2C2_SMBA,
SPI2_NSS/I2S2_WS,
DFSDM_DATIN1,
USART3_CK, CAN2_RX,
51 K8 73 N12 P12 92 104 T14 PB12 I/O FT_u - OTG_HS_ULPI_D5,
ETH_MII_TXD0/ETH_RM
II_TXD0, OTG_HS_ID,
TIM1_BKIN_COMP12,
UART5_RX, EVENTOUT
TIM1_CH1N,
LPTIM2_OUT,
SPI2_SCK/I2S2_CK,
DFSDM_CKIN1,
USART3_CTS_NSS, OTG_HS_
52 J8 74 L11 P13 93 105 U14 PB13 I/O FT_u -
CAN2_TX, VBUS
OTG_HS_ULPI_D6,
ETH_MII_TXD1/ETH_RM
II_TXD1, UART5_TX,
EVENTOUT
TIM1_CH2N,
TIM12_CH1,
TIM8_CH2N,
USART1_TX,
SPI2_MISO/I2S2_SDI,
53 H10 75 N13 R14 94 106 U15 PB14 I/O FT_u - DFSDM_DATIN2, -
USART3_RTS,
UART4_RTS,
SDMMC2_D0,
OTG_HS_DM,
EVENTOUT
RTC_REFIN,
TIM1_CH3N,
TIM12_CH2,
TIM8_CH3N,
USART1_RX,
54 G10 76 M13 R15 95 107 T15 PB15 I/O FT_u - SPI2_MOSI/I2S2_SDO, -
DFSDM_CKIN2,
UART4_CTS,
SDMMC2_D1,
OTG_HS_DP,
EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
DFSDM_CKIN3,
SAI3_SCK_B,
USART3_TX,
55 K9 77 M12 P15 96 108 U16 PD8 I/O FT_h - -
SPDIFRX_IN1,
FMC_D13/FMC_DA13,
EVENTOUT
DFSDM_DATIN3,
SAI3_SD_B,
USART3_RX,
56 J9 78 K11 P14 97 109 T17 PD9 I/O FT_h - -
CAN2_RXFD,
FMC_D14/FMC_DA14,
EVENTOUT
DFSDM_CKOUT,
SAI3_FS_B,
USART3_CK,
57 H9 79 K12 N15 98 110 T16 PD10 I/O FT_h - -
CAN2_TXFD,
FMC_D15/FMC_DA15,
LCD_B3, EVENTOUT
- - - N7 - - - N12 VDD S - - - -
- - - - F9 - - U17 VSS S - - - -
LPTIM2_IN2,
I2C4_SMBA,
USART3_CTS_NSS,
58 G9 80 J10 N14 99 111 R15 PD11 I/O FT_h - -
QUADSPI_BK1_IO0,
SAI2_SD_A, FMC_A16,
EVENTOUT
LPTIM1_IN1, TIM4_CH1,
LPTIM2_IN1, I2C4_SCL,
USART3_RTS,
59 K10 81 K13 N13 100 112 R16 PD12 I/O FT_fh - -
QUADSPI_BK1_IO1,
SAI2_FS_A, FMC_A17,
EVENTOUT
LPTIM1_OUT,
TIM4_CH2, I2C4_SDA,
60 J10 82 J11 M15 101 113 R17 PD13 I/O FT_fh - QUADSPI_BK1_IO3, -
SAI2_SCK_A, FMC_A18,
EVENTOUT
TIM4_CH3,
SAI3_MCLK_B,
61 H8 85 J13 M14 104 116 P16 PD14 I/O FT_h - UART8_CTS, -
FMC_D0/FMC_DA0,
EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM4_CH4,
SAI3_MCLK_A,
62 G8 86 J12 L14 105 117 P15 PD15 I/O FT_h - UART8_RTS, -
FMC_D1/FMC_DA1,
EVENTOUT
TIM8_CH2, LCD_R7,
- - - - - - 118 N15 PJ6 I/O FT - -
EVENTOUT
TRGIN, TIM8_CH2N,
- - - - - - 119 N14 PJ7 I/O FT - -
LCD_G0, EVENTOUT
- - - - - - - N10 VDD S - -
- - - - F10 - - R8 VSS S - -
TIM1_CH3N, TIM8_CH1,
- - - - - - 120 N13 PJ8 I/O FT - UART8_TX, LCD_G1, -
EVENTOUT
TIM1_CH3, TIM8_CH1N,
- - - - - - 121 M14 PJ9 I/O FT - UART8_RX, LCD_G2, -
EVENTOUT
TIM1_CH2N, TIM8_CH2,
- - - - - - 122 L14 PJ10 I/O FT - SPI5_MOSI, LCD_G3, -
EVENTOUT
TIM1_CH2, TIM8_CH2N,
- - - - - - 123 K14 PJ11 I/O FT - SPI5_MISO, LCD_G4, -
EVENTOUT
- - - - - - 124 N8 VDD S - -
- - - - G6 - 125 U1 VSS S - - - -
N17
- - - - - - - (1) NC - - - - -
M16
- - - - - - - (1) NC - - - - -
M17
- - - - - - - (1) NC - - - - -
- - - - - - - L7 VSS S - - - -
(1)
- - - - - - - L16 NC - - - - -
- - - - - - - L17(1) NC - - - - -
K16
- - - - - - - (1) NC - - - - -
K17
- - - - - - - (1) NC - - - - -
- - - - - - - L8 VSS S - - - -
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM1_CH1N, TIM8_CH3,
- - - - - - 126 J14 PK0 I/O FT - SPI5_SCK, LCD_G5, -
EVENTOUT
TIM1_CH1, TIM8_CH3N,
- - - - - - 127 J15 PK1 I/O FT - SPI5_NSS, LCD_G6, -
EVENTOUT
TIM1_BKIN, TIM8_BKIN,
TIM8_BKIN_COMP12,
- - - - - - 128 H17 PK2 I/O FT - -
TIM1_BKIN_COMP12,
LCD_G7, EVENTOUT
TIM8_BKIN,
- - 87 H9 L15 106 129 H16 PG2 I/O FT_h - TIM8_BKIN_COMP12, -
FMC_A12, EVENTOUT
TIM8_BKIN2,
- - 88 H10 K15 107 130 H15 PG3 I/O FT_h - TIM8_BKIN2_COMP12, -
FMC_A13, EVENTOUT
- - - - G7 - - - VSS S - - - -
- - - - - - - N7 VDD S - - - -
TIM1_BKIN2,
TIM1_BKIN2_COMP12,
- - 89 F8 K14 108 131 H14 PG4 I/O FT_h - -
FMC_A14/FMC_BA0,
EVENTOUT
TIM1_ETR,
- - 90 H11 K13 109 132 G14 PG5 I/O FT_h - FMC_A15/FMC_BA1, -
EVENTOUT
TIM17_BKIN,
HRTIM_CHE1,
- - 91 G9 J15 110 133 G15 PG6 I/O FT_h - QUADSPI_BK1_NCS, -
FMC_NE3, DCMI_D12,
LCD_R7, EVENTOUT
HRTIM_CHE2,
SAI1_MCLK_A,
- - 92 G10 J14 111 134 F16 PG7 I/O FT_h - USART6_CK, FMC_INT, -
DCMI_D13, LCD_CLK,
EVENTOUT
TIM8_ETR, SPI6_NSS,
USART6_RTS,
SPDIFRX_IN2,
- - 93 G11 H14 112 135 F15 PG8 I/O FT_h - -
ETH_PPS_OUT,
FMC_SDCLK, LCD_G7,
EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
VDD50
- - - G12 - - - G17 S - - - -
USB
VDD33
- F6 95 G13 H13 114 137 F17 S - - - -
USB
- - - - - - - M5 VDD S - - - -
HRTIM_CHA1,
TIM3_CH1, TIM8_CH1,
DFSDM_CKIN3,
I2S2_MCK, USART6_TX,
SDMMC1_D0DIR,
63 F10 96 F9 H15 115 138 F14 PC6 I/O FT_h - SWPMI_IO
FMC_NWAIT,
SDMMC2_D6,
SDMMC1_D6, DCMI_D0,
LCD_HSYNC,
EVENTOUT
TRGIO, HRTIM_CHA2,
TIM3_CH2, TIM8_CH2,
DFSDM_DATIN3,
I2S3_MCK,
USART6_RX,
64 E10 97 F10 G15 116 139 F13 PC7 I/O FT_h - SDMMC1_D123DIR, -
FMC_NE1,
SDMMC2_D7,
SWPMI_TX,
SDMMC1_D7, DCMI_D1,
LCD_G6, EVENTOUT
TRACED1,
HRTIM_CHB1,
TIM3_CH3, TIM8_CH3,
USART6_CK,
65 F9 98 F12 G14 117 140 E13 PC8 I/O FT_h - UART5_RTS, -
FMC_NE2/FMC_NCE,
SWPMI_RX,
SDMMC1_D0, DCMI_D2,
EVENTOUT
MCO2, TIM3_CH4,
TIM8_CH4, I2C3_SDA,
I2S_CKIN, UART5_CTS,
QUADSPI_BK1_IO0,
66 E9 99 F11 F14 118 141 E14 PC9 I/O FT_fh - -
LCD_G3,
SWPMI_SUSPEND,
SDMMC1_D1, DCMI_D3,
LCD_B2, EVENTOUT
- - - - G8 - - - VSS S - - -
- - - - - - - L5 VDD S - - -
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
MCO1, TIM1_CH1,
HRTIM_CHB2,
TIM8_BKIN2, I2C3_SCL,
USART1_CK,
FT_
67 D9 100 E12 F15 119 142 E15 PA8 I/O - OTG_FS_SOF, -
fha
UART7_RX,
TIM8_BKIN2_COMP12,
LCD_B3, LCD_R6,
EVENTOUT
TIM1_CH2,
HRTIM_CHC1,
LPUART1_TX,
I2C3_SMBA,
68 C9 101 E11 E15 120 143 D15 PA9 I/O FT_u - SPI2_SCK/I2S2_CK, OTG_FS_VBUS
USART1_TX,
CAN1_RXFD,
ETH_TX_ER, DCMI_D0,
LCD_R5, EVENTOUT
TIM1_CH3,
HRTIM_CHC2,
LPUART1_RX,
USART1_RX,
69 D10 102 E10 D15 121 144 D14 PA10 I/O FT_u - CAN1_TXFD, -
OTG_FS_ID,
MDIOS_MDIO, LCD_B4,
DCMI_D1, LCD_B1,
EVENTOUT
TIM1_CH4,
HRTIM_CHD1,
LPUART1_CTS,
SPI2_NSS/I2S2_WS,
70 C10 103 F13 C15 122 145 E17 PA11 I/O FT_u - UART4_RX, -
USART1_CTS_NSS,
CAN1_RX,
OTG_FS_DM, LCD_R4,
EVENTOUT
TIM1_ETR,
HRTIM_CHD2,
LPUART1_RTS,
SPI2_SCK/I2S2_CK,
71 B10 104 E13 B15 123 146 E16 PA12 I/O FT_u - UART4_TX, -
USART1_RTS,
SAI2_FS_B, CAN1_TX,
OTG_FS_DP, LCD_R5,
EVENTOUT
PA13(JTM JTMS-SWDIO,
72 A10 105 D11 A15 124 147 C15 I/O FT - -
S-SWDIO) EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM8_CH1N, UART4_TX,
- - - - E12 128 151 D16 PH13 I/O FT_h - CAN1_TX, FMC_D21, -
LCD_G2, EVENTOUT
TIM8_CH2N,
UART4_RX, CAN1_RX,
- - - - E13 129 152 B17 PH14 I/O FT_h - -
FMC_D22, DCMI_D4,
LCD_G3, EVENTOUT
TIM8_CH3N,
CAN1_TXFD, FMC_D23,
- - - - D13 130 153 B16 PH15 I/O FT_h - -
DCMI_D11, LCD_G4,
EVENTOUT
TIM5_CH4,
SPI2_NSS/I2S2_WS,
- - - A13 E14 131 154 A16 PI0 I/O FT_h - CAN1_RXFD, FMC_D24, -
DCMI_D13, LCD_G5,
EVENTOUT
- - - - G9 - - - VSS S - - - -
TIM8_BKIN2,
SPI2_SCK/I2S2_CK,
- - - B13 D14 132 155 A15 PI1 I/O FT_h - TIM8_BKIN2_COMP12, -
FMC_D25, DCMI_D8,
LCD_G6, EVENTOUT
TIM8_CH4,
SPI2_MISO/I2S2_SDI,
- - - A6 C14 133 156 B15 PI2 I/O FT_h - -
FMC_D26, DCMI_D9,
LCD_G7, EVENTOUT
TIM8_ETR,
SPI2_MOSI/I2S2_SDO,
- - - B7 C13 134 157 C14 PI3 I/O FT_h - -
FMC_D27, DCMI_D10,
EVENTOUT
- - - - D9 135 - - VSS S - - - -
PA14
JTCK-SWCLK,
76 A9 109 B12 A14 137 159 B14 (JTCK- I/O FT - -
EVENTOUT
SWCLK)
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
JTDI,
TIM2_CH1/TIM2_ETR,
HRTIM_FLT1,
PA15 HDMI_CEC,
77 A8 110 C11 A13 138 160 A14 I/O FT - -
(JTDI) SPI1_NSS/I2S1_WS,
SPI3_NSS/I2S3_WS,
SPI6_NSS, UART4_RTS,
UART7_TX, EVENTOUT
HRTIM_EEV1,
DFSDM_CKIN5,
SPI3_SCK/I2S3_CK,
FT_ USART3_TX,
78 B9 111 A12 B14 139 161 A13 PC10 I/O - -
ha UART4_TX,
QUADSPI_BK1_IO1,
SDMMC1_D2, DCMI_D8,
LCD_R2, EVENTOUT
HRTIM_FLT2,
DFSDM_DATIN5,
SPI3_MISO/I2S3_SDI,
USART3_RX,
79 B8 112 B11 B13 140 162 B13 PC11 I/O FT_h - -
UART4_RX,
QUADSPI_BK2_NCS,
SDMMC1_D3, DCMI_D4,
EVENTOUT
TRACED3,
HRTIM_EEV2,
SPI3_MOSI/I2S3_SDO,
80 C8 113 A11 A12 141 163 C12 PC12 I/O FT_h - USART3_CK, -
UART5_TX,
SDMMC1_CK, DCMI_D9,
EVENTOUT
- - - - G10 - - - VSS S - - - -
DFSDM_CKIN6,
SAI3_SCK_A,
81 D8 114 D10 B12 142 164 D13 PD0 I/O FT_h - UART4_RX, CAN1_RX, -
FMC_D2/FMC_DA2,
EVENTOUT
DFSDM_DATIN6,
SAI3_SD_A, UART4_TX,
82 E8 115 C10 C12 143 165 E12 PD1 I/O FT_h - CAN1_TX, -
FMC_D3/FMC_DA3,
EVENTOUT
TRACED2, TIM3_ETR,
UART5_RX,
83 B7 116 E9 D12 144 166 D12 PD2 I/O FT_h - -
SDMMC1_CMD,
DCMI_D11, EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
DFSDM_CKOUT,
SPI2_SCK/I2S2_CK,
84 C7 117 D9 D11 145 167 B12 PD3 I/O FT_h - USART2_CTS_NSS, -
FMC_CLK, DCMI_D5,
LCD_G7, EVENTOUT
HRTIM_FLT3,
SAI3_FS_A,
85 D7 118 C9 D10 146 168 A12 PD4 I/O FT_h - USART2_RTS, -
CAN1_RXFD,
FMC_NOE, EVENTOUT
HRTIM_EEV3,
USART2_TX,
86 B6 119 A9 C11 147 169 A11 PD5 I/O FT_h - -
CAN1_TXFD,
FMC_NWE, EVENTOUT
- - 120 - D8 148 170 R4 VSS S - - - -
SAI1_D1,
DFSDM_CKIN4,
DFSDM_DATIN1,
SPI3_MOSI/I2S3_SDO,
SAI1_SD_A,
USART2_RX,
87 C6 122 B9 B11 150 172 B11 PD6 I/O FT_h - -
SAI4_SD_A,
CAN2_RXFD, SAI4_D1,
SDMMC2_CK,
FMC_NWAIT,
DCMI_D10, LCD_B2,
EVENTOUT
DFSDM_DATIN4,
SPI1_MOSI/I2S1_SDO,
DFSDM_CKIN1,
88 D6 123 D8 A11 151 173 C11 PD7 I/O FT_h - USART2_CK, -
SPDIFRX_IN0,
SDMMC2_CMD,
FMC_NE1, EVENTOUT
TRGOUT, LCD_G3,
- - - - - - 174 D11 PJ12 I/O FT - -
LCD_B0, EVENTOUT
LCD_B4, LCD_B1,
- - - - - - 175 E10 PJ13 I/O FT - -
EVENTOUT
- - - - H6 - - - VSS S - - - -
- - - A7 - - - - VDD S - - - -
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
SPI1_MISO/I2S1_SDI,
USART6_RX,
SPDIFRX_IN3,
QUADSPI_BK2_IO2,
- - 124 C8 C10 152 178 A10 PG9 I/O FT_h - -
SAI2_FS_B,
FMC_NE2/FMC_NCE,
DCMI_VSYNC,
EVENTOUT
HRTIM_FLT5,
SPI1_NSS/I2S1_WS,
- - 125 A8 B10 153 179 A9 PG10 I/O FT_h - LCD_G3, SAI2_SD_B, -
FMC_NE3, DCMI_D2,
LCD_B2, EVENTOUT
HRTIM_EEV4,
SPI1_SCK/I2S1_CK,
SPDIFRX_IN0,
- - 126 B8 B9 154 180 B9 PG11 I/O FT_h - SDMMC2_D2, -
ETH_MII_TX_EN/ETH_R
MII_TX_EN, DCMI_D3,
LCD_B3, EVENTOUT
LPTIM1_IN1,
HRTIM_EEV5,
SPI6_MISO,
USART6_RTS,
- - 127 E8 B8 155 181 C9 PG12 I/O FT_h - -
SPDIFRX_IN1, LCD_B4,
ETH_MII_TXD1/ETH_RM
II_TXD1, FMC_NE4,
LCD_B1, EVENTOUT
TRACED0,
LPTIM1_OUT,
HRTIM_EEV10,
SPI6_SCK,
- - 128 D7 A8 156 182 D9 PG13 I/O FT_h - -
USART6_CTS_NSS,
ETH_MII_TXD0/ETH_RM
II_TXD0, FMC_A24,
LCD_R0, EVENTOUT
TRACED1,
LPTIM1_ETR,
SPI6_MOSI,
USART6_TX,
- - 129 C7 A7 157 183 D8 PG14 I/O FT_h - -
QUADSPI_BK2_IO3,
ETH_MII_TXD1/ETH_RM
II_TXD1, FMC_A25,
LCD_B0, EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
- - - - H7 - - - VSS S - - - -
USART6_CTS_NSS,
- - 132 E7 B7 160 191 D6 PG15 I/O FT_h - FMC_SDNCAS, -
DCMI_D13, EVENTOUT
JTDO/TRACESWO,
TIM2_CH2,
HRTIM_FLT4,
PB3(JTDO
SPI1_SCK/I2S1_CK,
89 A7 133 F7 A10 161 192 C6 /TRACES I/O FT - -
SPI3_SCK/I2S3_CK,
WO)
SPI6_SCK,
SDMMC2_D2,
UART7_RX, EVENTOUT
NJTRST, TIM16_BKIN,
TIM3_CH1,
HRTIM_EEV6,
SPI1_MISO/I2S1_SDI,
PB4(NJTR
90 A6 134 B6 A9 162 193 B7 I/O FT - SPI3_MISO/I2S3_SDI, -
ST)
SPI2_NSS/I2S2_WS,
SPI6_MISO,
SDMMC2_D3,
UART7_TX, EVENTOUT
TIM17_BKIN, TIM3_CH2,
HRTIM_EEV7,
I2C1_SMBA,
SPI1_MOSI/I2S1_SDO,
I2C4_SMBA,
SPI3_MOSI/I2S3_SDO,
91 C5 135 C6 A6 163 194 A5 PB5 I/O FT - -
SPI6_MOSI, CAN2_RX,
OTG_HS_ULPI_D7,
ETH_PPS_OUT,
FMC_SDCKE1,
DCMI_D10, UART5_RX,
EVENTOUT
- - - - H8 - - - VSS S - - - -
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
TIM16_CH1N,
TIM4_CH1,
HRTIM_EEV8,
I2C1_SCL, HDMI_CEC,
I2C4_SCL, USART1_TX,
92 B5 136 A5 B6 164 195 B5 PB6 I/O FT_f - LPUART1_TX, -
CAN2_TX,
QUADSPI_BK1_NCS,
DFSDM_DATIN5,
FMC_SDNE1, DCMI_D5,
UART5_TX, EVENTOUT
TIM17_CH1N,
TIM4_CH2,
HRTIM_EEV9,
I2C1_SDA, I2C4_SDA,
USART1_RX,
93 A5 137 D6 B5 165 196 C5 PB7 I/O FT_fa - PVD_IN
LPUART1_RX,
CAN2_TXFD,
DFSDM_CKIN5,
FMC_NL, DCMI_VSYNC,
EVENTOUT
TIM16_CH1, TIM4_CH3,
DFSDM_CKIN7,
I2C1_SCL, I2C4_SCL,
SDMMC1_CKIN,
95 B4 139 B5 A5 167 198 D5 PB8 I/O FT_fh - UART4_RX, CAN1_RX, -
SDMMC2_D4,
ETH_MII_TXD3,
SDMMC1_D4, DCMI_D6,
LCD_B6, EVENTOUT
TIM17_CH1, TIM4_CH4,
DFSDM_DATIN7,
I2C1_SDA,
SPI2_NSS/I2S2_WS,
I2C4_SDA,
96 A4 140 C5 B4 168 199 D4 PB9 I/O FT_fh - SDMMC1_CDIR, -
UART4_TX, CAN1_TX,
SDMMC2_D5,
I2C4_SMBA,
SDMMC1_D5, DCMI_D7,
LCD_B7, EVENTOUT
I/O structure
Pin name
TFBGA240 +25
UFBGA176+25
Pin type
Notes
UFBGA169
TFBGA100
(function Additional
LQFP144
LQFP100
LQFP176
LQFP208
Alternate functions
after functions
reset)
LPTIM1_ETR,
TIM4_ETR,
HRTIM_SCIN,
LPTIM2_ETR,
97 D4 141 D5 A4 169 200 C4 PE0 I/O FT_h - UART8_RX, -
CAN1_RXFD,
SAI2_MCK_A,
FMC_NBL0, DCMI_D2,
EVENTOUT
LPTIM1_IN2,
HRTIM_SCOUT,
UART8_TX,
98 C4 142 D4 A3 170 201 B4 PE1 I/O FT_h - -
CAN1_TXFD,
FMC_NBL1, DCMI_D3,
EVENTOUT
- - - - - - - A7 VCAP3 S - - - -
99 - - - D5 - 202 - VSS S - - - -
- F4 - B4 - - - A6 VDDLDO3 S - - - -
TIM8_CH1,
SAI2_SCK_A,
- - - - C4 174 206 A3 PI5 I/O FT_h - FMC_NBL3, -
DCMI_VSYNC, LCD_B5,
EVENTOUT
TIM8_CH2, SAI2_SD_A,
- - - A4 C3 175 207 A2 PI6 I/O FT_h - FMC_D28, DCMI_D6, -
LCD_B6, EVENTOUT
TIM8_CH3, SAI2_FS_A,
- - - E2 C2 176 208 B3 PI7 I/O FT_h - FMC_D29, DCMI_D7, -
LCD_B7, EVENTOUT
- - - - H9 - - - VSS S - - - -
- - - - K9 - - - VSS S - - - -
- - - - K10 - - - VSS S - - - -
Pin descriptions
Table 9. Port A alternate functions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1/ SPI2/3/6/ TIM13/14/Q SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ 3/I2C4/ USART1/2/ UADSPI/F TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4/ TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ MC/ DFSDM/ LCD
HRTIM1 HRTIM1 5/HRTIM1/ LPTIM2/ SDMMC1/S OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC PDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
ETH_MII_
LPTIM3_ TIM15_ USART2_ QUADSPI_ SAI2_MCK_ RX_CLK/ EVENT-
PA1 - TIM2_CH2 TIM5_CH2 - - UART4_RX - - LCD_R2
OUT CH1N RTS BK1_IO3 B ETH_RMII_ OUT
REF_CLK
ETH_MII_
TIM8_CH1 SPI1_MOSI TIM14_CH RX_DV/ FMC_SDN EVENT-
PA7 - TIM1_CH1N TIM3_CH2 - - - SPI6_MOSI - - -
N /I2S1_SDO 1 ETH_RMII_ WE OUT
CRS_DV
STM32H743xI
JTMS- EVENT-
PA13 - - - - - - - - - - - - - -
SWDIO OUT
Table 9. Port A alternate functions (continued)
STM32H743xI
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1/ SPI2/3/6/ TIM13/14/Q SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ 3/I2C4/ USART1/2/ UADSPI/F TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4/ TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ MC/ DFSDM/ LCD
HRTIM1 HRTIM1 5/HRTIM1/ LPTIM2/ SDMMC1/S OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC PDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
JTCK- EVENT-
PA14 - - - - - - - - - - - - - -
SWCLK OUT
Port A
SAI4/ I2C4/
SAI2/4/
I2C1/2/3/4/ FDCAN1/2/ UART7/
DocID030538 Rev 3
SPI3_
DFSDM_ SAI4_SD_ QUADSPI_ ETH_TX_ EVENT-
PB2 - - SAI1_D1 - - SAI1_SD_A MOSI/I2S3_ SAI4_D1 - - -
CKIN1 A CLK ER OUT
SDO
TIM17_ HRTIM_ SPI1_MOSI/ SPI3_MOSI/ SPI6_ OTG_HS_ ETH_PPS_ FMC_ DCMI_D1 UART5_ EVENT-
PB5 - TIM3_CH2 I2C1_SMBA I2C4_SMBA CAN2_RX
BKIN EEV7 I2S1_SDO I2S3_SDO MOSI ULPI_D7 OUT SDCKE1 0 RX OUT
Pin descriptions
N EEV8 TX TX BK1_NCS DATIN5 1 TX OUT
Pin descriptions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
I2C1/2/3/4/ FDCAN1/2/ UART7/
LPUART/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
USART1/ SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCM
TIM15/ SPI1/2/3/4/5/ /3/I2C4/ USART1/2/3 QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 8/LPUART/ SDMMC2/ MDIOS/ I/LCD/ SYS
LPTIM2/ 6/CEC UART4/ /6/UART7/S FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM/ DFSDM DMMC1 SDMMC2/ SDMMC2/
DFSDM SPDIFRX OTG2_FS/ LCD
CEC LCD/ MDIOS/
LCD
SPDIFRX ETH
ETH_MII_
HRTIM_ LPTIM2_ DFSDM_ USART3_ OTG_HS_ TX_EN/ EVENT-
PB11 - TIM2_CH4 I2C2_SDA - - - - - LCD_G5
SCIN ETR CKIN7 RX ULPI_D4 ETH_RMII_ OUT
TX_EN
Port B
ETH_MII_ TIM1_
SPI2_NSS/ DFSDM_ USART3_ OTG_HS_ OTG_HS_ UART5_ EVENT-
PB12 - TIM1_BKIN - - I2C2_SMBA - CAN2_RX TXD0/ETH_ BKIN_
I2S2_WS DATIN1 CK ULPI_D5 ID RX OUT
RMII_TXD0 COMP12
DocID030538 Rev 3
ETH_MII_
LPTIM2_ SPI2_SCK/ DFSDM_CK USART3_ OTG_HS_ UART5_ EVENT-
PB13 - TIM1_CH1N - - - CAN2_TX TXD1/ETH_ - -
OUT I2S2_CK IN1 CTS_NSS ULPI_D6 TX OUT
RMII_TXD1
STM32H743xI
Table 11. Port C alternate functions
STM32H743xI
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
SPI2_
DFSDM_ DFSDM_ SAI4_SD_ SDMMC2_ MDIOS_ EVENT-
PC1 TRACED0 - SAI1_D1 MOSI/I2S2 SAI1_SD_A - SAI4_D1 ETH_MDC - -
DATIN0 CKIN4 A CK MDC OUT
_SDO
SPI2_
DFSDM_ DFSDM_CK OTG_HS_ ETH_MII_ FMC_SDNE EVENT-
PC2 - - - - MISO/I2S2 - - - - -
CKIN1 OUT ULPI_DIR TXD2 0 OUT
_SDI
SPI2_
DFSDM_ OTG_HS_ ETH_MII_ FMC_SDCK EVENT-
PC3 - - - - MOSI/I2S2 - - - - - -
DATIN1 ULPI_NXT TX_CLK E0 OUT
_SDO
DocID030538 Rev 3
ETH_MII_
DFSDM_ SPDIFRX_ FMC_SDNE EVENT-
PC4 - - - - I2S1_MCK - - - - RXD0/ETH_ - -
CKIN2 IN2 0 OUT
RMII_RXD0
ETH_MII_
DFSDM_ SPDIFRX_ FMC_SDCK COMP_1_ EVENT-
PC5 - - SAI1_D3 - - - - SAI4_D3 RXD1/ETH_ -
DATIN2 IN3 E0 OUT OUT
RMII_RXD1
Port C
Pin descriptions
PC12 TRACED3 - - - - UART5_TX - - - DCMI_D9 -
EEV2 I2S3_SDO CK CK OUT
EVENT-
PC13 - - - - - - - - - - - - - - -
OUT
83/226
Table 11. Port C alternate functions (continued)
84/226
Pin descriptions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
EVENT-
PC14 - - - - - - - - - - - - - - -
OUT
Port C
EVENT-
PC15 - - - - - - - - - - - - - - -
OUT
DocID030538 Rev 3
STM32H743xI
Table 12. Port D alternate functions
STM32H743xI
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
SDMMC1_ EVENT-
PD2 TRACED2 - TIM3_ETR - - - - - UART5_RX - - - DCMI_D11 -
CMD OUT
SPI3_
DFSDM_ DFSDM_ USART2_ SAI4_SD_ CAN2_ SDMMC2_ FMC_ EVENT-
PD6 - - SAI1_D1 MOSI/I2S3 SAI1_SD_A SAI4_D1 DCMI_D10 LCD_B2
CKIN4 DATIN1 RX A RXFD CK NWAIT OUT
_SDO
SPI1_
DFSDM_ DFSDM_CK USART2_ SPDIFRX_ SDMMC2_ EVENT-
PD7 - - - - MOSI/I2S1 - - FMC_NE1 - -
Port D
Pin descriptions
PD13 - TIM4_CH2 - I2C4_SDA - - - - FMC_A18 - -
OUT BK1_IO3 A OUT
Pin descriptions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
SAI4_SD_ EVENT-
PE3 TRACED0 - - - TIM15_BKIN - SAI1_SD_B - - - - FMC_A19 - -
B OUT
STM32H743xI
HDMI__ FMC_D12/ TIM1_BKIN EVENT-
PE15 - TIM1_BKIN - - - - - - - - LCD_R7
TIM1_BKIN FMC_DA12 _COMP12 OUT
Table 14. Port F alternate functions
STM32H743xI
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
EVENT-
PF0 - - - - I2C2_SDA - - - - - - - FMC_A0 - -
OUT
EVENT-
PF1 - - - - I2C2_SCL - - - - - - - FMC_A1 - -
OUT
EVENT-
PF2 - - - - I2C2_SMBA - - - - - - - FMC_A2 - -
OUT
EVENT-
PF3 - - - - - - - - - - - - FMC_A3 - -
OUT
EVENT-
PF4 - - - - - - - - - - - - FMC_A4 - -
OUT
DocID030538 Rev 3
EVENT-
PF5 - - - - - - - - - - - - FMC_A5 - -
OUT
EVENT-
PF12 - - - - - - - - - - - - FMC_A6 - -
OUT
DFSDM_ EVENT-
PF13 - - - I2C4_SMBA - - - - - - - FMC_A7 - -
DATIN6 OUT
Pin descriptions
DFSDM_ EVENT-
PF14 - - - I2C4_SCL - - - - - - - FMC_A8 - -
CKIN6 OUT
EVENT-
PF15 - - - - I2C4_SDA - - - - - - - FMC_A9 - -
OUT
87/226
Table 15. Port G alternate functions
88/226
Pin descriptions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/
SAI2/4/TIM8/ I2C4/UART7
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ FDCAN1/2/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ QUADSPI/ /SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ TIM13/14/ /SDMMC1/ TIM1/
SPI1/2/3/4/ /3/I2C4/ USART1/2/ SDMMC2/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ QUADSPI/ MDIOS/ DCMI/LCD SYS
5/6/CEC UART4/ 3/6/UART7/ OTG1_HS/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ FMC/ OTG1_FS/ /COMP
DFSDM SDMMC1 OTG2_FS/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX SDMMC2/ LCD
LCD MDIOS/ETH
LCD/SPDIFRX
EVENT
PG0 - - - - - - - - - - - - FMC_A10 - -
-OUT
EVENT
PG1 - - - - - - - - - - - - FMC_A11 - -
-OUT
TIM8_BKIN_ EVENT
PG2 - - - TIM8_BKIN - - - - - - - FMC_A12 - -
COMP12 -OUT
FMC_A15/ EVENT
PG5 - TIM1_ETR - - - - - - - - - - - -
FMC_BA1 -OUT
SPI1_
USART6_ SPDIFRX_ QUADSPI_BK FMC_NE2/ DCMI_ EVENT
PG9 - - - - - MISO/I2S1 - SAI2_FS_B - -
RX IN3 2_IO2 FMC_NCE VSYNC -OUT
_SDI
ETH_MII_
HRTIM_ SPI1_SCK/ SPDIFRX_ TX_EN/ LCD_B EVENT
PG11 - - - - - - - SDMMC2_D2 - DCMI_D3
EEV4 I2S1_CK IN0 ETH_RMII_ 3 -OUT
TX_EN
ETH_MII_
HRTIM_ SPI6_ USART6_ SPDIFRX_ LCD_ EVENT
PG12 - LPTIM1_IN1 - - LCD_B4 - TXD1/ETH_ FMC_NE4 -
EEV5 MISO RTS IN1 B1 -OUT
RMII_TXD1
ETH_MII_
LPTIM1_ HRTIM_ USART6_ LCD_ EVENT
PG13 TRACED0 - - SPI6_SCK - - - - TXD0/ETH_ FMC_A24 -
STM32H743xI
OUT EEV10 CTS_NSS R0 -OUT
RMII_TXD0
Table 15. Port G alternate functions (continued)
STM32H743xI
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/
SAI2/4/TIM8/ I2C4/UART7
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ FDCAN1/2/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ QUADSPI/ /SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ TIM13/14/ /SDMMC1/ TIM1/
SPI1/2/3/4/ /3/I2C4/ USART1/2/ SDMMC2/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ QUADSPI/ MDIOS/ DCMI/LCD SYS
5/6/CEC UART4/ 3/6/UART7/ OTG1_HS/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ FMC/ OTG1_FS/ /COMP
DFSDM SDMMC1 OTG2_FS/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX SDMMC2/ LCD
LCD MDIOS/ETH
LCD/SPDIFRX
ETH_MII_
LPTIM1_ SPI6_ USART6_ QUADSPI_ LCD_ EVENT
PG14 TRACED1 - - - - - TXD1/ETH_ FMC_A25 -
ETR MOSI TX BK2_IO3 B0 -OUT
Port G
RMII_TXD1
Pin descriptions
89/226
Table 16. Port H alternate functions
90/226
Pin descriptions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
EVENT-
PH0 - - - - - - - - - - - - - - -
OUT
EVENT-
PH1 - - - - - - - - - - - - - - -
OUT
OTG_HS_ EVENT-
PH4 - - - - I2C2_SCL - - - - LCD_G5 - - - LCD_G4
ULPI_NXT OUT
DocID030538 Rev 3
FMC_ EVENT-
PH5 - - - - I2C2_SDA SPI5_NSS - - - - - - - -
SDNWE OUT
DCMI_ EVENT-
PH8 - - TIM5_ETR - I2C3_SDA - - - - - - - FMC_D16 LCD_R2
HSYNC OUT
TIM12_ EVENT-
PH9 - - - I2C3_SMBA - - - - - - - FMC_D17 DCMI_D0 LCD_R3
CH2 OUT
EVENT-
PH10 - - TIM5_CH1 - I2C4_SMBA - - - - - - - FMC_D18 DCMI_D1 LCD_R4
OUT
EVENT-
PH11 - - TIM5_CH2 - I2C4_SCL - - - - - - - FMC_D19 DCMI_D2 LCD_R5
OUT
EVENT-
PH12 - - TIM5_CH3 - I2C4_SDA - - - - - - - FMC_D20 DCMI_D3 LCD_R6
OUT
TIM8_ EVENT-
PH13 - - - - - - - UART4_TX CAN1_TX - - FMC_D21 - LCD_G2
CH1N OUT
TIM8_µCH EVENT-
PH14 - - - - - - - UART4_RX CAN1_RX - - FMC_D22 DCMI_D4 LCD_G3
2N OUT
STM32H743xI
TIM8_ CAN1_ EVENT-
PH15 - - - - - - - - - - FMC_D23 DCMI_D11 LCD_G4
CH3N TXFD OUT
Table 17. Port I alternate functions
STM32H743xI
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
SPI2_
EVENT-
PI2 - - - TIM8_CH4 - MISO/I2S2 - - - - - - FMC_D26 DCMI_D9 LCD_G7
OUT
_SDI
SPI2_
EVENT-
PI3 - - - TIM8_ETR - MOSI/I2S2 - - - - - - FMC_D27 DCMI_D10 -
OUT
_SDO
DocID030538 Rev 3
EVENT-
PI6 - - - TIM8_CH2 - - - - - - SAI2_SD_A - FMC_D28 DCMI_D6 LCD_B6
OUT
EVENT-
Port I
EVENT-
PI8 - - - - - - - - - - - - - - -
OUT
LCD_ EVENT-
PI9 - - - - - - - - UART4_RX CAN1_RX - - FMC_D30 -
VSYNC OUT
OTG_HS_ EVENT-
PI11 - - - - - - - - - LCD_G6 - - - -
ULPI_DIR OUT
LCD_ EVENT-
Pin descriptions
PI13 - - - - - - - - - - - - - -
VSYNC OUT
EVENT-
PI14 - - - - - - - - - - - - - - LCD_CLK
OUT
EVENT-
PI15 - - - - - - - - - LCD_G2 - - - - LCD_R0
OUT
91/226
Table 18. Port J alternate functions
92/226
Pin descriptions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
EVENT-
PJ0 - - - - - - - - - LCD_R7 - - - - LCD_R1
OUT
EVENT-
PJ1 - - - - - - - - - - - - - - LCD_R2
OUT
EVENT-
PJ2 - - - - - - - - - - - - - - LCD_R3
OUT
EVENT-
PJ3 - - - - - - - - - - - - - - LCD_R4
OUT
EVENT-
PJ4 - - - - - - - - - - - - - - LCD_R5
OUT
DocID030538 Rev 3
EVENT-
PJ5 - - - - - - - - - - - - - - LCD_R6
OUT
EVENT-
PJ6 - - - TIM8_CH2 - - - - - - - - - - LCD_R7
OUT
TIM8_ EVENT-
PJ7 TRGIN - - - - - - - - - - - - LCD_G0
CH2N OUT
Port J
EVENT-
PJ8 - TIM1_CH3N - TIM8_CH1 - - - - UART8_TX - - - - - LCD_G1
OUT
TIM8_ EVENT-
PJ9 - TIM1_CH3 - - - - - UART8_RX - - - - - LCD_G2
CH1N OUT
SPI5_ EVENT-
PJ10 - TIM1_CH2N - TIM8_CH2 - - - - - - - - - LCD_G3
MOSI OUT
EVENT-
PJ12 TRGOUT - - - - - - - - LCD_G3 - - - - LCD_B0
OUT
EVENT-
PJ13 - - - - - - - - - LCD_B4 - - - - LCD_B1
OUT
EVENT-
PJ14 - - - - - - - - - - - - - - LCD_B2
OUT
STM32H743xI
EVENT-
PJ15 - - - - - - - - - - - - - - LCD_B3
OUT
Table 19. Port K alternate functions
STM32H743xI
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
SAI4/ I2C4/
SAI2/4/
FDCAN1/2/ UART7/
LPUART/ I2C1/2/3/4/ SPI6/SAI2/ TIM8/ TIM1/8/FMC
SPI2/3/SAI1 SPI2/3/6/ TIM13/14/ SWPMI1/
Port TIM1/2/16/1 SAI1/TIM3/ TIM8/ USART1/ 4/UART4/5/ QUADSPI/ /SDMMC1/ TIM1/DCMI
SPI1/2/3/4/ /3/I2C4/ USART1/2/ QUADSPI/ TIM1/8/ UART5/
SYS 7/LPTIM1/ 4/5/12/ LPTIM2/3/4 TIM15/ 8/LPUART/ SDMMC2/ MDIOS/ /LCD/ SYS
5/6/CEC UART4/ 3/6/UART7/ FMC/ DFSDM/ LCD
HRTIM1 HRTIM1 /5/HRTIM1/ LPTIM2/ SDMMC1/ OTG1_HS/ OTG1_FS/ COMP
DFSDM SDMMC1 SDMMC2/ SDMMC2/
DFSDM DFSDM/CEC SPDIFRX OTG2_FS/ LCD
LCD/ MDIOS/
LCD
SPDIFRX ETH
EVENT-
PK0 - TIM1_CH1N - TIM8_CH3 - SPI5_SCK - - - - - - - - LCD_G5
OUT
TIM8_ EVENT-
PK1 - TIM1_CH1 - - SPI5_NSS - - - - - - - - LCD_G6
CH3N OUT
EVENT-
PK3 - - - - - - - - - - - - - - LCD_B4
OUT
Port K
EVENT-
PK4 - - - - - - - - - - - - - - LCD_B5
OUT
DocID030538 Rev 3
EVENT-
PK5 - - - - - - - - - - - - - - LCD_B6
OUT
EVENT-
PK6 - - - - - - - - - - - - - - LCD_B7
OUT
EVENT-
PK7 - - - - - - - - - - - - - - LCD_DE
OUT
Pin descriptions
93/226
Electrical characteristics STM32H743xI
6 Electrical characteristics
Figure 11. Pin loading conditions Figure 12. Pin input voltage
C = 50 pF VIN
MS19011V2 MS19010V2
100 nF
100 nF
VDD33USB VDD50USB
VDD33USB VDD50USB
VSS USB
IOs
USB
VDDLDO VSS
regulator
VCAP
2 x 2.2μF
regulator
Power
Power
switch
switch
VSS
D3 domain
(System
Level shifter
logic, D1 domain
IO EXTI, D2 domain (CPU, peripherals,
IOs (peripherals, RAM)
logic Peripherals,
RAM) RAM) Flash
VDD
VSS
N(1) x 100 nF
VDD domain
+ 1 x 4.7 μF
HSI, CSI,
VDD
HSI48,
VBAT HSE, PLLs Backup domain
charging
VBAT VSW Backup VBKP
1.2 to 3.6V VBAT regulator
Power switch
Power switch
LSI, LSE,
RTC, Wakeup
Backup
logic, backup
BKUP IO RAM
registers,
IOs logic Reset
VREF
VDDA VSS
VDDA VSS
Analog domain
100 nF + 1 x 1 μF
100 nF + 1 x 1 μF
MSv46116V3
IDD_VBAT
VBAT
IDD
VDD
VDDA
ai14126
ΣIVDD Total current into sum of all VDD power lines (source)(1) 620
(1)
ΣIVSS Total current out of sum of all VSS ground lines (sink) 620
(1)
IVDD Maximum current into each VDD power pin (source) 100
IVSS Maximum current out of each VSS ground pin (sink)(1) 100
IIO Output current sunk by any I/O and control pin 20
Total output current sunk by sum of all I/Os and control pins (2)
140 mA
ΣI(PIN)
Total output current sourced by sum of all I/Os and control pins(2) 140
Injected current on FT_xxx, TT_xx, RST and B pins except PA4,
−5/+0
IINJ(PIN)(3)(4) PA5
Injected current on PA4, PA5 −0/0
ΣIINJ(PIN) Total injected current (sum of all I/Os and control pins)(5) ±25
1. All main power (VDD, VDDA, VDD33USB) and ground (VSS, VSSA) pins must always be connected to the
external power supplies, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output
current must not be sunk/sourced between two consecutive power supply pins referring to high pin count
QFP packages.
3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the
specified maximum value.
4. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. IINJ(PIN) must
never be exceeded. Refer also to Table 20: Voltage characteristics for the maximum allowed input voltage
values.
5. When several inputs are submitted to a current injection, the maximum ∑IINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values).
VDD (2)
Standard operating voltage - 1.62 3.6
VDDLDO Supply voltage for the internal regulator VDDLDO ≤ VDD 1.62(2) 3.6
USB used 3.0 3.6
VDD33USB Standard operating voltage, USB domain
USB not used 0 3.6
ADC or COMP used 1.62
DAC used 1.8
OPAMP used 2.0
VDDA Analog operating voltage 3.6 V
VREFBUF used 1.8
ADC, DAC, OPAMP,
COMP, VREFBUF not 0
used
TT_xx I/O −0.3 VDD+0.3
BOOT0 0 9
VIN I/O Input voltage
Min(VDD, VDDA,
All I/O except BOOT0
−0.3 VDD33USB) +3.6V
and TT_xx
< 5.5V(3)(4)
TFBGA240+25 - - 1093
LQFP208 - - 943
LQFP176 - - 930
4. For operation with voltage higher than Min (VDD, VDDA, VDD33USB) +0.3V, the internal Pull-up and Pull-Down resistors must
be disabled.
5. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 7.9: Thermal characteristics).
6. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.9:
Thermal characteristics).
ESR
R Leak
MS19044V2
Reset temporization
tRSTTEMPO(1) - - 377 - µs
after BOR0 released
Rising edge(1) 1.62 1.67 1.71
VBOR0 Brown-out reset threshold 0
Falling edge 1.58 1.62 1.68
Rising edge 2.04 2.10 2.15
VBOR1 Brown-out reset threshold 1
Falling edge 1.95 2.00 2.06
Rising edge 2.34 2.41 2.47
VBOR2 Brown-out reset threshold 2
Falling edge 2.25 2.31 2.37
Rising edge 2.63 2.70 2.78
VBOR3 Brown-out reset threshold 3
Falling edge 2.54 2.61 2.68
VREFIN_CAL Raw data acquired at temperature of 30 °C, VDDA = 3.3 V 1FF1E860 - 1FF1E861
Table 29. Typical and maximum current consumption in Run mode, code with data processing
running from ITCM, regulator ON(1)
Max(2)
frcc_c_ck
Symbol Parameter Conditions Typ TJ = TJ = TJ = TJ = unit
(MHz)
25°C 85°C 105°C 125°C
400 71 110 210 290 540
VOS1
300 56 - - - -
300 50 72 170 230 370
VOS2 216 37 58 150 210 380
200 35.5 - - - -
All
peripherals 200 33 50 130 190 300
disabled
180 30 47 130 180 290
Supply 168 28 45 130 180 290
IDD current in Run VOS3 mA
mode 144 25 41 120 180 290
60 13 28 110 160 280
25 10 24 99 160 270
400 165 220 400 500(3) 840
VOS1
300 130 - - - -
All
peripherals 300 120 170 300 390 570
enabled VOS2
200 83 - - - -
VOS3 200 78 110 220 300 470
1. Data are in DTCM for best computation performance, cache has no influence on consumption in this case.
2. Guaranteed by characterization results unless otherwise specified.
3. Guaranteed by test in production.
Table 30. Typical and maximum current consumption in Run mode, code with data processing
running from Flash memory, cache ON, regulator ON
Max(1)
frcc_c_ck
Symbol Parameter Conditions Typ TJ = TJ = TJ = TJ = unit
(MHz)
25°C 85°C 105°C 125°C
400 105 160 310 420 750
VOS1
300 55 - - - -
300 50 72 160 230 370
VOS2 216 38 - - - -
200 36 - - - -
All
peripherals 200 33 50 130 190 300
disabled
180 30 - - - -
Supply 168 29 - - - -
IDD current in Run VOS3 mA
mode 144 26 - - - -
60 14 - - - -
25 14 - - - -
400 160 220 400 500(2) 750
VOS1
300 130 - - - -
All
peripherals 300 120 160 300 390 560
enabled VOS2
200 81 - - - -
VOS3 200 77 110 220 300 460
1. Guaranteed by characterization results unless otherwise specified.
2. Guaranteed by by test in production.
Table 31. Typical and maximum current consumption in Run mode, code with data processing
running from Flash memory, cache OFF, regulator ON
Max(1)
frcc_c_ck
Symbol Parameter Conditions Typ TJ = TJ = TJ = TJ = unit
(MHz)
25°C 85°C 105°C 125°C
VOS1 400 73 110 220 290 540
All
peripherals VOS2 300 52 75 170 230 370
Supply disabled
VOS3 200 34 52 130 190 300
IDD current in Run mA
mode VOS1 400 135 190 360 470 730
All
peripherals VOS2 300 100 150 270 370 550
enabled
VOS3 200 70 100 210 300 460
1. Guaranteed by characterization results.
D1Standby,
Supply current in D2Standby, VOS3 64 6.5
IDD batch acquisition D3Run mA
mode D1Stop, D2Stop,
VOS3 64 12
D3Run
Table 34. Typical and maximum current consumption in Sleep mode, regulator ON
Max(1)
frcc_c_ck
Symbol Parameter Conditions Typ TJ = TJ = TJ = TJ = unit
(MHz)
25°C 85°C 105°C 125°C
400 31.0 64 220 330 660
VOS1
300 24.5 57 210 330 650
Supply All
IDD(Sleep) current in peripherals 300 22.0 48 180 270 500 mA
Sleep mode disabled VOS2
200 17.0 42 170 270 490
VOS3 200 15.5 37 150 230 400
1. Guaranteed by characterization results.
Table 35. Typical and maximum current consumption in Stop mode, regulator ON
Max(1)
Symbol Parameter Conditions Typ TJ = TJ = TJ = TJ = unit
25°C 85°C 105°C 125°C
Flash SVOS5 1.4 7.2 49 75 140
memory
SVOS4 1.95 11 66 110 200
OFF, no
D1Stop, IWDG SVOS3 2.85 16 91 150 240
D2Stop,
D3Stop SVOS5 1.65 7.2 49 75 140
Flash
memory ON, SVOS4 2.2 11 66 110 180
no IWDG
SVOS3 3.15 16 91 150 300
Flash SVOS5 0.99 5.1 35 60 97
memory
SVOS4 1.4 7.5 47 79 130
OFF, no
D1Stop, IWDG SVOS3 2.05 12 64 110 170
IDD(Stop) D2Standby, mA
D3Stop SVOS5 1.25 5.5 35 61 98
Flash
memory ON, SVOS4 1.65 7.8 47 80 130
no IWDG
SVOS3 2.3 12 65 110 170
SVOS5 0.57 3 21 36 57
D1Standby,
D2Stop, SVOS4 0.805 4.5 27 47 74
D3Stop
Flash OFF, SVOS3 1.2 6.7 37 63 99
no IWDG SVOS5 0.17 1.1 8 13 20
D1Standby,
D2Standby, SVOS4 0.245 1.5 11 17 26
D3Stop
SVOS3 0.405 2.4 15 23 35
1. Guaranteed by characterization results.
I SW = V DDx × f SW × C L
where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDDx is the MCU supply voltage
fSW is the I/O switching frequency
CL is the total capacitance seen by the I/O pin: C = CINT+ CEXT
The test pin is configured in push-pull output mode and is toggled by software at a fixed
frequency.
Table 39. Peripheral current consumption in Stop, Standby and VBAT mode
Typ
Symbol Parameter Conditions Unit
3V
RTC+LSE low drive - 2.32
RTC+LSE medium-
- 2.4
low drive
IDD µA
RTC+LSE medium-
- 2.7
high drive
RTC+LSE High drive - 3
CPU
tWUSLEEP(2) Wakeup from Sleep - 9 10 clock
cycles
VOS3, HSI, Flash memory in normal mode 4.4 5.6
VOS3, HSI, Flash memory in low-power
12 15
mode
VOS4, HSI, Flash memory in normal mode 15 20
VOS4, HSI, Flash memory in low-power
23 28
mode
VOS5, HSI, Flash memory in normal mode 30 71
VOS5, HSI, Flash memory in low-power
38 47
mode
tWUSTOP(2) Wakeup from Stop
VOS3, CSI, Flash memory in normal mode 27 37
VOS3, CSI, Flash memory in low power
36 50
mode µs
VOS4, CSI, Flash memory in normal mode 38 48
VOS4, CSI, Flash memory in low-power
47 61
mode
VOS5, CSI, Flash memory in normal mode 52 64
VOS5, CSI, Flash memory in low-power
62 77
mode
Wakeup from Stop, VOS3, HSI, Flash memory in normal mode 2.6 3.4
tWUSTOP2(2)
clock kept running VOS3, CSI, Flash memory in normal mode 26 36
VHSEH
90 %
10 %
VHSEL
tr(HSE) tf(HSE) tW(HSE) tW(HSE) t
THSE
External fHSE_ext
IL
clock source OSC_IN
STM32
ai17528b
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
VLSEH
90%
10%
VLSEL
tr(LSE) tf(LSE) tW(LSE) tW(LSE) t
TLSE
External fLSE_ext
OSC32_IN IL
clock source
STM32
ai17529b
For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 25 pF range (typical), designed for high-frequency applications, and selected to
match the requirements of the crystal or resonator (see Figure 18). CL1 and CL2 are usually
the same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. The PCB and MCU pin capacitance must be included
(10 pF can be used as a rough estimate of the combined pin and board capacitance) when
sizing CL1 and CL2.
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
Resonator with
integrated capacitors
CL1
OSC_IN fHSE
Bias
8 MHz RF controlled
resonator
gain
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
Resonator with
integrated capacitors
CL1
OSC32_IN fLSE
Bias
32.768 kH z RF controlled
resonator
gain
OSC32_OU T STM32
CL2
ai17531b
1. An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden to add one.
VDD = 3.3 V,
TJ = 25 °C (after 31.4 32 32.6
fLSI LSI frequency calibration) kHz
TJ = –40 to 105 °C,
29.76 - 33.60
VDD = 1.62 to 3.6 V
tsu(LSI)(1) LSI oscillator startup time - - 80 130
LSI oscillator stabilization µs
tstab(LSI)(1) - - 120 170
time (5% of final value)
LSI oscillator power
IDD(LSI)(1) - - 130 280 nA
consumption
1. Guaranteed by design.
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
0.1 to 30 MHz 6
30 to 130 MHz 5
VDD = 3.6 V, TA = 25 °C, UFBGA240 package, dBµV
SEMI Peak level 130 MHz to 1 GHz 13
conforming to IEC61967-2
1 GHz to 2 GHz 7
EMI Level 2.5 -
Static latchup
Two complementary static tests are required on six parts to assess the latchup
performance:
• A supply overvoltage is applied to each power supply pin
• A current injection is applied to each input, output and configurable I/O pin
These tests are compliant with JESD78 IC latchup standard.
PA7, PC5, PG1, PB14, PJ7, PA11, PA12, PA13, PA14, PA15,
5 0
PJ12, PB4
PA2, PH2, PH3, PE8, PA6, PA7, PC4, PE7, PE10, PE11 0 NA
IINJ mA
PA0, PA_C, PA1, PA1_C, PC2, PC2_C, PC3, PC3_C, PA4,
0 0
PA5, PH4, PH5, BOOT0
All other I/Os 5 NA
1. Guaranteed by characterization.
All I/Os are CMOS and TTL compliant (no software configuration required). Their
characteristics cover more than the strict CMOS-technology or TTL parameters. The
coverage of these requirements for FT I/Os is shown in Figure 20.
2.5
V DD
min
=0.7 TLL requirement: VIHmin = 2 V
2 me nt: V IH
equire
OS r
, CM
ction +0.25
rodu 0.47VDD
d in p VIHmin=
Teste ulation
n sim
1.5 Based o
Voltage
+0.1
0.4VDD
VILmax=
n s im ulation V ax=
0.3VDD
1 o ent: m
Based
IL
O S re quirem
CM
uction,
in prod
Tested TLL requirement: VILmin = 0.8 V
0.5
0
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
MSv46121V1
CMOS port(2)
VOL Output low level voltage IIO=8 mA 0.4
2.7 V≤ VDD ≤3.6 V
CMOS port(2)
VOH Output high level voltage IIO=-8 mA VDD−0.4
2.7 V≤ VDD ≤3.6 V
TTL port(2)
VOL(3) Output low level voltage IIO=8 mA 0.4
2.7 V≤ VDD ≤3.6 V
TTL port(2)
VOH (3) Output high level voltage IIO=-8 mA 2.4
2.7 V≤ VDD ≤3.6 V
V
IIO=20 mA
VOL(3) Output low level voltage 1.3
2.7 V≤ VDD ≤3.6 V
IIO=-20 mA
VOH(3) Output high level voltage VDD−1.3
2.7 V≤ VDD ≤3.6 V
IIO=4 mA
VOL(3) Output low level voltage 0.4
1.62 V≤ VDD ≤3.6 V
IIO=-4 mA
VOH (3) Output high level voltage VDD−-0.4
1.62 V≤VDD<3.6 V
IIO= 20 mA
- 0.4
Output low level voltage for an FTf 2.3 V≤ VDD≤3.6 V
VOLFM+(3)
IO pin in FM+ mode IIO= 10 mA
- 0.4
1.62 V≤ VDD ≤3.6 V
1. The IIO current sourced or sunk by the device must always respect the absolute maximum rating specified in Table 20:
Voltage characteristics, and the sum of the currents sourced or sunk by all the I/Os (I/O ports and control pins) must always
respect the absolute maximum ratings ΣIIO.
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. Guaranteed by design.
VDD
External
reset circuit (1)
RPU
NRST (2) Internal Reset
Filter
0.1 μF
STM32
ai14132d
Refer to Section 6.3.15: I/O port characteristics for more details on the input/output
characteristics.
tw(NE)
FMC_NE
FMC_NOE
FMC_NWE
tv(A_NE) t h(A_NOE)
FMC_A[25:0] Address
tv(BL_NE) t h(BL_NOE)
FMC_NBL[1:0]
t h(Data_NE)
t su(Data_NOE) th(Data_NOE)
t su(Data_NE)
FMC_D[15:0] Data
t v(NADV_NE)
tw(NADV)
FMC_NADV (1)
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32753V1
FMC_NEx
FMC_NOE
tv(NWE_NE) tw(NWE) t h(NE_NWE)
FMC_NWE
tv(A_NE) th(A_NWE)
FMC_A[25:0] Address
tv(BL_NE) th(BL_NWE)
FMC_NBL[1:0] NBL
tv(Data_NE) th(Data_NWE)
FMC_D[15:0] Data
t v(NADV_NE)
tw(NADV)
FMC_NADV (1)
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32754V1
FMC_ NE
tv(NOE_NE) t h(NE_NOE)
FMC_NOE
t w(NOE)
FMC_NWE
tv(A_NE) th(A_NOE)
t v(NADV_NE) th(AD_NADV)
tw(NADV)
FMC_NADV
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32755V1
FMC_ NEx
FMC_NOE
tv(NWE_NE) tw(NWE) t h(NE_NWE)
FMC_NWE
tv(A_NE) th(A_NWE)
t v(NADV_NE) th(AD_NADV)
tw(NADV)
FMC_NADV
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32756V1
FMC_CLK
Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)
FMC_NEx
t d(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:16]
td(CLKL-NOEL) td(CLKH-NOEH)
FMC_NOE
td(CLKL-ADIV) th(CLKH-ADV)
t d(CLKL-ADV) tsu(ADV-CLKH) tsu(ADV-CLKH) th(CLKH-ADV)
FMC_AD[15:0] AD[15:0] D1 D2
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)
MS32757V1
FMC_CLK
Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:16]
td(CLKL-NWEL) td(CLKH-NWEH)
FMC_NWE
td(CLKL-ADIV) td(CLKL-Data)
td(CLKL-ADV) td(CLKL-Data)
FMC_AD[15:0] AD[15:0] D1 D2
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)
td(CLKH-NBLH)
FMC_NBL
MS32758V1
tw(CLK) tw(CLK)
FMC_CLK
td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:0]
td(CLKL-NOEL) td(CLKH-NOEH)
FMC_NOE
tsu(DV-CLKH) th(CLKH-DV)
tsu(DV-CLKH) th(CLKH-DV)
FMC_D[15:0] D1 D2
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) t h(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
MS32759V1
FMC_CLK
td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:0]
td(CLKL-NWEL) td(CLKH-NWEH)
FMC_NWE
td(CLKL-Data) td(CLKL-Data)
FMC_D[15:0] D1 D2
FMC_NWAIT
(WAITCFG = 0b, WAITPOL + 0b) tsu(NWAITV-CLKH) td(CLKH-NBLH)
th(CLKH-NWAITV)
FMC_NBL
MS32760V1
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
FMC_NWE
td(ALE-NOE) th(NOE-ALE)
FMC_NOE (NRE)
tsu(D-NOE) th(NOE-D)
FMC_D[15:0]
MS32767V1
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NWE) th(NWE-ALE)
FMC_NWE
FMC_NOE (NRE)
tv(NWE-D) th(NWE-D)
FMC_D[15:0]
MS32768V1
Figure 32. NAND controller waveforms for common memory read access
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) th(NOE-ALE)
FMC_NWE
tw(NOE)
FMC_NOE
tsu(D-NOE) th(NOE-D)
FMC_D[15:0]
MS32769V1
Figure 33. NAND controller waveforms for common memory write access
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) tw(NWE) th(NOE-ALE)
FMC_NWE
FMC_N OE
td(D-NWE)
tv(NWE-D) th(NWE-D)
FMC_D[15:0]
MS32770V1
FMC_SDCLK
td(SDCLKL_AddC)
td(SDCLKL_AddR) th(SDCLKL_AddR)
th(SDCLKL_AddC)
td(SDCLKL_SNDE) th(SDCLKL_SNDE)
FMC_SDNE[1:0]
td(SDCLKL_NRAS) th(SDCLKL_NRAS)
FMC_SDNRAS
td(SDCLKL_NCAS) th(SDCLKL_NCAS)
FMC_SDNCAS
FMC_SDNWE
tsu(SDCLKH_Data) th(SDCLKH_Data)
MS32751V2
FMC_SDCLK
td(SDCLKL_AddC)
td(SDCLKL_AddR) th(SDCLKL_AddR)
th(SDCLKL_AddC)
td(SDCLKL_SNDE) th(SDCLKL_SNDE)
FMC_SDNE[1:0]
td(SDCLKL_NRAS) th(SDCLKL_NRAS)
FMC_SDNRAS
td(SDCLKL_NCAS) th(SDCLKL_NCAS)
FMC_SDNCAS
td(SDCLKL_NWE) th(SDCLKL_NWE)
FMC_SDNWE
td(SDCLKL_Data)
td(SDCLKL_NBL) th(SDCLKL_Data)
FMC_NBL[3:0]
MS32752V2
2.7 V ≤ VDD<3.6 V
- - 133
CL=20 pF
Fck1/t(CK) Quad-SPI clock frequency MHz
1.62 V<VDD<3.6 V
- - 100
CL=15 pF
tw(CKH) Quad-SPI clock high and low t(CK)/2 -0.5 - t(CK)/2
-
tw(CKL) time t(CK)/2 - t(CK)/2 + 0.5
ts(IN) Data input setup time 1.5 - -
- ns
th(IN) Data input hold time 2 - -
tv(OUT) Data output valid time - - 1.5 2
th(OUT) Data output hold time - 0.5 - -
2.7 V<VDD<3.6 V
- - 100
Quad-SPI clock CL=20 pF
Fck1/t(CK) MHz
frequency 1.62 V<VDD<3.6 V
- - 100
CL=15 pF
tw(CKH) Quad-SPI clock high and t(CK)/2 - 0.5 - t(CK)/2
-
tw(CKL) low time t(CK)/2 - t(CK)/2+0.5
tsr(IN), tsf(IN) Data input setup time - 2 - -
thr(IN), thf(IN) Data input hold time - 2 - -
DHHC=0 - 3.5 4 ns
tvr(OUT),
Data output valid time DHHC=1
tvf(OUT) - t(CK)/4+3.5 t(CK)/4+4
Pres=1, 2...
DHHC=0 3 - -
thr(OUT),
Data output hold time DHHC=1
thf(OUT) t(CK)/4+3 - -
Pres=1, 2...
Clock
tv(OUT) th(OUT)
Data output D0 D1 D2
ts(IN) th(IN)
Data input D0 D1 D2
MSv36878V1
Clock
tvf(OUT) thr(OUT) tvr(OUT) thf(OUT)
Data output D0 D1 D2 D3 D4 D5
Data input D0 D1 D2 D3 D4 D5
MSv36879V1
The formula above (Equation 1) is used to determine the maximum external impedance
allowed for an error below 1/4 of LSB. N = 12 (from 12-bit resolution).
Single BOOST = 1 - ±6 -
Total ended BOOST = 0 - ±8 -
ET unadjusted
error BOOST = 1 - ±10 -
Differential
BOOST = 0 - ±16 -
Single BOOST = 1 - 2 -
Differential ended BOOST = 0 - 1 -
ED linearity ±LSB
error BOOST = 1 - 8 -
Differential
BOOST = 0 - 2 -
Single BOOST = 1 - ±6 -
Integral ended BOOST = 0 - ±4 -
EL linearity
error BOOST = 1 - ±6 -
Differential
BOOST = 0 - ±4 -
Single BOOST = 1 - 72 -
Signal-to- ended BOOST = 0 - 74 -
SNR(5) noise ratio
BOOST = 1 - 82 - dB
(2 MSPS)
Differential
BOOST = 0 - 83 -
Single
BOOST = 1 - −78 -
ended
Total
THD(5) harmonic Single BOOST = 0 - −80 -
distortion ended BOOST = 1 - −90 -
Differential BOOST = 0 - −95 -
1. Guaranteed by characterization for BGA packages, the values for LQFP packages might differ.
2. ADC DC accuracy values are measured after internal calibration.
3. The above table gives the ADC performance in 16-bit mode.
4. ADC clock frequency ≤ 36 MHz, 2 V ≤ VDDA ≤3.3 V, 1.6 V ≤ VREF ≤ VDDA, BOOSTEN (for I/O) = 1.
5. ENOB, SINAD, SNR and THD are specified for VDDA = VREF = 3.3 V.
Note: ADC accuracy vs. negative injection current: injecting a negative current on any analog
input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to
ground) to analog pins which may potentially inject negative currents.
Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in
Section 6.3.15 does not affect the ADC accuracy.
(2)
ET
7 (3)
(1)
6
5
EO EL
4
3
ED
2
1L SBIDEAL
1
0
1 2 3 456 7 4093 4094 4095 4096
V SSA VDDA
ai14395c
VDD STM32
Sample and hold ADC
VT converter
0.6 V
RAIN(1) AINx RADC(1)
12-bit
converter
VT
VAIN
0.6 V C ADC(1)
Cparasitic
IL±1 μA
ai17534b
Figure 40. Power supply and reference decoupling (VREF+ not connected to VDDA)
STM32
VREF+ (1)
1 μF // 10 nF
VDDA
1 μF // 10 nF
(1)
VSSA/VREF+
ai17535c
1. VREF+ input is available on all package whereas the VREF– s available only on UFBGA176+25 and
TFBGA240+25. When VREF- is not available, it is internally connected to VDDA and VSSA.
Figure 41. Power supply and reference decoupling (VREF+ connected to VDDA)
STM32
VREF+/VDDA (1)
1 μF // 10 nF
(1)
VREF-/VSSA
ai17536d
1. VREF+ input is available on all package whereas the VREF– s available only on UFBGA176+25 and
TFBGA240+25. When VREF- is not available, it is internally connected to VDDA and VSSA.
VREF+
Voltage on DAC_OUT DAC output buffer ON 0.2 -
VDAC_OUT −0.2 V
output
DAC output buffer OFF 0 - VREF+
Settling time (full scale: for
a 12-bit code transition
between the lowest and
the highest input codes Normal mode, DAC output buffer
tSETTLING - 1.7(1) 2(1) µs
when DAC_OUT reaches OFF, ±1LSB CL=10 pF
the final value of ±0.5LSB,
±1LSB, ±2LSB, ±4LSB,
±8LSB)
Wakeup time from off
state (setting the Enx bit in Normal mode, DAC output buffer
tWAKEUP(2) - 5 7.5 µs
the DAC Control register) ON, CL ≤ 50 pF, RL = 5 ㏀
until the ±1LSB final value
No load, middle
- 360 -
DAC output code (0x800)
buffer ON No load, worst
- 490 -
code (0xF1C)
DAC quiescent
IDDA(DAC) No load,
consumption from VDDA DAC output
middle/worst - 20 -
buffer OFF
code (0x800)
Sample and Hold mode, 360*TON/
- -
CSH=100 nF (TON+TOFF)
No load, middle
- 170 - µA
DAC output code (0x800)
buffer ON No load, worst
- 170 -
code (0xF1C)
No load,
DAC consumption from DAC output
IDDV(DAC) middle/worst - 160 -
VREF+ buffer OFF
code (0x800)
Sample and Hold mode, Buffer 170*TON/
- -
ON, CSH=100 nF (worst code) (TON+TOFF)
Sample and Hold mode, Buffer 160*TON/
- -
OFF, CSH=100 nF (worst code) (TON+TOFF)
1. Guaranteed by design.
2. In buffered mode, the output can overshoot above the final value for low input code (starting from the minimum value).
1. Guaranteed by characterization.
2. Difference between two consecutive codes minus 1 LSB.
3. Difference between the value measured at Code i and the value measured at Code i on a line drawn between Code 0 and
last Code 4095.
4. Difference between the value measured at Code (0x001) and the ideal value.
5. Difference between the ideal slope of the transfer function and the measured slope computed from code 0x000 and 0xFFF
when the buffer is OFF, and from code giving 0.2 V and (VREF+ - 0.2 V) when the buffer is ON.
6. Signal is -0.5dBFS with Fsampling=1 MHz.
Buffered/Non-buffered DAC
Buffer(1)
RL
12-bit DAC_OUTx
digital to
analog
converter
CL
ai17157V3
1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
VBRS in PWR_CR3= 0 - 5 -
RBC Battery charging resistor KΩ
VBRS in PWR_CR3= 1 1.5 -
CLOAD ≤ 50pf /
Power supply rejection
PSRR RLOAD ≥ 4 kΩ(2) at 1 kHz, - 66 - dB
ratio
Vcom=VDDA/2
φm Phase margin - - 55 - °
GM Gain margin - - 12 - dB
CLOAD ≤ 50pf,
Normal RLOAD ≥ 4 kΩ(2),
- 0.8 3.2
mode follower
Wake up time from OFF configuration
tWAKEUP µs
state CLOAD ≤ 50pf,
High RLOAD ≥ 4 kΩ(2),
- 0.9 2.8
speed follower
configuration
- - 2 - -
- - 4 - -
Non inverting gain value
- - 8 - -
- - 16 - -
PGA gain
- - −1 - -
- - −3 - -
Inverting gain value
- - −7 - -
- - −15 - -
PGA Gain=2 - 10/10 -
R2/R1 internal resistance PGA Gain=4 - 30/10 -
values in non-inverting
PGA mode(3) PGA Gain=8 - 70/10 -
at
- 140 -
1 KHz output loaded nV/√
en Voltage noise density
with 4 kΩ Hz
at
- 55 -
10 KHz
Normal
- 570 1000
mode no Load,
OPAMP consumption from
IDDA(OPAMP) quiescent mode, µA
VDDA High- follower
speed - 610 1200
mode
1. Guaranteed by design, unless otherwise specified.
2. RLOAD is the resistive load connected to VSSA or to VDDA.
3. R2 is the internal resistance between the OPAMP output and th OPAMP inverting input. R1 is the internal resistance
between the OPAMP inverting input and ground. PGA gain = 1 + R2/R1.
Output clock
fCKOUT 1.62 < VDD < 3.6 V - - 20
frequency
Output clock
DuCyCKOUT frequency duty 1.62 < VDD < 3.6 V 45 50 55 %
cycle
ns
Manchester mode
Manchester data (SITP[1:0]=2,3),
(CKOUTDIV+1) (2*CKOUTDIV)
TManchester period (recovered Internal clock mode -
* TDFSDMCLK * TDFSDMCLK
clock period) (SPICKSEL[1:0]≠0),
1.62 < VDD < 3.6 V
DFSDM_CKINy (SPICKSEL=0)
SPI timing : SPICKSEL = 0
twl twh tr tf
tsu th
DFSDM_DATINy
SITP = 00
tsu th
SITP = 01
SPICKSEL=3
DFSDM_CKOUT
SPICKSEL=2
SPI timing : SPICKSEL = 1, 2, 3
SPICKSEL=1
twl twh tr tf
tsu th
DFSDM_DATINy
SITP = 0
tsu th
SITP = 1
SITP = 2
DFSDM_DATINy
Manchester timing
SITP = 3
recovered clock
recovered data 0 0 1 1 0
MS30766V2
1/DCMI_PIXCLK
DCMI_PIXCLK
tsu(HSYNC) th(HSYNC)
DCMI_HSYNC
tsu(VSYNC) th(HSYNC)
DCMI_VSYNC
tsu(DATA) th(DATA)
DATA[0:13]
MS32414V2
tv(HSYNC), ns
HSYNC/VSYNC/DE output valid
tv(VSYNC), - 0.5
time
tv(DE)
th(HSYNC),
HSYNC/VSYNC/DE output hold
th(VSYNC), 0.5 -
time
th(DE)
1. Guaranteed by characterization results.
tCLK
LCD_CLK
LCD_VSYNC
tv(HSYNC) tv(HSYNC)
LCD_HSYNC
tv(DE) th(DE)
LCD_DE
tv(DATA)
LCD_R[0:7]
LCD_G[0:7] Pixel Pixel Pixel
1 2 N
LCD_B[0:7]
th(DATA)
One line
MS32749V1
tCLK
LCD_CLK
tv(VSYNC) tv(VSYNC)
LCD_VSYNC
LCD_R[0:7]
LCD_G[0:7] M lines data
LCD_B[0:7]
One frame
MS32750V1
AHB/APBx prescaler=1
or 2 or 4, fTIMxCLK = 1 - tTIMxCLK
200 MHz
tres(TIM) Timer resolution time
AHB/APBx
prescaler>4, fTIMxCLK = 1 - tTIMxCLK
100 MHz
Timer external clock
fEXT 0 fTIMxCLK/2 MHz
frequency on CH1 to CH4 f
TIMxCLK = 200 MHz
ResTIM Timer resolution - 16/32 bit
Maximum possible count 65536 ×
tMAX_COUNT - - tTIMxCLK
with 32-bit counter 65536
1. TIMx is used as a general term to refer to the TIM1 to TIM17 timers.
2. Guaranteed by design.
3. The maximum timer frequency on APB1 or APB2 is up to 200 MHz, by setting the TIMPRE bit in the
RCC_CFGR register, if APBx prescaler is 1 or 2 or 4, then TIMxCLK = rcc_hclk1, otherwise TIMxCLK = 4x
Frcc_pclkx_d2.
Standard-mode 2
Analog filter ON
8
DNF=0
Fast-mode
Analog filter OFF
I2CCLK 9
f(I2CCLK) DNF=1 MHz
frequency
Analog filter ON
17
DNF=0
Fast-mode Plus
Analog filter OFF
16
DNF=1
The SDA and SCL I/O requirements are met with the following restrictions:
• The SDA and SCL I/O pins are not “true” open-drain. When configured as open-drain,
the PMOS connected between the I/O pin and VDD is disabled, but is still present.
• The 20 mA output drive requirement in Fast-mode Plus is not supported. This limits the
maximum load Cload supported in Fm+, which is given by these formulas:
tr(SDA/SCL)=0.8473xRpxCload
Rp(min)= (VDD-VOL(max))/IOL(max)
Where Rp is the I2C lines pull-up. Refer to Section 6.3.15: I/O port characteristics for the
I2C I/Os characteristics.
All I2C SDA and SCL I/Os embed an analog filter. Refer to Table 101 for the analog filter
characteristics:
Master mode
90
1.62 V≤VDD≤3.6 V
Master mode
2.7 V≤VDD≤3.6 V 133
SPI1,2,3
Master mode
2.7 V≤VDD≤3.6 V 100
SPI4,5,6
Slave receiver mode
fSCK 1.62 V≤VDD≤3.6 V 150
SPI clock frequency - - MHz
1/tc(SCK) SPI1,2,3
Slave receiver mode
1.62 V≤VDD≤3.6 V 100
SPI4,5,6
Slave mode transmitter/full
duplex 31
2.7 V≤VDD≤3.6 V
Slave mode transmitter/full
duplex 25
1.62 V≤VDD≤3.6 V
tsu(NSS) NSS setup time 2 - -
Slave mode
th(NSS) NSS hold time 1 - -
ns
tw(SCKH),
SCK high and low time Master mode TPLCK - 2 TPLCK TPLCK + 2
tw(SCKL)
NSS input
tc(SCK) th(NSS)
CPOL=0
CPHA=0
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tf(SCK) tdis(SO)
MISO output First bit OUT Next bits OUT Last bit OUT
th(SI)
tsu(SI)
MSv41658V1
Figure 48. SPI timing diagram - slave mode and CPHA = 1(1)
NSS input
tc(SCK)
CPOL=0
CPHA=1
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tr(SCK) tdis(SO)
MISO output First bit OUT Next bits OUT Last bit OUT
tsu(SI) th(SI)
MSv41659V1
High
NSS input
tc(SCK)
SCK Output
CPHA= 0
CPOL=0
CPHA= 0
CPOL=1
SCK Output
CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(SCKH) tr(SCK)
tsu(MI) tw(SCKL) tf(SCK)
MISO
INP UT MSB IN BIT6 IN LSB IN
th(MI)
MOSI
MSB OUT B I T1 OUT LSB OUT
OUTPUT
tv(MO) th(MO)
ai14136c
1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
SAI characteristics
Unless otherwise specified, the parameters given in Table 104 for SAI are derived from tests
performed under the ambient temperature, fPCLKx frequency and VDD supply voltage
conditions summarized in Table 23: General operating conditions, with the following
configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load C=30 pF
• Measurement points are performed at CMOS levels: 0.5VDD
Refer to Section 6.3.15: I/O port characteristics for more details on the input/output alternate
function characteristics (SCK,SD,WS).
SAI_SCK_X
th(FS)
SAI_FS_X
(output) tv(FS) tv(SD_MT) th(SD_MT)
SAI_SD_X
Slot n Slot n+2
(transmit)
tsu(SD_MR) th(SD_MR)
SAI_SD_X Slot n
(receive)
MS32771V1
SAI_SCK_X
tw(CKH_X) tw(CKL_X) th(FS)
SAI_FS_X
(input) tsu(FS) tv(SD_ST) th(SD_ST)
SAI_SD_X
Slot n Slot n+2
(transmit)
tsu(SD_SR) th(SD_SR)
SAI_SD_X Slot n
(receive)
MS32772V1
MDIO characteristics
The MDIO controller is mapped on APB2 domain. The frequency of the APB bus should at
least 1.5 times the MDC frequency: FPCLK2 ≥ 1.5 * FMDC.
td(MDIO)
tsu(MDIO) th(MDIO)
MSv40460V1
Clock
tvf(OUT) thr(OUT) tvr(OUT) thf(OUT)
Data output D0 D1 D2 D3 D4 D5
Data input D0 D1 D2 D3 D4 D5
MSv36879V1
Clock
tSC tHC
Control In
(ULPI_DIR,
ULPI_NXT) tSD tHD
data In
(8-bit)
tDC tDC
Control out
(ULPI_STP)
tDD
data out
(8-bit)
ai17361c
Ethernet characteristics
Unless otherwise specified, the parameters given in Table 110, Table 111 and Table 112 for
SMI, RMII and MII are derived from tests performed under the ambient temperature,
frcc_c_ck frequency summarized in Table 23: General operating conditions, with the following
configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load C = 20 pF
• Measurement points are done at CMOS levels: 0.5VDD.
Refer to Section 6.3.15: I/O port characteristics for more details on the input/output
characteristics.
Table 110 gives the list of Ethernet MAC signals for the SMI and Figure 59 shows the
corresponding timing diagram.
ETH_MDC
td(MDIO)
ETH_MDIO(O)
tsu(MDIO) th(MDIO)
ETH_MDIO(I)
MS31384V1
Table 111 gives the list of Ethernet MAC signals for the RMII and Figure 60 shows the
corresponding timing diagram.
RMII_REF_CLK
td(TXEN)
td(TXD)
RMII_TX_EN
RMII_TXD[1:0]
tsu(RXD) tih(RXD)
tsu(CRS) tih(CRS)
RMII_RXD[1:0]
RMII_CRS_DV
ai15667b
Table 112 gives the list of Ethernet MAC signals for MII and Figure 61 shows the
corresponding timing diagram.
MII_RX_CLK
tsu(RXD) tih(RXD)
tsu(ER) tih(ER)
tsu(DV) tih(DV)
MII_RXD[3:0]
MII_RX_DV
MII_RX_ER
MII_TX_CLK
td(TXEN)
td(TXD)
MII_TX_EN
MII_TXD[3:0]
ai15668b
TCK clock
frequency
1/tc(TCK) 1.62 V <VDD< 3.6 V - - 27.5
TMS input
tisu(TMS) - 2 - -
setup time
TMS input
tih(TMS) - 1 - -
hold time
MHz
TDI input
tisu(TDI) - 1.5 - -
setup time
TDI input
tih(TDI) - 1 - -
hold time
TDO output
toh(TDO) - 7 - -
hold time
SWDIO input
tisu(SWDIO) - 2.5 - -
setup time
SWDIO input MHz
tih(SWDIO) - 1 - -
hold time
SWDIO
toh(SWDIO) output hold - 8 - -
time
TCK
tsu(TMS/TDI) th(TMS/TDI)
tw(TCKL) tw(TCKH)
TDI/TMS
tov(TDO) toh(TDO)
TDO
MSv40458V1
SWCLK
tov(SWDIO) toh(SWDIO)
SWDIO
(transmit)
MSv40459V1
7 Package information
SEATING PLANE
C
0.25 mm
A2
A
A1
c
GAUGE PLANE
ccc C
A1
K
L
D1
L1
D3
75 51
76 50
b
E1
E3
100 26
PIN 1 1 25
IDENTIFICATION
e 1L_ME_V5
A - - 1.600 - - 0.0630
A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.170 0.220 0.270 0.0067 0.0087 0.0106
c 0.090 - 0.200 0.0035 - 0.0079
D 15.800 16.000 16.200 0.6220 0.6299 0.6378
D1 13.800 14.000 14.200 0.5433 0.5512 0.5591
D3 - 12.000 - - 0.4724 -
E 15.800 16.000 16.200 0.6220 0.6299 0.6378
E1 13.800 14.000 14.200 0.5433 0.5512 0.5591
E3 - 12.000 - - 0.4724 -
e - 0.500 - - 0.0197 -
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - 1.000 - - 0.0394 -
k 0.0° 3.5° 7.0° 0.0° 3.5° 7.0°
ccc - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
76 50
0.5
0.3
16.7 14.3
100 26
1.2
1 25
12.3
16.7
ai14906c
Product identification(1)
ES32H743VIT6
R Revision code
Date code
Y WW
Pin 1
indentifier
MSv46104V1
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
ddd C
SEATING
PLANE
A1
A
A2
A1 ball
index
B
D1 A1 ball area
identifier
e D
F
A
B
C
G
D
E
E1
E
F
G
e
H A
J
K
10 9 8 7 6 5 4 3 2 1
eee C A B
fff C
A08Q_ME_V1
A - - 1.100 - - 0.0433
A1 0.150 - - 0.0059 - -
A2 - 0.760 - - 0.0299 -
b 0.350 0.400 0.450 0.0138 0.0157 0.0177
Dpad
Dsm
Table 117. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8
Dpad 0.400 mm
0.470 mm typ (depends on the soldermask
Dsm
registration tolerance)
Stencil opening 0.400 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.120 mm
Product
identification(1)
VHI6
R
Date code
Ball
A1identifier
Y WW
MSv46178V1
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
A1
A2
c
0.25 mm
ccc C GAUGE PLANE
A1
D
L
K
D1
L1
D3
108 73
109
72
b
E1
E3
37
144
PIN 1 1 36
IDENTIFICATION
e
1A_ME_V4
A - - 1.600 - - 0.0630
A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.170 0.220 0.270 0.0067 0.0087 0.0106
c 0.090 - 0.200 0.0035 - 0.0079
D 21.800 22.000 22.200 0.8583 0.8661 0.8740
D1 19.800 20.000 20.200 0.7795 0.7874 0.7953
D3 - 17.500 - - 0.6890 -
E 21.800 22.000 22.200 0.8583 0.8661 0.8740
E1 19.800 20.000 20.200 0.7795 0.7874 0.7953
E3 - 17.500 - - 0.6890 -
e - 0.500 - - 0.0197 -
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - 1.000 - - 0.0394 -
k 0° 3.5° 7° 0° 3.5° 7°
ccc - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
1.35
108 73
109 0.35 72
0.5
19.9 17.85
22.6
144 37
1 36
19.9
22.6
ai14905e
Revision code
Product identification(1) R
ES32H743ZIT6
Date code
Y WW
Pin 1 identifier
MSv46106V1
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
A
F
D1 D
e
Y
N
13 1
Table 119. UFBGA169 - 169-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball
grid array package mechanical data
millimeters inches(1)
Symbol
Min. Typ. Max. Min. Typ. Max.
Table 119. UFBGA169 - 169-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball
grid array package mechanical data (continued)
millimeters inches(1)
Symbol
Min. Typ. Max. Min. Typ. Max.
C Seating plane
A
c
A1
A2
0.25 mm
gauge plane
k
A1
L
HD L1
PIN 1 D
IDENTIFICATION
ZE
E
HE
ZD
b
1T_ME_V2
A - - 1.600 - - 0.0630
A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 - 1.450 0.0531 - 0.0571
b 0.170 - 0.270 0.0067 - 0.0106
c 0.090 - 0.200 0.0035 - 0.0079
D 23.900 - 24.100 0.9409 - 0.9488
HD 25.900 - 26.100 1.0197 - 1.0276
ZD - 1.250 - - 0.0492 -
E 23.900 - 24.100 0.9409 - 0.9488
HE 25.900 - 26.100 1.0197 - 1.0276
ZE - 1.250 - - 0.0492 -
e - 0.500 - - 0.0197 -
(2)
L 0.450 - 0.750 0.0177 - 0.0295
L1 - 1.000 - - 0.0394 -
k 0° - 7° 0° - 7°
ccc - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. L dimension is measured at gauge plane at 0.25 mm above the seating plane.
1.2
176 133
1 0.5 132
0.3
26.7
21.8
44 89
45 88
1.2
21.8
26.7
1T_FP_V1
Product identification(1)
ES32H743IIT6
Date code
Revision code Y WW
R
Pin 1identifier
MSv46108V1
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
SEATING
PLANE
C A2
A
A1
c
ccc C
0.25 mm
GAUGE PLANE
A1
K
L
D L1
D1
D3
156 105
157 104
b
E1
E3
208
53
PIN 1
IDENTIFICATION 1 52
e
UH_ME_V2
A - - 1.600 - - 0.0630
A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.170 0.220 0.270 0.0067 0.0087 0.0106
c 0.090 - 0.200 0.0035 - 0.0079
D 29.800 30.000 30.200 1.1811 1.1732 1.1890
D1 27.800 28.000 28.200 1.1024 1.0945 1.1102
D3 - 25.500 - - 1.0039 -
E 29.800 30.000 30.200 1.1811 1.1732 1.1890
E1 27.800 28.000 28.200 1.1024 1.0945 1.1102
E3 - 25.500 - - 1.0039 -
e - 0.500 - - 0.0197 -
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - 1.000 - - 0.0394 -
k 0° 3.5° 7° 0° 3.5° 7°
ccc - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
1 0.5
156
1.25
0.3
28.3
30.7
52 105
53 104 1.2
25.8
30.7
UH_FP_V2
Revision code
Product identification(1) R
ES32H743BIT6
Date code
Y WW
Pin 1 identifier
MSv46110V1
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
A
A3 A2 b A1
A1 ball A
A1 ball index E
identifier area
E1
e Z
A
Z
D1 D
e
B
R
15 1
Øb (176 + 25 balls)
BOTTOM VIEW Ø eee M C A B
TOP VIEW
Ø fff M C
A0E7_ME_V8
A - - 0.600 - - 0.0236
A1 - - 0.110 - - 0.0043
A2 - 0.130 - - 0.0051 -
A3 - 0.450 - - 0.0177 -
A4 - 0.320 - - 0.0126 -
b 0.240 0.290 0.340 0.0094 0.0114 0.0134
D 9.850 10.000 10.150 0.3878 0.3937 0.3996
D1 - 9.100 - - 0.3583 -
E 9.850 10.000 10.150 0.3878 0.3937 0.3996
E1 - 9.100 - - 0.3583 -
e - 0.650 - - 0.0256 -
Z - 0.450 - - 0.0177 -
ddd - - 0.080 - - 0.0031
Figure 81. UFBGA176+25 - 201-ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball
grid array package recommended footprint
Dpad
Dsm
A0E7_FP_V1
Table 123. UFBGA 176+25 recommended PCB design rules (0.65 mm pitch BGA)
Dimension Recommended values
Pitch 0.65 mm
Dpad 0.300 mm
0.400 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Stencil opening 0.300 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.100 mm
Revision code
R
Product identification(1)
ES32H743II
Date code
Ball
A1identifier
Y WW
MSv46112V1
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
Figure 83. TFBGA240+25 - 265 pin, 14x14 mm, 0.8 mm pitch, fine pitch ball grid array
package outline
ddd C
SEATING
PLANE
C
A2
A1
A
D1 A1 ball identifier D
e
A
E
E1
S
17 1
F
b (240 + 25 balls)
BOTTOM VIEW TOP VIEW
A07U_ME_V1
Table 124. TFBGA240+25 - 265 pin, 14x14 mm, 0.8 mm pitch, fine pitch ball grid array
mechanical data
millimeters inches(1)
Symbol
Min Typ Max Min Typ Max
A - - 1.100 - - 0.0433
A1 0.150 - - 0.0059 - -
A2 - 0.760 - - 0.0299 -
b 0.350 0.400 0.450 0.0138 0.0157 0.0177
D 13.850 14.000 14.150 0.5453 0.5512 0.5571
D1 - 12.800 - - 0.5039 -
E 13.850 14.000 14.150 0.5453 0.5512 0.5571
E1 - 12.800 - - 0.5039 -
e - 0.800 - - 0.0315 -
F - 0.600 - - 0.0236 -
G - 0.600 - - 0.0236 -
ddd - - 0.100 - - 0.0039
eee - - 0.150 - - 0.0059
fff - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Dpad
Dsm
A07U_FP_V2
Table 125. TFBGA240+25, 265 pin recommended PCB design rules (0.8 mm pitch)
Dimension Recommended values
Pitch 0.8 mm
Dpad 0.325 mm
0.425 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Stencil opening 0.250 mm
Stencil thickness 0.100 mm
Product
identification(1)
R
Date code
Ball
A1identifier Y WW
MSv46114V1
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
8 Ordering information
Table 127. STM32H743xI ordering information scheme
Example: STM32 H 743 V I T 6 TR
Device family
STM32 = Arm-based 32-bit microcontroller
Product type
H = High performance
Device subfamily
743 = STM32H7x3 line
Pin count
V = 100 pins
Z = 144 pins
A = 169 pins
I = 176 pins/balls
B = 208 pins
X = 240 balls
Package
T = LQFP
K = UFBGA pitch 0.65 mm
I = UFBGA pitch 0.5 mm
H = TFBGA
Temperature range
6 = Industrial temperature range, –40 to 85 °C
Packing
TR = tape and reel
No character = tray or tube
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.
9 Revision history
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.