Professional Documents
Culture Documents
FEATURES MBF
●Rating to 1000V PRV .071(1.8)
.055(1.4)
●Ideal for printed circuit board
C0.5
●Reliable low cost construction utilizing
.260(6.6)
.276(7.0)
molded plastic technique results in inexpensive product
- +
.157(4.0)
.142(3.6)
●Lead tin plated copper
.027(0.7)
.043(1.1)
~ ~
MECHANICAL DATA
.030(0.75) .014(.35)
●Polarity:Symbol molded on body .018(0.45) .006(.15)
.106(2.7)
●Mounting position :Any
.09(2.3)
.197(5.0)
.181(4.6)
.063(1.6)
.047(1.2) .008(0.2)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS SYMBOL MB05F MB1F MB2F MB4F MB6F MB8F MB10F UNIT
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward
I(AV) 0.8 A
Rectified Current (Note 1) @T A=40 ℃
Peak Forward Surge Current
8.3ms Single Half Sine-Wave IFSM 30 A
Super Imposed on Rated Load(JEDEC Method)
Peak Forward Voltage at 0.8A DC VF 1.1 V
Maximum DC Reverse Current @T J=25℃ 5.0
IR μA
at Rated DC Bolcking Voltage @T J=125℃ 500
Typical Junction Capacitance Per Element (Note2) CJ 15 pF
Typical Thermal Resistance (Note3) RθJC 75 ℃/W
Operating Temperature Range TJ -55 to +150 ℃
Storage Temperature Range TSTG -55 to +150 ℃
0.8
30
AMPERES
0.6
AMPERES
20
0.4
TJ=125°C
10
1.0
1.0
0.1
TJ=25°C
0.1
TJ=25°C
PULSE WIDTH:300us
2% DUTY CYCLE
0.01
0 20 40 60 80 100 120 140 0.01
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) INSTANTANEOUS FORWARD VOLTAGE,VOLTS
100
CAPACITANCE(PF)
10
TJ=25°C,f=1MHZ
1.0
1 100
4 10
REVERSE VOLTAGE, VOLTS
3M-A