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X00602MA STMicroelectronics
X00602MA STMicroelectronics
MAIN FEATURES: A
G
IT(RMS) 0.8 A
K
VDRM/VRRM 600 V
IGT 200 µA
DESCRIPTION
Thanks to highly sensitive triggering levels, the
X006 SCR series is suitable for all applications
where the available gate current is limited, such as
ground fault circuit interrupters, overvoltage KG
A
crowbar protection in low power supplies,
TO-92
capacitive ignition circuits, ...
MIN. 15 µA
IGT
VD = 12 V RL = 140 Ω MAX. 200 µA
VGT MAX. 0.8 V
VGD VD = VDRM RL = 3.3 kΩ RGK = 1 kΩ Tj = 125°C MIN. 0.2 V
VRG IRG = 10 µA MIN. 5 V
IH IT = 50 mA RGK = 1 kΩ MAX. 5 mA
IL IG = 1 mA RGK = 1 kΩ MAX. 6 mA
dV/dt VD = 67 % VDRM RGK = 1 kΩ Tj = 125°C MIN. 25 V/µs
VTM ITM = 1 A tp = 380 µs Tj = 25°C MAX. 1.35 V
Vt0 Threshold voltage Tj = 125°C MAX. 0.85 V
Rd Dynamic resistance Tj = 125°C MAX. 245 mΩ
IDRM Tj = 25°C MAX. 1 µA
VDRM = VRRM RGK = 1 kΩ
IRRM Tj = 125°C 100
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth(j-l) Junction to lead (DC) 70 °C/W
Rth(j-a) Junction to ambient (DC) 150 °C/W
PRODUCT SELECTOR
ORDERING INFORMATION
SENSITIVITY:
02: 200µA
OTHER INFORMATION
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X00602MA
Fig. 1: Maximum average power dissipation Fig. 2-1: Average and D.C. on-state current
versus average on-state current. versus lead temperature.
P(W) IT(av)(A)
0.65 1.1
D.C.
0.60 α = 180° 1.0
0.55 0.9
0.50
0.45 0.8
0.40 0.7
0.35 0.6 α = 180°
0.30 0.5
0.25 0.4
0.20 360° 0.3
0.15
0.10 0.2
0.05 IT(av)(A) α 0.1 Tlead(°C)
0.00 0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125
Fig. 2-2: Average and D.C. on-state current Fig. 3: Relative variation of thermal impedance
versus ambient temperature (device mounted on junction to ambient versus pulse duration.
FR4 with recommended pad layout).
IT(av)(A) K = [Zth(j-a)/Rth(j-a)]
1.0 1.00
0.9
0.8 D.C.
0.7
0.6 α = 180°
0.5 0.10
0.4
0.3
0.2
0.1 Tamb(°C) tp(s)
0.0 0.01
0 25 50 75 100 125 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
Fig. 4: Relative variation of gate trigger current, Fig. 5: Relative variation of holding current
holding current and latching current versus versus gate-cathode resistance (typical values).
junction temperature.
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X00602MA
Fig. 6: Relative variation of dV/dt immunity Fig. 7: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical values). versus gate-cathode capacitance (typical
values).
dV/dt[Rgk]/dV/dt[Rgk=1kΩ] dV/dt[Cgk]/dV/dt[Rgk=1kΩ]
1E+2 20
1E+1 10
5
1E+0
1E-1 2
Rgk(kΩ) Cgk(nF)
1E-2 1
1E-2 1E-1 1E+0 1E+1 1 2 5 10
Fig. 8: Surge peak on-state current versus Fig. 9: Non-repetitive surge peak on-state
number of cycles. current for a sinusoidal pulse with width
tp < 10 ms, and corresponding value of I²t.
ITM(A)
1E+1
Tj max.:
Vto = 0.85V
Rd = 245mΩ
1E+0
Tj = Tjmax.
Tj = 25°C
1E-1
VTM(V)
1E-2
0.5 1.0 1.5 2.0 2.5 3.0 3.5
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X00602MA
DIMENSIONS
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
http://www.st.com
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