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52 Layer PCB Board Flash Gold + Hard Gold Manufacturing

Layer :52 Layer Multi-layer PCB

Material TU-872 SKK Board

Thickness :6.2mm

Size : 440*440mm

Pitch :0.8mm

Board Aspect Ratio:25:1,

VIA DISPOSAL: Non-conductive epoxy filled

Surface Treatment : Flash Gold+Hard Gold

Board Warpage: 0.3% ( Board surface flatness<8mil )

52 layer PCB board

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Table of Contents

Introduction

High density interconnect (HDI) PCBs with layer counts greater than 20 are

increasingly being used in advanced electronics designs to pack more

functionality into smaller form factors. 52 layer PCBs represent

leading-edge technology, enabling complex routing in tight spaces not

possible with conventional boards.

This article provides an overview of the special manufacturing

considerations for fabricating 52 layer boards, with a focus on the

importance of flash gold and hard gold plating finishes to ensure solder

joint reliability. We also outline key factors in partnering with a capable

PCB manufacturer able to reliably produce these dense, advanced boards

cost-effectively in lower quantities.

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Drivers for 52 Layer HDI Technology

Here are some of the key reasons why electronics products utilize 52 layer

PCBs:

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 Accommodate I/O-intensive complex devices like FPGAs, ASICs,

GPUs

 Enable length and impedance matching for multi-gigabit interfaces

 Tightly integrate various functional blocks within strict height limits

 Avoid connector interfaces by routing multilayer daughtercards

onto mainboard

 Maximize PCB real estate utilization via dense HDI routing

 Reduce layer counts versus >100 layer builds using lamination

stacking

 Lower costs by eliminating packaging interfacing PCBs

With 52+ layers, electrical engineers can break free from routing

congestion limitations and optimize board layout for electrical

performance, thermal dissipation, manufacturing yields and system

miniaturization.

Key Technology Elements of 52 Layer PCBs

Building reliable 52 layer HDI boards requires mastery of various

advanced PCB fabrication and plating processes:

Fine Line Capabilities

 Tolerances to reliably etch 5/5 mil line/space on external layers

 3/3 mil line/space etching on select inner layers

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 Tighter impedance control using thinner copper traces

High Aspect Ratio Plating

 Semi-additive process (SAP) to plate high aspect ratio through-holes

 Ensuring uniform plating of via barrels with >10:1 depth to diameter

ratio

Microvias

 Laser drilling to reliably create 0.10 to 0.15mm microvias

 Forming connections between layers using

staggered microvia stacks

Registration Accuracy

 Tight layer-to-layer alignment of +/- 0.025mm or better

 Accumulation of registration error across 50+ layers

Lamination

 Balancing pressures to bond large panel sizes with up to 50 foil

layers

 Eliminating air pockets while curing sheets at up to 200°C

By leveraging advanced processes, 52+ layer count boards with high

interconnect densities between layers can be manufactured.

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Importance of Flash Gold and Hard Gold Plating

A key process step vital for solder joint reliability of high layer count

boards is surface finishing using flash gold over hard gold plating:

Flash Gold

 25 to 50 microinches thick gold deposit over nickel barrier

 Protects nickel from oxidation during storage and assembly

 Provides excellent solderability for component terminations

Hard Gold

 Underlying 1 to 2 microns thick gold directly over copper

 Prevents copper traces from leaching into tin solder over long usage

 Maintains conductive continuity of traces during thermal cycles

Solder Joint Reliability

 Flash gold dissolves rapidly into molten solder, enabling strong IMC

bonding

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 Hard gold layer prevents brittle intermetallics between copper and

tin-based solders

 Reduces risks of opens, intermittent contacts under thermal cycling

Gold layers cost more but are vital for solderability, oxidation resistance

and long-term robustness needed in high-reliability, longer lifetime

electronics.

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Partnering with an Expert 52 Layer PCB Manufacturer

Building dense, thinner 52 layer boards requires know-how, precision

process execution and quality focus within the PCB factory. Key

capabilities in a manufacturing partner include:

Technical Expertise

 Extensive experience manufacturing 20+ layer count boards reliably

 Fine line PCB technology down to 3/3 mil etching

 Excellent registration accuracy of +/- 0.025mm or better

 Smooth lamination using optimized pressures for layer count

Quality

 Process control focus on plating thickness uniformity

 Microsectioning and metallography analysis skills

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 Cross-sectioning vias to validate hole wall plating quality

 Attention to electroless nickel thickness under gold

Testing

 Specialized bare board electrical testing for shorts between dense

circuitry

 Microsectioning boards from initial runs to verify plating quality

 Coupon testing for solderability per IPC J-STD-003

Precautions

 Shielding boards from scratches during handling with 52+ layers

 Protection of thin traces from nickel corrosion if flash gold omitted

 Eliminating moisture absorption and preventing delamination

Cost Optimization

 Maximum panel utilization to batch small run quantitues

 Value engineering for cost reduction where possible

 Tight process controls to maximize yields on low volumes

Partnering with manufacturers that have a demonstrated track record

building and delivering complex, high layer count boards provides

assurance that the first articles will meet design expectations.

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Key Specification Considerations

Here are some key specifications to review with prospective PCB

manufacturers when planning 52+ layer HDI boards:

Parameter Considerations
Board Thickness Target thickness with layer count, dielectric materials used
Number of Layers 52-60+ active signal layers are typical range
Line Width/Space 5/5 mil on outer layers, 3/3 mil on selected inner layers
Aspect Ratio 10:1 depth:diameter ratio needs plating process finesse
Hole Size ~0.15mm range including annular ring
Microvia Technology Staggered laser drilled blind and buried vias
Dielectric Resin system selection e.g. BT, epoxy, polyimide
Materials
Registration +/- 0.025mm tolerance ideal on >50 layer builds
Surface Finishes Electroless Ni/Immersion Au or HASL, important for soldering
Solder Mask Type LPI preferred for small openings/registration accuracy
Testing Use bare board electrical tester able to detect shorts
Inspection Microsectioning of plated holes to check plating distribution
Impedance Control Matching differential pair impedances vital for high-speed
Plating Options Flash gold over hard gold recommended

Rigorously reviewing capabilities against above parameters ensures

manufacturer can satisfy design requirements.

Factors that Impact 52 Layer PCB Cost

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Here are key considerations impacting the cost of advanced 52+ layer HDI

PCBs:

 Small quantities – High setup costs for low volume prototype builds

 Panel utilization – Balancing board sizes to maximize use of panel

area

 Board thickness – More layers and thinner dielectrics increase

material costs

 Registration – Tighter tolerances require precision lamination rigs

 Microvias – High density microvia drilling tied to quantity of holes

 Plating – Thick gold over entire surface is more expensive

 Handling – Careful handling required to avoid scratches and

contamination

 Testing – Investment in test fixtures to probe high-density boards

 Rework – Lower yields increase cost; rework opportunities limited

 Lead time – Advanced planning enables cost optimization

While significant effort is required for reliability, the approach balances

performance with cost manageability.

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Assembly Considerations

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Here are some key considerations when assembling populated boards

using 52+ layer PCBs:

 Allow slightly thicker solder stencil apertures for adequate paste

volume on fine pitch ICs

 Use adhesive on components susceptible to tombstoning e.g. larger

connectors

 Optical inspection of solder paste print quality before component

placement

 Ensure sufficient preheat ramp rate for even heating of larger

boards

 Characterize optimal reflow profile considering layers; adjust

convection reflow

 Limit rapid cooling after reflow to avoid thermally induced stresses

 Thoroughly clean any trapped flux residues under components post

soldering

 Conduct shock/vibration testing for mechanically reliable solder

joints

With careful assembly process optimization, reliable soldering and

inspection can be achieved.

Conclusion

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Advanced 52 layer PCB designs enable packing of high component

densities and routing complex signals between layers. Producing these

leading-edge boards cost-effectively requires know-how in fabrication

using fine line technology, laser microvias, thin dielectrics, and high aspect

ratio plating across 50+ layers with tight registration tolerances.

Flash gold over hard gold plating is highly recommended for solder joint

integrity. Partnering with expert manufacturers skilled in leveraging

automated processes for scale is key while applying stringent process

controls on lower volume complex PCBs.

With attention to design, materials, special processes, testing and

handling precautions, 52+ layer HDI boards can deliver powerful

functionality within tight form factor constraints across long product life

cycles.

Frequently Asked Questions

Q: Why are 52 layer boards preferred over boards with 100+ layers?

Stacking 52-60 layers achieves routing density goals while avoiding

reliability and cost issues with boards having 100+ layers. Key issues with

100+ layer designs include high thermal stresses, potential for plating

folds in ultra-thin dielectrics, limited fabricator expertise and exponential

costs.

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Q: What drives the need for increasing PCB layer counts?

Key drivers for higher layer counts are integrating more functionality into

constrained spaces, accommodating high I/O device pinouts, enabling 3D

stair-step routing, and avoiding connectors between boards through

vertical system-in-package integration.

Q: What insulating dielectric materials are commonly used?

Common dielectric materials for high layer count boards include FR-4,

polyimides, bismaleimides (BT), Isola, ceramics and liquid crystal polymers.

Material selection balances cost, performance and manufacturability.

Q: How does the cost scale with layer count increases?

As layer counts increase, raw materials and processes involving handling,

preparation, lamination, drilling and plating become exponentially more

expensive due to higher precision requirements and yields. Testing costs

also rise significantly.

Q: What design guidelines help maximize manufacturability?

Key guidelines aiding manufacturability include maximum utilization of

panel area, maintaining symmetry of metal and dielectric thickness across

layers, allowing adequate annular rings on microvias, minimizing high

aspect ratio plating, and applying finish over all exposed copper.

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