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What are the low CTE materials for

PCB?
Printed circuit boards (PCBs) designed for high reliability applications must
maintain integrity of interconnects and mechanical stability across extremes of
operating temperatures as well as thermal cycling conditions. Using base
materials with lower coefficient of thermal expansion becomes critical. Let’s
analyze suitable low CTE options.

Importance of Low CTE for PCBs

As operating temperatures rise or fall significantly beyond room levels most

solid materials expand or contract in size due to thermodynamic effects. This
gets quantified by the coefficient of thermal expansion (CTE) measured in
parts-per-million expansion per degree temperature change (ppm/°C).

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For PCB substrate materials, when CTE greatly differs between component
assembly materials vs PCB dielectric layers, shear stresses develop across
solder joints and interfaces leading to cracked joints, pad lifting, fractured vias
or even conductor delamination during thermal excursions.

Low CTE materials minimize such thermo-mechanical stresses keeping boards

and assemblies intact across demanding temperature environments without
compromising electrical connections or structural integrity even after years of
thermal cycling. This makes them vital for product durability and longevity.

Next let’s analyze some popular low expansion PCB materials.

Low CTE Dielectric Materials

Multiple material options for PCB fabrication exhibit low coefficient of thermal
expansion well below baseline FR4 laminates allowing maintain board
assembly reliability and layer adhesion across high temperature operation
extremes and cyclic temperature environments:

Polyimide (PI)

 CTE: X,Y axis — 8 to 10 ppm/°C

 Tg: 260°C

 TD Rating: 150°C

 Key Properties: Flexible films, low Z-axis expansion

PTFE Composites

 CTE: X,Y axis — 17 to 25 ppm/°C

 Tg: 130°C

 TD Rating: 150°C

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 Key Properties: Lowest dielectric losses, microwave circuits

Bismaleimide Triazine (BT)

 CTE: X,Y axis — 40 to 60 ppm/°C

 Tg: >350°C

 TD Rating: 180°C

 Key Properties: High Tg, moisture resistance

Ceramics

 CTE: X,Y axis — 4 to 7 ppm/°C

 Tg: N/A

 TD Rating: 500°C+

 Key Properties: Excellent thermal performance

Liquid Crystal Polymer (LCP)

 CTE: X,Y axis — 7 to 20 ppm/°C

 Tg: >280°C

 TD Rating: 240°C

 Key Properties: Lead-free assembly compatibility

Analyzing this representative data reveals certain material classes including

polyimides, PTFE composites, bismaleimides, ceramics and LCP polymers
reliably maintain low expansion similar to copper interconnects across
temperature ranges from well below freezing up to nearly 300°C for many
options.

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Now that we have covered dielectric choices let’s examine metal core layers.

Low CTE Metal Core Materials

While dielectric materials determine X-Y axis expansion, adding metal core
central planes further reduces net Z-axis thickness change by countering
dielectric movement with opposites CTE metals to maintain overall sandwich
stability. Popular selections include:

Invar’s exceptional CTE match with dielectrics permits large board sizes
without bending or bowing trouble during temperature fluctuations. Kovar and
copper-molybdenum alloys offer similar stiffening benefits.

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For specialized applications even diamond or ceramic inserts further enhance

thermal conductivity and dimensional stability across thermal shock extremes.

Now that we have covered suitable low expansion PCB materials both for
dielectric layers and metal core center planes, let’s analyze multi-material
constructions.

Low CTE Final Board Stackups

Careful pairing of selected low expansion dielectric layers reinforced with

controlled expansion metal cores allows configuring laminated stacks
optimized for managing CTE effects across expected operating conditions:

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This representative cross-section exemplifies how low expansion dielectrics

surround a thermally conductive controlled expansion metal core while adding
glass cloth layers reinforces board stiffness. Copper traces maintain reliable
connections throughout.

Through this composite approach, dimensional changes get minimized across

X, Y and Z axis as the entire assembly experiences temperature swings. Next
we will cover application considerations.

Low CTE PCB Application Analysis

Automotive Electronics

Low CTE materials give automotive underhood electronics the wide

temperature tolerance and thermal cycle durability to outlast engine or
powertrain service lifetimes spanning 15 years while resisting solder fatigue
and layer delamination up to 150°C heat soak under peak loads.

High Density Interconnects

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HDI designs minimizing interconnect lengths rely on low expansion dielectrics

like polyimides or liquid polymers paired with low CTE cores allowing high I/O
BGAs, QFNs, 0201 passives to retain pad connections across lead-free reflow
or operational extremes avoiding cracked joints.

High Frequency RF

Microwave systems leverage low loss tangent and mechanically stable low
expansion PTFE composites like Rogers laminates to maintain transmission
line impedance tolerances and layer registration across temperature
fluctuation prone avionics applications.

Downhole Petrochemical

Withstanding high pressures and temperatures exceeding 225°C for extended

durations applies low CTE ceramics like aluminum nitride having exceptional
dimensional stability necessary preventing electrical or physical degradation
despite years of uninterrupted operation.

This application sampling validates that low CTE printed circuit board
materials deliver vital survivability where unrelenting environments would
quickly compromise commodity boards and assemblies.

Now let’s cover some typical questions that arise on the topic of low thermal
expansion boards.

Frequently Asked Questions

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Q1. How low should the CTE be for a high reliability PCB?

For lifelong consistent reliability across thermal cycling spanning from -65°C
to 200°C peak swings, target below TCE 20 ppm/°C across XY axes. This
minimizes shear stresses and strains across interfaces allowing thousands of
uninterrupted thermal shock cycles year after year without degraded
performance.

Q2. Does low Dk match with low CTE?

Yes, low loss dielectric candidates like PTFE, polyimides, and liquid crystal
polymers renowned for microwave circuits and other high frequency
applications thankfully also maintain excellent dimensional stability with CTE
below 30 ppm/°C facilitating reliable constructions despite temperature
fluctuations.

Q3. Can you solder components onto non-glass low CTE

PCBs?
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Both polyimide and PTFE boards allow conventional Pb-free assembly. LCP
materials may need specialized chemical roughening. But non-glass low CTE
boards readily accept SMT passive parts, connectors and other attachments
using standard soldering processes.

Q4. What causes interlayer separation in multi-material low CTE

PCBs?

Excessive Z-axis expansion mismatch between bonded dielectric layers or core

separation can manifest when CTE matched material pairings outlined
previously get ignored during stackup design. Additionally poor lamination
bonding or inadequate resin flow exacerbate latent delamination risks upon
temperature cycling.

Q5. Why avoid continuous ribs for low CTE PCBs?

While copper ribs seem to allow larger board sizes without bowing,
uninterrupted top to bottom ribs can wick moisture internally. Under
temperature excursions, they pump-prime steam explosions cracking low CTE
laminates apart violently. Thus segmented ribs prove important for safety.

This FAQ reveals additional helpful insights on properly leveraging low

expansion boards for product longevity.

In summary, carefully engineered printed circuit board constructions utilizing

specifically low expansion dielectric materials reinforced with controlled
coefficient core layers enable electronics to endure punishing operational
temperatures safely. Keeping CTE matched and low preserves electrical,
mechanical and structural integrity necessary for high reliability products.
When thermomechanical resilience becomes vital, ensure low CTE PCBs form
the foundation of robust designs!

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