Hybrid Material PCB Circuit Board

RAYMING PCB & ASSEMBLY
Hybrid Material PCB Circuit Board
Telecom hybrid material PCB
Telecom hybrid material PCB Manufacturing
Layer count：4
Board thickness：1.6mm
Dimension：118*57.5mm
Raw material：PTFE+FR4
Copper thickness on the board surface：56um
Copper thickness in the hole barrel：25um
Min.line width/space：0.20mm Minimum hole diameter：0.25mm
Surface finishing：immersion gold≥1u”
Application：Communication[/get_pro1]
PCB Manufacturing & Assembly Services https://www.raypcb.com/

Rayming accept different kinds of hybride Pcb design: Rogers material +
Fr4, Taconic + Fr4, Fr4 + Aluminum, or other special design, Pls send
design file to sales@raypcb.com
Request Hybrid PCB Quote Now
Table of Contents
Hybrid Circuit: All You Should Know
Hybrid
PCB

Oftentimes, people always inquire about the hybrid circuit. This is because
of the growth in technology. The hybrid circuit becomes useful in the
production of electronic items. It is very crucial to understand how this
component works in technical tools as well as electronic equipment. The
question is mostly centred on the importance of the hybrid circuit. How
are hybrid circuit components beneficial?
This article aims to answer all questions surrounding the hybrid circuit.
More emphasis would center on the features of hybrid PCB. Also, you will
learn of the advantages of its components, and how you can apply the
hybrid circuit. These components are miniature and they are made
possible in technical tools through soldering.
With more advancement in technology, hybrid technology seems to be
becoming more in use in our electronic equipment. As you read through
this write-up, get ready to learn new and interesting facts about the hybrid
circuit. You have the right piece in your hands!
What Is a Hybrid Circuit?
It is very crucial to lay more emphasis on what the hybrid circuit is. This
part of this article focuses on what you need to know about a hybrid
circuit.

In today’s electronic equipment components, it is easier to install
this circuit. During the primeval years of the nascence of electronic
equipment, the technical components came with varying installation
processes. These components were basically planted or fixed on metal
boxes. These metal boxes were locked with screws and joined through
some cables.
In the contemporary age, these electronic elements are a handful and
hulking. They mostly dispel loads of power in the mode of the
thermoelectric devices. This is why there had to be a need for better
inventions. This led to the invention of transistors as well as other tiny
electronic elements. The latter is now referred to as printed circuits.
The hybrid circuit is a class of the printed circuit. This consists of miniature
element size of electronic equipment. This element gets attached to the
cushioning board through soldering. A hybrid kind of printed circuit
board (PCB) polygonal consists of a PCB that utilizes disparate kits. This is
with the objective of boosting electrical discharge.
Also, it is intended to ameliorate system accuracy aimed at colossal
periodicity RF applications. The huge confrontation one expresses
when producing this ilk of PCB is controlling the diverse quantity of caloric
enlargement (CTE) tract of the divergent orbit materials. This is not only
through PCB fabrication but also component throng.

It is highly important to note something when generating a PCB alongside
disparate gear. You must have enough training in the phenomenal
components of the foil and the potentiality of one’s apparatus. As a result
in the CTE worth of the loop of these substances, something happens.
Each substance develops at a varying degree during aerial heated
uncovering or lamination. This can be the reason for weighty registration
challenges as a material diminishes while another substance amplifies.
Also, this can result to the peeling of the copper to coating linking.
However, not every material can be a component of hybrid applications.
This is because not all are manufacturable despite the preferred or
wanted execution. Using one’s PCB fibber speedily during one’s design
technique may result in achieving unprecedented after-effects as one is
informed of the kinds of materials that can be best put together.
Over the past years, the expansion of the Very Large Scale Integration
circuits with the uninterrupted decrease in the magnitude of inert
elements like the capacitors has brought about some arrival or advent of
novel automation and innovations like the SMD. SMD makes it possible for
the decrease in mass of present-day electronic hardware. Thus, it helps
with an increase in operations as well as power utilization.
To further discuss the hybrid circuit, it is better to say that it is cushioning
equipment. This insulating component is a ceramic panel which makes it

possible for passive elements to get integrated via some photolithography
techniques. Above all, it makes use of specific inks. This makes it quite
diminutive.
The hybrid circuit is a kind of automation spotted between some printed
circuits alongside an integrated circuit. This technology gulps the surface
mount devices known as the SMD and every type of technology available.
Also, it liquidates glitches and reserves its additional benefits.
Initially, when the hybrid circuits just got introduced, their prices were
exorbitant. This made it possible for only big organizations
like aerospace to have access to it. Also, the military could bear the cost.
Although hybrid circuits are expensive in contemporary times, different
people from various walks of life can afford them. The price is cutthroat.
How Is The Hybrid Circuit Formed?
Earlier, we stated that this article contains information about the hybrid
circuit. It is paramount to know how the components are formed. The
hybrid circuit comes with a good ceramic composition. The support it gets
from this ceramic plate makes it absorb the right constituent of power.
The ceramic plate is the cursory backing of the hybrid circuit. This element
possesses solid mechanical insulation features with exceptional thermal
pressure or strength. This makes it apt for these kinds of operations.

The resistor gets consolidated into the exterior, with a certain or specific
resistive patch is installed on it through some photolithography method.
The resistive patch is comprised of extremely classy conductive alloy
molecules. These molecules could either be gold or silver. It is therefore
cemented together by some gum. This is contingent on its units of
molecules with the expansion and density of the hoof prints. One can get
some considerable size of resistance intrinsic worth without necessarily
making use of common values in vogue. So as to alter the resistivity value,
one can use a bar to put together a nice split on it. This will help to
vaporize the terminal alloy wire.
These fine-tunings enable the intrinsic worth from the resistance to get
larger. It does not necessarily have to decrease any resistance value.
During your design development, the resistor mostly comes with some
secondary resistance value. This is in relation to altering the resistance
value as the design progresses.
The electrical condensers are attached to some condensing shoal. They
are distinguished from one another through the cushioning adhesive that
encompasses silicon dioxide. For mass production, this approach may not
necessarily work out. This is the primary reason diverse elements or SMD
exterior stake are commonly in use.

The technical fragments are created from conductive ink consisting of gold
and platinum. Hybrid circuits could be referred to as unilateral circuits
owing to the premise that it is very difficult to make them work with
extremely classy ceramics. However, it is simple to manufacture some
“bridges” alongside multiple layers in the major design and production.
In recent times, the availability of quality circuits is no longer in denial.
That is why you can easily come across plain hybrid circuits. These plain
hybrid circuits are available in different electronic departments. They join
varying common applications which are mostly in demand by the general
people. These applications are not far from the
standard audio transmitters, receivers, as well as data.
It is noteworthy that there are receiver and transmitter components that
make it possible for the plotting and gathering of some electronic devices.
However, these components readily need some generated power to
effectively work the right way.
They are sometimes electrified by the battery when in orbit of about 12v
to 18v. The data conductor components are congenial with some TTL
rationale rankings or positions. However, the audio conductor can link up
with an LF converter to convert some microphone waves. These circuits
help many organizations to now effectively use technology thereby
minimizing space on PCB.

Request Hybride Circuit Quote Now
What Are The Advantages Of Hybrid Circuits?
Hybrid
Circuit
For the hybrid circuits, there offer many advantages. These merits are as
follow;
 The ultimate conduit value is figured out through design.
Interestingly, it can be regulated or altered by laser neatening.
 A number of contemporary composite circuit innovations among
which is the LTCC-substrate composite permits the implanting of
elements within the surfaces of a multidimensional coating
concerning elements positioned on the layer of the coating.

 Elements that seemingly cannot be added in an intractable IC can
be utilized. These include capacitors with huge value, wound
elements, gems, and inductors.
 The orbit developer is total autonomy as regards the option of
rheostat value in compact film technology.
 The creation and proportion of rheostat can be picked to deliver the
wanted values.
 Regulating before the ultimate test probably can be affected by
diligent laser embellishments.
 The constant use of the compact film aids the merit of its ingenuity.
What Is a Hybrid Integrated Circuit?
There is no doubt that people inquire about the hybrid integrated circuit.
It is to say that most people think that there are disparities between
a hybrid integrated circuit and an hybrid circuit. Let’s explain this in a
simple way.
This means that a hybrid circuit refers to one of the elements on a PCB –
Printed Circuit Board. This is in a similar manner with any monolithic
integrated circuit. However, distinct and striking differences exist between
all hybrid circuits and hybrid integrated circuits.

The notable disparity between the devices simply is seen in their structure
and production. The two devices have varying constructions as well as
installations. However, both are miniature in their sizes. The HIC is made
up of specific elements that include some semiconductor elements as well
as passive devices. The passive devices include the capacitors, inductors,
and transformers while the semiconductors are transistors and monolithic
ICS.
It is therefore perceived that any Printed Circuit Board that possesses
elements on some PWB cannot be taken to be a natural hybrid circuit. This
works well with this principle – MIL- PRF- 38534. The integrated circuit is in
relation to the monolithic IC.
The hybrid integrated circuit- This is a total electronic perimeter that is
fashioned around some padding knock off making use of the diversity of
applied technologies. The coating serves as a vehicle for the perimeter.
Thus, it possesses the associating hoofprints between the apparatus
engraved on it via polygonal techniques.
Other attributes of the hybrid integrated circuit are mentioned below. This
helps with more emphasis on the subject matter of HIC.
 The joined circuit can simply be restored but it seems difficult to
redesign whenever it flops.

 It multiplies the working speed owing to the shortage of freeloading
and capacitance performance.
 It possesses some flat power utilization as a result of its miniature
size.
 The joined circuit seems to be more dependable. This is owing to
how appropriate it is for minute luminous operation.
 The weight with the complete natural capacity of the entwined
circuits are overly minor than the one of the distinct circuit.
 The thermal reading disparity between the elements of a circuit is
minute.
Hybrid PCB
A hybrid printed circuit board utilizes different materials to build the
substrate core layers and also the dielectric layers. Rather than using one
material, the fabrication of hybrid PCB involves the use of different
materials. Different materials are used to combine all positives into the
manufacturing process of the PCB and reduce the negatives that a
particular material may feature.
The positives may include exceptional strength, better signal performance,
and a more stable dielectric constant. These negatives of these materials
may include poor heat transfer, poor coefficient of thermal expansion,
etc. The major goal of utilizing dissimilar materials in the production of

Hybrid PCB is to increase system reliability and improve electrical
performance.
Due to this manufacturing process, this type of PCB is used in
high-frequency Radio frequency applications. One of the greatest
challenges that come with producing this type of board is handling the
various CTE properties of the different circuit materials during
the component assembly and PCB production. `
The fabrication of Hybrid PCB involves the use of PTFE laminates and FR-4
material. When designing a hybrid PCB, it is very important to know the
appropriate materials used for it. The Polytetrafluoroetyhlene laminates
and FR-4 material help to condense RF functionality on the PCB and as
such, reducing the costs of the device.
Materials Utilized in the Fabrication of Hybrid PCBs
The fabrication of hybrid PCBs involves two major materials which are
PTFE and FR-4. The layers of these PCBs can also feature several laminates
in the same material like PTFE laminate filled with ceramic. The designer
will have to change some of the material’s formula in order to develop
different dissipation factors and dielectric constant rates to make the
materials useful in certain applications.
PTFE

PTFE material is a ceramic-filled plastics used for
fabricating high-frequency PCBs. Due to the dielectric constant of this
material, it is suitable for applications that require improved impedance
control and low signal loss. Polytetrafluoroetyhlene is a type of material
that is also utilized for applications that will be subjected to higher
temperatures since it offers great mechanical stability.
However, PTFE has its own disadvantages since it is a more expensive
option. It will also experience dimensional changes being the fact that it is
a softer material.
FR-4
FR-4 is a type of material commonly used in the fabrication of a printed
circuit board. This material which is also known as Flame Retardant 4
maintains a good standard in the PCB industry. It is mostly preferred
because of its low costs. This material features exceptional electrical
insulation and high dielectric strength. FR-4 is a material that can
withstand moisture and a varying temperature.
Due to the features of this material, it is useful in a variety of applications.
Although there are some downsides of this material, it is still a suitable
option. This material features properties that don’t make them suitable for
higher frequencies that are recently developed.

Polyimide
Polyimide is another type of material that can be used for the fabrication
of a hybrid circuit. This material features high chemical resistance which
enables them to withstand some chemicals. Asides this feature, polyimide
have great electrical properties and can be used in various applications.
Polyimide is a lightweight and flexible material that is ideal for portable
applications. However, polyimide is a less considered option since they are
more expensive than PTFE and FR-4.
Why are Different Materials Used for Designing Hybrid PCB?
One of the unique features of Hybrid printed circuit boards is the
dissimilar materials used in their manufacturing process. Dissimilar
materials are utilized for some reasons. The primary purpose of utilizing
different materials to fabricate multilayer boards is to reduce poor
structural and mechanical characteristics of some of the laminates.
When these laminates are combined, they complement each other by
reducing the negative properties of some materials and increasing the
strength of some properties. For instance, PTFE offers great electrical
properties but it can have issues with its structural properties when
exposed to certain temperatures.

Combining different materials also help to reduce the costs of fabrication;
hence it is a budget-friendly option. Most times PTFE and FR-4 are utilized
in designing hybrid PCBs. PTFE laminates are utilized for high-speed
functions while FR-4 offers enough advantages for low speed applications.
Furthermore, FR-4 materials can be utilized to balance the thickness
issues for the layers of these laminates.
Issues to Consider when Designing Hybrid PCBs
There are certain things that should be put into consideration when
designing a circuit board that features different materials. It is important
to understand that each material has different CTE values. The values
represent the level of dimensional changes each material will undergo
when exposed to varying temperatures.
This can result in registration issues as one laminate expands while
another shrinks. Therefore, it is important to note that some materials
shouldn’t be utilized in hybrid applications. Layer separation is an
important problem that must be solved when fabricating multilayered
hybrid PCBs. Delamination is another issue that can also happen. In this
case, the laminate layers begin to peel off.
To tackle the issue of delamination, knowing the period of delamination
for materials is very important. The stack-up process is another major

issue experienced when designing hybrid PCBs. Fabricators must have the
appropriate thickness for the circuit board for every piece and panel in
order to meet the required thickness without affecting the needed
frequencies. Depending on the type of materials utilized, the adhesive
system utilized for hybrid circuit board varies. The printed circuit board
will have the appropriate thickness if the right amount of insulation is
provided.
Not all companies have the experience or skill required to design hybrid
PCBs. PCB fabricators may work with certain materials. Furthermore, the
fabricator will have to understand certain issues that happen
while etching multilayer boards. Having a discussion with the fabricator
will help them understand what you want. They can also give suggestions
about the type of material that can be utilized.
When Should Hybrid PCB Stackup be used?

hybride rogers +
fr4 material
There are different factors that determine when to use hybrid PCBs. The
costs, the temperatures, the applications’ functions, and the frequencies
are some of these factors. One of the benefits of hybrid PCB stackups is
that it enables you to increase your creativity when fabricating the circuit
board that will have the mechanical and electrical properties needed.
Cost considerations are also very important when it comes to hybrid
designs. Since hybrid PCBs involve the use of dissimilar materials, you can
benefit from using a cheaper material in places that don’t need higher
frequencies. You can then use smaller amount of the expensive materials
for sections of the PCB that need greater electrical, thermal, and
mechanical properties.
Mechanical Features of a Hybrid PCB

During the fabrication of Hybrid PCB, some PCB designers desire some
unique mechanical features that may be complex to include. Some of the
features are
Odd shape board outlines
Most times, these laminates must fit into other space and there are times
when the printed circuit board features different turns and twists. For a
hybrid design, routing the outline of the PCB is a sensitive procedure. The
speeds and feeds must be reduced to ensure that the edges remain crisp.
It is also important to monitor your drill bits since the material is more
complex on drill bits. You should also be aware that most RF materials can
fray easily if they are not properly cut.
Plated through hole consistency
A fabricator must understand that hole preparation before plating for FR4
is different. The way these processes affect the quality of the hole wall
must be understood. For PTFE, you must use plasma etch process to
desmear the holes. This is not the ideal method for FR4 as it can result in
an uneven surface which will then lead to uneven copper in the holes.
Controlled depth rout process

Some of the mechanical features of hybrid PCBs result from utilizing
several lamination cycles while others are as a result of utilizing a
controlled depth routing patterns. However, these processes have their
own problems which can add complexity and cost to the PCB design.
A manufacturer must rout out the pattern in the prepreg and the
production pattern when utilizing several lamination cycles to build these
cavities.
What Are The Features Of Hybrid PCB?
This is also one of the most asked questions in relation to the hybrid
circuit. Noting a circuit’s features is very important. When you get to know
about its components, you understand perfectly how it is structured. Not
only do you understand its structure, but you also know how best it works.
A lot has been discussed about hybrid circuits.
The hybrid PCB is simply a multifaceted element. This PCB uses some
disparate components with the sole purpose of boosting electrical
performance. The PCB of the hybrid circuit is a small one. It is
an electronic circuit that has more than an ilk or class of elements.
Where Are Hybrid Circuits Used?

People would always want to find out more about the hybrid circuit. It is
crucial to know about the applications of hybrid circuits. We have
discussed extensively the components of this circuit. Let’s now consider
those areas where hybrid circuits can be utilized.
Hybrid circuits are components that are mostly used in every industry.
They are basically in use when mechanical components have to fit into
huge technical demands.
The applications vary from mechanism and movable power fragment to
security and soothing electronics. During severe ecological disorder under
the bonnet, one can categorically admit that only hybrids fit into the lofty
standard. One benefit with this particular circuit is that elements that
ordinarily cannot be added to a common monolithic IC can be included in
the hybrid circuit.
The hybrid circuit is present in many devices. The different classes of
circuits can also be seen in various electrical gears. All the electronic
devices or gadgets we all make use of daily have some elements revolving
around these circuits.
Appliances like laptops, phones, computers, refrigerators, televisions,
have these circuits present in them. There is no production of these

electrical devices that is possible without the circuits whether miniature or
huge in size.
The electrical circuits used in manufacturing these devices may be plain or
intricate components. These electrical circuits are conceived through
several electrical elements interlocked to each other. This attachment is
achieved alongside joining wires or conducting cables for the discharge of
mechanical current via the numerous constituents of the circuit.
More Information on Hybrid PCB
One may experience some challenges when producing the hybrid printed
circuit board. It requires that one becomes prepared for the production.
One of the main challenges producers encounter is in line with conducting
the divergent quantum of thermal extension (CTE) components of the
disparate circuit elements throughout PCB construction as well as a
component throng.
Traditionally, one should note that these schemes involve the blending of
some FR-4 components with PTFE laminates. This makes a fabricator
compress the pair of RF features on an equivalent PCB which can diminish
the track of the appliance as well as the charges.
Engaging one’s PCB designer beforehand in the layout process will enable
one to get the perfect after-effects. This is because the fabricators mostly

have a vast knowledge of materials that can be blended. It is perceived
that materials such as the Rogers 5880 are an extremely excellent RF
property used in towering dependable applications.
The most challenging issue with the component is in relation to how it gets
smaller. This is after someone carves the copper away. Therefore, your
designer has to know more about the tasks in the production. This will
help him or her to indemnify the big challenge. Hybrid microcircuits,
hybrid PCB, and microwave hybrid circuits all have challenges in relation
to any production. This is in no way to undermine their effectiveness.
What Is The Innovative Idea Behind The Hybrid Circuit?
The main purpose of inventing the hybrid circuit is to help develop our
electronic devices. This is because the circuit is a minute electronic circuit.
It also uses more than a pattern of elements. It mostly consists of
individual components and some passive materials. There have been
innovative and more developed hybrid circuits in the past years. This can
be seen in quantum computers and modern-day appliances. Without
doubt, the hybrid circuit plays a significant role in electronics industry.
Conclusion
It is the belief that this article is well detailed in respect to the hybrid
circuits and their components. The invention of the IC can be traced back

to 1959. This happened to be a great one, as it has done a lot for mankind.
Before its invention was the vacuum tube. After this, there was the
invention of the transistor. The transistor was to replace the once
preferred vacuum tubes.
A hybrid kind of printed circuit board (PCB) polygonal consists of a PCB
that utilizes disparate kits. This is with the objective of boosting electrical
discharge. With the development of the circuit, the electronic elements
used in production have also become advanced. No matter the size of
these circuits, it is crucial in manufacturing our everyday devices.
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4. Properties of the Panasonic MEGTRON4 R-5725 Circuit Board
Material
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RAYMING PCB & ASSEMBLY

Hybrid Material PCB Circuit Board

Telecom hybrid material PCB

Telecom hybrid material PCB Manufacturing

Copper thickness on the board surface：56um

Copper thickness in the hole barrel：25um

Min.line width/space：0.20mm Minimum hole diameter：0.25mm

Surface finishing：immersion gold≥1u”

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Rayming accept different kinds of hybride Pcb design: Rogers material +

design file to sales@raypcb.com

Request Hybrid PCB Quote Now

Hybrid Circuit: All You Should Know

PCB Manufacturing & Assembly Services https://www.raypcb.com/

of the growth in technology. The hybrid circuit becomes useful in the

production of electronic items. It is very crucial to understand how this

component works in technical tools as well as electronic equipment. The

question is mostly centred on the importance of the hybrid circuit. How

are hybrid circuit components beneficial?

possible in technical tools through soldering.

With more advancement in technology, hybrid technology seems to be

becoming more in use in our electronic equipment. As you read through

circuit. You have the right piece in your hands!

What Is a Hybrid Circuit?

PCB Manufacturing & Assembly Services https://www.raypcb.com/

In today’s electronic equipment components, it is easier to install

this circuit. During the primeval years of the nascence of electronic

equipment, the technical components came with varying installation

processes. These components were basically planted or fixed on metal

In the contemporary age, these electronic elements are a handful and

hulking. They mostly dispel loads of power in the mode of the

thermoelectric devices. This is why there had to be a need for better

inventions. This led to the invention of transistors as well as other tiny

electronic elements. The latter is now referred to as printed circuits.

element size of electronic equipment. This element gets attached to the

cushioning board through soldering. A hybrid kind of printed circuit

with the objective of boosting electrical discharge.

Also, it is intended to ameliorate system accuracy aimed at colossal

periodicity RF applications. The huge confrontation one expresses

through PCB fabrication but also component throng.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

It is highly important to note something when generating a PCB alongside

disparate gear. You must have enough training in the phenomenal

components of the foil and the potentiality of one’s apparatus. As a result

in the CTE worth of the loop of these substances, something happens.

Each substance develops at a varying degree during aerial heated

uncovering or lamination. This can be the reason for weighty registration

challenges as a material diminishes while another substance amplifies.

However, not every material can be a component of hybrid applications.

This is because not all are manufacturable despite the preferred or

technique may result in achieving unprecedented after-effects as one is

informed of the kinds of materials that can be best put together.

circuits with the uninterrupted decrease in the magnitude of inert

the decrease in mass of present-day electronic hardware. Thus, it helps

with an increase in operations as well as power utilization.

To further discuss the hybrid circuit, it is better to say that it is cushioning

equipment. This insulating component is a ceramic panel which makes it

PCB Manufacturing & Assembly Services https://www.raypcb.com/

possible for passive elements to get integrated via some photolithography

The hybrid circuit is a kind of automation spotted between some printed

circuits alongside an integrated circuit. This technology gulps the surface

Also, it liquidates glitches and reserves its additional benefits.

exorbitant. This made it possible for only big organizations

Although hybrid circuits are expensive in contemporary times, different