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What is PCB Water Temperature? A Closer Look


PCBs are an essential component in electronic applications, making

performance, reliability, and safety-critical factors to consider. To ensure

these aspects, engineers must comprehend how temperature impacts the

quality of their printed circuit board assembly during the development

phase, even before PCB creation begins.

PCB design comprises several components like holes, traces, solder masks,

layers, and through holes, each susceptible to heat. Elevated

temperatures can have negative consequences on standard PCBs, as well

as any other type of PCB. The PCB’s element determines its maximum

temperature, known as the printed circuit board temperature limit.

What is the typical temperature range for PCBs? The temperature range of

a PCB is measurable by the material, resulting in variations in the

temperature limits for different PCBs.

FR-4 is the most prevalent substrate useful in PCBs, comprising a

flame-resistant glass epoxy substrate. It can endure temperatures ranging

from 90°C-110°C.

High-temperature printed circuit boards are typically categorized as those

with the Tg exceeding 170°C, although some may use 150°C as the

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threshold. The specific definition may differ among high-temperature

printed circuit board manufacturers.

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Table of Contents

How to measure PCB Water Temperature?

It is important to consider thermal expansion before checking the

temperature range of your PCB. Temperature monitoring is critical for

identifying hot-power areas and power-hungry ICs and making necessary

adjustments or corrections early.

Ensuring that the CTE aligns crucial if your printed circuit board has

greater than one layer. CTE measures the expansion of materials at high

temperatures. The dielectric layers must have a similar CTE to the copper

coatings. If they are not together, each layer will expand at multiple rates,

which can cause serious issues.

Measuring PCB Water Temperature

Before determining the maximum operating temperature of your PCB,

there are some factors that you should consider.

1. No need to rewrite this sentence as it is already clear and concise.

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2. Ensure the printed circuit board temperature indicator is installing

properly before checking the temperature.

3. Locate the ground pins, which should be with the laminate of the

primary heat source. These ground pins facilitate the transfer of

around 60 to 65 percent of the generated heat to the temperature

sensor. Since the ground pins are with the laminate, they also have

a minimum thermal resistance than other components among the

heat source and the sensor.

Measure PCB temperature

1. Place a ground plane between the temperature sensors and the

heat source to achieve thermal equilibrium.

2. Join the ground pins of every temperature gauge to the ground

plane of the heat source.

3. Maintain proximity between the heat source & temperature

sensors.

Acceptable temperature boost for a PCB trace

The mechanical stability of the base material of a PCB becomes

compromised at the glass temperature (Tg). It is important to note that

the printed circuit board’s Tg is less than its melting point.

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Each PCB has a unique glass transition temperature (Tg) based on its

substrate. When the operating temperature exceeds the glass transition

temperature, the printed circuit board’s mechanical stability becomes

compromised. PCBs with a greater Tg value have improved stability at

elevated temperatures because their substrates offer good heat

resistance, chemical stability, and mechanical stability.

It is recommended that the Tg value of your PCB should be 20°C-25°C

greater than the anticipated functional temperature of the equipment you

are designing for. For example, if your PCB’s Tg value is 130°C, the device’s

functional temperature must be less than 110°C.

PCB Water Temperature copper traces

Copper traces generate heat due to power dissipation from I2R, where I is

the current and R is the trace’s resistance. The heat is then dissipated

through the base material by thermal conductivity, radiation, and

convection. The PCB temperature will stabilize when the heating or

cooling costs are equivalent.

The copper trace current capacity is influenced by various factors,

including the highest temperature rise needed and the trace width.

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The trace width of a PCB depends on various factors, including the

resistance, current flow, and the maximum temperature increase that can

be tolerated.

Usually, a temperature increase of up to 10°C above the average

temperature of twenty-five-degree centigrade is acceptable. However, in

some cases, a temperature rise of up to 20°C may be permitted if the PCB

design and material allow it.

What happens if the PCB Water Temperature drift is too high?

If the temperature rises in your PCB’s copper trace is too high, such as

50°C or 100°C, it can negatively impact nearby components’ ambient

temperature, leading to decreased board integrity and power loss. While a

copper trace on a FR 4 board may be able to handle such a temperature

rise, it’s still important to consider the potential consequences.

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Common causes of PCB Water Temperature increases

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There are several reasons why PCBs may experience high temperatures;

some of the most usual include:

· Malfunction causes heat dissipation

If a component malfunctions on your printed circuit board, it can lead

to heat dissipation. The faulty component can no longer create high

power, which causes nearby components to work more to compensate

and generate more power. This results in the generation of more heat.

· Through-hole interference

Through-holes provide electrical connections among the layers

through electroplating in the plated holes. The heat sink elements and

through-holes are responsible for the power supply. However, if the heat

dissipator doesn’t connect properly or if there is any obstruction with

the PTH due to other components, it causes nearby elements to work

harder, leading to the generation of more heat. This, in turn, leads to the

maximum temperature.

· Lead-free solder

The use of lead in electronic applications is a hazardous material and

increases challenges to health and environmental safety. As a result,

design engineers globally comply with the EU’s RoHS by limiting the use of

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lead solder. However, the lead-free alternatives often have a higher

melting point, resulting in PCBs requiring higher temperatures to operate,

leading to increased stress on components.

· The distance of your surface mount

Proper distance between through-hole components and surface

mount devices (SMDs) ensures a smooth current flow via a through-hole

and heatsink. If placed too far apart, the current has to travel farther,

resulting in cooling time for the receiving components. This can cause

other components on the circuit board to create more power to

compensate, ultimately leading to overheating.

· External thermal issues

It is important to consider the operating environment of the PCB and its

components during the design phase. Neglecting this can lead to thermal

stresses on the board in both high-temperature environments and

extremely low. Resistors, capacitors, and semiconductors are among the

components that can be affected by temperature changes.

· High-frequency circuits

High-frequency circuits are prevalent in mobile, microwave, high-speed

design applications, and radio frequencies like smartphones. However,

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the downside is that these circuits tend to produce more heat due to the

power they require. As a result, higher temperatures are inevitable in such

boards.

There are several common methods for preventing

temperature enhancement in PCBs.

To ensure high-performance PCBs, it’s essential to control heat through

effective design. If the circuit board will be exposed to extreme

temperatures, such as high or low environments, it’s crucial to consider

this during the design phase. Follow these tips to maintain the optimal

temperature of your PCB.

· Use heat sinks

Effective heat conductivity is crucial in controlling heat for

high-performance PCB design. Heat sinks, typically made of aluminum or

copper due to their outstanding thermal performance and low thermal

resistance, are attached to components such as high-power transistors on

the board to absorb and disperse heat in the air. The heat generated by

the components is naturally transferred to the heat sinks.

· Choosing the right materials and components

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Effective PCB design relies on using high-temperature-resistant materials.

PCBs with thick copper plates are capable of withstanding high

temperatures, which can extend the lifespan of the application. In contrast

to conventional PCBs, these boards can handle elevated current levels,

resist high temperatures for longer periods, and provide stronger

connection features. The most commonly used material for PCBs is FR4,

which is a glass epoxy that can tolerate high temperatures. Additionally,

high-frequency elements like PCB laminates can provide outstanding

dielectric attributes at various frequencies. When selecting a laminate, it is

important to choose one that can absorb moisture and withstand high

temperatures.

· Adequate Spacing

To prevent any interaction between the segments on your circuits, it is

important to ensure sufficient space between them. Failure to do so could

result in heat generation caused by the interaction between the

components. By maintaining a distance between them, such issues can be

avoided.

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Minimum Temperature For Fr-4 PCBs

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FR-4 PCBs typically endure temperatures as low as -50°C, beyond which

brittle cracks may develop in the element. However, it’s advisable to avoid

subjecting your FR-4 PCBs to extreme temperatures to reduce stress and

extend their lifespan. In industries like aerospace, where PCBs may be

deployed to outer space, they may be exposed to temperatures as low as

-150°C, well below the recommended limit for the FR-4 printed circuit

board.

Applications Of PCB Water Temperature

Thankfully, one can use several alternative materials instead of FR-4 to

fabricate PCBs that require high-temperature resistance. One such

material is polyimide, which can withstand a wide range of temperatures,

including cryogenic conditions and temperatures as high as 260 Celsius.

Additionally, polyimide materials are highly resistant to fire. While

polyimide materials offer excellent temperature resistance, they are

vulnerable to water, making them a crucial factor to consider during the

design phase.

Ceramic PCBs, on the other hand, are a more expensive option that offers

the advantages of both worlds. These boards can withstand extreme

temperatures, both low and high, and are impervious to water.

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However, the high cost and design constraints with ceramic circuit boards

are their downsides. In conclusion, there are meaningful differences or

benefits among ceramic printed circuit boards. One should evaluate FR-4

circuit boards & MCPCBs evaluated for each application.

Due to its exceptional conductivity at or -272°C, aluminum holds great

value in cryogenic printed circuit boards. However, the drawback of using

aluminum is its high reactivity, which necessitates unconventional

techniques for constructing circuit boards.

Related Posts:

1. A Closer Look at LED PCB Circuit Design

2. A Closer Look at the coefficient of CTE PCB (Thermal Expansion)

3. Rogers AD250C – A Closer Look at a Low-Cost Microwave PCB

4. A Closer Look at Analog PCB Design – Comprehensive Guide

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