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Do you know that a via needs to be filled? After it has been used to
establish a connection between the circuit’s layers, you have to get them
filled. In this article, we help you understand the two major ways to get
this done.
Table of Contents
What is a Via?
Thus, you need to use any of the common via fill processes to close the
via’s holes.
It is common to use epoxy for covering the via holes. The choice of epoxy
for the process is borne out of the fact that the material supports the
retention of the solder at the assembly level. This allows for the reduced
risk of compromising the solder joints and to keep away the bath solution
The routing density (when measured in terms of the higher density per
layer), is improved.
plating the via over copper. This proves to be a better method when
the Ball Grid Array (BGA), pass it through the via and then have it passed
used therein.
The filled vis process also does away with the high-speed design
Through the use of filled vias, the high-frequency designs will have
It is one of the via fill processes/options for circuit boards. It refers to the
PCB to the other. At the same time, the via’s thermal transfer properties
You can choose between copper and silver epoxy for this purpose. The
metallic design of the via fill. This sees to the excellent transfer of
heat from the Integrated Circuit (IC) to the other side of the PCB.
The major materials used here are the DuPont CB100 and the Tatsuto
AE3030 epoxy fill. With the two making up the “silver coated copper
particle” and filled with the epoxy matrix; they are ideal for the improved
Here are some of the additional points to note about these materials:
and the fact that it comprises both a higher CTE and a larger particle
size.
and vias of the circuit board. This is derived via the deposition
This process is not entirely an opposite of the conductive via fill option,
However, the difference between the non-conductive via fill and the
used for preventing the contamination of the via by solder and other
contaminants; the conductive option allows for the effecting both signal
Here are some of the additional benefits of the non-conductive via fill
process:
Both Peters PP2795 and San-Ei Kagaku PHP-900 epoxy are the common
materials used for non-conductive via fills. The former has been enjoying
the many years of usage, but now has a fierce competition in San-Ei, which
The first difference between the two is that the conductive via fill
the via.
non-conductive via fill option might be better. These reasons support the
claim:
reduced due to the stoppage of the solder mask on the filled vias a
few mils short of the pad. When used in the medium-density circuit
The fill materials for the non-conductive vias help to fill the gap that
You also need to match the value of the Coefficient of Thermal Expansion
Here are some of the steps involved in the CTE value matching:
This comes in handy as the circuit board “lives off the life” in an on/off and
structures.
variant? Generally, the non-conductive variants are a better bet for the
CTE’s value matching. This is because they provide a more reliable overall
Considering the popularity of the DuPont CB100 as the best via fill, it is
evident why the conductive epoxies are still popular in some quarters.
The following reasons also support the necessity of using the conductive
Conductive epoxies are ideal for use with the high pin count Ball
Conductive epoxies are a better option for the thermal vias. These
vias on pads
It is common for the non-conductive and the conductive via fills to be used
in covering the vias in a PCB. However, there is a third option, which is not
It is a filled vias process commonly used when the aspect ratio gets to 10:1.
You can also use it when the diameter is less than 8 mils.
It is imperative to mention that the copper-plated shut filled vias can also
If you are using either the Teflon or PTFE materials, rest assured
Certain materials are better not used for the design. For example,
thin materials or subs measuring less than 20 mils may not be ideal.
The making of fine spaces or lines might not be possible. This is the
1. Vias Drilling
You can choose between the laser beam and mechanical drilling methods
for the vias’ creation. You can determine the best vias’ drilling method
based on the number of circuit boards you want to produce, the costs and
Talking about the holes, make sure that the right annular ring size is
created.
Brush and Solvent: this combination helps to get rid of debris, while
Irrespective of the cleaning method used, one point to note is that the
debris must be removed at all costs. Also, put the circuit board under
close scrutiny to ensure that there is an even plating of the copper within
Depending on what you want, you can choose to fill the vias with either
The via filling processes for a PCB include the filling of the holes with
pressure and vacuum. This enables the excellent hole filling without giving
a way for gap formation in the resin. The other process is to clean the
panel’s surface. This process serves a dual purpose of getting rid of the
the copper’s surface. This way, a uniform surface is achieved, while getting
5. Over-Plating
non-conductive filled vias’ processes; they also have some similarities and
Generally, the processes of filling the via holes are fraught with some
There is a risk of filling up the via holes during the soldering process.
offer.
Final Thoughts
For the best results, always contact a professional PCB designer to help
you navigate the hole drilling, soldering and filling process. Rayming
Related Posts:
https://www.raypcb.com/conductive-vs-non-conductive-via-fill-pcb/