Microchip PackagingReference

SECTION 11
PACKAGING
Outlines and Parameters ............................................................................................................................. 1

Packaging Diagrams and Parameters.......................................................................................................... 3
Product Tape and Reel Specifications ...................................................................................................... 77
Thermal Characteristics ............................................................................................................................ 85
Overview of Microchip Die/Wafer Support ................................................................................................ 87
 2003 Microchip Technology Inc. DS00049W-page i

Packaging Index
CERAMIC SIDE BRAZED DUAL IN-LINE FAMILY
8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil .............................................. 3
14-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil .......................................... 4
28-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil ............................................. 5
CERAMIC DUAL IN-LINE (CERDIP) FAMILY
8-Lead Ceramic Dual In-line (JA) – 300 mil (CERDIP) ......................................................................... 6

8-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP) ................................................... 7
14-Lead Ceramic Dual In-line (JD) – 300 mil (CERDIP) ....................................................................... 8
14-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP) ................................................. 9
16-Lead Ceramic Dual In-line (JE) – 300 mil (CERDIP) ..................................................................... 10
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP) ............................................... 11
24-Lead Ceramic Dual In-line (JG) – 600 mil (CERDIP) ..................................................................... 13
28-Lead Ceramic Dual In-line (JJ) – 600 mil (CERDIP) ...................................................................... 14
40-Lead Ceramic Dual In-line (JK) – 600 mil (CERDIP) ..................................................................... 17
CERAMIC CHIP CARRIER (CERQUAD) FAMILY
68-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD) ............................. 19
84-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD) ............................. 20
SMALL OUTLINE TRANSISTOR FAMILY
3-Lead Plastic Transistor Outline (TO) (TO-92) ............................................................................. 21

3-Lead Plastic Small Outline Transistor (TT) (SOT-23) ...................................................................... 22
3-Lead Plastic Small Outline Transistor Header (MB) (SOT-89) ........................................................ 23
5-Lead Plastic Small Outline Transistor Header (MT) (SOT-89) ........................................................ 24
5-Lead Plastic Small Outline Transistor (OT) (SOT-23) ..................................................................... 25
5-Lead Plastic Small Outline Transistor (LT) (SC-70) ......................................................................... 26
6-Lead Plastic Small Outline Transistor (CH) (SOT-23) ..................................................................... 27
Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT-385) ...................................... 28
DOUBLE DECA-WATT PACKAGE (DDPAK) FAMILY
3-Lead Plastic (EB) (DDPAK) ............................................................................................................. 29

5-Lead Plastic (ET) (DDPAK) ............................................................................................................. 30
7-Lead Plastic (EK) (DDPAK) ............................................................................................................. 31
DS00049W-page ii  2003 Microchip Technology Inc.

Packaging Index
PLASTIC DUAL IN-LINE (PDIP) FAMILY
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) ................................................................................ 32

14-Lead Plastic Dual In-line (P) – 300 mil (PDIP) .............................................................................. 33
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP) ............................................................................. 35
24-Lead Plastic Dual In-line (P) – 600 mil (PDIP) ............................................................................. 37
24-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP) ................................................................ 38
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP) ................................................................ 39
64-Lead Shrink Plastic Dual In-line (SS) – 750 mil (PDIP) ................................................................ 42
PLASTIC LEADED CHIP CARRIER (PLCC) FAMILY
20-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) ............................................................... 43

32-Lead Plastic Leaded Chip Carrier (L) – Rectangle (PLCC) ........................................................... 45
PLASTIC SMALL OUTLINE (SOIC) FAMILY
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) ............................................................. 49
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC) ........................................................... 50
16-Lead Plastic Small Outline (SL) – Narrow 150 mil (SOIC) .......................................................... 51
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC) ........................................................... 52
16-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) ............................................................. 53
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) .............................................................. 54
PLASTIC QUAD FLATPACK (QFN) AND PLASTIC DUAL FLATPACK (DFN) FAMILY
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) .......................................... 57
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN) ........... 58
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Saw Singulated (QFN) .............. 59
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN) ......................................... 60
8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x1 mm Body (DFN) .......................................... 61
PLASTIC MICRO SMALL OUTLINE (MSOP) FAMILY
8-Lead Plastic Micro Small Outline Package (MS) (MSOP) ............................................................... 62

10-Lead Plastic Micro Small Outline Package (MS) (MSOP) ............................................................. 63
PLASTIC SHRINK SMALL OUTLINE (SSOP) FAMILY
20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP) ........................................... 64
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP) ............................................ 65
 2003 Microchip Technology Inc. DS00049W-page iii

Packaging Index
PLASTIC THIN SHRINK SMALL OUTLINE (TSSOP) FAMILY
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) .................................................... 66
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) .................................................. 67
20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) .................................................. 68
PLASTIC THIN SMALL OUTLINE (TSOP) AND VERY SMALL OUTLINE (VSOP) FAMILY
28-Lead Plastic Thin Small Outline (TS) – 5 x 20 mm (TSOP) ........................................................... 69

28-Lead Plastic Very Small Outline (VS) – 8 x 13.4 mm (VSOP) ....................................................... 70
PLASTIC LOW PROFILE QUAD FLATPACK (LQFP) FAMILY
32-Lead Plastic Low Profile Quad Flatpack (PL) 7x7x1.4 mm Body,

1.0/0.10 mm Lead Form (LQFP) ..................................................................................................... 71
PLASTIC QUAD FLATPACK (MQFP) FAMILY
44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body,

1.6/0.15 mm Lead Form (MQFP) .................................................................................................... 72
PLASTIC THIN QUAD FLATPACK (TQFP) FAMILY
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) ....... 73
100-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) ..... 76
DS00049W-page iv  2003 Microchip Technology Inc.

PACKAGING
Outlines and Parameters
PART NUMBER SUFFIX DESIGNATIONS:
XXXXXXXXXX - XX X/XX XXX
QTP, SQTP or ROM Code; Special Requirements
Package:
1C = 1000pF COB Module, .75mm MS = Plastic Micro Small Outline (MSOP)
3C = 330pF COB Module, .45mm MT = 5-Lead SOT-89 Small Outline Transistor
L = Plastic Leaded Chip Carrier (PLCC) OT = 5-Lead SOT-23 Small Outline Transistor
P = Plastic DIP PF = 100-Lead Plastic Quad Flatpack (TQFP)
S = Die in Waffle Pack PQ = Plastic Quad Flatpack (MQFP)
W = Die in Wafer Form PL = Plastic Low Profile Quad Flatpack (LQFP)
CB = Chip on Board (COB) PT = Plastic Thin Quad Flatpack (TQFP)
CH = 6-Lead SOT-23 SB = Bumped Die in Waffle Pack
CL = Windowed CERQUAD SL = 14-lead Small Outline (150 mil)
EB = 3-lead DDPAK SM = 8-lead Small Outline (207 mil)
EK = 7-lead DDPAK SN = 8-lead Small Outline (150 Mil)
ET = 5-lead DDPAK SO = Plastic Small Outline (SOIC) (300 mil)
JA = 8-Lead Non-Windowed CERDIP SP = Plastic Skinny DIP
JD = 14-Lead Non-Windowed CERDIP SS = Plastic Shrink Small Outline
JE = 16-Lead Non-Windowed CERDIP ST = Thin Shrink Small Outline (4.4mm)
JG = 24-Lead Non-Windowed CERDIP TO = Transistor Outline
JJ = 28-Lead Non-Windowed CERDIP TS = Thin Small Outline (8mm x 20mm)
JK = 40-Lead Non-Windowed CERDIP TT = 3-Lead SOT-23 Small Outline Transistor
JW = Windowed CERDIP VS = Very Small Outline (8mm x 12mm)
LT = 5-Lead SC-70 WB = Bumped Wafer (11 mil)
MB = 3-Lead SOT-89 WF = Sawed Wafer on Frame (7 mil)
MF = Dual Flat No Leads (DFN) WFB = Bumped, Sawed Wafer on Frame
ML = Quad Flat No Leads (QFN) WM = SOT-385 Leadless Module
Process Temperature:
Blank = 0°C to +70°C E (Extended) = -40°C to +125°C
I (Industrial) = -40°C to +85°C
Speed: OR Crystal Frequency Designator for PICmicro® MCUs

-90 = 90 ns LP = DC to 20 MHz, High Speed Crystal Oscillator
-10 = 100 ns RC = DC to 2 MHz, XT and RC Oscillator Support
-12 = 120 ns XT = DC to 4 MHz Internal, XT, RC Osc Support
-15 = 150 ns HS = DC to 200 kHz, LP Oscillator Support
-17 = 170 ns 02 = DC to 10 MHz, HS Oscillator Support
-20 = 200 ns 04 = DC to 20 MHz, High Speed Crystal Oscillator
-25 = 250 ns 04 = DC to 2 MHz, XT and RC Oscillator Support
-30 = 300 ns 10 = DC to 4 MHz Internal, XT, RC Osc Support
Option:
T = Tape and Reel Shipments F = 200 µs
Blank = twc = 1 ms X = Rotated pinout
Device Type: (Up to 10 digits)

AA = 1.8V EEPROM Memory LCE = Low Power CMOS/EPROM/EEPROM MCU
C = CMOS EPROM MCU LCR = Low Power CMOS ROM MCU
CE = CMOS EPROM/EEPROM MCU LCS = Low Power Security
CR = CMOS ROM MCU LF = Low Power FLASH MCU
F = FLASH MCU LV = Low Voltage
HC = High Speed 24 = 2-Wire (I2CTM)
HV = High Voltage 25 = SPITM
LC = Low Power CMOS EPROM MCU 93 = 3-Wire (Microwire®)
 2003 Microchip Technology Inc. DS00049W-page 1

Packaging
NOTES:

Packaging Diagrams and Parameters
8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
E1 W
T D
2
n 1
A
A2
L
A1
c B1
p
eB B
Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 8 8
Pitch p .100 2.54
Top to Seating Plane A .145 .165 .185 3.68 4.19 4.70
Top of Body to Seating Plane A2 .103 .123 .143 2.62 3.12 3.63
Standoff A1 .025 .035 .045 0.64 0.89 1.14
Package Width E1 .280 .290 .300 7.11 7.37 7.62
Overall Length D .510 .520 .530 12.95 13.21 13.46
Tip to Seating Plane L .130 .140 .150 3.30 3.56 3.81
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Upper Lead Width B1 .050 .055 .060 1.27 1.40 1.52
Lower Lead Width B .016 .018 .020 0.41 0.46 0.51
Overall Row Spacing § eB .296 .310 .324 7.52 7.87 8.23
Window Diameter W .161 .166 .171 4.09 4.22 4.34
Lid Length T .440 .450 .460 11.18 11.43 11.68
Lid Width U .260 .270 .280 6.60 6.86 7.11
* Controlling Parameter
§ Significant Characteristic
JEDC Equivalent: MS-015
Drawing No. C04-083
DS00049W-page 3  2003 Microchip Technology Inc.

E1
T D
n 1
A
A2
L
A1
c B1
eB B p

Pitch p .100 2.54
Standoff A1 .025 .035 .045 0.64 0.89 1.14
Package Width E1 .280 .290 .300 7.11 7.37 7.62
Overall Length D .693 .700 .707 17.60 17.78 17.96
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Lid Length T .440 .450 .460 11.18 11.43 11.68
Lid Width U .260 .270 .280 6.60 6.86 7.11
JEDEC Equivalent: MS-015
Drawing No. C04-107

E1
T D
2
n 1
A A2
L
A1
c B1
p
eB B

Pitch p .100 2.54
Standoff A1 .040 .050 .060 1.02 1.27 1.52
Package Width E1 .280 .290 .300 7.11 7.37 7.62
Overall Length D 1.386 1.400 1.414 35.20 35.56 35.92
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Lid Length T .490 .500 .510 12.45 12.70 12.95
Lid Width U .275 .285 .295 6.99 7.24 7.49
Drawing No. C04-084

8-Lead Ceramic Dual In-line (JA) – 300 mil (CERDIP)
E1
n 1
E
A2
c L
eB B1
B
A1
p

Pitch p .100 2.54
Standoff § A1 .020 .030 .040 0.51 0.77 1.02
Shoulder to Shoulder Width E .290 .305 .320 7.37 7.75 8.13
Ceramic Pkg. Width E1 .230 .265 .300 5.84 6.73 7.62
Overall Length D .370 .385 .400 9.40 9.78 10.16
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Overall Row Spacing eB .320 .360 .400 8.13 9.15 10.16
*Controlling Parameter
Drawing No. C04-010

8-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
E1
D
2
n 1
E
A2
c L
A1
eB B1

Pitch p .100 2.54
Standoff § A1 .020 .030 .040 0.51 0.77 1.02
Overall Length D .370 .385 .400 9.40 9.78 10.16
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Drawing No. C04-027

14-Lead Ceramic Dual In-line (JD) – 300 mil (CERDIP)
E1
D
2
n 1
E
A2
c L
A1
eB B1
B p

Pitch p .100 2.54
Standoff § A1 .015 .030 .040 0.38 0.76 1.02
Overall Length D .752 .760 .780 19.10 19.30 19.81
Lead Thickness c .008 .012 .014 0.20 0.30 0.36
Drawing No. C04-002

E1
n 1
E
A2
c L
eB B1
A1 B p

Pitch p .100 2.54
Standoff § A1 .015 .030 .040 0.38 0.76 1.02
Overall Length D .752 .760 .780 19.10 19.30 19.81
Lead Thickness c .008 .012 .014 0.20 0.30 0.36
JEDEC Equivalent: MS-030 AC
Drawing No. C04-099

16-Lead Ceramic Dual In-line (JE) – 300 mil (CERDIP)
E1
n 1
E
A2
L
c
A1
B1
eB
B p

Pitch p .100 2.54
Standoff § A1 .015 .030 .040 0.38 0.76 1.02
Overall Length D .752 .760 .780 19.10 19.30 19.81
Lead Thickness c .008 .012 .014 0.20 0.30 0.36
Drawing No. C04-003

E1
W2 D
n 1
W1
A A2
c L
A1
eB B1
B p

Pitch p .100 2.54
Ceramic Package Height A2 .155 .160 .165 3.94 4.06 4.19
Standoff A1 .015 .023 .030 0.38 0.57 0.76
Overall Length D .880 .900 .920 22.35 22.86 23.37
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Window Width W1 .130 .140 .150 3.30 3.56 3.81
Window Length W2 .190 .200 .210 4.83 5.08 5.33
JEDEC Equivalent: MO-036
Drawing No. C04-010

E1
2
n 1
E
A2
c L
eB B1
A1 B p

Pitch p .100 2.54
Standoff A1 .015 .023 .030 0.38 0.58 0.76
Overall Length D .942 .950 .970 23.93 24.13 24.64
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Drawing No. C04-115

24-Lead Ceramic Dual In-line (JG) – 600 mil (CERDIP)
E1
2
n 1
A A2
c L
B1
eB
A1 B p

Pitch p .100 2.54
Ceramic Package Height A2 .140 -- .175 3.56 -- 4.45
Standoff § A1 .015 -- -- 0.38 -- --
Shoulder to Shoulder Width E .608 -- .625 15.44 -- 15.88
Overall Length D 1.242 1.250 1.270 31.55 31.75 32.26
Lead Thickness c .008 .012 .014 0.20 0.30 0.36
Drawing No. C04-004

28-Lead Ceramic Dual In-line (JJ) – 600 mil (CERDIP)
E1
2
n 1
A A2
c L
B1
eB
A1 B p

Pitch p .100 2.54
Standoff § A1 .015 -- -- 0.38 -- --
Shoulder to Shoulder Width E .608 -- .625 15.44 -- 15.88
Overall Length D 1.442 1.450 1.470 36.63 36.83 37.34
Lead Thickness c .008 .012 .015 0.20 0.30 0.38
Drawing No. C04-006

E1
W2 D
2
n 1
W1
A A2
c L
B1
eB A1
B p

Pitch p .100 2.54
Standoff A1 .015 .023 .030 0.38 0.57 0.76
Overall Length D 1.430 1.458 1.485 36.32 37.02 37.72
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Window Width W1 .130 .140 .150 3.30 3.56 3.81
Window Length W2 .290 .300 .310 7.37 7.62 7.87
Drawing No. C04-080

E1
2
n 1
A A2
c L
B1
eB A1
B p

Pitch p .100 2.54
Standoff A1 .015 .038 .060 0.38 0.95 1.52
Overall Length D 1.430 1.460 1.490 36.32 37.08 37.85
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Drawing No. C04-013

40-Lead Ceramic Dual In-line (JK) – 600 mil (CERDIP)
E1
2
n 1
A2
c L
B1
eB B p

Pitch p .100 2.54
Standoff § A1 .020 .040 .060 0.51 1.02 1.52
Overall Length D 2.042 2.050 2.070 51.87 52.07 52.58
Lead Thickness c .008 .012 .014 0.20 0.30 0.36
Drawing No. C04-008

E1
2
n 1
A2 A
c A1
B1
eB B p

Pitch p .100 2.54
Standoff A1 .030 .045 .060 0.76 1.14 1.52
Overall Length D 2.040 2.050 2.060 51.82 52.07 52.32
Lead Thickness c .008 .011 .014 0.20 0.28 0.36
Drawing No. C04-014

68-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD)
E
E1
#leads=n1
W
C
D1 D
R .010 MIN.
p
R .020 MIN.
L1
DETAIL
n 12
R CH1 x 45°
DETAIL
A3 B1 B
A2
45°
A1
A
E3 D3
E2 D2

Pins each side n1 17 17
Pitch p .050 1.27
Overall Height A .155 .172 .190 3.94 4.37 4.83
Package Thickness A2 .132 REF 3.35 REF
Lead Height A1 .090 .100 .120 2.29 2.54 3.05
Side One Chamfer Dim. A3 .030 .035 .040 0.76 0.89 1.02
Corner Chamfer (1) CH1 .030 .040 .050 0.76 1.02 1.27
Corner Radius (Others) R .020 .025 .030 0.51 0.64 0.76
Overall Package Width E .985 .990 .995 25.02 25.15 25.27
Overall Package Length D .985 .990 .995 25.02 25.15 25.27
Ceramic Package Width E1 .930 .950 .965 23.62 24.13 24.51
Ceramic Package Length D1 .930 .950 .965 23.62 24.13 24.51
Overall Lead Centers E3 .800 REF 20.32 REF
Overall Lead Centers D3 .800 REF 20.32 REF
Footprint E2 .880 .910 .940 22.35 23.11 23.88
Footprint D2 .880 .910 .940 22.35 23.11 23.88
Lead Length L1 .006 - - 0.15 - -
Lead Thickness C .006 .007 .010 0.15 0.18 0.25
Drawing No. C04-097

84-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD)
E
E1
#leads=n1
C
W D1 D
R .010 MIN.
p
R .020 MIN.
L1
DETAIL
R n 12
CH1 x 45°
A3 DETAIL
B B1
45°
A2 A
E3 D3 A1
E2 D2

Pins each side n1 21 21
Pitch p .050 1.27
Overall Height A .155 .172 .190 3.94 4.37 4.83
Package Thickness A2 .132 REF 3.35 REF
Lead Height A1 .090 .100 .120 2.29 2.54 3.05
Side One Chamfer Dim. A3 .030 .035 .040 0.76 0.89 1.02
Corner Chamfer (1) CH1 .040 REF 1.02 REF
Corner Radius (others) R - - .025 - - 0.64
Overall Package Width E 1.185 1.190 1.195 30.10 30.23 30.35
Overall Package Length D 1.185 1.190 1.195 30.10 30.23 30.35
Ceramic Package Width E1 1.130 1.150 1.165 28.70 29.21 29.59
Ceramic Package Length D1 1.130 1.150 1.165 28.70 29.31 29.59
Overall Lead Centers E3 1.00 REF 25.40 REF
Overall Lead Centers D3 1.00 REF 25.40 REF
Footprint E2 1.080 1.110 1.140 27.43 28.19 28.96
Footprint D2 1.080 1.110 1.140 27.43 28.19 28.96
Lead Length L1 .006 - - 0.15 - -
Lead Thickness C .006 .007 .010 0.15 0.18 0.25
Lower Lead Width B1 .017 .019 .021 0.43 0.48 0.53
Upper Lead Width B .026 .029 .032 0.66 0.74 0.81

Drawing No. C04-112

3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
1 n
1
2
3
α
B
p
c
R
β

Pitch p .050 1.27
Bottom to Package Flat A .130 .143 .155 3.30 3.62 3.94
Overall Width E1 .175 .186 .195 4.45 4.71 4.95
Overall Length D .170 .183 .195 4.32 4.64 4.95
Molded Package Radius R .085 .090 .095 2.16 2.29 2.41
Lead Thickness c .014 .017 .020 0.36 0.43 0.51
Lead Width B .016 .019 .022 0.41 0.48 0.56
Mold Draft Angle Top α 4 5 6 4 5 6
Mold Draft Angle Bottom β 2 3 4 2 3 4
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101

3-Lead Plastic Small Outline Transistor (TT) (SOT-23)
E1
B p1 D
n p
1
α
c
A A2
φ A1
β
L

Pitch p .038 0.96
Outside lead pitch (basic) p1 .076 1.92
Overall Height A .035 .040 .044 0.89 1.01 1.12
Molded Package Thickness A2 .035 .037 .040 0.88 0.95 1.02
Standoff § A1 .000 .002 .004 0.01 0.06 0.10
Overall Width E .083 .093 .104 2.10 2.37 2.64
Molded Package Width E1 .047 .051 .055 1.20 1.30 1.40
Overall Length D .110 .115 .120 2.80 2.92 3.04
Foot Length L .014 .018 .022 0.35 0.45 0.55
Foot Angle φ 0 5 10 0 5 10
Lead Thickness c .004 .006 .007 0.09 0.14 0.18
Lead Width B .015 .017 .020 0.37 0.44 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-104

3-Lead Plastic Small Outline Transistor Header (MB) (SOT-89)
H
E
B1
3
B
D D1 p1
2
p
1
B1
E1
Units INCHES MILLIMETERS*

Dimension Limits MIN MAX MIN MAX
Pitch p .059 BSC 1.50 BSC
Outside lead pitch (basic) p1 .118 BSC 3.00 BSC
Overall Height A .055 .063 1.40 1.60
Overall Width H .155 .167 3.94 4.25
Molded Package Width at Base E .090 .102 2.29 2.60
Molded Package Width at Top E1 .084 .090 2.13 2.29
Overall Length D .173 .181 4.40 4.60
Tab Length D1 .064 .072 1.62 1.83
Foot Length L .035 .047 0.89 1.20
Lead Thickness c .014 .017 0.35 0.44
Lead 2 Width B .017 .022 0.44 0.56
Leads 1 & 3 Width B1 .014 .019 0.36 0.48
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
Drawing No. C04-29

5-Lead Plastic Small Outline Transistor Header (MT) (SOT-89)
B1
B1
4
3
B2 B
D1 p1
2
p
5 1 2
B1
B1
L L
E D

Dimension Limits MIN MAX MIN MAX
Outside lead pitch (basic) p1 .118 BSC 3.00 BSC
Overall Height A .055 .063 1.40 1.60
Overall Width H - .177 - 4.50
Molded Package Width E .090 .102 2.29 2.60
Overall Length D .173 .181 4.40 4.60
Tab Width D1 .055 .071 1.40 1.80
Foot Length L .031 - 0.80 -
Lead Thickness c .015 .017 0.37 0.44
Lead 2 Width B .016 .021 0.41 0.53
Leads 1,3, 4 & 5 Width B1 .014 .019 0.36 0.48
Tab Lead Width B2 .013 .019 0.32 0.48
Notes:
Drawing No. C04-030

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E1
p
B
p1 D
n 1
c
A A2
φ A1
L
β

Pitch p .038 0.95
Overall Height A .035 .046 .057 0.90 1.18 1.45
Standoff § A1 .000 .003 .006 0.00 0.08 0.15
Overall Width E .102 .110 .118 2.60 2.80 3.00
Overall Length D .110 .116 .122 2.80 2.95 3.10
Foot Length L .014 .018 .022 0.35 0.45 0.55
Foot Angle φ 0 5 10 0 5 10
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .014 .017 .020 0.35 0.43 0.50
Notes:
.010” (0.254mm) per side.
Drawing No. C04-091

5-Lead Plastic Small Outline Transistor (LT) (SC-70)
E
E1
p B
n 1
Q1
A2 A
c
A1

Pitch p .026 (BSC) 0.65 (BSC)
Overall Height A .031 .043 0.80 1.10
Molded Package Thickness A2 .031 .039 0.80 1.00
Standoff A1 .000 .004 0.00 0.10
Overall Width E .071 .094 1.80 2.40
Molded Package Width E1 .045 .053 1.15 1.35
Overall Length D .071 .087 1.80 2.20
Foot Length L .004 .012 0.10 0.30
Top of Molded Pkg to Lead Shoulder Q1 .004 .016 0.10 0.40
Lead Thickness c .004 .007 0.10 0.18
Lead Width B .006 .012 0.15 0.30
Notes:
JEITA (EIAJ) Standard: SC-70

Drawing No. C04-061

6-Lead Plastic Small Outline Transistor (CH) (SOT-23)
E1
B
p1 D
n 1
A A2
L A1
β

Pitch p .038 0.95
Overall Height A .035 .046 .057 0.90 1.18 1.45
Standoff A1 .000 .003 .006 0.00 0.08 0.15
Overall Width E .102 .110 .118 2.60 2.80 3.00
Overall Length D .110 .116 .122 2.80 2.95 3.10
Foot Length L .014 .018 .022 0.35 0.45 0.55
Foot Angle φ 0 5 10 0 5 10
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .014 .017 .020 0.35 0.43 0.50
Notes:
JEITA (formerly EIAJ) equivalent: SC-74A

Drawing No. C04-120

Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT-385)
E
CH1 x 45 °
α TYP.
CH2 x 45 °
A
A1
β
TYP.

Overall Height A .114 .118 .120 2.90 3.00 3.05
Bottom of Package to Chamfer A1 .075 .079 .083 1.90 2.00 2.10
Overall Width E .236 .240 2.44 6.00 6.10 6.20
Overall Length D .472 .476 .480 12.00 12.10 12.20
Width at Tapered End J .173 .177 .181 4.40 4.50 4.60
Length of Flat F .193 .197 .200 4.90 5.00 5.10
Chamfer Distance, Horizontal CH1 .039 .043 .047 1.00 1.10 1.20
Chamfer Distance, Vertical CH2 .039 .043 .047 1.00 1.10 1.20
Notes:
Dimensions D, E, F and J do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-109

3-Lead Plastic (EB) (DDPAK)
E L3 E1
D2
D
D1
b
e BOTTOM VIEW
TOP VIEW
θ1
b1
(5X)
A c2
θ
A1 c L

Number of Pins 3 3
Pitch e 1.00 BSC 2.54 BSC
Overall Height A .170 .177 .183 4.32 4.50 4.65
Standoff § A1 .000 .005 .010 0.00 0.13 0.25
Overall Width E .385 .398 .410 9.78 10.11 10.41
Exposed Pad Width E1 .256 REF 6.50 REF
Molded Package Length D .330 .350 .370 8.38 8.89 9.40
Overall Length D1 .549 .577 .605 13.94 14.66 15.37
Exposed Pad Length D2 .303 REF 7.70 REF
Lead Thickness c .014 .020 .026 0.36 0.51 0.66
Pad Thickness c2 .045 -- .055 1.14 -- 1.40
Lower Lead Width b .026 .032 .037 0.66 0.81 0.94
Upper Lead Width b1 .049 .050 .051 1.24 1.27 1.30
Foot Length L .068 -- .110 1.73 -- 2.79
Pad Length L3 .045 -- .067 1.14 -- 1.70
Foot Angle θ -- -- 8° -- -- 8°
Mold Draft Angle θ1 3° -- 7° 3° -- 7°
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
JEDEC equivalent: TO-252
Drawing No. C04-011

5-Lead Plastic (ET) (DDPAK)
E L3 E1
D2
D1
e BOTTOM VIEW
b
TOP VIEW
θ1
(5X)
A c2
θ
A1 c L

Number of Pins 5 5
Pitch e .067 BSC 1.70 BSC
Overall Height A .170 .177 .183 4.32 4.50 4.65
Standoff § A1 .000 .005 .010 0.00 0.13 0.25
Overall Width E .385 .398 .410 9.78 10.11 10.41
Overall Length D1 .549 .577 .605 13.94 14.66 15.37
Lead Thickness c .014 .020 .026 0.36 0.51 0.66
Pad Thickness c2 .045 -- .055 1.14 -- 1.40
Lead Width b .026 .032 .037 0.66 0.81 0.94
Foot Length L .068 .089 .110 1.73 2.26 2.79
Pad Length L3 .045 -- .067 1.14 -- 1.70
Foot Angle θ -- -- 8° -- -- 8°
Notes:
Drawing No. C04-012

7-Lead Plastic (EK) (DDPAK)
E L3 E1
D2
D1
1
BOTTOM VIEW
b
e
TOP VIEW θ1
(5X)
A c2
θ
A1 c L

Number of Pins 5 5
Pitch e .050 BSC 1.27 BSC
Overall Height A .170 .177 .183 4.32 4.50 4.65
Standoff § A1 .000 .005 .010 0.00 0.13 0.25
Overall Width E .385 .398 .410 9.78 10.11 10.41
Overall Length D1 .549 .577 .605 13.94 14.66 15.37
Lead Thickness c .014 .020 .026 0.36 0.51 0.66
Pad Thickness c2 .045 -- .055 1.14 -- 1.40
Lead Width b .026 .032 .037 0.66 0.81 0.94
Foot Length L .068 .089 .110 1.73 2.26 2.79
Pad Length L3 .045 -- .067 1.14 -- 1.70
Foot Angle θ -- -- 8° -- -- 8°
Notes:
Drawing No. C04-015

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
n 1
A A2
L
c
A1
β B1
p
eB B

Pitch p .100 2.54
Base to Seating Plane A1 .015 0.38
Overall Length D .360 .373 .385 9.14 9.46 9.78
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-018

E1
n 1
α
A A2
c L
A1
β B1
eB
B p

Pitch p .100 2.54
Overall Length D .740 .750 .760 18.80 19.05 19.30
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-005

E1
2
α
n 1
A A2
c L
β A1
B1
eB
B p

Pitch p .100 2.54
Overall Length D .740 .750 .760 18.80 19.05 19.30
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Lower Lead Width B .014 .018 .022 .036 0.46 0.56
Notes:
.010” (0.254mm) per side.
Drawing No. C04-017

E1
n 1 α
E A2
c L
A1
B1
β
B p
eB

Pitch p .100 2.54
Overall Length D .890 .898 .905 22.61 22.80 22.99
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-007

E1
n 1 α
A A2
c L
A1
β B1
eB B p

Pitch p .100 2.54
Overall Length D 1.025 1.033 1.040 26.04 26.24 26.42
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-019

E1
2
n 1 α
A A2
L
c
B1
β
A1
eB B p

Pitch p .100 2.54
Overall Length D 1.245 1.250 1.255 31.62 31.75 31.88
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-081

24-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
E1
2
n 1
α
A A2
c L
A1
B1 p
β
eB B

Pitch p .100 2.54
Overall Length D 1.245 1.250 1.255 31.62 31.75 31.88
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-043

28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
E1
2
n 1 α
E
A2
L
c
β A1 B1
eB B p

Pitch p .100 2.54
Overall Length D 1.345 1.365 1.385 34.16 34.67 35.18
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-070

E1
2
n 1 α
A A2
c L
B1
β A1
B p
eB

Pitch p .100 2.54
Overall Length D 1.395 1.430 1.465 35.43 36.32 37.21
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-079

E1
2 α
n 1
A A2
L
c
β B1
A1
eB B p

Pitch p .100 2.54
Overall Length D 2.045 2.058 2.065 51.94 52.26 52.45
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-016

64-Lead Shrink Plastic Dual In-line (SS) – 750 mil (PDIP)
E1
2 α
n 1
A A2
c
β B1
L
A1 B p
eB

Pitch p .070 1.78
Overall Length D 2.260 2.270 2.280 57.40 57.66 57.91
Lead Thickness c .008 .010 .012 0.20 0.25 0.30
Notes:
.010” (0.254mm) per side.
Drawing No. C04-090

20-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
E
E1
#leads=n1
D1 D
n 1 2
CH2 x 45° CH1 x 45° α
A3
A2 A
35°
B1
c E2 B A1
β p
D2

Pitch p .050 1.27
Pins per Side n1 5 5
Overall Height A .165 .173 .180 4.19 4.39 4.57
Standoff § A1 .020 .028 .035 0.51 0.71 0.89
Side 1 Chamfer Height A3 .042 .049 .056 1.07 1.24 1.42
Corner Chamfer 1 CH1 .040 .045 .050 1.02 1.14 1.27
Corner Chamfer (others) CH2 .010 .015 .020 0.25 0.38 0.51
Overall Width E .385 .390 .395 9.78 9.91 10.03
Overall Length D .385 .390 .395 9.78 9.91 10.03
Molded Package Length D1 .350 .353 .356 8.89 8.97 9.04
Footprint Width E2 .282 .310 .338 7.16 7.87 8.59
Footprint Length D2 .282 .310 .338 7.16 7.87 8.59
Lead Thickness c .008 .011 .013 0.20 0.27 0.33
Notes:
.010” (0.254mm) per side.
Drawing No. C04-064

E
E1
#leads=n1
D1 D
n 1 2
CH2 x 45 ° CH1 x 45 °
α
A3
A2 A
32°
c B1
A1
B
β
p
E2 D2

Pitch p .050 1.27
Overall Height A .165 .173 .180 4.19 4.39 4.57
Standoff § A1 .020 .028 .035 0.51 0.71 0.89
Overall Width E .485 .490 .495 12.32 12.45 12.57
Overall Length D .485 .490 .495 12.32 12.45 12.57
Lead Thickness c .008 .011 .013 0.20 0.27 0.33
Notes:
.010” (0.254mm) per side.
Drawing No. C04-026

32-Lead Plastic Leaded Chip Carrier (L) – Rectangle (PLCC)
E
E1
#leads=n1
D1 D
n 1 2
CH2 x 45° CH1 x 45 ° α
A3
A2 A
32°
c B1
A1
B
β p
E2 D2

Pitch p .050 1.27
Pins along Width n1 7 7
Pins along Length n2 9 9
Overall Height A .125 .133 .140 3.18 3.37 3.56
Standoff § A1 .020 .028 .035 0.51 0.71 0.89
Overall Width E .485 .490 .495 12.32 12.45 12.57
Overall Length D .585 .590 .595 14.86 14.99 15.11
Lead Thickness c .008 .010 .013 0.20 0.25 0.33
Notes:
.010” (0.254mm) per side.
Drawing No. C04-023

E
E1
#leads=n1
D1 D
n 1 2
CH2 x 45 ° CH1 x 45 °
A3 α
A2 A
35°
B1
c
B A1
β
p
E2 D2

Pitch p .050 1.27
Overall Height A .165 .173 .180 4.19 4.39 4.57
Standoff § A1 .020 .028 .035 0.51 0.71 0.89
Overall Width E .685 .690 .695 17.40 17.53 17.65
Overall Length D .685 .690 .695 17.40 17.53 17.65
Lead Thickness c .008 .011 .013 0.20 0.27 0.33
Notes:
.010” (0.254mm) per side.
Drawing No. C04-048

E
E1
#leads=n1
D1 D
n12
CH2 x 45 ° CH1 x 45 ° α
A2 A3
A
32°
c B1
A1
β B p
D2
E2

Pitch p .050 1.27
Overall Height A .165 .173 .180 4.19 4.39 4.57
Standoff § A1 .020 .028 .035 0.51 0.71 0.89
Overall Width E .985 .990 .995 25.02 25.15 25.27
Overall Length D .985 .990 .995 25.02 25.15 25.27
Lead Thickness c .008 .011 .013 0.20 0.27 0.33
Notes:
.010” (0.254mm) per side.
Drawing No. C04-049

E
E1
#leads=n1
D1 D
n12
CH2 x 45° CH1 x 45 ° α
A2 A3
A
45°
c B1
A1
β B p
D2
E2

Pitch p .050 1.27
Overall Height A .165 .173 .180 4.19 4.39 4.57
Standoff § A1 .020 .028 .035 0.51 0.71 0.89
Overall Width E 1.185 1.190 1.195 30.10 30.23 30.35
Overall Length D 1.185 1.190 1.195 30.10 30.23 30.35
Molded Package Width E1 1.150 1.154 1.158 29.21 29.31 29.41
Molded Package Length D1 1.150 1.154 1.158 29.21 29.31 29.41
Footprint Width E2 1.090 1.110 1.130 27.69 28.19 28.70
Footprint Length D2 1.090 1.110 1.130 27.69 28.19 28.70
Lead Thickness c .008 .011 .013 0.20 0.27 0.33
Notes:
.010” (0.254mm) per side.
Drawing No. C04-093

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E1
D
2
B n 1
h α
45°
c
A A2
φ
β L A1

Pitch p .050 1.27
Overall Height A .053 .061 .069 1.35 1.55 1.75
Standoff § A1 .004 .007 .010 0.10 0.18 0.25
Overall Width E .228 .237 .244 5.79 6.02 6.20
Overall Length D .189 .193 .197 4.80 4.90 5.00
Chamfer Distance h .010 .015 .020 0.25 0.38 0.51
Foot Length L .019 .025 .030 0.48 0.62 0.76
Foot Angle φ 0 4 8 0 4 8
Lead Thickness c .008 .009 .010 0.20 0.23 0.25
Lead Width B .013 .017 .020 0.33 0.42 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-057

14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
E1
B n 1
α
h
45°
c
A A2
φ
A1
L
β

Pitch p .050 1.27
Overall Height A .053 .061 .069 1.35 1.55 1.75
Standoff § A1 .004 .007 .010 0.10 0.18 0.25
Overall Width E .228 .236 .244 5.79 5.99 6.20
Overall Length D .337 .342 .347 8.56 8.69 8.81
Foot Length L .016 .033 .050 0.41 0.84 1.27
Lead Thickness c .008 .009 .010 0.20 0.23 0.25
Lead Width B .014 .017 .020 0.36 0.42 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-065

16-Lead Plastic Small Outline (SL) – Narrow 150 mil (SOIC)
E
E1
B n 1
α
h
45°
c
A A2
φ
L A1
β

Pitch p .050 1.27
Overall Height A .053 .061 .069 1.35 1.55 1.75
Standoff § A1 .004 .007 .010 0.10 0.18 0.25
Overall Width E .228 .237 .244 5.79 6.02 6.20
Overall Length D .386 .390 .394 9.80 9.91 10.01
Foot Length L .016 .033 .050 0.41 0.84 1.27
Lead Thickness c .008 .009 .010 0.20 0.23 0.25
Lead Width B .013 .017 .020 0.33 0.42 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-108

8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
E1
D
2
n 1
B
c
A A2
A1
β L

Pitch p .050 1.27
Overall Height A .070 .075 .080 1.78 1.97 2.03
Standoff § A1 .002 .005 .010 0.05 0.13 0.25
Overall Width E .300 .313 .325 7.62 7.95 8.26
Overall Length D .202 .205 .210 5.13 5.21 5.33
Foot Length L .020 .025 .030 0.51 0.64 0.76
Lead Thickness c .008 .009 .010 0.20 0.23 0.25
Lead Width B .014 .017 .020 0.36 0.43 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-056

16-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
E
p
E1
2
n 1
B
h
α
45°
c
A A2
φ
β L A1

Pitch p .050 1.27
Overall Height A .093 .099 .104 2.36 2.50 2.64
Standoff § A1 .004 .008 .012 0.10 0.20 0.30
Overall Width E .394 .407 .420 10.01 10.34 10.67
Overall Length D .398 .406 .413 10.10 10.30 10.49
Foot Length L .016 .033 .050 0.41 0.84 1.27
Lead Thickness c .009 .011 .013 0.23 0.28 0.33
Lead Width B .014 .017 .020 0.36 0.42 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-102

E
p
E1
2
B n 1
h
α
45°
c
A A2
φ
β L A1

Pitch p .050 1.27
Overall Height A .093 .099 .104 2.36 2.50 2.64
Standoff § A1 .004 .008 .012 0.10 0.20 0.30
Overall Width E .394 .407 .420 10.01 10.34 10.67
Overall Length D .446 .454 .462 11.33 11.53 11.73
Foot Length L .016 .033 .050 0.41 0.84 1.27
Lead Thickness c .009 .011 .012 0.23 0.27 0.30
Lead Width B .014 .017 .020 0.36 0.42 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-051

E1
p
2
B n 1
h
α
45°
c
A A2
φ
β L A1

Pitch p .050 1.27
Overall Height A .093 .099 .104 2.36 2.50 2.64
Standoff § A1 .004 .008 .012 0.10 0.20 0.30
Overall Width E .394 .407 .420 10.01 10.34 10.67
Overall Length D .496 .504 .512 12.60 12.80 13.00
Foot Length L .016 .033 .050 0.41 0.84 1.27
Lead Thickness c .009 .011 .013 0.23 0.28 0.33
Lead Width B .014 .017 .020 0.36 0.42 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-094

E
E1
p
B
2
n 1
h
α
45°
c
A A2
φ
β L A1

Pitch p .050 1.27
Overall Height A .093 .099 .104 2.36 2.50 2.64
Standoff § A1 .004 .008 .012 0.10 0.20 0.30
Overall Width E .394 .407 .420 10.01 10.34 10.67
Overall Length D .695 .704 .712 17.65 17.87 18.08
Foot Length L .016 .033 .050 0.41 0.84 1.27
Foot Angle Top φ 0 4 8 0 4 8
Lead Thickness c .009 .011 .013 0.23 0.28 0.33
Lead Width B .014 .017 .020 0.36 0.42 0.51
Notes:
.010” (0.254mm) per side.
Drawing No. C04-052

8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
E
B p
E1
n
L
D1 D D2
PIN 1
EXPOSED
ID
METAL
1 2
PADS
E2
TOP VIEW
BOTTOM VIEW
A2
A3
A1

Overall Height A .033 .039 0.85 1.00
Standoff A1 .000 .0004 .002 0.00 0.01 0.05
Base Thickness A3 .008 REF. 0.20 REF.
Overall Length E .194 BSC 4.92 BSC
Molded Package Length E1 .184 BSC 4.67 BSC
Exposed Pad Length E2 .152 .158 .163 3.85 4.00 4.15
Overall Width D .236 BSC 5.99 BSC
Molded Package Width D1 .226 BSC 5.74 BSC
Exposed Pad Width D2 .085 .091 .097 2.16 2.31 2.46
Lead Width B .014 .016 .019 0.35 0.40 0.47
Lead Length L .020 .024 .030 0.50 0.60 0.75
Tie Bar Width R .014 .356
Mold Draft Angle Top α 12 12
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113

28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
E EXPOSED
METAL
E1 PADS
D1 D D2
p
2
1 B
n
R
E2
CH X 45° L
TOP VIEW BOTTOM VIEW
α
A2 A
A1
A3

Overall Height A .033 .039 0.85 1.00
Standoff A1 .000 .0004 .002 0.00 0.01 0.05
Base Thickness A3 .008 REF 0.20 REF
Overall Width E .236 BSC 6.00 BSC
Molded Package Width E1 .226 BSC 5.75 BSC
Exposed Pad Width E2 .140 .146 .152 3.55 3.70 3.85
Overall Length D .236 BSC 6.00 BSC
Molded Package Length D1 .226 BSC 5.75 BSC
Exposed Pad Length D2 .140 .146 .152 3.55 3.70 3.85
Lead Width B .009 .011 .014 0.23 0.28 0.35
Lead Length L .020 .024 .030 0.50 0.60 0.75
Tie Bar Width R .005 .007 .010 0.13 0.17 0.23
Tie Bar Length Q .012 .016 .026 0.30 0.40 0.65
Chamfer CH .009 .017 .024 0.24 0.42 0.60
Mold Draft Angle Top α 12° 12°
Notes:
JEDEC equivalent: mMO-220
Drawing No. C04-114

28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Saw Singulated (QFN)
E E2
EXPOSED
METAL
PAD
D D2
2 B
OPTIONAL ALTERNATE SEE DETAIL

INDEX L
INDEX
TOP VIEW AREA INDICATORS BOTTOM VIEW
A1
DETAIL
ALTERNATE
PAD OUTLINE

Overall Height A .031 .035 .039 0.80 0.90 1.00
Standoff A1 .000 .001 .002 0.00 0.02 0.05
Overall Width E .232 .236 .240 5.90 6.00 6.10
Overall Length D .232 .236 .240 5.90 6.00 6.10
Lead Width B .009 .011 .013 0.23 0.28 0.33
Lead Length L .020 .022 .024 0.50 0.55 0.60
Notes:
JEDEC equivalent: mMO-220
Drawing No. C04-105

44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
E EXPOSED
METAL
PAD
D D2
2 B
1
n
OPTIONAL PIN 1 PIN 1
INDEX ON E2
INDEX ON
TOP MARKING EXPOSED PAD L
A
A1
A3

Overall Height A .031 .035 .039 0.80 0.90 1.00
Standoff A1 .000 .001 .002 0 0.02 0.05
Base Thickness A3 .010 REF 0.25 REF
Lead Width B .012 .013 .013 0.30 0.33 0.35
Lead Length L .014 .016 .018 0.35 0.40 0.45
Notes:
JEDEC equivalent: M0-220
Drawing No. C04-103

8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x1 mm Body (DFN)
E
p
b
n
D D2
EXPOSED PIN 1
METAL ID INDEX
2 1
PAD AREA
E2 (NOTE 2)
A
A1
A3
EXPOSED
TIE BAR
(NOTE 1)

Overall Height A .031 .035 .039 0.80 0.90 1.00
Standoff A1 .000 .001 .002 0.00 0.02 0.05
Lead Thickness A3 .008 REF. 0.20 REF.
Overall Length E .118 BSC 3.00 BSC
Exposed Pad Length (Note 4) E2 .055 .096 1.39 2.45
Overall Width D .118 BSC 3.00 BSC
Exposed Pad Width (Note 4) D2 .047 .069 1.20 1.75
Lead Width b .007 .010 .015 0.23 0.26 0.37
Lead Length L .012 .019 .022 0.30 0.48 0.55
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
4. Exposed pad dimensions vary with paddle size.
5. JEDEC equivalent: Pending
Drawing No. C04-062

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E1
D
2
B
n 1
A A2
c
φ
A1
(F) L
β

Overall Height A - - .043 - - 1.10
Standoff A1 .000 - .006 0.00 - 0.15
Overall Width E .193 TYP. 4.90 BSC
Foot Length L .016 .024 .031 0.40 0.60 0.80
Footprint (Reference) F .037 REF 0.95 REF
Foot Angle φ 0° - 8° 0° - 8°
Lead Thickness c .003 .006 .009 0.08 - 0.23
Lead Width B .009 .012 .016 0.22 - 0.40
Mold Draft Angle Top α 5° - 15° 5° - 15°
Mold Draft Angle Bottom β 5° - 15° 5° - 15°
Notes:
Drawing No. C04-111

10-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E1
B 2
n 1
α
A
φ
c
A2
A1
(F) L
β
L1

Pitch p .020 TYP 0.50 TYP.
Standoff A1 .000 - .006 0.00 - 0.15
Foot Length L .016 .024 .031 0.40 0.60 0.80
Footprint F .037 REF 0.95 REF
Foot Angle φ 0° - 8° 0° - 8°
Lead Thickness c .003 - .009 0.08 - 0.23
Lead Width B .006 .009 .012 0.15 0.23 0.30
Mold Draft Angle Top α 5° - 15° 5° - 15°
Mold Draft Angle Bottom β 5° - 15° 5° - 15°
Notes:
Drawing No. C04-021

20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
E1
p
B 2
n 1
c
A A2
L A1
β

Pitch p .026 0.65
Overall Height A .068 .073 .078 1.73 1.85 1.98
Standoff § A1 .002 .006 .010 0.05 0.15 0.25
Overall Width E .299 .309 .322 7.59 7.85 8.18
Overall Length D .278 .284 .289 7.06 7.20 7.34
Foot Length L .022 .030 .037 0.56 0.75 0.94
Lead Thickness c .004 .007 .010 0.10 0.18 0.25
Foot Angle φ 0 4 8 0.00 101.60 203.20
Lead Width B .010 .013 .015 0.25 0.32 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-072

28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
E1
p
B
2
n 1
α
A
c
A2
φ A1
L
β

Pitch p .026 0.65
Overall Height A .068 .073 .078 1.73 1.85 1.98
Standoff § A1 .002 .006 .010 0.05 0.15 0.25
Overall Width E .299 .309 .319 7.59 7.85 8.10
Overall Length D .396 .402 .407 10.06 10.20 10.34
Foot Length L .022 .030 .037 0.56 0.75 0.94
Lead Thickness c .004 .007 .010 0.10 0.18 0.25
Foot Angle φ 0 4 8 0.00 101.60 203.20
Lead Width B .010 .013 .015 0.25 0.32 0.38
Notes:
.010” (0.254mm) per side.
Drawing No. C04-073

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E1
D
2
1
n
B
α
A
φ A1 A2
β
L

Pitch p .026 0.65
Overall Height A .043 1.10
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Overall Width E .246 .251 .256 6.25 6.38 6.50
Foot Length L .020 .024 .028 0.50 0.60 0.70
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .010 .012 0.19 0.25 0.30
Notes:
.005” (0.127mm) per side.
Drawing No. C04-086

E1
2
n 1
B
α
A
β A1 A2
L

Pitch p .026 0.65
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Overall Width E .246 .251 .256 6.25 6.38 6.50
Foot Length L .020 .024 .028 0.50 0.60 0.70
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .010 .012 0.19 0.25 0.30
Notes:
.005” (0.127mm) per side.
Drawing No. C04-087

p E1
D
B
2
n 1
α
A
φ
A2
β
L A1

Pitch p .026 0.65
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Overall Width E .246 .251 .256 6.25 6.38 6.50
Foot Length L .020 .024 .028 0.50 0.60 0.70
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .010 .012 0.19 0.25 0.30
Notes:
.005” (0.127mm) per side.
Drawing No. C04-088

28-Lead Plastic Thin Small Outline (TS) – 5 x 20 mm (TSOP)
E1 3xp
p
2
1
n
B
α
A
c
φ A2
β L A1

Pitch p .020 0.50
Overall Height A .039 .045 .051 0.99 1.14 1.30
Standoff § A1 .002 .006 .010 0.05 0.15 0.25
Overall Width E .780 .787 .795 19.80 20.00 20.20
Foot Length L .020 .024 .028 0.50 0.60 0.70
Lead Thickness c .004 .006 .008 0.10 0.15 0.20
Lead Width B .006 .008 .010 0.15 0.20 0.25
Notes:
.005” (0.127mm) per side.
EIAJ Equivalent: IC-74-2-3
Drawing No. C04-067

28-Lead Plastic Very Small Outline (VS) – 8 x 13.4 mm (VSOP)
E1
p
2
1 D
n
α
A
c
β L A1 A2

Pitch p .022 0.55
Overall Height A .039 .045 .051 0.99 1.14 1.29
Standoff § A1 .002 .005 .010 0.05 0.13 0.25
Overall Width E .520 .528 .535 13.20 13.40 13.60
Foot Length L .012 .020 .028 0.30 0.50 0.70
Lead Thickness c .006 .006 .006 0.14 0.15 0.16
Lead Width B .007 .008 .009 0.17 0.20 0.23
Notes:
.005” (0.127mm) per side.
Drawing No. C04-075

32-Lead Plastic Low Profile Quad Flatpack (PL) 7x7x1.4 mm Body, 1.0/0.10 mm Lead Form (LQFP)
E
E1
D1 D
2
B 1
CHAMFER
VARIES n
A2
φ
c A
L A1
β (F)

Pitch p .031 BSC. 0.80 BSC
Standoff A1 .002 - .006 0.05 - 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Footprint (F) .039 (REF.) 1.00 (REF.)
Foot Angle φ 0° 3.5° 7° 0° 3.5° 7°
Overall Width E .354 BSC. 9.00 BSC.
Overall Length D .354 BSC. 9.00 BSC.
Molded Package Width E1 .276 BSC. 7.00 BSC.
Molded Package Length D1 .276 BSC. 7.00 BSC.
Lead Thickness c .004 - .008 0.09 - 0.20
Lead Width B .012 .015 .018 0.30 0.37 0.45
Mold Draft Angle Top α 11° 12° 13° 11° 12° 13°
Mold Draft Angle Bottom β 11° 12° 13° 11° 12° 13°
Notes:
JEDEC Equivalent: MS-026 BBA
Drawing No. C04-045

44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form (MQFP)
E
E1
#leads=n1
D1 D
2
1
B
n
CH x 45°
α
c A1
A
β L φ (F) A2

Pitch p .031 0.80
Overall Height A .079 .086 .093 2.00 2.18 2.35
Standoff § A1 .002 .006 .010 0.05 0.15 0.25
Foot Length L .029 .035 .041 0.73 0.88 1.03
Footprint (Reference) (F) .063 1.60
Foot Angle φ 0 3.5 7 0 3.5 7
Overall Width E .510 .520 .530 12.95 13.20 13.45
Overall Length D .510 .520 .530 12.95 13.20 13.45
Lead Thickness c .005 .007 .009 0.13 0.18 0.23
Lead Width B .012 .015 .018 0.30 0.38 0.45
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-071

44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
D1 D
2
1
B
n
CH x 45 °
α
A
φ
β A1 A2
L
(F)

Pitch p .031 0.80
Overall Height A .039 .043 .047 1.00 1.10 1.20
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle φ 0 3.5 7 0 3.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .012 .015 .017 0.30 0.38 0.44
Notes:
.010” (0.254mm) per side.
Drawing No. C04-076

E
E1
#leads=n1
D1 D
2
1
B
n
CH x 45 °
α
A
c
A2
L φ
β A1
(F)

Pitch p .020 0.50
Overall Height A .039 .043 .047 1.00 1.10 1.20
Standoff § A1 .002 .006 .010 0.05 0.15 0.25
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle φ 0 3.5 7 0 3.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Lead Thickness c .005 .007 .009 0.13 0.18 0.23
Lead Width B .007 .009 .011 0.17 0.22 0.27
Notes:
.010” (0.254mm) per side.
Drawing No. C04-085

E
E1
#leads=n1
D1 D
2
B 1
n
CH x 45 °
A α
c
β φ A2
L A1
(F)

Pitch p .020 0.50
Overall Height A .039 .043 .047 1.00 1.10 1.20
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle φ 0 3.5 7 0 3.5 7
Overall Width E .541 .551 .561 13.75 14.00 14.25
Overall Length D .541 .551 .561 13.75 14.00 14.25
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .009 .011 0.17 0.22 0.27
Notes:
.010” (0.254mm) per side.
Drawing No. C04-092

100-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
D1 D
2
1
A α
c
β φ A2
L A1
(F)

Pitch p .020 0.50
Standoff § A1 .002 .006 0.05 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle φ 0 3.5 7 0 3.5 7
Molded Package Length D1 .551 BSC 14.00 BSC
Lead Thickness c .004 .008 0.09 0.20
Lead Width B .007 .009 .011 0.17 0.22 0.27
Notes:
.010” (0.254mm) per side.

Drawing No. C04-110

PACKAGING
Product Tape and Reel Specifications
FIGURE 1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16, AND 24 MM TAPE ONLY)
Top
Cover
Tape A0
W
K0 B0
TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS

Carrier Cavity
Dimensions Dimensions Output Reel
Case Package
Quantity Diameter in
Outline Type W P A0 B0 K0 Units mm
mm mm mm mm mm
SN SOIC .150” 8L 12 8 6.4 5.2 2.1 3300 330
SO SOIC .300” 16L 16 12 10.9 10.7 3.0 1000 330
SO SOIC .300” 18L 24 12 10.9 13.3 3.0 1600 330
24 16 11.1 12.0 2.8 1100 330
SO SOIC .300” 20L 24 12 10.9 13.3 3.0 1600 330
SO SOIC .300” 24L 24 12 10.9 16.0 3.0 1000 330
SO SOIC .300” 28L 24 12 10.9 18.3 3.0 1600 330
24 12 11.1 18.5 3.0 1600 330
L PLCC 28L 24 16 13.0 13.0 4.9 750 330
L PLCC 32L 24 16 13.1 15.5 3.9 900 330
L PLCC 44L 32 24 18.0 18.0 4.9 500 330
32 24 18.0 18.0 5.0 500
L PLCC 68L 44 32 25.6 25.6 5.8 300 330
L PLCC 84L 44 36 30.7 30.7 5.8 200 330
SM SOIC .208” 8L 16 12 8.3 5.7 2.3 2100 330
SL SOIC .150” 14L 16 8 6.5 9.5 2.1 2600 330
SL SOIC .150” 16L 16 8 6.5 10.3 2.1 2600 330
TS TSOP 28L/32L 32 16 8.6 20.6 2.1 1500 330
SS SSOP 20L 16 12 8.4 7.7 2.5 1600 330
SS SSOP 28L 24 12 8.4 10.9 2.4 2100 330
PQ MQFP 44L 24 24 14.2 14.2 2.8 900 330
PT TQFP 44L/64L 24 16 12.4 12.4 2.2 1200 330
VS VSOP 28L 24 12 8.7 13.9 2.1 2500 330

Packaging
TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS (CONTINUED)
Carrier Cavity
Dimensions Dimensions Output Reel
Case Package
Quantity Diameter in
Outline Type W P A0 B0 K0 Units mm
mm mm mm mm mm
ST TSSOP 8L 12 8 7.0 3.6 1.6 2500 330
ST TSSOP 14L 16 8 6.8 5.4 1.6 2500 330
ST TSSOP 20L 16 8 6.8 6.9 1.6 2500 330
TT SOT-23 3L 8 4 3.15 2.77 1.22 3000 180
OT SOT-23 5L 8 4 3.2 3.2 1.4 3000 180
MS MSOP 8L/10L 12 8 5.3 3.6 1.4 2500 330
LT SC-70 5L 8 4 2.24 2.34 1.22 3000 180
MF DFN 3x3 12 8 3.3 3.3 1.1 3300 330
MF DFN 5x6 12 8 5.3 6.3 1.2 3300 330
ML QFN 6x6 16 12 6.3 6.3 1.1 1600 330
ML QFN 8x8 16 12 8.3 8.3 1.1 1600 330
FIGURE 2: SOP, SOIC, MSOP, QSOP DEVICES
User Direction of Feed
W, Width
Pin 1 of Carrier
Tape
Pin 1
P, Pitch
Standard Reel Component Orientation Reverse Reel Component Orientation
FIGURE 3: 3L SOT-23/SC-70 DEVICES
Marking
Device User Direction of Feed Device
Marking
W, Width
Pin 1 of Carrier
Tape
Pin 1
P, Pitch

Packaging
FIGURE 4: 5L SOT-23/SC-70 DEVICES
Device
Marking User Direction of Feed
Pin 1 W, Width
of Carrier
Tape
Pin 1
P, Pitch
FIGURE 5: 6L SOT-23 DEVICES
Device User Direction of Feed

Marking
W, Width
Pin 1 of Carrier
Tape
Pin 1
P, Pitch

Packaging

Marking
W, Width
Pin 1 of Carrier
Tape
Pin 1
P, Pitch
FIGURE 7: PLCC DEVICES
W, Width
Pin 1 of Carrier
Tape
Pin 1
P, Pitch

Packaging
FIGURE 8: MQFP DEVICES
Pin 1 W, Width
of Carrier
Tape
Pin 1
P, Pitch

Marking
W, Width
Pin 1 of Carrier
Tape
Pin 1
P, Pitch

Packaging
FIGURE 10: 3L/5L/7L DDPAK AND 3L DPAK DEVICES
Device
User Direction of Feed Marking
W, Width
Leaded of Carrier
side should Tape
be placed
toward
sprocket
hole Leaded side
P, Pitch should be placed
opposite to
sprocket hole
FIGURE 11: SOT-89 DEVICES
W, Width
Pin 1 of Carrier
Tape
Pin 1
P, Pitch
FIGURE 12: DFN/QFN DEVICES
Pin 1

Packaging
FIGURE 13: TO-92 DEVICES
P, Pitch
Device
Marking
3 LEAD
TO-92
W, Width of
Carrier Tape
Device
Marking
2 LEAD
TO-92
W, Width of
Carrier Tape
Standard Reel Reverse Reel

Component Orientation Component Orientation
H1
H W6
H0
D F1 F
F2 P1
P2

Packaging
DIMENSIONS AND TOLERANCES
All component taping diagrams, dimensions, toler-
ances, and component positioning requirements are
those which are specified per EIA Standard EIA-481,
current revision.
For the 8-lead SOIC EIAJ Type II Package and 16 mm
Carrier Tape width, the component taping diagrams,
dimensions, and tolerances, and component position-
ing requirements are those which are specified per
EIAJ Standard RC-1009B, current revision.

PACKAGING
Thermal Characteristics
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Average Junction Temperature TJ TA + (PD x Θja) °C
Ambient Temperature TA User Determined °C
Total Power Dissipation1 PD PINT + PI/O W
Device Internal Power Dissipation PINT IDD X VDD W
I/O Pin Power Dissipation PI/O User Determined W

Packaging
THERMAL RESISTANCE
ΘJc ΘJa
Item Leads Package Package Body
(°C/W) (°C/W)
8 PDIP .300” 41.2 84.6
14 PDIP .300” 32.5 69.8
16 PDIP .300” 34.1 69.9
18 PDIP .300” 29.4 65.9
20 PDIP .300” 28.1 62.4
24 PDIP .600” 21 63
28 PDIP .600” 31.4 59.1
28 SPDIP .300” 29 60
40 PDIP .600” 24.7 47.2
8 SOIC .150” 38.8 163
8 SOIC .208” 27.98 117.55
16 SOIC .300” 24.8 89.6
18 SOIC .300” 24.6 63.6
20 SOIC .300” 24.2 85.2
28 SOIC .300” 23.8 80.2
8 MSOP .118” 39.1 206.3
8 TSSOP 4.4 mm 36.6 123.7
Package Thermal 14 TSSOP 4.4 mm 31.7 100.4
Resistance(2) 20 TSSOP 4.4 mm 17 90.2
28 TSSOP 4.4 mm 13.3 75.5
20 SSOP .209” 32.2 108.1
28 SSOP .209” 23.9 89.4
3 SOT-23 110.12 336
5 SOT-23 81 255.9
3 TO-92 66.3 131.9
20 PLCC 37.6 62.5
28 PLCC 25.4 50.4
32 PLCC 22.7 52.4
44 PLCC 20.6 45.4
68 PLCC 16.1 39.3
84 PLCC 11.4 35.8
44 TQFP 10x10x1 mm 14.5 45.79
64 TQFP 10x10x1 mm 24.4 76.6
80 TQFP 12x12x1 mm 24.4 69.4
100 TQFP 14x14x1 mm 24.4 50
44 MQFP 10x10x2 mm 14.8 57.8
Note 1: Approximate value, disregarding PI/O.

2: All thermal resistance values are estimated and are dependent on die and materials used. Variables include
die and leadframe paddle sizes. Relative values are taken in still air.

PACKAGING
Overview of Microchip Die/Wafer Support
INTRODUCTION ELECTRICAL SPECIFICATIONS

Microchip Technology Inc. devices are available in The functional and electrical specifications of Microchip
wafer form and in die form. All products sold in die or devices in die form are identical to those of a packaged
wafers have been characterized and qualified accord- version. Please refer to individual data sheets for
ing to the requirements of Microchip Technology Inc. complete details.
Specifications SPI-41014, “Characterization and
Qualification of Integrated Circuits,” and QCI-39000, QTP
“Worldwide Quality Conformance Requirements.”
Quick-Turnaround-Production (QTP) applies only to
PRODUCT INTEGRITY EPROM and EEPROM microcontrollers.
With QTP devices, the program memory array is only
Product supplied in die or wafer form are fully tested tested against the code provided. This method ensures
and characterized. Die or Wafers are inspected to that the device will operate correctly as programmed,
Microchip Technology Inc. Specification, QCI-30014. but does not ensure that every program memory bit can
CAUTION be programmed to every state.
Some EEPROM devices use EPROM cells for Note: Do not erase QTP devices and program
device configuration. Exposure to ultraviolet light them with a different code.
must be avoided. Exposure to ultraviolet light
may cause the device to operate improperly. EPROM
Extreme care is urged in the handling and EPROM devices are supplied as fully erased
assembly of these products since they are programmable parts that are UV erasable and re-
susceptible to damage from electro-static programmable by the user (except for QTP and SQTP
discharge. devices).
ORDERING INFORMATION EEPROM
Die sales must be conducted by contacting your EEPROM devices may not be supplied in a fully erased
Microchip Sales Office. state, but are reprogrammable by the user (except for
To order or obtain information (on pricing or delivery) QTP and SQTP devices).
for a specific device, use one of the following part
numbers: ROM
Devices in Waffle Pack ROM devices are supplied as fully programmed parts
DEVICE_NUMBER/S (program memory only). These are not
Devices in Wafer form reprogrammable by the user.
DEVICE_NUMBER/W
DEVICE_NUMBER/WF DIE MECHANICAL SPECIFICATIONS
where DEVICE_NUMBER is the device that you Refer to the individual data sheet for these
require. The S specifies die in a waffle pack while a W specifications.
specifies wafer sales, and WF specifies sawn wafer on
frames.

Packaging
BOND PAD COORDINATES SHIPPING OPTIONS
The die figures have associated bond pad coordinates. Die Form Shipping
These coordinates assist in the attaching of the bond
Microchip product in die form can be shipped in waffle
wire to the die. All the dimensions of these coordinates
pack. The waffle pack has sufficient cavity area to
are in micrometers (µm) unless otherwise specified.
restrain the die, while maintaining their orientation. Lint
The origin for the coordinates is the center of the die,
free paper inserts are placed over the waffle packs, and
as shown in Figure 1. Refer to the Microchip Die
each pack is secured with a plastic locking clip. Groups
Specification sheet for openings and pitch.
of waffle packs are assembled into sets for shipment. A
FIGURE 1: DIE COORDINATE ORIGIN label with lot number, quantity, and part number is
attached.
These waffle packs are hermetically sealed in bags.
Origin (0,0)
Wafer Form
DIE
Products may also be shipped in wafer form (see order-
ing information). Wafers are shipped in a wafer tub. The
tub is padded with non-conductive foam. Lint free
paper inserts are placed around each wafer. A label
with lot number, quantity, and part number is attached.
Sawn Wafer on Frames
Products may also be shipped on wafer frames. Wafers
Bottom Left Top Right are mounted on plastic frames and 100% sawn
(x,y) †
(x,y) † through. Sawn wafer on frames may be shipped in bulk
† All dimensions in µm unless specified otherwise. (25 wafers per carrier) or in a single wafer in a carrier.
A label with lot number, quantity, and part number is
The die is capable of thermosonic gold or ultrasonic attached with each shipment.
wire bonding. Die meet the minimum conditions of Storage Procedures
MIL-STD 883, Method 2011 on “Bond Strength
(Destructive Bond Pull Test)”. The Bond Pad Temperature and humidity greatly affect the storage life
metallization is silicon doped aluminum. of die. It is recommended that the die be used as soon
as possible after receipt.
SUBSTRATE BONDING Upon receipt, the sealed bags should be stored in a
cool and dry environment (25°C and 25% relative
Substrate bonding may be required on certain product humidity). In these conditions, sealed bags have a shelf
families. For more information refer to the die life of 12 months. Temperatures or humidities greater
specification sheet. than these will reduce the storage life.
Once a bag containing waffle packs has been opened,
the devices should be assembled and encapsulated
within 48 hours (assuming, 25°C and 25% humidity).

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Microchip PackagingReference

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SECTION 11

Outlines and Parameters ............................................................................................................................. 1

 2003 Microchip Technology Inc. DS00049W-page i

CERAMIC DUAL IN-LINE (CERDIP) FAMILY

8-Lead Ceramic Dual In-line (JA) – 300 mil (CERDIP) ......................................................................... 6

CERAMIC CHIP CARRIER (CERQUAD) FAMILY

SMALL OUTLINE TRANSISTOR FAMILY

3-Lead Plastic Transistor Outline (TO) (TO-92) ............................................................................. 21

DOUBLE DECA-WATT PACKAGE (DDPAK) FAMILY

3-Lead Plastic (EB) (DDPAK) ............................................................................................................. 29

DS00049W-page ii  2003 Microchip Technology Inc.

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) ................................................................................ 32

PLASTIC LEADED CHIP CARRIER (PLCC) FAMILY

20-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) ............................................................... 43

PLASTIC SMALL OUTLINE (SOIC) FAMILY

PLASTIC MICRO SMALL OUTLINE (MSOP) FAMILY

8-Lead Plastic Micro Small Outline Package (MS) (MSOP) ............................................................... 62

PLASTIC SHRINK SMALL OUTLINE (SSOP) FAMILY

 2003 Microchip Technology Inc. DS00049W-page iii

28-Lead Plastic Thin Small Outline (TS) – 5 x 20 mm (TSOP) ........................................................... 69

PLASTIC LOW PROFILE QUAD FLATPACK (LQFP) FAMILY

32-Lead Plastic Low Profile Quad Flatpack (PL) 7x7x1.4 mm Body,

PLASTIC QUAD FLATPACK (MQFP) FAMILY

44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body,

PLASTIC THIN QUAD FLATPACK (TQFP) FAMILY

DS00049W-page iv  2003 Microchip Technology Inc.

QTP, SQTP or ROM Code; Special Requirements

Speed: OR Crystal Frequency Designator for PICmicro® MCUs

Device Type: (Up to 10 digits)

 2003 Microchip Technology Inc. DS00049W-page 1

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