IC PACKAGES

-by Sudha

[DATE]
[COMPANY NAME]
[Company address]
 Types of IC Packages

Types of IC packages are broadly classified based on Package to Board connections as

Through hole and Surface mount Technology.
Through Hole:
-classical approach
-uses leads mounded into holes on PCB.
-provides strong mechanical bonds
Surface Mount Technology (SMT):
-Components are mounted directly on PCB
Advantages:
-in Surface Mount better use of board area
-components can be placed on both side of circuit board
Disadvantages:
-Manufacturing process is much sophisticated
-can’t directly used with breadboards
-solder connections may damage easily when temperature increases

Different Types of SMT leads:

1. Gull-wing SMT package lead
-Drawback in soldering issues
2. J-Lead SMT package lead
-Less Board spacing than Gull-wing

3. Solder Balls
-used in Ball Grid Array (BGA)
-more robust
-convenient for IC with large number of pins
Various IC packages are described below:
1. DIP-Dual In-Line Packages:

-with two rows of leads on two sides of the package

-Each of the pins on a DIP IC are spaced by 100 mils (3.9mm)
-Pin counts can be 4 to 64
-can be Plastic or ceramic
-through - hole mounted
-usually referred to as a DIPn, where n is the total number of pins
Advantages:
-Lowest implementation cost
-highly reliable
Disadvantages:
-less pin count (only 64)
-not surface mountable
2. ZIP – Zig-Zag In-Line Package:
-not commonly used
3. SOP – Small Outline Package:
-Surface mounted
-occupies less area than DIP

-SOP includes a large family of packages:

1. SOIC – Small Outline Integrated Circuit
-2 different standards are JEDEC and EIAJ
-EIAJ is approximately 5.3 mm (0.21 in) wide
-JEDEC is approximately 3.8 mm (0.15 in) wide
2. SSOP – Shrink Small Outline Package
-have Gull-wing leads
-Applications in pagers, portable audio/video, disc drives, radio, RF devices and
telecom
3. QSOP – Quarter‐size Small Outline Package
4. TSOP-Thin Small Outline package
-Surface mounted
-used for RAM and Flash IC due to high pin count and small volume
 5. TSSOP – Thin Shrink Small Outline Package
- suited for memory modules, Comparators and gate drivers
a) Type I TSSOP has legs protruding from the width portion of the package
b) Type II TSSOP has the legs protruding from the length portion of the package
6. MSOP – Mini Small Outline Package
4. SOJ – Small Outline J-lead:
- term Small Outline refers to the width of the component body
-‘J’ leads on both sides
-surface mounted

5. SIP-SINGLE IN-LINE PACKAGES:

-used for packaging RAM chips and multiple resistor with a common pin
-24 I/O counts
 6. QUIP-Quad Inline Package:

-Packages with staggered leads

-reduces pitch wiring
7. FP-Flat Package :
- is a rectangular or square package
-with leads parallel to base plane attached on two opposing sides
-used in early military and Space Applications
-pitch is 50 mils
Advantages:
-low Material cost
-solder joints visible
Disadvantages:
-pin count limitations
-handling during soldering and rework is difficult
8. QFP-Quad Flat Package :
-has gull-wing leads
- 2.0 to 3.8 mm thick
-they have Expose pad, an extra pad above or below the QFP acts as a heat sink or
ground connection
-common in modern electronics

a) TQFP-Thin Quad Flat Package :

-typical thickness is 1.0mm and 2.0mm lead footprint
-package material is plastic
-reduces board density

b) BQFPH - Bumpered Quad Flat Pack with Heat spreader:

-uses pin protectors at corners
- has heat spreaders to enable larger levels of power to be dissipated
c) CQFP - Ceramic Quad Flat Pack:
-high quality version
 d) HQFP - Heat sinked Quad Flat Pack:
- Thin pins in the center of opposing sides are replaced with a thicker pin which is
soldered to a large pad on the PCB with a large area of copper connected to it. This will remove
a significant amount of heat.
e) LQFP - Low profile Quad Flat Pack:
- Thinner with a thickness or height of 1.4mm
- 2.0mm lead footprint
- Lead counts ranges from 32-256
- Body sizes range from 5 x 5mm to 28 x 28mm

f) PQFP - Plastic Quad Flat Pack:

- Thickness from 2mm up-to 3.8mm
9. PLCC – Plastic Leaded Chip Carrier:
-Also called QFJ-Quad Flat J lead
- A reduced cost evolution of the ceramic leadless chip carrier (CLCC)
-used in ROMs and controllers
10. LCC- Leadless Chip Carrier:
-no leads
-has round pins at edges of ceramic or plastic packages

11. PGA-Pin Grid Arrays:

- is a rectangular or square package
-with terminals attached perpendicular to a major surface in a grid matrix
-available with heatsinks to remove heat generated in package
-400+ pins connections are possible
12. BGA – Ball Grid Arrays:
-high Volume and high pin count
-200-500 I/O s is common
-Good heat conduction into PCB board
-Difficult to Solder and replace