KHENJIE LORENO. RESMA.

OCTOBER 12, 2022

BET-CPET 2C.
PROFESSOR. CASUAT

ASSIGNMENT-IC
INSTRUCTIONS:
1. WHAT IS AN IC?
2. ORIGIN OF IC
3. WHAT ARE THE DIFFERENT IC PACKAGING? GIVE AN EXAMPLE OF IC
PACKAGING

1. WHAT IS AN IC?
An integrated circuit (IC), sometimes called a chip, microchip or microelectronic
circuit, is a semiconductor wafer on which thousands or millions of tiny
resistors, capacitors, diodes and transistors are fabricated.

2. ORIGIN OF IC
Robert Noyce invented the first monolithic integrated circuit chip at Fairchild
Semiconductor in 1959. It was made from silicon, and was fabricated using
Jean Hoerni’s planar process and Mohamed Atalla’s surface passivation
process.

3. WHAT ARE THE DIFFERENT IC PACKAGING? GIVE AN EXAMPLE

OF IC PACKAGING
The packages are classified into two kinds on the basis of how they are
mounted on a circuit board

 Through-Hole Mount Packages

 They are designed in a way that the lead pins are stuck through one side of the
board and soldered on the other. They are bigger in size as compared to the
other kind. These are majorly used in electronic equipment to compensate for
the board space and cost limitations. Dual inline packages are one of the
examples of through-hole mount packages.

 To add on to that classification, Through-hole mount packages come in

ceramic and plastic types.

 These are the most significantly used IC packages is Dual Inline Packages (DIP).
Just like in 28-pin ATmega328, the pins are placed in parallel to each other
extending perpendicularly and laid out on a black plastic housing which is
rectangular in shape. The pins are spaced at 0.1 inches. Furthermore, the
package varies in size due to the difference in the number of pins in different
packages. The number ranges from 4 to 64. These pins are placed in a manner
that they can be adjusted on to the center of a breadboard without short-
circuiting each other or even get smoldered into PCBs.

 There are many types of DIP Packages, Plastic Dual In-Line Package (PDIP) and
Molded Dual In-Line Package (MDIP) are the few popular types. Further, it can
be classified as-

 Standard – This is the most common packaging. The pins are spaced 0.1”
apart.

 Skinny – In this packaging, the space between the terminal rows is 7.62mm.

 Shrink – Similar to the standard ones but the lead pitch is 1.778 mm. Smaller in
size, they use high pin density packaging.

 Zig-Zag in Line Packages (ZIP)- The pins in this kind of a package are inserted
perpendicularly to the circuit board. These pins are perpendicularly aligned in
the package and closer to each other. This sort of packaging was short-lived
and was mainly used in dynamic RAM chips. Other types of through holed
packages include CER-DIP in which the lead pitch is 2.54mm and the body is
molded with ceramics. Also, the sealing material used in this is glass. Pin Grid
Array (PGA) in the lead pitch is 2.54 mm, and the body is made out of
 ceramics. The pins are arranged vertically from the body and can be placed on
a grid. This one usually suits a multi-pin packaging.

 Surface Mount Packaging

 Surface mount packaging follows the technology of mounting or placing the
components directly on the printed circuit board surface. Although this
process of fabrication helps do things quickly, it also increases the chances of
defects. This is because of the miniaturization of components and also because
they are mounted extremely close to each other. This, in turn, results in
making it extremely important to detect the failure in the entire process.
Again, Surface mount packaging also uses ceramic or plastic molding.
 The different types of surface mount packages that use plastic molds are as
following-

 Small outline L-leaded package- This type has gull-wing type leads that draw
out on either direction from the body in an L fashion and can be mounted
directly on the board.
 Quad Flat L-leaded Packages (QFP)- These are similar to SOP. However, the
only difference is that the leads are drawn out in 4 directions instead of 2 and
are mounted directly on the board. They also come with a heat sink and built-
in heat spreader.

 Ball Grid Array (BGA) – These have solder ball arrays on the back surface of
PCBs.

 Fine Pitch Land Grid Array- These have solder land arrays on the back surface
of PCBs.

 Wafer Level Chip Size Package- Many Individual chips are made out of a
packaged wafer that is cut out.