SOIC Vs SSOP - What Are The Similarities and Differences Between These IC Packages

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SOIC Vs SSOP – What are the Similarities and Differences between these IC packages?
Integrated circuits are an integral part of electronic devices. These circuits
are commonly found in modern devices. They are responsible for the
compactness of electronic devices. Integrated circuits are the heart of
most printed circuit boards. These ubiquitous black chips are available on
almost every printed circuit board.
At least one IC is available in every electronics. ICs comprise a collection of
components such as capacitors, diodes, transistors, etc. These
components are all included in a tiny chip, which is the IC. Also, these
components are connected together to help the electronic device function
as expected. Integrated circuits have several types of packages. Examples
of these packages include SOIC, SSOP,TSSOP, and more.
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Table of Contents
What is the SOIC Package?
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SSOP
SOIC package is a type of surface mount integrated circuit that has a
rectangular body with leads protruding from two sides. The small outline
integrated circuit (SOIC) package has one of the easiest SMD parts that can

be soldered. Each pin on an SOIC package has a space of about 1.27mm
from the next.
The leads of the SOIC package are in a gull wing shape that enables
footing during PCB assembly. Due to the benefits and features of SOIC, it
is one of the most commonly used SMT IC packages today. One of the
benefits of this package is that it is JEDEC compliant. Also, this package is
available in various body widths. The most popular body width is 3.8mm
or 150 mils.
However, the standard lead pitch for SOIC package is 50 mils or 1,27mm.
This IC package is usually shipped in reel and tubes. SOIC is available in
various types which include the small outline J-leaded packages (SOJ), the
small mini outlines package (MSOP), the shrink small outlines packages
(SSOP), and the small thin outline integrated circuit package (TSOP).
These variants come with different structural measurements. However,
the SOIC features 1.25mm lead spacing . SOIC is standardized and
regulated in order to make installment an easy process. This IC package
comes with package information that has a prefix SO. The number after
the prefix is the pin count of the particular integrated circuit.
The small outline integrated circuit package is shorter than the dual inline
package (DIP). It is a surface mount IC package with its DIP bins shrunk

down to a smaller size. SOIC has an exposed pad which helps to improve
heat dissipation more than a standard TSSOP. This helps to increase the
operating parameters’ margin.
What are the Advantages of the SOIC package?
SOIC offers a lot of advantages. Compared to other IC packages, SOIC
provides more benefits. The most significant benefit of SOIC is
the footprint reduction. This is because space reduction helps in
fabricating smaller printed circuit boards. Also, SOIC minimized the cost of
fabricating integrated circuits since the materials used in the packaging
are reduced.
With the small outline IC package, it is easy to access small size
components by a machine during PCB assembly. This IC package makes
the fabrication of multilayer boards very easy since it is a surface mount IC
package type. Another advantage of SOIC is that it is suitable for
applications where low-cost solutions are required.
Furthermore, SOIC package makes use of at least 0.50-inch lead spacing.
This helps to ensure the pins or leads have enough spacing.
Features of SOIC Package
 It features gull wing lead configuration

 Multilayer ceramic package
 Comes with footprint similar to plastic SOP
 The leads of SOIC are gold plated
 It is a type of surface mount package with .050 inches as its lead
spacing
 SOIC is available in a few variants.
 The pin sizes and package size of SOIC have references
 SOIC comes with an identical pinout
SOIC Standards
The SOIC package is ideal for use in different applications. SOIC package
makes use of the JEITA and JEDEC standards. However, it is quite confusing
to decide which of these standards are better. JEITA is a standard set up by
the Japanese trade organization to evaluate the performance of specific
electronic s and the IT industries.
JEDEC, on the other hand, regulates the activities of
the semiconductor market. It oversees the standardization of
semiconductor part numbers and the Electrostatic Discharge (ESD)
standard. The best way to differentiate between JEITA and JEDEC SOIC is
the sizes. JEITA SOIC is smaller and lighter than JEDEC SOIC.

Also, the JEDEC standard is popularly used for manufacturing SOIC in the
U.S while JEITA is a standard set up and used for manufacturing SOIC in
Japan.
SSOP Meaning: What is SSOP Package?
The SSOP package is a variant of SOIC package. The shrink small-outline
package, popularly known as SSOP is a smaller type of SOIC package. It
integrates SMT in packaging integrated circuits. This variant of SOIC is
suitable for applications where optimum performance is crucial in IC
packaging that has tightened lead pitch.
The body size of SSOP is usually compressed to get a smaller version of
SOIC. Also, the lead pitch of SSOP is also tightened to achieve this smaller
version. The lead counts of SSOP is within the range of 8 to 64. Its body

size ranges from about 209 to 300 mils. One of the benefits of this IC
package is that it complies with standards like EIAJ and JEDEC.
This IC package offers a significant reduction in terms of size while
providing low-cost and value-added solutions for various applications. The
gull-wing leads of SSOP are extending from its longer sides. You will find
SSOP in end-products like disc drivers, RDF devices or components, radio,
and telecom. This compact IC packaging option comes with a lot of
benefits which include improved electrical performance and better heat
dissipation.
Furthermore, SSOP has solder plated leads which helps to ensure
excellent performance when used in some applications. SSOP package
features leads in both sides of periphery. Also, the lead pitch of this SSOP
is less than 1.0mm.
Features of SSOP
 The tube quantity varies
 The parts of this package are available on reel and tape according to
request
 Its body widths ranges from 209 to 300 mils
 The copper lead frames have high conductivity
 Also, its moisture sensitivity complies with JEDEC level 3

 Multi-die production capability
 The leadframe strips have higher density
 Comes with standard JECEC package outlines
SOIC vs SSOP Package
SOIC package is a type of surface mount integrated circuit that has a
rectangular body with leads protruding from two sides. The small outline
integrated circuit (SOIC) package has one of the easiest SMD parts that can
be soldered. Each pin on an SOIC package has a space of about 1.27mm
from the next.
The SSOP package is a variant of SOIC package. The shrink small-outline
package, popularly known as SSOP is a smaller type of SOIC package. It
integrates SMT in packaging integrated circuits. This variant of SOIC is
suitable for applications where optimum performance is crucial in IC
packaging that has tightened lead pitch.
The major difference between these IC packages is in their size and the
spacing between their leads. SOIC features 1.25mm lead spacing. Each
pin on an SOIC package has a space of about 1.27mm from the next. The
lead pitch of this SSOP is less than 1.0mm. On the other hand, standard
lead pitch for SOIC package is 50 mils or 1,27mm.

When comparing SOIC vs SSOP package, you will realize some similarities
between these two packages. This is because the SSOP package is a
smaller version of SOIC. Therefore, there are a few similarities these
packages share. SOIC vs SSOP compares the features, advantages, and
applications of these packages.
TSSOP Vs SSOP
TSSOP means thin shrink small outline package. This variant of SOIC
integrates surface mount technology to package integrated circuits. TSSOP
provides an efficient solution for installing ICs on PCBs. TSSOP looks like a
flat rectangular IC die fixed to a lead frame encapsulated in plastic
material. Also, the lead frame comprises elongated pins or leads arrange
along a package’s perimeter.
From its name, TSSOP is a thin variant of SOIC. The thin profile of this IC
package enables greater density on a circuit board. Furthermore, TSSOP is
more compact and thinner than other IC packages or SOIC variants. Due
to the space-saving feature of TSSOP, this IC package is an ideal option for
applications where functionality and high level integration is needed in a
limited space.
Although the SSOP package is a variant of SOIC package, TSSOP is more
compact than it. The shrink small-outline package, popularly known as

SSOP is a smaller type of SOIC package. It integrates SMT in packaging
integrated circuits. This variant of SOIC is suitable for applications where
optimum performance is crucial in IC packaging that has tightened lead
pitch.
Asides from the compactness TSSOP package offers, this package option
provides enhanced heat dissipation when compared to SSOP.
Furthermore, TSSOP offers excellent electrical performance due to the
close spacing between the leads and the IC die. Therefore, this enables
reduced parasitic and shorter signal paths.
This IC package offers a significant reduction in terms of size while
providing low-cost and value-added solutions for various applications. The
gull-wing leads of SSOP are extending from its longer sides. TSSOP
provides a wide range of benefits which include increased reliability when
used in electronic devices.
Both TSSOP and SSOP packaging are popular IC package options for
different applications in the electronics industry.
What are the Applications of TSSOP?
TSSOP is an alternative option when SSOP is not suitable. The thin shrink
small outline package is widely integrated in various electronic devices.

Due to its compactness and excellent electrical performance, it has
become a popular IC package option among electronics manufacturers.
TSSOP package is commonly used in microcontrollers. Microcontrollers
are used in various devices like medical equipment and industrial
machines. Since TSSOP is very thin, it is ideal for microcontrollers. Also,
this package is great for various electronic devices
like power management ICs and memory modules. Since these devices
need great functionality and high level of performance within a limited
space, you can consider TSSOP package.
Over time, TSSOP has found its use in several electronic applications. Also,
you can find this packaging in different markets and industries
like consumer electronics, automotive, and telecommunications among
others.
Other SMT Packages
Asides from SOIC packages, there are also other SMT packages. These
days, there are various surface mount IC packages. You need a custom
PCB to work with these packages. This PCB must have a matching pattern
of copper for soldering. Below are some SMT IC packages.
Quad flat packages

A quad flat package has IC pins in all its four directions. These pins are
about 8 per each side of the package. The pins of this package have a
spacing from about 0.4mm to 1mm. There are smaller variants of the
quad flat package. This include low-profile packages (LQFP), thin quad flat
package (TQFP), and very thin quad flat package (VTQFP).
Quad flat no-leads (QFN) package
You can achieve a quad-flat no leads (QFN) package if the legs of a QFP are
sanded off. QFN packages have tiny connections and there are
exposed pads. Sometimes these pads are exposed on the bottom and
both sides. The other package exposes the pad on the chip’s bottom. Also,
the QFN package has smaller variants which are TQFN, micro lead (MLF),
and VQFN. There are thin-dual no-lead (TDFN) packages and dual no-lead
(DFN) packages.
Conclusion
SOIC packaging has several variants which include TSSOP, SOIC, MSOP,
and SOJ. We have discussed SOIC and TSSOP in this article. These IC
packages are some of the most popular IC package options. SOIC
packaging and its variants integrate the surface mount technology to
package ICs. These IC packaging options offers unique benefits.

Due to the benefits of these IC packages, they are considered a great
option for various electronic devices. Also, they are used in different
industries like telecommunications and automotive.
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RAYMING PCB & ASSEMBLY

Integrated circuits are an integral part of electronic devices. These circuits

compactness of electronic devices. Integrated circuits are the heart of

almost every printed circuit board.

At least one IC is available in every electronics. ICs comprise a collection of

components such as capacitors, diodes, transistors, etc. These

components are connected together to help the electronic device function

as expected. Integrated circuits have several types of packages. Examples

of these packages include SOIC, SSOP,TSSOP, and more.

Request PCB Manufacturing & Assembly Quote Now

What is the SOIC Package?

PCB Manufacturing & Assembly Services https://www.raypcb.com/

SOIC package is a type of surface mount integrated circuit that has a

PCB Manufacturing & Assembly Services https://www.raypcb.com/

be soldered. Each pin on an SOIC package has a space of about 1.27mm

from the next.

benefits of this package is that it is JEDEC compliant. Also, this package is

This IC package is usually shipped in reel and tubes. SOIC is available in

These variants come with different structural measurements. However,

the SOIC features 1.25mm lead spacing . SOIC is standardized and

regulated in order to make installment an easy process. This IC package

the prefix is the pin count of the particular integrated circuit.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

operating parameters’ margin.

What are the Advantages of the SOIC package?

SOIC offers a lot of advantages. Compared to other IC packages, SOIC

provides more benefits. The most significant benefit of SOIC is

the footprint reduction. This is because space reduction helps in

fabricating integrated circuits since the materials used in the packaging

With the small outline IC package, it is easy to access small size

components by a machine during PCB assembly. This IC package makes

the fabrication of multilayer boards very easy since it is a surface mount IC

package type. Another advantage of SOIC is that it is suitable for

applications where low-cost solutions are required.

Furthermore, SOIC package makes use of at least 0.50-inch lead spacing.

This helps to ensure the pins or leads have enough spacing.

Features of SOIC Package

 It features gull wing lead configuration

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Multilayer ceramic package

 Comes with footprint similar to plastic SOP

 The leads of SOIC are gold plated

 It is a type of surface mount package with .050 inches as its lead

 SOIC is available in a few variants.

 The pin sizes and package size of SOIC have references

 SOIC comes with an identical pinout

to decide which of these standards are better. JEITA is a standard set up by

the Japanese trade organization to evaluate the performance of specific

electronic s and the IT industries.

JEDEC, on the other hand, regulates the activities of

the semiconductor market. It oversees the standardization of

semiconductor part numbers and the Electrostatic Discharge (ESD)

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Request PCB Manufacturing & Assembly Quote Now

SSOP Meaning: What is SSOP Package?

The SSOP package is a variant of SOIC package. The shrink small-outline

package, popularly known as SSOP is a smaller type of SOIC package. It

integrates SMT in packaging integrated circuits. This variant of SOIC is

suitable for applications where optimum performance is crucial in IC

packaging that has tightened lead pitch.

The body size of SSOP is usually compressed to get a smaller version of

PCB Manufacturing & Assembly Services https://www.raypcb.com/

package is that it complies with standards like EIAJ and JEDEC.