IPC-7525C

2021 - November
Stencil Design Guidelines
Supersedes IPC-7525B
October 2011

A standard developed by /PC

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Standardization Standardization as a guiding principle ofIPC 's standardization efforts.

S tandar d s Sh o uld: S tandards S hould N ot:

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problems for future improvement

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 IPC-7525C
IPC-1401
®

Stencil Design Guidelines

Supply Chain Social
Responsibility Management
System Guidance

Developed by the Corporate Social Responsibility and Sustainability in

the Supply Chain in China Subcommittee (4-35cn) of the Environment,
Health & Safety Steering Committee (4-30) of IPC

Developed by the members of the Solder Stencil Task Group (5-21e) of

the Assembly & Joining Committee (5-20) of IPC.
This IPC international standard was developed by the IPC Corporate
Social Responsibility and Sustainability in the Supply Chain in China
Task Group (4-35cn) in its native language and was translated to English
for peer review and publication. The Mandarin version (IPC-1401 CN)
represents the primary language.

Supersedes: Users of this publication are encouraged to participate in the

IPC-7525B - October 2011 development of future revisions.

Contact:

IPC
3000 Lakeside Drive, Suite 105N
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
November 2021 IPC-7525C

Acknowledgment
Any document involving a complex technology draws mate1ial from a vast munber of sources. ·w h ile the principal members of the
Stencil Des ign Task Group (5-2 l e) of the Assembly and Joining Processes Co1lllllittee (5-20) are shown belo,;v, it is not possible to
include all of those who assisted in the evolution of this stan dard. To each of them, the members of the IPC extend their gratitude.

Assembly and Joining Solder Stencil Task Group Technical Liaisons of t he

Processes Committee (5-21 e ) IPC Board of Directors

Chair: Chair: Bob N eves

Daniel Foster JeffSchake Microtek (Ch angzh ou) Laboratoties
M issile Defense Agency (MDA) ASM Assembly Systems
V ice Chair:
Greg Smith
B lueRing Stencils

Component Mounting Subcommittee

Daniel Fillipe BaJTos Alves Danielle L. Daniel Kem1eth Rahn

Bosch Car Multimedia Portugal, S.A Naval Surface Warfare Center FCI USA, Inc.
Dudi Amir Francesco D i Maio Robert R owland
Intel Co1poration GESTLABS S.r.l. Axiom Electronics, LLC
Michael Durkan JeffSch ake
Gerald Leslie Bogert
Mentor Graphics Co1poratio n ASM Assembly Systems
Bechtel Plant M achine1y, Inc.
B1i an Flemming Jeff Slmbrooks
Lance Brack Raytheon Company
Natio nal Instmments
Raytheon M issile Systems - • ' ; ·· · · r- . ... : ..1 ..
J V::>1;j.lJ..i .L.:. • .1"...<IU C
Robin Bridge BAE System s RlneRing Stencils
Curtiss-Wright D efense Solu tions
Anthony W. Lentz Raymond Whittier
Edgar Butron !'CT Assembly, lnc. DAE System s
T,ockheecl M::irtin Mich ael W . Yu en
Kyle Loomis
ZhimanChen Ke~ter Foxconn EMS, Inc.
Zhuzl1ou CRRC Times Timothy O'Neill Jack Zhu
Electric Co., Ltd. AIM Solder Veoneer China Co., Ltd.
Robert E . Cochran I'rank Paradis
Mind Chasers Inc. Callan Advanced Technologies

iv
November 2021 IPC-7525C

Table of Contents
1.0 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.8.25 Transfer Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.8.26 Ultra-Fine Pitch Technology . . . . . . . . . . . . . . . . . 3
1.2 Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.0 APPLICABLE DOCUMENTS . . . . . . . . . . . . . . . . . . 3
1.3 Measurement Units . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Definition of Requirements . . . . . . . . . . . . . . . . . . 1
3.0 STENCIL DESIGN . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Order of Precedenc . . . . . . . . . . . . . . . . . . . . . . . . . 1
3.1 Stencil Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5.1 Conflict . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3.1.1 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5.2 Clause References . . . . . . . . . . . . . . . . . . . . . . . . 1
3.1.2 Gerber® Format . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5.3 Appendices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3.1.3 Aperture List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Use of “Lead” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.1.4 Solder Paste Layer . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Abbreviations and Acronyms . . . . . . . . . . . . . . . . . 2
3.1.5 Data Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7.1 PCB Printed Circuit Board . . . . . . . . . . . . . . . . . . 2
3.1.6 Panelized Stencils . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7.2 BGA Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . 2
3.1.7 Step-and-Repeat . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7.3 FPT Fine-Pitch Technology . . . . . . . . . . . . . . . . 2
3.1.8 Image Orientation/Rotation . . . . . . . . . . . . . . . . . . 4
1.7.4 SMT Surface Mount Technology . . . . . . . . . . . . . 2
3.1.9 Image Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7.5 THT Through-Hole Technology . . . . . . . . . . . . . 2
3.1.9.1 Multiple Assembly Images . . . . . . . . . . . . . . . . . . . 5
1.8 Terms and Definitions . . . . . . . . . . . . . . . . . . . . . . 2
3.1.10 Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.8.1 *Aperture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2 Aperture Design . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.8.2 *Area Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.1 Aperture Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.8.3 *Aspect Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.1.2 Area Ratio/Aspect Ratio . . . . . . . . . . . . . . . . . . . . . 5
1.8.4 Border . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.2 Aperture Size versus Board Land Size f
1.8.5 Enclosed Print Head . . . . . . . . . . . . . . . . . . . . . . . . 2 or Tin Lead Solder Paste . . . . . . . . . . . . . . . . . . . 12
1.8.6 Etch Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2.2.1 Terminal Leaded SMDs . . . . . . . . . . . . . . . . . . . . 12
1.8.7 Relief Etch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2.2.2 Plastic BGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.8.8 Fiducials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2.2.3 Ceramic Grid Arrays . . . . . . . . . . . . . . . . . . . . . . 12
1.8.9 Fine-Pitch Ball Grid Array (BGA) . . . . . . . . . . . . . 2 3.2.2.4 Fine and Ultra-Fine Pitch BGA and CSP . . . . . . . 12
1.8.10 Fine-Pitch Technology (FPT) . . . . . . . . . . . . . . . . . 2 3.2.2.5 Discrete Components –
1.8.11 Foil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Resistors and Capacitors . . . . . . . . . . . . . . . . 12
1.8.12 Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2.2.6 Cylindrical, Mini-MELF and
Discrete Components . . . . . . . . . . . . . . . . . . . . . 12
1.8.13 Intrusive Soldering . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.2.7 LCC/BTC Devices . . . . . . . . . . . . . . . . . . . . . . . . 12
1.8.14 *Land . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.3 Aperture Size versus Board Land
1.8.15 Modification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Size for Lead Free Solder Paste . . . . . . . . . . . . . . 13
1.8.16 *Overprinting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.3.1 Terminal Leaded SMDs . . . . . . . . . . . . . . . . . . . . 13
1.8.17 *Pad See “Land” . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3.2.3.2 Plastic BGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.8.18 Squeegee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.3.3 Ceramic Grid Arrays . . . . . . . . . . . . . . . . . . . . . . 13
1.8.19 Squeegee Direction . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.3.4 Fine and Ultra-Fine Pitch BGA and CSP . . . . . . . 13
1.8.20 Standard BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.3.5 Discrete Components -
1.8.21 *Stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Resistors and Capacitors . . . . . . . . . . . . . . . . . . 14
1.8.22 Step Stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.2.3.6 MELF, Mini-MELF Components . . . . . . . . . . . . 14
1.8.23 *Surface-Mount Technology (SMT) . . . . . . . . . . . 3 3.2.3.7 BTC/LCC Devices . . . . . . . . . . . . . . . . . . . . . . . . 14
1.8.24 Through-Hole Technology (THT) . . . . . . . . . . . . . 3 3.2.4 Glue Aperture Discrete Component . . . . . . . . . . . 14

v
IPC-7525C November 2021

3.2.5 Glue Apertures for Combination of Discrete Tables

Components and Terminal Leaded Devices . . . . . 14 Table 3-1 Stencil Use Clauses . . . . . . . . . . . . . . . . . . . . 5
3.2.6 Relief Etch with Glue Stencils . . . . . . . . . . . . . . . 14 Table 3-2 General Aperture Design
3.3 Mixed Technology Surface-Mount/Through-Hole Guideline Examples for Selective
(Intrusive Soldering) . . . . . . . . . . . . . . . . . . . . . . . 15 Surface-Mount Devices . . . . . . . . . . . . . . . . 6
3.3.1 Solder Paste Volume . . . . . . . . . . . . . . . . . . . . . . 15 Table 3-3 Process Window for Intrusive Soldering -
Maximum Limits Desirable . . . . . . . . . . . . . 15
3.4 Mixed Technology Surface-Mount/Flip Chip . . . 16
3.4.1 Two-Print Stencil for Figures
Surface-Mount/Flip Chip . . . . . . . . . . . . . . . . . . . 16 Figure 3-1a 3mil Thick Stencil
3.5 Step Stencil Design . . . . . . . . . . . . . . . . . . . . . . 17 Aperture Size Guidelines . . . . . . . . . . . . . . . . 7
3.5.1 Step-Down Stencil . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 3-1b 0.080 mm Thick Stencil
Aperture Size Guideline . . . . . . . . . . . . . . . . 7
3.5.2 Step-Up Stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 3-2b 0.100 mm Thick Stencil
3.5.3 Step Stencil for Enclosed Print Heads . . . . . . . . . 18 Aperture Size Guideline . . . . . . . . . . . . . . . . 8
3.5.4 Relief-Etch Stencil . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 3-3b 0.125 mm Thick Stencil
3.6 Fiducials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Aperture Size Guideline . . . . . . . . . . . . . . . . 9
3.6.1 Global Fiducials . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 3-4b 0.150 mm Thick Stencil
3.6.2 Local Fiducials . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Aperture Size Guideline . . . . . . . . . . . . . . . 10

3.7 Rework and Repair Stencils . . . . . . . . . . . . . . . . . 19
3.7.1 Mini Stencils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.7.2 Repair Tool for Printing Paste Directly
on the Component . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.0 STENCIL FABRICATION . . . . . . . . . . . . . . . . . . . . . 19
4.1 Foils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2 Frames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.3 Stencil Border . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.4 Stencil Fabrication Technologies . . . . . . . . . . . . . 19
4.4.1 Chemical Etch . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.4.1.1 High-Precision Etch . . . . . . . . . . . . . . . . . . . . . . . 19
4.4.2 Laser-Cut Stencils . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 3-5b 0.200 mm Thick Stencil
Aperture Size Guideline . . . . . . . . . . . . . . . 11
Figure 3-7 Home Plate Aperture Design . . . . . . . . . . . . 12
Figure 3-6 Cross-Sectional View of a Stencil . . . . . . . . 12
Figure 3-8 Bow Tie Aperture Design . . . . . . . . . . . . . . 13
Figure 3-10 Aperture Design for Cylindrical
Components and Chip Components
(All Corners Rounded) . . . . . . . . . . . . . . . . 13
Figure 3-9 Oblong Aperture Design . . . . . . . . . . . . . . . 13
Figure 3-12 Glue Stencil Aperture Design . . . . . . . . . . . 14
Figure 3-14 Print Only Mode 15 mil Thick Stencil . . . . . 14
Figure 3-13 Chip Component and
SOIC Present on Board . . . . . . . . . . . . . . . . 14

4.4.3 Electroform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 3-15 Glue Stencil with Glue Reservoir . . . . . . . . 14

4.4.4 Hybrid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 3-16 Through-Hole Solder Paste Volume . . . . . . . 15

4.4.5 Trapezoidal Apertures . . . . . . . . . . . . . . . . . . . . . 20 Figure 3-17 Overprint Without Step . . . . . . . . . . . . . . . . 16

4.4.6 Additional Options . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 3-18 Overprint With Step (Squeegee Side) . . . . . 16
Figure 3-19 Overprint With Step (Contact/Board Side) . 16
5.0 STENCIL MOUNTING . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 3-22 Print With Step . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 Location of Image on Metal . . . . . . . . . . . . . . . . . 20
Figure 3-20 Two-Print Through-Hole Stencil . . . . . . . . . 17
5.2 Centering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 3-21 Two-Print Through-Hole Stencil . . . . . . . . . 17
5.3 Additional Design Guidelines . . . . . . . . . . . . . . 20
Figure 3-23 Step Down . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.0 STENCIL ORDERING . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 3-24 Step Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.0 STENCIL USER’S Figure 4-1 Trapezoidal Apertures . . . . . . . . . . . . . . . . . 19
INSPECTION/VERIFICATION . . . . . . . . . . . . . . . . . 21

8.0 STENCIL CLEANING . . . . . . . . . . . . . . . . . . . . . . . 21

9.0 END OF LIFE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

vi
IPC- 7525C Nov ember 2021

80

70

~ 60
E

-
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111 40
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0 1 Z 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Z0 21 ZZ 23 24 ZS 26 27 ZS 29 30
Aperture Width (mils)
- AR ~ 0.66 - legacy Design Rules ::: ~ !:. ~- 0.5 s AR < 0.60 - Process Control Sensitive
0.60 SAR< 0.66 - Acceptable Design - AR< 0.5 - Not Recommended
Figure 3-2a 4 mil Thick Stencil Aperture S ize Guideline

z
2
1.8 1.8
1.6

-E 1.4
1.6 1.4
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Aperture Width (mm)

- AR~ 0.66 - legacy Design Rules :: ~ :· ·: 0.5 ~AR< 0.60 - Process Control Sensitive

0.60 ~AR< 0.66 - Acceptable Design - AR< 0.5 - Not Recommended

Figure 3-2b 0.100 mm Thick Stencil Aperture Size Guideline

8
Nove m ber 2021 IPC-7525C

0.1 L t o
_ :o.2 L:_ l-- 112 w--1
I I
-t
1/2W
t
-1 -1
_t _+ w
w

_j _j
I 3
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Fi g u re 3-8 B ow T ie Apertur e Desig n Fi gur e 3-9 Oblo ng A perture Des ig n

1. Aperture L = Length 1. Aperture L = Length
2. Land W = W idth 2 . Land W = Width
3 . Full radius

Additional design guidelines for bottom tem1ination components are available in IPC-7 093.
Ifvia s are imbedded in the ground land design, it is recommended that the w eb of the window-pane grid is designed to cover ea~h
via w hich w ill prevent the solder paste being screened directly into the vias . This design may also prevent solder wicking into t~e
via. Solder wicking may not allow you to achieve a > 50% solder coverage of the gronnd plane area. ·,

3.2.3 Aperture Size vers us Board Land Size for Lead Free Solder Paste A s a general design guide, the aperture size should be
as close as possible to a one-to-one ratio w hen compared to the board land size. This is done to assure comple te cov erage of the
land w ith solder after reflow. Some slight reduction (e.g., 0 .5 mils [0 .0 127 mm] per side o fland) is acceptable since pushing the
component into the solder paste w ill cause the paste to spread and cover the land. Reduction of the apertln e size for the gronnd
plane of BTC or LCC dev ices is an exception and is desirable. R adius ed comers ai·e also acceptable as it reduces the chance of
solder paste sticking in sharp comers of the apertme.

The use of a slight stenc il aperture reduction w ill a lso assist in obtaining a tight board to stencil gasket during the print proces s,
especially on m etal defined lands that have been over e tched .

3.2.3.1 Terminal Leaded SM Ds For lea ded SMD s (e.g., J-le ad or gull-w ing lead c omponents with 1.3 - 0.4 nun [51.2 - 15.7 n1il]
pitch) the reduc tion is typic ally 0 .254 [1. 0 mil] in w idth and no reduction in len gth .

3.2.3.2 Plastic BGAs N o reduc tion in the aperture c om pared to the lan d.

3 .2.3. 3 Cera m ic Grid Arrays Ceramic giid array pa ckages require a spec ific solder p aste volum e to ensure long-term re liability of
th e solder joint. Greater volume is r equire d for ceramic ball giid aITays than for ceram ic column gii.d arrays. Inform ation regarding
proper solder paste volum es for these pack ages c a11 be found in IPC-7095.

3.2.3.4 Fine a nd Ultra-Fine Pitc h BGA and CS P Square aperture w ith the w idth of the sq uar e equal to the diam eter of the land circle
on the board. T he square sh ould have radiused c orners. A guideline is 0 .06 mm [2.4 mil] radiused com ers for a 0.25 mm (9.8 m il]
square and 0.09 [3.5 m il] radiuse d comers for a 0.35 mm [ 14 mil] square.

r
2
-,
1
-- ---
1
· 1111111 11111111
---
-- -- ---
- - --
-
L ~
I
l J
Figu re 3-10 A pertur e Desi g n for Cylin d ric.ii Components nnd Chip
Figure 3-1 1 Window Pnne Design for Ground Pla ne
( See n lso Figure 3-25)
1. BTC Packa ge Referenced t o Board
II I 11111

Components (All Corners Rounded) 2. Aperture D esig n 2 0 % t o 50% Reduct ion

1 . Aperture 3 . Ground Plane
2. Land

13
IPC-7525C November 2021

3.5.3 Step Stencil for Enclosed Print Heads As a

general design guide, a step should not exceed 0.05
mm [2.0 mil].

3.5.4 Relief-Etch Stencil This type of stencil has relief

step pockets on the contact/board side of the stencil
foil. There are several applications where relief-etch
stencils are useful. Some examples are:
• Relief pocket for a bar code label on th board. The
stencil foil might be 0.15 mm [5.9 mil] thick
Figure 3-23 Step Down with a 0.08 mm [3.1 mil] relief for the bar
1. Squeegee Blade code label.
2. Solder Paste - Paste not Extracted by the Squeegee
3. Board • Test via relief pockets . The stencil foil has relief
4. Stencil pockets over each raised test via to allow the stencil
foil to sit flat and gasket to the board.
• Solder mask pedestals at the comers of ceramic
components. A relief etch on the stencil foil provides
good gasketing. The standoff of ceramic leadless
components can be increased to accommodate
cleaning under the component and to increase the
length of solder joint.
• Two-print stencil. This stencil foil has deep relief
pockets in the areas where surface-mount solder
paste was previously printed (see Sections 3.3.1.3
Figure 3-24 Step Up and 3.4.1). An example of this stencil would be a
1. Squeegee Blade
2. Solder Paste - Paste not Extracted by the Squeegee stencil 0.5 mm [20 mil] thick for printing paste in and
3. Board around through-holes with relief step on the contact
4. Stencil side 0.3 mm [12 mil] thick to clear surface mount
solder paste previously printed.
3 .6 Flduclals Depending on the vision system, fiducials are located on the squeegee or contact side and engraved or filled with
a contrasting color epoxy. Typically, they are solid, round dots 0.5 to 1.5 mm [19.7 to 59.1 mil] in diameter. They may be
half-etched, laser engraved, or etched through the stencil.

3 .6 .1 Global Fiducials Fiducials that are placed a minimum of 5 mm [0.20 in] from the board corners in three locations.

3 .6 .2 Local Fiducia ls I'iducials that are placed near critical components (e.g., fine-pitch QI'P) are useful for pick and place machines
but useless for stencil printing. For the printing process the best fiducials are as far apart as possible.

Figure 3-26 BTC ..· .. ·. · . .. .. . _.fiQl.lr!'.:}:~.6 BGA

18
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