Table of Contents
Terminology Surface Mount • CHIPs, MELFs & SOTs
Introduction . . . . . . . . . . . . . . . . . . . . . . . . 2
Through Hole vs. Surface Mount . . . . . . . 3
Through Hole Leads . . . . . . . . . . . . . . . . 3, 4
Surface Mount Leadless . . . . . . . . . . . . . . 4
Surface Mount Leaded . . . . . . . . . . . . . . . 5
Component Packaging . . . . . . . . . . . . . . . . 6
Identifying Components . . . . . . . . . . . . . . . 7
Lead-Free Components . . . . . . . . . . . . . . . . 8
Component Reference Designators . . . . . 9
Common Class Letters . . . . . . . . . . . . . . 10
Schematic Symbols . . . . . . . . . . . . . . . . . . 11
Value and Tolerance . . . . . . . . . . . . . . . . . . 11
Polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Orientation . . . . . . . . . . . . . . . . . . . . . . . . 13
The Square Land/Pad . . . . . . . . . . . . . . . . 13
Through Hole • Axial & Radial
Capacitor (Non-Polarized) . . . . . . . . . . . . 14
Capacitor (Polarized) . . . . . . . . . . . . . 15, 16
Variable Capacitor . . . . . . . . . . . . . . . . . . 17
Crystal Oscillator . . . . . . . . . . . . . . . . . . . 18
Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Light-Emitting Diode . . . . . . . . . . . . . . . . 20
Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fuse and Circuit Breaker . . . . . . . . . . . . . 22
Inductor and Coil . . . . . . . . . . . . . . . . . . . 23
Transformer . . . . . . . . . . . . . . . . . . . . . . . . 24
Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Variable Resistor . . . . . . . . . . . . . . . . . . . 26
Voltage Regulator . . . . . . . . . . . . . . . . . . . 27
Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . 28
Transistor . . . . . . . . . . . . . . . . . . . . . . . . . 29
Switch and Relay . . . . . . . . . . . . . . . . . . . 30
Through Hole • Hardware
Connector . . . . . . . . . . . . . . . . . . . . . . . . . 31
Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Jumper . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Through Hole • ICs
SIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
IC Can . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
PGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Chip Components . . . . . . . . . . . . . . . . . . . . . . 39
Chip Components/Resistor . . . . . . . . . . . . . 40
Chip Components/Capacitor . . . . . . . . . . . . . 41
Tantalum Capacitor . . . . . . . . . . . . . . . . . . . . 42
MELF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
SOT/SOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
DPAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Surface Mount • Dual Inline SOICs
SOIC/SOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
SO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
SOM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
SOL/SOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
SOJ/SOL-J . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
SSOP/VSOP/TSSOP . . . . . . . . . . . . . . . . . . . . . 51
QSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
TSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Flat Lead Small Outline and Quad Package 54
Surface Mount • Peripheral Leaded Quads
PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
QFP/MQFP/FQFP/CQFP . . . . . . . . . . . . . . . . . 56
LQFP/TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
PQFP BQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Surface Mount • Peripheral Dual and Quad
Leadless Packages
LCC/LCCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
DFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
QFN Multiple Row . . . . . . . . . . . . . . . . . . . . . . .62
Surface Mount • Area Arrays
BGA/CBGA/PBGA/CCGA/LGA . . . . . . . . . . . 63
PoP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
CSP/FBGA/DSBGA/FLGA/DSLGA . . . 65, 66
Surface Mount • Chip on Board
COB/Bare Die/ Flip Chip . . . . . . . . . . . . . 67, 68
Reading Component Values
Axial Resistor Values . . . . . . . . . . . . . . . . . . . 69
Numbered Resistors . . . . . . . . . . . . . . . . . . . 69
4-, 5-, and 6-Band Resistors . . . . . . . . . . . 70
Resistor Band Color Codes . . . . . . . . . . . . . . . 71
Capacitor Values . . . . . . . . . . . . . . . . . . . . . . . 72
Numbered Capacitors . . . . . . . . . . . . . . . . . . 72
Inductor Band Color Codes . . . . . . . . . . . . . . 73
Component ID Training & Reference Guide
 Terminology Terminology

Introduction Through Hole vs. Surface Mount

There are two primary types of components, the difference being
Components how they are attached
An electronic component is any device that handles electricity. These to the circuit board.
devices come in many different configurations, shapes and sizes. Different primary
components have different electrical functions and are used for a great side One group is called
variety of purposes. For example, some components may be used to slow through hole.
electricity, and others may be used to store it. Through hole components
have leads that are inserted
Understanding Electricity secondary side through mounting holes in
Electricity basically consists of voltage, measured in volts, and current, the circuit board.
measured in amperes, or amps. Voltage is the electrical pressure, or force cross-section of a
through hole solder joint
of electricity through a circuit. This is similar to the water pressure in a
garden hose. Current is the amount of electricity that goes through the
circuit. The other type is called
Active vs. Passive surface mount.
Some components are active — meaning they can amplify or interpret Surface mount components are
a signal. Active components include diodes, transistors and integrated designed so they are placed
circuits, also called ICs. Other components are passive — meaning that directly onto lands that serve
cross-section of a
they cannot change an electrical signal — except to reduce it in size or as mounting points on the surface mount solder joint
delay it. Passive components include resistors, capacitors and inductors. surface of the board.
Discrete vs. Integrated
When a component is packaged with only one or two functional elements, Through Hole Leads
it is called a discrete component. An example of a discrete component
is a resistor that performs the simple function of limiting the electrical Axial Leads = Arms
current that flows through it. On the other hand, an integrated circuit is
Axial leaded components have two
a group of interconnected elements assembled into a single package that
leads — with one lead extending from
performs multiple functions. A well-known example of a complex IC is the
each side of the component, like arms.
microprocessor found in computers.
Axial components need to have their
Electronic Assemblies leads bent so they can be inserted
through the holes of a circuit board.
When a group of components are placed together on a printed circuit board
to perform some function, it’s called an electronic assembly. Circuit board
assemblies are created by attaching and soldering the components by Radial Leads = Legs
hand, or by machine.
Radial leaded components have two or more
leads extending from the bottom of the
component, like legs.

2 Component ID Training & Reference Guide Component ID Training & Reference Guide 3
This training & reference guide does not take precedence over, or replace in any way, the
requirements in any IPC Standard or Specification. This guide is intended for use as an
illustrated support document to assist in the training of component identification.
IPC disclaims any warranties or guarantees, expressed or implied, and shall not be liable
for damages of any kind in connection with the information set forth in DRM-18.

Acknowledgements
Larry Joy, Consultant
Technical Content Advisor (Revision J)

James “Mark” Bird — MBird and Associates

Technical Content Advisor (Revision H)

Special Thanks to:

Heather Portillo — Practical Components
Lee Smith — Amkor
Nancy Chism — Solectron
Daniel Cusick — Rubycon America

If you have comments or suggestions regarding this

Training and Reference Guide, please contact:
IPC Training
P.O. Box 389
Ranchos de Taos, New Mexico 87557
+1 847.597.2940 (tel.)
ipctraining@ipc.org

IPC-DRM-18

revision J - 1/18 - 5k
revision H - 3/11 - 5k
revision H - 11/07 - 5k
revision G - 6/07 - 5k
revision G - 9/03 - 5k
revision F - 8/01 - 5k
revision E - 8/00 - 5k
revision D - 7/99 - 5k
revision C - 7/98 - 5k
revision B - 2/97 - 5k
revision A - 4/96 - 5k
1st printing - 9/95 - 1k
 Resistor Color Code Chart

Association Connecting Electronics Industries

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