Resistor Color Code Chart

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ISBN 1-580984-67-3
 Table of Contents
Terminology:
Int roduct ion ................................................2
Through-Hole vs. Surface Mount .............3
Through-Hole Axial vs. Radial ..................3
Surface Mount Leadless .............................4
Surface Mount Leaded .............................5
Component Packaging ............................6
Ident ifying Component s .........................7
Component Reference Designat or ..............8
Common Class Let t ers ..............................9
Schemat ic Symbols .................................10
Value and Tolerance .......................................10
Polarit y ........................................................11
Orient at ion..........................................12
The Square Land/ Pad ................................12
Through-Hole Axial & Radial:
Capacit or (Non-Polarized) ....................13
Capacit or (Polarized) ........................... 14, 15
Variable Capacit or .....................................16
Cryst al .......................................................17
Diode ..........................................................18
Light -Emit t ing Diode .................................19
Filt er ...........................................................20
Fuses and Circuit Breakers .....................21
Induct ors and Coils ........................................22
Transformers....................................................23
Resist or .....................................................24
Variable Resist or ........................................25
Volt age Regulat or ........................................26
Thermist or .................................................27
Transist or ....................................................28
Swit ches and Relays ....................................29
Through-Hole Hardware:
Connect or ........................................................30
Header ........................................................31
Jumper ........................................................32
Socket ............................................................. 33
Com ponent Identification Desk Reference Manual
Through-Hole IC’s:
SIP ..............................................................34
DIP ............................................................35
IC Can ............................................................36
PGA ............................................................37
Surface Mount :
CHIPs, MELFs & SOTs:
Chip Component s ......................................38
Tant alum Capacit ors .............................41
MELF ...........................................................42
SOT ...........................................................43
DPAK ............................................................44
Surface Mount :
The SOIC Family:
SOIC .........................................................45
SO .............................................................46
SOM ...........................................................47
SOL / SOW ....................................................48
SOL-J ........................................................49
VSOP ........................................................50
SSOP .........................................................51
QSOP ...........................................................52
TSOP ...............................................................53
Surface Mount :
Large Scale ICs:
LCC ...............................................................54
PLCC ............................................................55
Flat Lead Package .......................................56
QFP (MQFP) .............................................57
PQFP ..............................................................58
BGA ..........................................................59
Reading Component Values:
Axial Resist or Values .................................60
Numbered Resist ors ...............................60
4-Band Resist ors ........................................61
5-Band Resist ors ....................................61
Resist or Band Color Codes ...................62
Capacit or Values ......................................6 3
Numbered Capacit ors ...........................6 3
Capacit or Band Color Codes ....................64
Induct or Band Color Codes ....................... 65
Terminology
Introduction
Component s
An elect ronic component is any device t hat handles elect ricit y.
These devices come in many different shapes and sizes. Different
component s have different elect rical funct ions and are used for a great
variet y of purposes. For example, some component s may be used t o slow
elect ricit y, and ot hers may be used t o st ore it .
Underst anding Elect ricit y
Elect ricit y basically consist s of volt age, measured in volt s, and
current , measured in amperes, or amps. Volt age is t he elect rical pressure,
or force of elect ricit y t hrough a circuit . This is similar t o t he wat er
pressure in a garden hose. Current is t he amount of elect ricit y t hat goes
t hrough t he circuit .
Act ive vs. Passive
Some component s are act ive - meaning t hey can amplify or
int erpret a signal. Act ive component s include diodes, t ransist ors and
int egrat ed circuit s, also called ICs. Ot her component s are passive - meaning
t hat t hey cannot change an elect rical signal - except t o reduce it in size or
delay it . Passive component s include resist ors, capacit ors and induct ors.
Discret e vs. Int egrat ed
When a component is packaged wit h only one or t wo funct ional
element s, it is called a discret e component . An example of a discret e
component is a resist or t hat performs t he simple funct ion of limit ing t he
elect rical current t hat flows t hrough it . On t he ot her hand, an int egrat ed
circuit is a group of int erconnect ed element s assembled int o a single
package t hat performs mult iple funct ions. A well-known example of a
complex IC is t he microprocessor found in comput ers.
Elect ronic Assemblies
When a group of component s are placed t oget her on a print ed
circuit board t o perform some funct ion, it ’s called an elect ronic assembly.
Circuit board assemblies are creat ed by at t aching and soldering t he
component s by hand, or by machine.
Com ponent Identification Desk Reference Manual 2
Through-Hole vs. Surface Mount Terminology

There are t wo primary t ypes of component s, t he difference being Single In-line Packages
how t hey are at t ached or SIPs,are t hrough-hole component s t hat
have a row of leads in a single, st raight line.
t o t he circuit board.
primary
side
One group is called Dual In-line Packages
t hrough-hole. or DIPs, are component s t hat have t wo rows
Through-hole component s of leads in parallel st raight lines.
have leads t hat are insert ed
secondary side t hrough mount ing holes in
t he circuit board.
cross-sect ion of a
t hrough-hole solder joint
Pin Grid Arrays
or PGAs, are ICs t hat have
several rows of round pins ext ending
The ot her t ype is called from t he bot t om of t he component .

Surface mount component s are

designed so t hey are placed
direct ly ont o lands t hat serve
as mount ing point s on t he
Surface M ount - Leadless
cross-sect ion of a
surface of t he board. surf ace mount solder joint
Leadless means t here are no met al leads st icking out of t he
component body. These t ypes of component s are at t ached t o a circuit
board using some t ype of met allized t erminat ion.
Through-Hole Leads
Chips & MELFs use t erminat ions on opposit e
Through-hole leads are rigid met al wires t hat st ick out of t he component . ends of t he component ’s body.

Axial Leads = Arms

Axial leaded component s have t wo Cast ellat ions are half round
Ball Grid Arrays, or BGAs, met allized recesses in t he side
leads - wit h one lead ext ending from consist of rows of t iny balls of solder
each side of t he component , like arms. of a component t hat are filled
Axial component s need t o have t heir on t he bot t om of t he component . wit h solder when connect ed t o
leads bent so t hey can be insert ed These solder t he circuit board.
t hrough t he holes of a circuit board. balls are
connect ed
to
mat ching
Radial Leads = Legs
Radial leaded component s have t wo or more rows of
lands on
leads ext ending from t he bot t om of t he t he circuit
component , like legs.
board.

3 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 4
Terminology
Surface M ount - Leaded
Leaded surface mount component s usually have one of five st yles
of leads: gull wings, J-leads, L-leads, flat leads or I-leads.
Gull Wing Lead: The gull wing
lead is a met al lead t hat bends
down and away - similar t o a
seagull’s wing.
J-Lead: The J-lead is a met al
lead t hat bends down and
underneat h a component in t he
shape of t he let t er J.
L-Lead: The L-lead is inward
formed underneat h a component .
The I-lead , or but t lead,
is act ually a t hrough-hole lead
t hat has been cut short for
surface mount ing. Because t he
connect ion is not very st rong or
st able, t he I-lead is not
considered suit able for high
reliabilit y assemblies.
Lead Pit ch
An import ant charact erist ic of
some leaded surface mount
component s is lead pit ch. Pit ch is
t he dist ance bet ween t he cent er of
one lead t o t he cent er of t he next .
Lead Pit ch When a component has fine pit ch it
means t he leads are spaced very
close t oget her (less t han 15 mils).
5 Com ponent Identification Desk Reference Manual
Terminology
Component Packaging
Component packaging refers t o t he way component manufact urers
package t heir product for use by elect ronics assemblers. See Int roduct ion
t o Elect ronics Assembly, IPC-DRM-53, for more about t he assembly
process. Through-hole and surface mount component s are packaged in one
of four ways: on t ape and reel, in t ubes, in waffle t rays or in st at ic-safe
bags. The packaging met hod depends on t he component t ype and whet her
t he component will be assembled ont o t he circuit board by machine or by
hand. Most component packages are made t o prot ect t he component s
from elect rost at ic discharge, or ESD, which could damage t hem.
Tape and Reel
Tape reels are used for axial leaded t hrough hole
component s and t he smaller surface mount component s.
Aut omat ic insert ion machines cut t hrough-hole component s
off t ape reels and insert t hem int o t he board.
Surface mount assembly machines, called pick and place, pick
surface mount component s from t ape reels and place t hem
ont o t he board.
Tubes
Tubes are used t o keep
component s st raight and ready
t o drop int o aut o-insert ion or
aut o-placement machines.
Waffle Trays
Waffle t rays are used for many of t he larger
surface mount component s. They are st ackable
on pick and place machines. Trays also provide
prot ect ion for fragile leads during st orage
and handling.
St at ic-Safe Bags
Some component s are simply packaged
loose in st at ic-safe bags. These
component s are usually simple
t hrough-hole axial and radial devices t hat
are t oo large or unusually shaped t o be
insert ed by machine.
Com ponent Identification Desk Reference Manual 6
Terminology
Identifying Components
Every component has
a manufact urer’s
part number. This
number is eit her marked
on t he component it self,
or on t he packaging.
And every assembly t o be
manufact ured comes wit h an
assembly drawing and a part s list ,
also called t he bill of mat erials,
or BOM.
The BOM list s t he component s by
part numbers, quant it ies
and reference designat ors.
The bill of mat erials
The assembly drawing shows
t he locat ion of each component .
PWB reference designat or for a diode
The assembly drawing wit h diode hi-light ed
7 Com ponent Identification Desk Reference Manual
Terminology
Component Reference Designators
Close-up of a component legend
print ed on a t hrough-hole PWB
Most of t he PWBs made
t oday have a component
legend silkscreened ont o
t hem.
These let t ers and numbers ident ify t he component t o be placed in
t he holes or ont o t he lands next t o each designat ion.
Also called t he silkscreen or
Component Reference Designat or (CRD) ,
t his legend is placed on t he
component mount ing (primary) side
of t he PWB. The ot her side of
a t hrough-hole board, like t he one shown,
is oft en referred t o as t he
solder (secondary) side.
The silkscreen may also indicat e
t he direct ion (for orient at ion or polarit y)
t he component is t o be placed on t he board.
SMT boards may have t he silkscreen on
bot h sides of t he board, if it has
component s on bot h sides.
Capacit or
For more definit ions of
CRD
reference designat ors, see
ANSI Y32.16/ IEEE St d 200.
For more definit ions of
component class let t ers, see
ANSI Y32.2/ IEEE St d 315,
Class Let t er(s) Unit Number
sect ion 22.
Com ponent Identification Desk Reference Manual 8
Terminology Terminology

Common Class Letters for CRDs Schemat ic Symbols

Along wit h t he assembly

ANSI/ IEEE IEC Other drawing and BOM, schemat ic diagrams
Amplifier AR A are also used t o specify assemblies.
Capacitor C
pack or network C CP or U Each discret e component has an
polarized C “+” (by the lead) associat ed symbol t hat is specified
variable C CVAR, CADJ in IEEE (Inst it ut e of Elect rical and
Connector J or P Elect ronics Engineers) St andard
Crystal Y B 315 and 315A (ANSI Y32.2).
Delay Line DL D---
Diode D or CR V Component s wit h mult iple funct ions,
Light Emitting Diode DS (Display) E LED, D, DIS, CR such as an int egrat ed circuit , do not
Voltage Rectifier D or CR V VR use a specific schemat ic symbol but
Zener Diode D or VR V are oft en represent ed by a block in t he
Filter FL Z schemat ic diagram. This includes ICs
Fuse F packaged as DIPs, SOICs, QFPs,
Header J or P PLCCs, PGAs or BGAs.
Inductor, Choke L
Integrated Circuit U IC
Insulated Jumper W or P JP Value and Tolerance
Jumper W, P or R JMP, J
Microprocessor U IC, MC, CPU
Some component s will have a value and t olerance associat ed wit h t hem.
Oscillator Y(crystal) orG (other) G OS
The value is a numerical quant it y given t o t he component . This value is usually
Relay K
assigned a t olerance which is t he amount of variat ion allowed from t hat value.
Resistor R
pack or network R RN, RP, U
Potentiometer R VR, POT If a 500 ohm resist or has a
Thermistor RT R 1%t olerance, it s accept able
variable R VR, VAR, VRN, ADJ measurement range would be
Varistor R, VAR 495 t o 505 ohms.
asymmetrical D or CR
symmetrical RV
Socket X, XAR, XU, XQ, etc TS, S
But , if t he same 500 ohm resist or has a
Switch S SW
10%t olerance, it s accept able
Test Point or Pin TP TST or J
measurement range would be
Transistor Q V U
450 t o 550 ohms.
Transformer T X, TR
Voltage Regulator VR U
Reading component values and
t olerances is described in det ail
in t he last sect ion of t his manual.

9 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 10
Terminology
Polarity = Positive & Negative
Each component placed on a PWB or “board”
has a specific funct ion. Some component s have a
posit ive and negat ive connect ion t o t he board and so
must be placed on t he board in t he correct orient at ion.
This means t hat t he correct
lead–posit ive or negat ive–is in
Polarized Capacit ors
t he correct hole, or on t he
Anode Cat hode correct land wit h surface
+ -- mount component s.
Component s wit h t his posit ive
and negat ive connect ion are
said t o have polarit y.
Anode & Cat hode
The posit ive lead
is called t he anode.
The negat ive lead
is called t he cat hode.
Polarit y can be indicat ed on
part s in a variet y of ways.
+ --
Diodes The symbol for a posit ive lead
is t he plus sign (+ ), alt hough
many component s will not have
t his marking.
The symbol for t he negat ive
lead is t he minus sign ( -- ).
Markings and symbols for
eit her t he anode or cat hode
leads can t ake many shapes and forms. Markings on
t he PWB include a square land or pad, a “ + ” symbol, or
a diode symbol silkscreened t o t he board t o show t he
correct orient at ion.
11 Com ponent Identification Desk Reference Manual
Terminology
Orientation = Position
Component orient at ion refers t o sit uat ions when a component
must be inst alled on t he PWB a cert ain way, whet her or not it has polarit y.
Orient at ion marks or symbols on a component ’s body include:
a not ch, a dimple, a wedge, a st ripe, or numbers.
Wit h mult i-pin component s, such as ICs, t hese orient at ion symbols
indicat e where “Pin One” of t hat component is locat ed so t hat pin may be mat ed
wit h t he corresponding pad or land on t he PWB. Many ICs have t ens t o hundreds
of I/O (input /out put ) connect ion point s. These may be pins, leads or t erminat ions.
Also, mat ching orient at ion marks may be found on t he PWB. These oft en
include silkscreened symbols ident ical t o markings on t he component body (not ch,
dimple, wedge, et c.) and / or a square pad or land on t he board, especially for
mult i-pinned component s.
The Square Land / Pad
The square land/ pad is a common way t o designat e polarit y or
orient at ion. The square land is most oft en used by PWB designers t o show where
t he marked lead or Pin One of a mult i-pinned component should be placed.
Mat ching Pin One of t he component t o t he correct land or pad on t he PWB is
crit ical for t he proper funct ion of t he component .
For component s t hat have t he posit ive or
anode lead marked, like polarized capacit ors, t he
square land t ypically indicat es where t he posit ive
lead should be placed. For component s which have
t he negat ive or cat hode lead marked, such as
diodes or LEDs, t he square land indicat es where
t he marked (negat ive) lead should be placed.
Not e: Always verify t he polarit y against any
drawings, schemat ics, silkscreen markings
(or any ot her document at ion from your board Square land / pad shows
and component suppliers) as t his may vary. pin 1orient at ion
Com ponent Identification Desk Reference Manual 12
Through-Hole G Axial & Radial
Capacitor (Non-Polarized)
Description: Capacit ors st ore and discharge elect ricit y. They consist of
t wo met al plat es, or conduct ing surfaces, separat ed by a
insulat ing mat erial called a dielect ric. Aft er a sufficient
buildup in one plat e, t he charge is felt in t he opposit e plat e.
There are four basic t ypes of non-polarized capacit ors:
• Ceramic disc-radial
• Dipped mica-radial
• Mylar-radial, usually round or oval bodies
• Glass-packed axial, easy t o mist ake for
diode or resist or.
Class letter: C (non-polarized)
Prefix: None
Value Code: Measured in microfarads (µF), nanofarads (nF) or
picofarads (pF). The value is print ed on t he capacit or body
using some form of abbreviat ion. Also specified is t he
operat ing volt age for t he capacit or. These t wo values
det ermine t he physical size of t he component .
Tolerance: Print ed as percent age (example: ±5%) or as let t er scheme.
Orientation: None
13 Com ponent Identification Desk Reference Manual
Through-Hole G Axial & Radial
Capacitor (Polarized)
Description: Polarized capacit ors funct ion in t he same way as
non-polarized capacit ors (see page 13).
Class letter: C
Other: “+ ” (by t he lead)
Prefix: None
Value Code: Measured in microfarads (µF), nanofarads (nF) or
picofarads (pF). The value is print ed on t he capacit or body
using some form of abbreviat ion. Also specified is t he
operat ing volt age for t he capacit or. These t wo values
det ermine t he physical size of t he component .
Tolerance: Print ed as percent age (example: ±5%) or as let t er scheme.
Orientation: By polarit y. A Square land on t he PWB may mark where
t he posit ive lead (anode) is t o be insert ed.
Polarity: Polarized capacit ors can be bot h axial or radial and will
have one lead marked as post ive (+). This posit ive lead can
be marked or formed in several ways:
Symbols:
Plus ( +); marks posit ive lead
Dot (•); marks posit ive lead
Band; marks posit ive lead
Line; t he line can have pluses (+) leading t o t he
posit ive leg or minuses (-) leading t o t he negat ive leg.
Arrows; arrows down t he side lead t o t he negat ive end.
Cont inued. . .
Com ponent Identification Desk Reference Manual 14
Through-Hole G Axial & Radial Through-Hole G Axial & Radial

Capacitor (Polarized) Variable Capacitor

. . . Cont inued: Description: These capacit ors can change capacit ance by t urning a
screw t hat causes t he plat es t o move closer or fart her
Colors: apart . The closer t he plat es, t he higher t he capacit ance.
Silver square; marks posit ive lead Class letter: C
Colored end; marks posit ive lead Other: C VAR, C ADJ
Prefix: None
Shapes and f orms: Value Code: Measured as a range, such as 27-200 µ F.
Ridge or bevel; marks posit ive lead Tolerance: None
Groove; marks posit ive lead Orientation: Non-symmet rical lead pat t ern allows it t o be inst alled
Bubble; marks posit ive lead only one way.
(if bot h ends have a bubble, t he larger one is posit ive) Polarity: None
Larger lead; t he PWB holes are sized t o mat ch t he
larger lead.

15 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 16
Through-Hole G Axial & Radial Through-Hole G Axial & Radial

diodes

anode cathode

zener diode

Crystal Diode

Description: Cryst als usually have met al bodies and produce a Description: Diodes are semiconduct ors t hat only allow current t o flow
consist ent elect rical pulse. They are t ypically used as in one direct ion - like a one way st reet . They can convert
clocks, cont rolling t he t iming of event s in digit al circuit s. alt ernat ing current t o direct current . A zener diode act s
Class letter: Y as a volt age limit er for DC volt ages. A diode’s part number
Other: B is usually specified by t he prefix 1N, followed by t wo t o four
Prefix: None digit numbers. Examples include 1N53, 1N751 and 1N4148.
Value Code: Measured in megahert z (MHz), or kilohert z (kHz). Class letter: D or CR
Tolerance: None Other: V
Orientation: Angled corner or dot Prefix: 1N
Polarity: None Value Code: None
Orientation: By polarit y.
Polarity: Polarit y is usually indicat ed by colored ring or up t o t hree
rings near t he negat ive (cat hode) end of axial diodes. An
arrow may also point t o t he negat ive end. The PWB is
marked wit h a st ripe, line, or arrow symbol showing where
t he cat hode end of t he diode should be placed.

A Square Land* may also mark where t he cat hode

end is insert ed.

* See page 12, “The Square Land/Pad”

17 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 18
Through-Hole G Axial & Radial Through-Hole G Axial & Radial

anode cathode

Light-Emitting Diode Filter

Description: Also known as LED’s, t hese component s emit light . Description: Filt ers are used t o pass one frequency or frequency
Class letter: DS band while blocking ot hers. They are oft en used t o filt er
Other: E, LED, D, DIS, CR elect rical noise in a circuit .
Prefix: None Class letter: FL
Value Code: None Other: Z
Tolerance: None Prefix: None
Orientation: By polarit y. Value Code: None
Polarity: LEDs are usually radial leaded and polarit y is t ypically Tolerance: None
indicat ed by t he locat ion of t he cup and spoon inside Orientation: The inst allat ion of filt ers is usually by lead configura -
t he lens. The cup is associat ed wit h t he cat hode, t ion. The pat t ern of holes or lands on t he PWB means
or negat ive lead. The negat ive lead t here is only one way t o insert t he filt er.
may also be short er. Polarity: None

Square Land: Cup

The PWB may also be marked
wit h a square land showing where Spoon
t he cat hode end is insert ed
and/or a silkscreened out line of
t he component body wit h a flat Cat hode
edge t o indicat e polarit y. Lead
See page 12,
“The Square Land/Pad”

19 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 20
Through-Hole G Axial & Radial Through-Hole G Axial & Radial

fuses

circuit breaker

Fuse Inductor

Description: Fuses consist of a wire wit h low melt ing point met al. Description: Induct ors consist of a coil of wire t hat creat es a magnet ic
When current passing t hrough t he wire exceeds a field when current flows t hrough t he coil.
prescribed level, t he wire melt s and opens t he circuit , Transformers, Coils and Toroids are relat ed t o induct ors.
prot ect ing equipment from damage. (see Transformers on page 23). The t oroid choke consist s of
Class letter: F a coil wound on a t oroid, or doughnut of magnet ic met al.
Prefix: None The met al core increases t he induct ance of t he coil.
Value Code: Measured in amps Class letter: L
Tolerance: None Prefix: None
Orientation: None Value Code: Measured in microhenry (µH) or millihenry (mH). The value
Polarity: None is eit her print ed on t he induct or body or calculat ed by
decoding 4 of 5 colored bands on t he induct or body int o
A circuit breaker is a device t hat when exposed t o numbers.
excess current will “t rip” or become elect rically open Tolerance: Print ed as last of five-band color band syst em.
and can be reset . Orientation: None
Class letter: CB

A Circuit Breaker Panel

like t he one in your home.

Choke Coil

21 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 22
Through-Hole G Axial & Radial
air core
iron core
Transformer
Description: Transformers are relat ed t o induct ors. Transformers
basically consist of primary and secondary coils wound on
a common core of ferromagnet ic mat erial.
When alt ernat ing current flows t hrough t he primary coil,
t he result ing magnet ic field induces an alt ernat ing volt age
across t he secondary coil. The induced volt age can cause
current t o flow in an ext ernal circuit .
Class letter: T
Prefix: None
Value Code: Measured in microhenry (µH) or millihenry (mH).
The value is print ed on t he body.
Orientation: Many t ransformers have non-symmet rical leads which only
allow it t o be inst alled one way.
Transformer
mount ed
on a board
23 Com ponent Identification Desk Reference Manual
Through-Hole G Axial & Radial
Resistor
Description: Resist ors limit t he flow of elect rical current in a circuit .
This is like a highway narrowing from six lanes t o a
t wo-lane road. Fixed resist ors are usually made of met al
film. The bigger t he met al film resist or, t he great er it s
wat t age rat ing (wat t age is a measure of elect rical power).
Resist ors can also be made of hot molded carbon.
In addit ion, t here are wire wound power resist ors.
Class letter: R
Prefix: RC= color coded
RN = met al film
RCL = wire wound
Value Code: Measured in ohms (Ω). The value is eit her print ed on t he
resist or body or is calculat ed by decoding 3 t o 5 colored
bands on t he resist or body int o numbers.
Tolerance: Print ed on body or as part of color band syst em.
Orientation: None
Polarity: None
Com ponent Identification Desk Reference Manual 24
Through-Hole G Axial & Radial Through-Hole G Axial & Radial

Variable Resistor Voltage Regulator

Description: Also called a pot ent iomet er, t rimpot or t rimmer, Description: Volt age regulat ors keep out put volt age const ant during
a variable resist or is a resist or whose value can be variat ions of t he out put load or t he input volt age.
changed by t urning a shaft , screw or sliding a cont act . Oft en looks like a TO220 package. .
Class letter: R Class letter: VR
Other: VR, VAR, VRN, ADJ Other: U
Prefix: None Prefix: None
Value Code: Measured in a range in ohms. Maximum value is usually Value Code: None
molded int o component body. Example: 20 MΩ. Tolerance: None
Tolerance: None Orientation: Angle on t he body or indent ed dot .
Orientation: Non-symmet rical lead pat t ern only allows it t o be Polarity: None
inst alled one way. Pin One is usually ident ified.
A square land may also mark where pin 1 is insert ed.*
Polarity: None

* See page 12, “The Square Land/Pad”

25 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 26
Through-Hole G Axial & Radial Through-Hole G Axial & Radial

to

to

Thermistor Transistor

Description: Resist s current flow based on t emperat ure. Description: Transist ors are semiconduct ors t hat can amplify,
Oft en looks like a disc capacit or. oscillat e and provide swit ching act ion on elect rical signals.
Class letter: RT Like diodes, t ransist ors do not ut ilize unit s of measure-
Other: R ment . Inst ead, t heir component t ype is usually specified
Prefix: None by t he prefix 2N or 3N, followed by t wo t o four digit
Value Code: None numbers. Examples include 2N50, 2N70 1 and 2N2222A.
Tolerance: None Class letter: Q
Orientation: None Other: Vor U
Polarity: None Prefix: 2N
Orientation: Indicat ed by one of several met hods:
• Pin Numbers or pin names which mat ch
t o t he PWB silkscreen.
• Tab on t he t ransist or “can”. When looking down
on t he component from t he t op, pin one is eit her t o
t he right of, or direct ly underneat h t he t ab. The
pins count count erclockwise from pin one.
• Mat ching component shape wit h PWB silkscreen
out line: Out line on PWB includes t he t ab—align t he
t ab. Out line on PWB includes t he flat side of t he
t ransist or—align t he flat side. Pat t ern of
t hrough-holes on PWB means t here is only one way
t o insert t he t ransist or.

27 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 28
Through-Hole G Axial & Radial Through-Hole G Hardware
swit ches

relay

Switch Connector

Description: Swit ches open and close a circuit . Description: Connect ors are placed on a PWB so t hat wires, cables and
Class letter: S ot her out side connect ions can be made t o t he PWB. They
Other: SW usually have a housing around t heir pins.
Prefix: None Class letter: P for MALE PLUG connect or,
Value Code: May have value rat ing for maximum current in amps. or J for FEMALE JACK / RECEPTACLE connect or.
Example: 10 A. May also have mechanical informat ion such Orientation: Bevel, not ch or pin number molded int o t he package.
as DPDT; “double-pole, double-t hrow” print ed on it . Polarity: None
Tolerance: None
Orientation: Dot or not ch
Polarity: None

Relays are swit ches t hat open and close when act uat ed
by an applied signal.
Class letter: K

A Relay on
a part ially assembled PWB

29 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 30
Through-Hole G Hardware Through-Hole G Hardware

Header Jumper

Description: Headers, like connect ors are placed on a PWB so t hat
out side connect ions can be made. Headers usually do not
have a housing around t heir pins.
Class letter: J or P
Orientation: Usually none. Oft en has alignment or locking t abs for t he
connect or which mat es wit h it . Correct orient at ion of t his
t ab is import ant .
Polarity: None
Description: Also called jumper configurat ion, jumper wire or head pin
configurat ion. Jumpers connect t wo pins on t he
assembly t oget her, providing an elect rical pat h bet ween
t hose point s. Jumpers are somet imes used t o solve
circuit ry errors in t he PWB it self. Ot her t imes t hey are
used t o provide a way t o change t he assembly’s
configurat ion for different applicat ions.
Class letter: W, or E for insulat ed piece of conduct or (wire);
or P, for a plug.
Other: JP
Prefix: None
Value Code: None
Tolerance: None
Orientation: Jumper goes int o header socket
Polarity: None

31 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 32
Through-Hole G Hardware Through-Hole G IC’s

resist er pack

diode pack

Socket SIP

Description: Socket s are soldered ont o circuit boards so t hat an IC can Description: SIP st ands for Single- In-line- Package. SIPs are oft en
be plugged int o t he socket and not soldered direct ly t o t he resist or net works (or packs) or diode arrays.
board. This makes removing or upgrading t he part much Class letter: R for resist or net works, D or CR for diode array, et c
easier. Socket s are somet imes used for component s t hat Other: RP, RN
cannot be soldered in place because of heat sensit ivit y. Prefix: None
Class letter: X, XAR, XU, XQ, et c.. Value Code: SIP packages somet imes hold banks of passive
Other: TS, S component s. Those values may be marked on t he
Prefix: None component package. For example, eight 2K resist ors
Value Code: None would have t he value: “8x2K.”
Tolerance: None Tolerance: None
Orientation: Socket s usually have Orientation: Det ermined by t he locat ion of lead one. A SIP IC’s leads
a dot are numbered t o ensure proper placement of t he
or a not ch component on t he circuit board or int o a PWB-mount ed
t o indicat e socket . The orient at ion marking on most SIPs is usually
orient at ion t o t he right over lead one. The remaining leads are count ed
PWB. Once inst alled, from lead one.
a socket may cover
Lead One Markings: The most common markings for
t he PWB orient at ion
orient at ion on SIPs are numbers, a st ripe or a dot .
mark, so it ’s
import ant t o place
t he socket correct ly.

33 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 34
Through-Hole G IC’s Through-Hole G IC’s

DIP IC Can

Description: DIP st ands for Dual- In-line- Package. DIPs are usually made Description: IC Cans are oft en t ransist ors or volt age regulat ors.
of plast ic or ceramic (called CERDIPS). They may include Class letter: U general IC, Q for t ransist or, AR amplifier, et c.
hundreds, or t housands of various component s. Other: IC
Class letter: U Prefix: None
Other: IC or AR, C, Q, R, et c. Value Code: None
Prefix: None Tolerance: None
Value Code: DIP packages somet imes hold banks of passive Orientation: Det ermined by t he locat ion of lead one.
component s. Those values may be marked on t he An IC Can’s leads are numbered t o ensure proper
component package. For example, eight 2K resist ors would placement of t he component on t he circuit board or
have t he value: “8x2K.” int o a PWB mount ed socket .
Lead Pitch: 100 mils
Orientation: Det ermined by t he locat ion of lead one. A DIP IC’s leads are The orient at ion marking on most IC Cans is usually a
numbered t o ensure proper placement of t he component on t ab in t he rim of t he can over t he highest numbered
t he circuit board or int o a PWB-mount ed socket . The pin, or bet ween pin 1 and t he highest pin.
orient at ion marking on most DIPs is usually eit her right over
lead one or on t he end at which lead one is found. The The pins are count ed count erclockwise
remaining leads are count ed count erclockwise from lead one. st art ing from t he right of t he t ab
when looking down on t he t op
Lead One Markings: The most common markings for
of t he can.
orient at ion on ICs are:
• not ch • numbers • st ripe
• dimple • wedge
Square Land: The square land is used t o show t he locat ion of lead one
on t he PWB. Aligning lead one of t he IC wit h t he square land on t he
board ensures proper inst allat ion of t he component .

35 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 36
Through-Hole G IC’s Surface Mount G CHIPs, MELFs & SOTs

capacit ors

resist ors

PGA Chip Components

Description: PGA st ands for Pin Grid Array. PGAs have several rows of Description: Chip component s are usually ceramic-bodied packages wit h
leads or pins ext ending from t he bot t om of t he IC. The met al connect ions called t erminat ions at eit her end. The
rows make up a grid of connect ion point s. PGAs come in most common t ypes of chip component s are ceramic
plast ic packages (left ) and ceramic packages (right ). resist ors and capacit ors. Five-sided chip component s have
Class letter: U a solderable surface on five sides of it s t erminal
Other: IC or AR, C, Q, R, et c. cont act . The t erminal cont act is t he area where t he
Prefix: None component is at t ached t o t he surface of t he PWB.
Value Code: None Three-sided component s have a solderable surface on t hree
Tolerance: None sides of it s t erminal cont act .
Orientation: Usually det ermined by t he locat ion of a not ch in t he
package right over pin one. A corresponding mark on t he Chip Resist ors
PWB or socket provides proper alignment . Somet imes also Class letter: R
by a missing pin on t he component , or a missing hole on Value: Measured in ohms (Ω).
t he board. Orientation: None
Square Land: A square base t o one lead among t he leads Polarity: None
in a PGA is also used t o show orient at ion. Aligning t hat
lead wit h a mat ching square land on t he board ensures Chip Capacit ors
proper inst allat ion of t he component . Class letter: C
Value: Measured in microfarads (µF) or picofarads (pF).
Orientation: None
Polarity: None Not e: See Tant alum Capacit ors, page 41

cont inued . . .

37 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 38
Surface Mount G CHIPs, MELFs & SOTs Surface Mount G CHIPs, MELFs & SOTs

Chip Components Chip Components

Reading Chip Resist or Value Codes Reading Chip Capacit or Value Codes
Somet imes t he numeric value (ohms) may be print ed on t he chip Depending on t he size of t he chip capacit or, t he value code may be
resist or body. More frequent ly, t his value code is print ed on t he label of t he print ed on t he body of t he component , or on t he label of t he reel in which
reel in which t he chips are packaged. This is because t he component it self t hey're packaged. The code for a chip capacit or is a t hree-digit number
is t oo small, or will not allow for print ing on t he resist ive element . expressing a value, usually in picofarads (pF).
The code is a t hree- or four-digit number. Wit h t hree-digit codes, t he first As wit h chip resist or t hree-digit codes, t he first t wo numbers are value
t wo numbers are value numbers, and t he t hird is t he mult iplier. For example: numbers, and t he t hird is t he mult iplier. Example: 221, where 2 and 2 are
102, where 1and 0 are at t ached t o 2 zeroes t o equal 10 0 0 Ohms. at t ached t o 1zero t o equal 220 pF.
Wit h four-digit codes, t he first t hree numbers are t he value numbers, and
A "0" (zero) in t he mult iplier posit ion for capacit ors means no zeros are
t he fourt h number is t he mult iplier. For example: 1501, where 1, 5, and 0
added t o t he value. A let t er R is a decimal point holder. Tolerance comes
are at t ached t o 1zero t o equal 150 0 Ohms.
in many variet ies and may be shown wit h let t er codes using t he key chart
For eit her code, a "0 " (zero), in t he mult iplier posit ion means don't add any at t he bot t om of t he previous page.
zeros. Example: 150 , where 1and 5 are at t ached t o no zeros t o equal 15 Ohms.
A let t er R in eit her code means t o "place a decimal point at t his spot ."
Size Codes
Example: 49R9 = 49.9 Ohms.
A chip’s size, in inches or millimet ers, is described by a 4-digit code:
B = ± .1% The first 2 digit s are
Tolerance Letter Codes C = ± .25% Size Codes (inches) It is SizeCodes (met ric) t he lengt h.
import ant
For some manufact urers, chip resist ors wit h D = ± .5 % 0402 .04” x.02” t o be cert ain 1005 1.0 x 0 .5 mm t he second 2 digit s
F = ± 1% 0605 .06” x .05” of which 1508 1.5 x 0.8 mm are t he widt h.
3-digit codes are assumed t o be 5%t olerance, G = ± 2% 0805 .08” x .0 5” measurement 2012 2.0 x 1.2 mm
and 4-digit chips are assumed t o be 1%. syst em
J = ± 5% 1005 .10” x .0 5” a size code 2512 2.5 x 1.2 mm
K = ± 10% 1206 .12” x .06 ” is in. 3225 3 .2 x 2 .5 mm
Tolerance can be decoded from t his chart M = ± 20% 1210 .12” x .10” (inches or
4532 4.5 x 3 .2 mm
when let t er codes are used. 1812 .18 ” x .12” millimet ers) 56 6 4 5 .6 x 6 .4 mm
Z = + 8 0 /-20 % 2225 .22” x .25”

39 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 40
Surface Mount G CHIPs, MELFs & SOTs Surface Mount G CHIPs, MELFs & SOTs

diodes

capacit ors

resist ors

induct ors

Tantalum Capacitors M ELF

Description: Molded Tant alum Capacit ors are polarized chip capacit ors
wit h inward formed L-leads. These leads almost t ouch t he
body of t he component . Inside are met al plat es which
st ore and discharge elect ricit y.
Class letter: C
Prefix: None
Value Range: 0.001 µF t o 10 00 pF, 4 t o 100 V dc.
Tolerance: None
Orientation: By polarit y.
Polarity: Line, + or A on anode end. Beveled t op on anode end.
Size Code: A t ant alum capacit or’s size is described by one of four
let t ers: A, B, C, or D. These four size codes st and for
met ric foot print s of lengt h and widt h.
Description: Met al ELect rode Face (MELF) leadless component s have
met allized t erminals at bot h ends of a cylindrical body.
Typical MELF component s include diodes, resist ors,
capacit ors and induct ors. Polarit y, value coding and CRDs
are t he same for t hese component s as for t heir surface
mount chip and t hrough-hole count erpart s. The smallest
of t he MELFs are called “mini-MELFs” and “micro-MELFs.”
Class letter: Depends on component t ype.
Prefix: None
Value Code: Resist ors have 4 or 5 bands which convey t heir value.
Tolerance: Resist ors have a t olerance band.
Orientation: By polarit y.
Polarity: MELF diodes have a band at t he cat hode end.

Tant alum Capacit or Sizes: MELF resist ors are designed t o fit same foot print s
Size Codes as chip resist ors, such as t he 08 05 (.08 x .05 inches)
and t he 1206 (.12 x .0 6 inches).
A = 3.2 x 1.6 mm
B = 3.5 x 2.8 mm
C= 6.0 x 3.2 mm
D = 7.3 x 4 .3 mm

41 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 42
Surface Mount G CHIPs, MELFs & SOTs Surface Mount G CHIPs, MELFs & SOTs

t ransist ors t ransist ors

diodes diodes

SOT DPAK

Description: Small Out line Transist ors (SOTs ) are rect angular
t ransist or or diode packages wit h t hree or more gull-wing
leads. The most popular size is t he SOT23. Ot her package
sizes include t he SOT89, SOT143 and SOT 223. SOTs have
3 or 4 gull wings on t wo sides of t heir package.
Class letter: Q for t ransist or packages; D or CR for diode packages.
Prefix: None
Value Code: By package size.
Tolerance: None
Orientation: Det ermined by lead pat t ern, or number one lead.
Polarity: None
Description: DPAKs are Diode Packages, which accommodat e higher
powered groups of t ransist ors and diodes. D2PAKs are
t he largest surface mount t ransist or made and include a
heat sink mount ing pad. DPAKs have 3 gull wings on t wo
sides of package.
Class letter: Qfor t ransist or packages; D or CR for diode packages.
Prefix: None
Value Code: Det ermined by package size.
Tolerance: None
Orientation: Det ermined by lead pat t ern.
Polarity: None
Sizes: SOTs and DPAKs are designed t o fit t he same foot print as
t heir t hrough-hole cousins. For inst ance, a D2PAK is
designed t o fit t he TO220 t hrough-hole t ransist or.

43 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 44
Surface Mount G The SOIC Family Surface Mount G The SOIC Family

SOIC SO

Description: SOIC st ands for Small Out line Int egrat ed Circuit . The Description: SO st ands for Small Out line. The original SOIC.
SOIC family is made up of nearly a dozen different IC’s wit h # of Pins: 8-16
a variet y of body sizes and lead st yles. The number of Body Width: 156 mils (3.97 mm)
leads varies also, and is det ermined by t he size of t he IC’s Lead Type: Gull-wing
body. SOICs are usually referred t o by t heir abbreviat ion, Lead Pitch: 50 mil (1.27 mm)
which may or may not include an “IC” at t he end. This Class letter: U
makes for some confusion as t he same package may be Other: IC or AR, C, Q, R, et c.
called by more t han one name. Also, some SOIC names Value: None
have cont radict ory words in t hem. For inst ance, a SOL and Orientation: Indicat ed by a beveled edge over t he number one lead,
a SOLIC are bot h names for t he same IC—a Small Out line or an end not ch or st ripe on t he IC. Leads are
Large IC. count ed count erclockwise from t he number one lead.
# of Pins: 8-56 The PWB oft en has a square silkscreened at
Body Width: Various t he pin one locat ion.
Lead Type: Gull-wing, J-lead, flat and I-lead Polarity: None
Lead Pitch: From 19.7 t o 50 mils
Class letter: U
Other: IC or AR, C, Q, R, et c.
Value: None
Orientation: Indicat ed by a dot or a beveled edge over t he number one
lead, or an end not ch or st ripe on t he IC. Leads are
count ed count erclockwise from t he number one lead.
The PWB oft en has a square silkscreened at t he pin one
locat ion.

45 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 46
Surface Mount G The SOIC Family Surface Mount G The SOIC Family

SOM SOL / SOW

Description: SOM st ands for Small Out line, Medium. Description: SOLst ands for Small Out line, Large; SOW st ands for
Commonly used for resist or net works. Small Out line, Wide. The name SOP, or Small Out line
# of Pins: 8-16 Package, is also used for t his IC.
Body Width: 220 mils (5.6 mm) # of Pins: 16-32
Lead Type: Gull-wing Body Width: 300 -440 mils (6.6 3 - 12.2 mm)
Lead Pitch: 50 mil (1.27 mm) Lead Type: Gull-wing
Class letter: U Lead Pitch: 50 mil (1.27 mm)
Other: IC or AR, C, Q, R, et c. Class letter: U
Value: None Other: IC or AR, C, Q, R, et c.
Orientation: Indicat ed by a dot or a beveled edge over t he number one Value: None
lead, or an end not ch or st ripe on t he IC. Leads are Orientation: Indicat ed by a dot or a beveled edge over t he number one
count ed count erclockwise from t he number one lead. lead, or an end not ch or st ripe on t he IC. Leads are
The PWB oft en has a square silkscreened at count ed count erclockwise from t he number one lead.
t he pin one locat ion. The PWB oft en has a square silkscreened at
Polarity: None t he pin one locat ion.
Polarity: None

47 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 48
Surface Mount G The SOIC Family Surface Mount G The SOIC Family

SOL-J VSOP

Description: SOL-J st ands for Small Out line, Large, J-Lead. Also called Description: VSOP st ands for Very Small Out line Package. Higher
t he SOJ. densit y gull-wing leads. Somet imes t he name VSOP is
# of Pins: 16-40 used int erchangeably wit h SSOP.
Body Width: 300 -440 mils (6.6 3 - 12.2 mm) # of Pins: 32-56
Lead Type: J-lead Body Width: 30 0 mils (6 .6 3 mm)
Lead Pitch: 50 mil (1.27 mm) Lead Type: Gull-wing
Class letter: U Lead Pitch: 25 mil (0.6 5 mm)
Other: IC or AR, C, Q, R, et c. Class letter: U
Value: None Other: IC or AR, C, Q, R, et c.
Orientation: Indicat ed by a dot or a beveled edge over t he number one Value: None
lead, or an end not ch or st ripe on t he IC. Leads are Orientation: Indicat ed by a dot or a beveled edge over t he number one
count ed count erclockwise from t he number one lead. lead, or an end not ch or st ripe on t he IC. Leads are
The PWB oft en has a square silkscreened at count ed count erclockwise from t he number one lead.
t he pin one locat ion. The PWB oft en has a square silkscreened at
Polarity: None t he pin one locat ion.
Polarity: None

49 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 50
Surface Mount G The SOIC Family Surface Mount G The SOIC Family

SSOP QSOP

Description: SSOP st ands for Shrink Small Out line Package. Same as Description: QSOP st ands for Quart er Small Out line Package.
VSOP but wit h smaller case. Same as t he original SO, but wit h 25 mil lead pit ch inst ead
# of Pins: 8-30 of 50.
Body Width: 208 mils (5.3 mm) # of Pins: 20-56
Lead Type: Gull-wing Body Width: 156 mils (3.97 mm)
Lead Pitch: 25 mil (0.6 5 mm) Lead Type: Gull-wing
Class letter: U Lead Pitch: 25 mil (0.6 5 mm)
Other: IC or AR, C, Q, R, et c. Class letter: U
Value: None Other: IC or AR, C, Q, R, et c.
Orientation: Indicat ed by a dot or a beveled edge over t he number one Value: None
lead, or an end not ch or st ripe on t he IC. Leads are Orientation: Indicat ed by a dot or a beveled edge over t he number one
count ed count erclockwise from t he number one lead. lead, or an end not ch or st ripe on t he IC. Leads are
The PWB oft en has a square silkscreened at count ed count erclockwise from t he number one lead.
t he pin one locat ion. The PWB oft en has a square silkscreened at
Polarity: None t he pin one locat ion.
Polarity: None

51 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 52
Surface Mount G The SOIC Family Surface Mount G Large Scale ICs

TSOP LCC

Description: TSOP st ands for Thin Small Out line Package. Description: LCCst ands for Leadless Chip Carrier. LCCs are most
Low profile package is only 1.0mm in height . commonly used in aerospace applicat ions. LCCs are
# of Pins: 20-56 ext remely rugged and have no leads t o bend. They are
Body Width: 208 mils (5.3 mm) somet imes called LCCC for Leadless Ceramic Chip Carrier.
Lead Type: Gull-wing # of Pins: 16 - 124
Lead Pitch: 19.7 mil (0.5 mm) Body Type: Ceramic body, very rugged and able t o wit hst and severe
Class letter: U operat ing condit ions, like high t emperat ures.
Other: IC or AR, C, Q, R, et c. Lead Type: Solderable cast ellat ions
Value: None Lead Pitch: 50 mil (1.27 mm)
Orientation: Indicat ed by a dot or a beveled edge over t he number one Class letter: U
lead, or an end not ch or st ripe on t he IC. Leads are Other: IC or AR, C, Q, R, et c.
count ed count erclockwise from t he number one lead. Value: None
The PWB oft en has a square silkscreened at Orientation: Indicat ed by a dot or a beveled edge over t he number one
t he pin one locat ion. cast ellat ion, or an end not ch or st ripe on t he IC.
Polarity: None Cast ellat ions are
count ed
count erclockwise
from number one.
The PWB oft en has
a square
silkscreened at t he
pin number
one locat ion.

53 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 54
Surface Mount G Large Scale ICs Surface Mount G Large Scale ICs

PLCC Flat Lead Package

Description: PLCC st ands for Plast ic Leaded Chip Carrier. PLCCs fit Description: Flat lead packages have leads ext ending from t wo sides.
int o IC socket s or may be soldered direct ly t o t he PWB. A # of Pins: 10 - 28
ceramic version of t his IC package is called t he CLCC, or Lead Type: Flat
Ceramic Leaded Chip Carrier. This name is easily confused Lead Pitch: 50 mil (1.27 mm)
wit h t he LCCC which is a leadless component . Class letter: U
Lead Type: J-lead Other: IC or AR, C, Q, R, et c.
# of Pins: 20 - 10 0 Value: None
Body Type: Plast ic Orientation: Indicat ed by a dot or a beveled edge over t he number one
Lead Pitch: 50 mil (1.27 mm) lead, or an end not ch or st ripe on t he IC. Leads are
Class letter: U count ed count erclockwise from t he number one lead when
Other: IC or AR, C, Q, R, et c. looking down at t he component from t he t op. The PWB
Value: None oft en has a square silkscreened at t he pin one locat ion.
Orientation: Indicat ed by a dot or a beveled edge over t he number one
lead, or an end not ch or st ripe on t he IC. Leads are
count ed count erclockwise from t he number one lead when shown here
looking down at t he component from t he t op. The PWB is t he Flat Lug Lead,
oft en has a square silkscreened at t he pin one locat ion. anot her t ype of
flat lead device.

55 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 56
Surface Mount G Large Scale ICs
QFP (MQFP)
Description: QFP st ands for Quad Flat Pack. Also commonly called t he
MQFP, for Met ric QFP. The QFP family is made up of a
variet y of different ICs. The “quad” part of Quad Flat Pack
t ells us t hat leads ext end from all four sides of t he package.
QFPs are high lead count , fine lead pit ch devices. QFPs, like
most ICs, are usually referred t o by t heir abbreviat ion, which
may or may not include a “QFP” at t he end. A met al body
version of t he QFP is called t he MQUAD® , a regist ered
t rademark of t he Olin Corporat ion. A ceramic body, int ernal
mult ilayer version of t he QFP is called t he CQFP.
# of Pins: 44-132
Body Type: Plast ic (Also met al and ceramic)
Lead Type: Gull-wing
Lead Pitch: 11.8 mil (0.3 mm) t o 25.6 mil (0.6 5 mm)
Class letter: U
Other: IC or AR, C, Q, R, et c.
Value: None
Orientation: Indicat ed by a dot or a beveled edge over t he number one
lead, or an end not ch or st ripe on t he IC. Leads are
count ed count erclockwise from t he number one lead. The
PWB oft en has a square silkscreened at
t he pin one locat ion.
57 Com ponent Identification Desk Reference Manual
Surface Mount G Large Scale ICs
PQFP
Description: PQFP st ands for Plast ic Quad Flat Pack. The PQFP is
essent ially t he same as a QFP except t hat each corner
ext ends beyond t he plane of t he leads, forming a prot ect ive
“bumper.” These bumpers prot ect t he leads during handling
and assembly. PQFPs are built wit h t rue inch
measurement s of t heir lead pit ch. The 25 mil lead pit ch
version is .6 35mm, not t he more common .6 5mm.
# of Pins: 44-132
Body Type: Plast ic
Lead Type: Gull-wing
Lead Pitch: 25 mil (0.6 36 mm)
Class letter: U
Other: IC or AR, C, Q, R, et c.
Value: None
Orientation: Indicat ed by a dot or a beveled edge over t he number one
lead, or an end not ch or st ripe on t he IC. Leads are
count ed count erclockwise from t he number one lead.
The PWB oft en has a square silkscreened at
t he pin one locat ion.
Com ponent Identification Desk Reference Manual 58
Surface Mount G Large Scale ICs Reading Component Values

Axial Resistor Values

The value of a resist or
is expressed in a unit of elect rical resist ance called ohms (Ω) .

Axial resist ors will oft en have 4 or 5 color bands

which are “read” using a
Resist or Band
Color Code Chart ,
page 6 2.

BGA

Description: BGA st ands for Ball Grid Array. Inst ead of convent ional
leads t hey use row upon row of t iny met al balls t hat are Axial resist ors will
soldered t o a mat ching set of lands on t he PWB. somet imes have t heir
The rows make up a grid of connect ion point s. wat t age and t olerance values
# of Pins: 25 - 6 25 print ed on t hem in number codes,
Body Type: Plast ic, met al or ceramic
Lead Type: Ball grid
Lead Pitch: 1.5 mm and 50 mil (1.27 mm)
Class letter: U Numbered Resistors
Other: IC or AR, C, Q, R, et c.
Value: None The example below shows how t o read t he value and t olerance when
Orientation: Indicat ed by a dot or a a number and let t er code syst em is used. You are provided wit h t he
beveled edge over t he value and mult iplier numbers, such as t he 10 0 3 example where t he 100
A1lead, or an end not ch is at t ached t o 3 zeros t o equal 10 0 ,0 0 0Ω
or st ripe on t he IC. 1 Tolerance
Leads are count ed using a A 2 Let t er Codes
grid syst em, similar t o a 3 Tolerance is shown
4 wit h let t ers using
road map, st art ing wit h B
t he A1 lead. t hese codes:
The PWB oft en has F = ±1%
a square silkscreened at C G = ±2%
t he A1 locat ion. J = ±5%
D K = ±10%
M = ±20%
Z = +80/-20%

59 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 60
Reading Component Values Reading Component Values

RESISTOR Band Color Codes

4-band Resistors

Value Bands: The first t wo color bands on 4-band resist ors are
read as act ual numbers.
Mult iplier Band: The t hird band on 4-band resist ors is called a
“mult iplier band” because t hat color’s number on
t he color chart shows how many zeros t o add t o
t he end of t he numbers from t he first t wo bands.
Tolerance Band: The last band is t he t olerance.

5-band Resistors

Value Bands: The first t hree color bands on 5-band resist ors are
read as act ual numbers.
Mult iplier Band: The fourt h band on 5-band resist ors is called a
“mult iplier band” because t hat color’s number on
t he color chart shows how many zeros t o add t o
t he end of t he numbers from t he first t hree bands.
Tolerance Band: The last band is t he t olerance.
Milit ary 5-Band: A fift h, whit e band in a milit ary 5-band resist or
means t hat t he resist or has Milit ary Solderable
Leads. Ignore t he fift h band, and read as a
4-band resist or.

61 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 62
Reading Component Values Reading Component Values

Capacitor Values
CAPACITOR Band Color Codes
The value of a capacit or is expressed in a unit of elect rical capacit ance
called farads. A capacit or will have t he value and t olerance marked on it s body.
There are t hree unit s of measurement for capacit ors, using farads:
• picofarads pF, The smallest unit of measurement .
• nanofarads nF, The middle range unit of measurement .
• microfaradµF, The largest unit of measurement .
The values on capacit ors are usually print ed in picofarads. The chart belowwill help
you convert from picofarads t o nanofarads t o microfarad:
picofarads - pF nanofarads - nF microfarad - µF
100,000,000 = 100,000 = 100
10,000,000 = 10,000 = 10
1,000,000 = 1,000 = 1
100,000 = 100 = .1
10,000 = 10 = .01
1,000 = 1 = .001
100 = .1 = .0001
10 = .0 1 = .00001
1 = .001 = .000 001
.1 = .0001 = .0000001

Numbered Capacit ors

If no t ol erance i s show n ,
t h e t ol erance i s ± 20%.
Values beginning wit h a decimal
are usually measured in microfarads (µF),
all ot her values are assumed t o be in
picofarads (pF). Four-digit values are
also measured in picofarads, but wit hout
a mult iplier. (see 3300 cap shown left )
Some capacit ors are coded wit h
a t hree-digit number which is similar t o
t he color-band syst em, except you are
provided wit h t he value and mult iplier
numbers, such as t he 203 example below
where t he 2 and 0 are at t ached t o
3 zeros t o equal 20,000 pF (or .02 µF).

Tolerance Let t er Codes

F = ±1%
Tolerance is G = ±2%
shown wit h J = ±5%
let t ers using K = ±10%
t hesecodes: M = ±20%
Z = +80/-20%

63 Com ponent Identification Desk Reference Manual Com ponent Identification Desk Reference Manual 64
Reading Component Values This reference manual does not take precedence over, or replace in any way, the requirm ents in
any IPC Standard or Specification. This m anual is intended for use as an illustrated support
docum ent to assist in the training of com ponent identification. IPC disclaim s any warranties or
guarantees, expressed or im plied, and shall not be liable for damages of any kind in connection
with the inform ation set forth in DRM-18.
INDUCTOR Band Color Codes

If you have comments or suggestions

regarding this Desk Reference Manual,
please contact:
IPC Video/ CBT
PO Box 389
Ranchos De Taos,
New Mexico, USA 87557
505.758.7937 x203
swede@ipcvideo.org
Induct ors are valued in microhenries. The symbol for microhenries is µH. DRM-18
original - 9/ 95 -1m
The value for an induct or may be print ed on t he component body, or it may revision A - 4/ 96 -5m
revision B - 2/ 97 -5m
be print ed wit h color bands, much in t he same way as a resist or. revision C - 7/ 98 -5m
revision D - 7/ 99 -5m
revision E - 8/ 00 -5m
revision F - 8/ 01 -5m
65 Com ponent Identification Desk Reference Manual