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  • BQ79616PAPRQ1

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    Saravanabhavan Chandrasekar
    12 views4 pages
    This document provides quality and reliability data for the BQ79616PAPRQ1 component from Texas Instruments. It includes information about the assembly site, RoHS and REACH compliance, device marking, lead finish and ball material, MSL rating and peak reflow temperature, and material content. No MTBF, FIT, or reliability test results are available in the report. The document directs readers to additional TI resources for general quality guidelines, certifications, and other component information.

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    Quality, reliability & packaging data for Texas Instruments BQ parts

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    This document provides quality and reliability data for the BQ79616PAPRQ1 component from Texas Instruments. It includes information about the assembly site, RoHS and REACH compliance, device marking, lead finish and ball material, MSL rating and peak reflow temperature, and material content. No MTBF, FIT, or reliability test results are available in the report. The document directs readers to additional TI resources for general quality guidelines, certifications, and other component information.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    12 views4 pages

    BQ79616PAPRQ1

    Uploaded by

    Saravanabhavan Chandrasekar
    This document provides quality and reliability data for the BQ79616PAPRQ1 component from Texas Instruments. It includes information about the assembly site, RoHS and REACH compliance, device marking, lead finish and ball material, MSL rating and peak reflow temperature, and material content. No MTBF, FIT, or reliability test results are available in the report. The document directs readers to additional TI resources for general quality guidelines, certifications, and other component information.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 4

    BQ79616PAPRQ1

    Quality, reliability & packaging data download


    Status: ACTIVE

    Report date: 04/05/2022

    Assembly site: TI PHILIPPINES A/T

    RoHS

    REACH

    Device marking

    Lead finish/Ball material

    MSL rating/Peak reflow

    Rating

    1 BQ79616PAPRQ1 - 05 APRIL 2022


    Copyright © 2020 Texas Instruments Incorporated
    www.ti.com

    Material content

    Homogeneous Material Level Component Level

    Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm

    Bond Wire

    Die Attach Adhesive

    Lead Frame

    Lead Frame Plating

    Mold Compound

    Semiconductor Device

    BQ79616PAPRQ1 - 05 APRIL 2022 2


    Copyright © 2020 Texas Instruments Incorporated
    www.ti.com

    MTBF/FIT estimates

    MTBF / FIT MTBF / FIT supporting data

    MTBF FIT Usage temp (°C) Conf level (%) Activation energy Test temp (°C) Test duration (hours) Sample size Fails Additional comments
    (eV)

    Qualification summary

    No results found

    Ongoing reliability monitoring

    FAB process reliability data

    Fab Process Reliability Test Rolling Year (4Q20 - 3Q21) Sample Size Cumulative Sample Size Disposition

    Assembly process reliability data

    Package Family Reliability Test Rolling Year (4Q20 - 3Q21) Sample Size Cumulative Sample Size Disposition

    3 BQ79616PAPRQ1 - 05 APRIL 2022


    Copyright © 2020 Texas Instruments Incorporated
    www.ti.com

    Additional resources
    General quality guidelines
    Certifications
    Conflict minerals specialized disclosure report
    Restricted chemical test report
    For additional component information, please visit Material content search
    For additional information, please contact TI customer support center

    BQ79616PAPRQ1 - 05 APRIL 2022 4


    Copyright © 2020 Texas Instruments Incorporated

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