SN74HC138PWR

Quality, reliability & packaging data download

Status: ACTIVE

Report date: 10/20/2021

Assembly site: TI MALAYSIA A/T

RoHS

REACH

Device marking

Lead finish/Ball material

MSL rating/Peak reflow

Rating

1 SN74HC138PWR - 20 OCTOBER 2021

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Material content

Homogeneous Material Level Component Level

Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm

Bond Wire

Die Attach Adhesive

Lead Frame

Lead Frame Plating

Mold Compound

Semiconductor Device

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Copyright © 2020 Texas Instruments Incorporated
Assembly site: Ext-Mfg

RoHS

REACH

Device marking

Lead finish/Ball material

MSL rating/Peak reflow

Rating

Material content

Homogeneous Material Level Component Level

Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm

Bond Wire

Die Attach Adhesive

Lead Frame

Lead Frame Plating

 www.ti.com

Mold Compound

Semiconductor Device

MTBF/FIT estimates

MTBF / FIT MTBF / FIT supporting data

MTBF FIT Usage temp (°C) Conf level (%) Activation energy Test temp (°C) Test duration (hours) Sample size Fails Additional comments
(eV)

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result

Ongoing reliability monitoring

FAB process reliability data

Fab Process Reliability Test Rolling Year (3Q20 - 2Q21) Sample Size Cumulative Sample Size Disposition

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Assembly process reliability data

Package Family Reliability Test Rolling Year (3Q20 - 2Q21) Sample Size Cumulative Sample Size Disposition

5 SN74HC138PWR - 20 OCTOBER 2021

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Additional resources
General quality guidelines
Certifications
Conflict minerals specialized disclosure report
Restricted chemical test report
For additional component information, please visit Material content search
For additional information, please contact TI customer support center

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Copyright © 2020 Texas Instruments Incorporated