Automotive Electronics

Council 2019
Chair Report
S TAT E O F T HE A E C A ND CHA L L E NG ES A HE A D
Automotive Electronics Council
Component Technical Committee

Welcome to the 2 nd European

Automotive Electronics Council
Reliability Workshop
• Thanks to all who contributed papers, chaired or participated in task
groups, participated in technical committee meetings and attended
and sponsored these workshops!
• This workshop has a full contingent of papers and workshop sessions.
Attendance is projected to exceed 120 participants!
Automotive Electronics Council
Component Technical Committee

Current Status
• Increased our membership to 90 companies … 15 NEW members
recently added … Current Membership (April 2019):
• 18 Sustaining
• 56 Technical
• 13 Associate
• 3 Guest

• Participation will be monitored by who is/is not on Technical

Committee or task group calls as well as ballot votes. We have a very
large organization and it should be a privilege to participate in spec
development as an AEC member. Members who are just in it for
sales/marketing purposes will be identified.
Automotive Electronics Council
Component Technical Committee

New Members
Automotive Electronics Council
Component Technical Committee

Chairperson AEC Spec New

/ Facilitator Revisions Memberships
• Technical Committee meetings • Main Q Specs • Process new applications
• Agenda, Minutes and Actions • Sub-spec revisions via sub-teams • Solicit justifications from
• Ballots – tabulation and resolution • Sub-spec issue resolution via new applicants
• Report on subcommittee activities task groups • Recommendation to TC
• Manage committees

Reliability ISO New

Publicity
Workshop Relationships Business
• Hotel Contract • Website improvement • EIA / JEDEC • MEMS
• Advertising • Appearance • JC14.0 • Accelerometers
• Set Topic Agenda • Functionality • JC14.3 • Pressure Sensors
• Judge Papers • Content • ESDA • MCM / Hybrids
• Operations • Communication • IPC • LED
• Printing (handouts) • Print Journals • IEC • PC Board
• Badges • On-line Publications • TC47 • Bare Die / KGD
• Session Chairs • Papers • JEITA (Japan) • Touch Systems
• Attendee Survey • ZVEI (Germany) • Copper Wire
• Workshop Moderators • SAE (U.S.)
Automotive Electronics Council
Component Technical Committee

Chairperson AEC Spec New

/ Facilitator Revisions Memberships

• Mark Kelly (Aptiv) • Subteam leaders and • All

• Hadi Mehrooz (ZF) members per activity
co-chair chart

Reliability ISO New

Publicity
Workshops Relationships Business
• Bassel Atala (ST) • TBD • David Locker (AMRDEC) • All
• Zhongning Liang (NXP) • Zhongning Liang (NXP)
• Mark Kelly (Aptiv) • Nick Lycoudes (NXP)
• Andy Mackie (Indium)
• Tom Lawler (Lattice)
• Steve Sibrel (Harman) Membership
• Ulrich Abelein (Infineon)
• Willi Binder (Microchip)
• Carmen Cotofana (Nexperia) • 90 member companies
• Ludger Kappius (Hella)
• Rene Rongen (NXP)
Automotive Electronics Council
Component Technical Committee

New Structure – Sponsors and Task

Group Chairs for the Mains Specs
Q100 Document Status
AEC Document Current
AEC Document Title
# Rev
Failure Mechanism Based Stress Test Qualification of Integrated Circuits
Q100 I→J
(Sub-Committee Working)
Q100-001 C Wire Bond Shear Test
Q100-002 D Human Body Model Electrostatic Discharge Test
Q100-004 C IC Latch-Up Test
Non-Volatile Memory Program/Erase Endurance, Data Retention and
Q100-005 D
Operating Life Test
Q100-007 B Fault Simulation and Fault Grading
Q100-008 A Early Life Failure Rate (ELFR)
Q100-009 B Electrical Distributions Assessment
Q100-010 A Solder Ball Shear Test
Q100-011 D Charged Device Model (CDM) Electrostatic Discharge Test (Published)
Short Circuit Reliability Characterization of Smart Power Devices for 12V
Q100-012 -
Systems
Q101 Document Status
AEC Document Current
AEC Document Title
# Rev
Q101 D→E Stress Test Qualification for Discrete Semiconductors (Ballot Out)
Q101-001 A Human Body Model (HBM) Electrostatic Discharge (ESD) Test
Q101-003 A Wire Bond Shear Test
Q101-004 - Miscellaneous Test Methods
Capacitive Discharge Model (CDM) Electrostatic Discharge (ESD) Test
Q101-005 A
(Published)
Short Circuit Reliability Characterization of Smart Power Devices for 12V
Q101-006 -
Systems
Q200 Document Status
AEC Document Current
AEC Document Title
# Rev
Stress Test Qualification for Passive Components
Q200 D→E
(Sub-Committee working, 75% ready, Target Ballot date: end of this year)
Q200-001 A Flame Retardance
Q200-002 A Human Body Model Electrostatic Discharge Test
Q200-003 A Beam Load (Break Strength) Test
Q200-004 - Measurement Methods for Resettable Fuses
Q200-005 - Board Flex / Terminal Bond Strength Test
Q200-006 A Terminal Strength Surface Mount / Shear Strength Test
Q200-007 - Voltage Surge Test
Other Documents Status
AEC Document Current
AEC Document Title
# Rev
Q001 D Parts Average Testing
Q002 B Statistical Yield Analysis
Q003 - Guide for Characterization of Integrated Circuits
Q004 -→A Zero Defects Guideline (Sub-Committee Working)
Q005 B Pb-Free Test Requirements
Q006 A Copper Wire Qualification
Charter F→G AEC Charter (Published)
Q104 - MCM/Module Qualification
Q103-002 - MEMS Pressure Sensors (Published)
Q103-003 - MEMS Microphones (Published)
Q102 -→A LED (Ballot out)
Q105 - Touch Systems (Sub-Committee Working)
Automotive Electronics Council
Component Technical Committee

Euro OEM - AEC Collaboration

• Q100 IC Qualification
• Q101 Discrete Qualification
• Q102 LED Qualification
• Q004 Zero Defects Guideline
• Other?
• Q103 MEMS Qualification
• Q104 MCM/Hybrid Qualification
Automotive Electronics Council
Component Technical Committee

Accomplishments in the past year

• Successful Inaugural European AEC Reliability Workshop
• Sub-committee work currently ongoing for Q100, Q101, Q102, Q200,
and Q004 with ballots out now for Q 101 and Q102.
• Ballots completed for Q103-002 Pressure Sensor Devices and
Q103-003 MEMS Microphones
• Ballots completed for both Q100 and Q101 Capacitive Discharge
Model (CDM)
• Strong participation in the 2019 AEC Reliability Workshops
Automotive Electronics Council
Component Technical Committee

Safe the Date

Automotive Electronics Council
Component Technical Committee

Challenges for 2020

• The increasing push for more “leading edge technology” electronic devices/applications
entering automotive environment (e.g., IoT, Autonomous Driving) … paired with
increased function density and OEM safety/critical requirements (ISO26262) is driving
the AEC to re-evaluate current qualification processes, tests and conditions … and
launch development of new documents
• Continue to build and strengthen a working relationship with outside standards
organizations (JEDEC, IEC, USCAR, ZVEI, SAE, JEITA, China) to enable development of
“Next Generation” automotive standards.
• Redefine AEC Membership. How to control rate of growth while maintaining
productivity? Enforce criteria for continued membership (e.g., meeting participation,
ballot voting).
Automotive Electronics Council
Component Technical Committee

Questions?