Professional Documents
Culture Documents
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Mohammad I. Kilani , Paul C. Galambos , Yousef S. Haik and Ching-Jen Chen
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Graduate Student, Mechanical Engineering Department, Florida State University, Tallahassee, FL 32310, kilani@eng.fsu.edu , 850-410-6225
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Intellignet Micromachine Department, Sandia National Laboratory, Albuquerque, NM 87185, pcgalam@sandia.gov, 505-844-2991
BioMEMS Group, Florida A&M University – Florida State University College of Engineering, Tallahassee, FL 32310, haik@eng.fsu.edu, 850-410-6431
Dean, College of Engineering, Florida A&M University-Florida State University. Tallahassee, FL 32310, cjchen@eng.fsu.edu, 850-410-6439
ABSTRACT rejoin the Sandia design team to test and characterize the developed
The paper describes the FAMU-FSU College of Engineering products.
approach in educating graduate students in MEMS technology. The
approach is based on a collaboration project between the Florida The paper gives an overview of SUMMiT surface micromachining
Agricultural and Mechanical University – Florida State University process and describes the software design tools developed for use by a
College of Engineering (FAMU-FSU COE) and Sandia National SUMMiT designer, paying special attention to the educational aspect of
Laboratories (SNL). The project aims at developing a line of these tools. The paper then describes the micropump designs developed
electrostatically and magnetically actuated surface micromachined during the first phase of the collaboration project. The pumps were
pumps. The paper describes our experience in this collaboration designed so that they can be actuated electrostatically using standard
program and illustrates the educational aspects of SNL MEMS design actuators or remotely by magnetic field using a technology that is
tools. The paper also describes the micropump designs developed in currently being developed at the FAMU-FSU COE [2]. The next phase
the first phase of the project and presents an overview of the work to of the project will characterize and optimize the performance of these
be done in the next phase. pumps under various operating conditions.
Poly 2
Poly 1
Anchor
4.1 Crescent Pump Dimple 1 Dimple 3
Ring gear
Figure 3 shows a schematic illustration of the crescent pump. seal vertical support
support
Anchor Axial roller
bearings
Dimple 3 lateral
support ring
The ring gear has internally cut teeth, which mesh with the teeth of an
externally cut idler gear that is set off-center from the ring gear. The Figure 4. Ring gear cross section
crescent part is fixed and divides the fluid flow between the idler gear
and the rotor. As the ring gear and the idler gear rotate in the counter
clockwise direction, the gear teeth come out of mesh in the left side 4.2 Offset Planetary Gear Pump
of the pump. This creates a partial vacuum, which draws fluid into An offset planetary, surface micromachined gear pump was
the pump. The fluid is then transferred to the right side of the pump designed in this work and is briefly described here. A detailed
between the rotating gear teeth and the fixed crescent. As the rotating description of the design can be found in Kilani [6]. The ring gear of
gears mesh together, they cause an increase in pressure that forces the the pump has an inner pitch diameter of 1080 microns and is used as a
fluid into the outlet line. A gear pump can discharge fluid in either driver. The sun gear is eccentrically pivoted around point O and has a
direction, depending on the direction of the gear rotation. pitch diameter of 372 microns. Planetary gear P1 and P2 have pitch
diameters of 348 and 360 microns respectively. It is noted that the
diameters of each of P1, P2 and the sun is approximately equal to 1/3
idler the diameter of the ring gear with P2 slightly larger than P1. The sum
inlet of those diameters is equal to the pitch diameter of the ring gear.
crescent Outlet
P2
ring gear
Sun
P1
O
Inlet
The implementation of the fixed crescent and the idler gear in Figure 5. An offset planetary gear pump in initial
SUMMiT is straightforward. The lower polysilicon level Poly0 is configuration. Ring gear outer teeth not shown.
used as a ground plane. The crescent is in laminated layers of Poly1,
The pumping cycle is illustrated in Figure 6. As the ring gear Driving mechanism
rotates around its center, gears P1 and P2 rotate in a planetary-like
motion around the sun. As P2 approaches the position initially
occupied by P1, it forces the sun to rotate because the gap between Main gear (Poly3)
Driving gear (Poly3)
the right side of the sun and the inner wall of the ring (just enough to
accommodate P1) is smaller than P2. As the sun gear rotates around Housing
its offset pivot, this gap continues to shrink and P2 will continue to
push the sun gear until it makes one full revolution around its offset
pivot. This eccentric rotation of the sun gear produces a successively
increasing/decreasing (suction/compression) volume on either side of
the gears during each pumping cycle and provides the pumping
action necessary for the pump to operate.
Spiral rotation
P2 Sun P1
6. CONCLUSION
The paper described the approach of the FAMU-FSU College of
Engineering in educating graduate students in MEMS technology. The
approach is based on a collaboration project with Sandia National
Laboratory which aims at developing a line of electrostatically and
magnetically actuated surface micromachined pumps. The paper
described Sandia Ultraplanar Multilevel Surface Micromachining
Process, SUMMiT and the design tools developed for this process,
Figure 9. Centrifugal pump design
emphasizing the educational aspect of these tools. Next, the paper
described the surface micromachined pump designs developed in the
first phase of the project and ended with an overview of the future work
5. POST FABRICATION
in the next phase.
The final phase of the micropump development project is to
characterize and optimize the pump designs. Following fabrication, a
number of post fabrication operations will be performed. Bosch
REFERENCES:
etching process [5] will be used to create vias through the backside of
the wafer to serve as inlet and outlet ports for the pump. Nitride
[1] Rodger, M. and Sniegowski, J. 1998 “Designing Micro-
sputtering and /or anodic glass bonding will seal the etch-release
electromechanical Systems on a Chip in a 5-Level Surface
holes on the upper polysilicon layer. Magnetic coating will be also
Micromachining Technology,” 2nd International Conference on
applied on the magnetically actuated designs.
Engineering Design and Automation.
Packaging of the systems produced will also be needed before the
[2] Chen C. J., Haik Y. S. and Pai V., “Magnetic Field Driven
onset of testing. The package needs to facilitate the physical
Micromachines and Related Methods”, Patent Pending, 09/106,132
introduction of fluids into the very small channels produced in the
pumps. Currently, an aluminum flow manifold is used which
[3] Yarberry V. and Jorgensen C., 2001, “A 2D Visualization Tool for
contains very small holes drilled on a pattern resembling that of the
SUMMiT V Designs,” Fourth International Conference on Modeling
Bosch etch holes on in the silicon wafer [7]. These holes intersect
and Simulation of Microsystems.
larger perpendicular holes drilled from the sides of the manifold.
These larger holes are sized to provide a tight fit for larger diameter
[4] Yarberry V. R., 1998, “MEMS Design Rule Checking: a batch
tubes that delivers the fluid to the pumps [8].
approach for remote operation,” SPIE 3328, 32-39.
Pump characterization allows for the prediction of pump performance
[5] Jorgensen C. R. and Yarberry V. R., 2001, “A 3D Geometry
under different operating conditions, an important step before the
Modeler for the SUMMiT-V MEMS Designer,” Fourth International
pump can be used in practical applications. Operating conditions
Conference on Modeling and Simulation of Microsystems.
include working fluid properties, pressure head and pump operating
speed. The most common performance parameter for a pump is the
[6] Kilani, M. I., Galambos, P. C., Haik, Y. S., and Chen, C. J., 2001,
flow rate it delivers. Other parameters include power consumption,
“Electrostatically Actuated Surface Micromachined Offset Planetary
maximum output pressure, output pulsation and leakage. When more
Gear Pump Design,” Accepted for publication in Microfluidics section
than one fluid are pumped at the same time, mixing of those fluids
of the ASME IMECE, New York City, New York.
may be considered as a performance parameter.
[7] Bosch, Patent No. 5501893, 1996, “Method of Anisotropically
A number of experiments will be conducted to characterize pump
Etching Silicon,” Robert Bosch Gmblt.
performance. Pressure head vs. flow rate measurement is one basic
experiment that defines the performance of the pump. Leakage test
[8] Galambos, P., Eaton W., et al., 1999, “Surface micromachined
will also be carried out, as micromachined pumps may leak or even
microfluidics: design, fabrication, testing and characterization,” ASME
rupture when exposed to very high pressures. Leakage pressure
Winter Annual Meeting, Nashville, Tennessee.
depends on working fluid properties and on the speed at which the
pump operates. The outcome of a leak test for a certain fluid is a