TE Connectivity

MINI
MODULAR
RACK
PRINCIPLE

BROUGHT TO YOU BY:

SIZE, WEIGHT, AND
RELIABLE PERFORMANCE ARE
KEY WHEN IT COMES TO AVIONICS.
One way to reduce size and weight and maintain reliability
is to follow the example demonstrated in other industries
of shrinking the electronics footprint and the associated
electronics packaging and then distributing that packaging
throughout the aircraft.

Because of its modular nature, the Mini

Modular Rack Principle (MiniMRP) solution
is being considered in many different
military and commercial applications as an
alternative avionics architecture. In the
MiniMRP deployment composite enclosures
are considered to further reduce weight
over traditional metal enclosures. MiniMRP
electronics packaging enclosures also can be
easily deployed using a fiber optic or copper
cabling system for information collection and
distribution throughout the network.
Modular avionics packaging is used to
connect hardware, including bus-structured
modules, interfaces, and power supplies.
Important considerations include placement,
size, and the components’ ability to withstand
environmental changes within the system and
from external environmental factors. Flexibility
in the placement of the enclosures can
enhance efficiency and reduce complexity.
The technical standards for aviation industry
engineering solutions are determined by
Aeronautical Radio, Incorporated (ARINC);
in particular, MiniMRP is standardized in
ARINC 836, which is designed for commercial
aircraft cabin systems. However, it also can
be applied to and is being used in military
aircraft, unmanned aerial vehicles, and military
helicopters.

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HISTORY OF AVIONICS
According to a white paper by TE Connectivity’s
(TE) Market Development Manager Russell W.
Graves, the genesis of his company’s work on
MiniMRP was to keep up with the increased
adoption in Integrated Modular Avionics
and associated avionics architectures. The
aerospace industry has increasingly adopted
Ethernet-based protocols, which has
allowed for higher speeds and bandwidth
over traditional protocols such as ARINC
429 and 629. TE also kept an eye on a future
roadmap that is likely to lead to 40-Gb/s
capabilities and beyond. MiniMRP is built
on the principle of shrinking the footprint
of the previously existing ARINC 836 MRP
Standard. MiniMRP is now covered under the
ARINC 836 Type II Standard.
In particular, connectivity speed between
boxes is a concern. High-speed interconnects
can lose performance over long distances
because high-speed signals are more likely
to fall prey to return loss, crosstalk, and other
interference within the signal passage. TE
has managed this problem by using suitable
connectors, in this case, the DEUTSCH
DMC-M Series.
TE’s MiniMRP has been deployed on High-
speed Optical Reconfigurable Network
(HORNET), a project of Airbus Defense and
Space. This project pioneered the use of fiber
optic networks in aerospace, including global
network traffic control. In HORNET, MiniMRP
avionics architecture was first successfully
used under real-world flight test conditions.
As a result, TE has expanded its efforts in
miniaturizing avionics packaging. Its MiniMRP
packages can reduce the size of the packages
by up to 40%. For example, instead of having
one big box in an avionics bay, smaller boxes
are distributed throughout the aircraft.
Design flexibility is achieved with size options
“...Everything drives TE
Connectivity engineering to
innovate bringing weight
reduction and space saving.”
— Thierry Marin-Martinod
VP Engineering & CTO
TE Connectivity
including double width/single height and
single width/single height, both significantly
smaller than an ARINC 600 legacy system.
The simplest box design single width/single
height is sized to house a printed circuit
board of 100mm X 100mm. These modules
can then be mixed and matched, combined,
or used separately as needed depending on
the aircraft requirements.
“The MiniMRP from an engineering point
of view is a perfect illustration of the way we
work [at TE],” said Thierry Marin-Martinod, VP
Engineering & CTO at TE, in an interview. “We
are listening to the ‘voice of the customer’ and
we continuously analyze the global technology
trends. Then we digest these inputs and
update our technology roadmaps accordingly.
Electronics in many different fields are being
reduced in size around the world. However,
most aircraft electronics formats were defined
30 years ago. There is definitively a need for
improvement: processors are more powerful,
electronic components are more efficient,
architecture is moving from centralized to
distributed. Everything drives TE Connectivity
engineering to innovate bringing weight
reduction and space saving.”
EVOLVING
WITH THE TIMES
The MiniMRP is shrinking the
footprint of the previously existing
ARINC 836 MRP Standard.
• Connectivity speed between boxes
•u
 sing suitable connectors (the
DEUTSCH DMC-M Series)
•d
 eployed on High-speed
Optical Reconfigurable Network
(HORNET)
• Size reduction by up to 40%
• s implest box design is sized to
house a printed circuit board of
100mm X 100mm
•c
 an be mixed and matched,
combined, or used separately
depending on aircraft
requirements
3 | MINI MODULAR RACK PRINCIPLE
...the challenge consists in replacing large boxes integrating.
different functions by small distributed electronic boxes.
VERSATILE APPLICATIONS
FOR MINIMRP
MiniMRP modules are customizable, but their
standard configurations are very versatile.
TE’s boxes also use standardized connector
inserts and well-defined sizes. These standard
sizes also lend themselves to use of
commercial-off-the-shelf components, which
can lower costs because they are produced in
higher volumes. Commonality of components
also make it easier to maintain over the life
of the system. Currently, these systems are
being used in aircraft such as the Airbus
Helicopter EC 135.
In the case of module upgrades,
replacements, or expansions, the modular
format also makes it easier to swap modules
out. A toolless option is available for easy
installation in a racking of boxes architecture.
Configuration can easily be determined once
a customer specifies the type of modules
CREATING
MINI
How does the MiniMRP become “mini”?
•U
 tilization of aluminum and
other lightweight composite
materials
•O
 ptimized fiber optic/copper
backbone system
• Reduction in copper cabling
• Architectural flexibility
4 | MINI MODULAR RACK PRINCIPLE
they need and the locations in which they will
be used. From there, designers can choose
one module or customize any number of units.
So, the challenge consists in replacing
large boxes integrating different functions
by small distributed electronic boxes. This
will simplify the installation and ease failure
detection. TE Connectivity also is bringing
a system approach with the mechanical
installation taking into account the thermal
dissipation constraint for specific power
electronics.
BIG CHANGES
IN A SMALL PACKAGE
How do they become “mini”? TE’s MiniMRP
modules are made of aluminum or other
lightweight composite materials. The fiber
optic or copper backbone system also is
optimized such that it does not add much
weight. Because the modules are distributed,
the total amount of copper cabling needed
in the aircraft is reduced. This architecture
also can move components closer to where
the intelligence is needed.
TE uses its DEUTSCH DMC-M connector
series for MiniMRP modules. These are
available in both multi-cavity and single-
module configurations, and include a variety
of layouts and sizes. The contacts can be
crimped to copper wire, aluminum wire, or
used with PCB mounting. This type of connector
itself is not new, but is recommended for the
MiniMRP modules because it conforms to
recognized aerospace industry standards.
It comes in many arrangements, including a
simple connector or a casing for two or four
connectors that houses multiple connector
inserts. The DEUTSCH DMC-M connector
series uses a mil-spec contact and can
interconnect copper, fiber optics, Quadrax
cables, or other types of cables.
Manufacturers and customers also must
take into account that cables used for
things like Gigabit and 10-Gigabit Ethernet,
USB, and IEEE 1394 need to be compliant
with electrical and structural standards.
Size and weight can then be reduced with
these factors in mind. Aerospace cabling in
particular also must conform to standards
for low smoke generation, toxicity, and
flammability because they may be in sealed
or almost completely enclosed spaces.
TE Connectivity’s solution is providing
an easy installation and a smart locking
mechanism to help support a safe signal
transmission.
Following the trends in other industries,
the IoT (Internet of Things) also is coming
to aerospace vehicles. More and more data
will be needed on aircraft. Overall systems
design can be further optimized with SWAP
(size, weight, and power) in mind.

By managing power and

communication using MiniMRP
enclosures, these considerations
can be met WITHOUT
SACRIFICING
RELIABILITY.

ABOUT THIS REPORT ABOUT TE CONNECTIVITY

The information in this report was
researched and produced by ECN in
conjunction with TE Connectivity. Statistical
data was researched and compiled by
Advantage Business Media. For more
information, visit advantagemedia.com.
TE Connectivity (NYSE: TEL) is a $12 billion
global technology leader. Our commitment
to innovation enables advancements in
transportation, industrial applications,
medical technology, energy, data
communications, and the home. TE’s
unmatched breadth of connectivity and
sensor solutions, proven in the harshest of
environments, helps build a safer, greener,
smarter, and more connected world. With
75,000 people – including more than 7,000
engineers – working alongside customers
in nearly 150 countries, we help ensure
that EVERY CONNECTION COUNTS –
www.TE.com.

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