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How to Solder LGA and BGA Packages: What is LGA BGA?

Compared with SMD components, LGA parts have more connections pins and are
soldered directly to the PCB. Like BGAs, they also have solder balls at the bottom of
the device, which melts during soldering to form a solid connection between the
component and the PCB. LGA parts are very similar to BGAs in structure. Both have
a flat surface with pads and are most commonly helpful as a physical interface for
microprocessors. Surface mount technology is often essential to solder them directly
to a PCB.

Table of Contents

Disadvantages of LGA BGA

LGA and BGA packages are similar but with some differences. For example, BGA
packages have lower thermal resistance and shorter electrical conductors, making
them easier to solder. These characteristics, however, also make them more expensive
to manufacture than leaded devices. Nevertheless, both BGA and LGA packages have
their advantages. The following are some of the main advantages of BGA and LGA
packages. Read on to find out more about each type.

LGA-based CPUs have flat surfaces and fit in a socket with several pins sticking out.
To lock the CPU in place, the CPU must appropriately align. Ball grid Array CPUs
have spherical contacts and are soldered directly onto the motherboard. We classify
CPU sockets and CPU types according to their shape and size. The size of the sockets
depends on the type and generation of the processor.

LGA sockets offer more incredible signal speeds and require smaller footprints than
BGAs. On the other hand, BGA sockets are more complex and support higher pitches,
but LGAs are cheaper and more versatile. But they have one drawback: they are more
expensive than BGAs. Nonetheless, they offer more versatility and are more
compatible with many different components. But for most applications, LGAs are the
way to go.

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Advantages

However, one big advantage of BGA over LGA is reliability. The reliability of BGAs
is dependent on the type of solder paste used. Rayming PCB &

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Assembly recommends a particular solder reflow profile to meet the requirements of

each component. The peak temperature must be high enough to ensure complete
reflow. The solder joint should be fully dried if the device can handle the maximum
temperatures.

LGA has fewer connections than BGA, and the socket prevents pin damage. This
makes it easier to install and handle. However, LGA increases the motherboard’s cost
and requires precise placement. It also increases the risk of chip failure due to
improper insertion. And it is much harder to replace a processor that is already
incompatible with an LGA motherboard. For these reasons, BGA is the best option
for most people.

While LGA sockets are easier to slot, LGA sockets are more challenging to remove.
In addition, they may result in damaged pins in the CPU, leading to expensive repairs.
However, compared to BGAs, LGAs are less expensive and easier to replace. They
are also more durable than BGA, but both have some differences in terms of
performance. They are similar in their use, but each has advantages and
disadvantages.

The biggest disadvantage of LGA and BGA sockets is their size. The size of a BGA
socket makes them unsuitable for desktop computers. Desktop computers typically
use LGA sockets. Laptops and notebooks are most likely to use BGA sockets.
However, you should understand the differences between the two. One must decide
which is best for their system. Ultimately, it’s up to you.

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Ball grid array

The Ball Grid Array Integrated Circuit, or BGA, is described as a surface

mount gadget that contains no leads. Instead, the device comprises metal sphere
arrays built with solder that we affix to a laminated substrate on the bottom of the
package. This flip-chip technology allows the BGA package to be smaller and is
widely applicable in modern products.

Both LGA and BGA components exhibit significant deformation and strain
accumulation during thermal cycling. These factors may be responsible for
discrepancies in their performance. While there are no direct differences in the
thermal cycling behavior of the two types of solder balls, several studies have
examined how they behave under deformation. The deformation of these components
is related to their morphology and intermetallic layer, which can vary considerably
between bulk solder and actual solder joints. Therefore, it is essential to understand
the physical properties of actual solder balls to obtain realistic creep data.

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Intel’s current BGA mounting method uses flip-chip binding technology.

Micro-FCBGA features 479 balls that are 0.78 mm in diameter. The processor is
soldered onto the motherboard using underfill. This is significantly thinner than pin
grid arrays.

Surface-mount technology

Surface-mount technology for LGA BGA consists of pads with balls of solder
attached to them. They are similar to LGA packages and PGAs but differ in their
physical I/O shapes. As such, they are easier to mass-produce. These advantages
make them an excellent choice for various electronic applications, such as wireless
devices.

Surface-mount technology has become an integral part of electronic product

miniaturization and weight reduction. Once a high-pin package, QFPs (Quad-Factory
Function Packages) played a prominent role. Likewise, micro-fabrication
and semiconductor integrated technology have advanced quickly. As a result, IC gate
count, I/O end number, and volume have decreased. However, this trend is unlikely to
change anytime soon.

The location of the LGA package on the motherboard has a direct impact on its
robustness. LGAs are susceptible to high temperatures and mechanical stress, so
placement on the board is essential. A thicker PCB reduces the stress on solder joints.
Thicker PCBs also have a positive effect on termination. Depending on the design,
surface-mount technology can improve the reliability of LGA BGA.

Surface-mount technology is a crucial aspect of PCB manufacturing. The solder

secures these components on the board’s surface and is easier to implement on
smaller PCBs. Unlike conventional devices, SMDs are also less bulky than leads, so
they are easier to fabricate. Therefore, this technology is an excellent choice for many
applications. If you have been looking for a way to improve your manufacturing yield,
consider using surface-mount technology in your PCB design.

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SMT uses

As previously mentioned, SMD BGA packages use the underside of the chip. This
makes it harder to inspect, de-solder, and test the components. But today’s
mainline PCB production equipment can overcome these issues and improve your
manufacturing process. Unfortunately, ball grid arrays are also known to have
reliability and performance issues.

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Surface-mount technology for LGA BGA ICs is more expensive than conventional
packaging methods but has many advantages. Surface-mount technology allows for a
lower mounting height and provides superior mechanical strength. As a result,
surface-mount technology is the most preferred choice in high-volume production. In
addition, a surface-mount PCB makes it possible to solder down a BGA. The
difference between the two technologies is very significant. One major advantage of
surface-mount technology over traditional methods is that it is much easier to install
on a PCB.

The Ball Grid Array is a type of surface-mount package for Integrated Circuits. This
method provides more interconnection pins than traditional surface-mount packages.
However, it also uses a different approach to connections. While the former uses the
side of the package for connections, Ball Grid Arrays use the underside of the
package. This gives the IC more space, and therefore, the reworkability is much
greater.

Related Posts:

1. The Fundamental Analysis of QFP vs QFN Packages

2. Different Types of BGA (Ball Grid Array) Packages

3. What is Solder Mask ?

4. What is Selective Solder ?

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