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Rogers CuClad 6250 bonding films are thermoplastic ethylene acrylic acid
co-polymers. These bonding films bear features that make them great for bonding
different dielectric structures such as glass and PTFE.
Using these bonding films, you can easily limit the amount of heat and pressure that
strikes a specific component. So, pressure and heat-sensitive components maintain
their stable form even under high heat or pressure.
Rogers CuClad 6250 bonding films come in two different variations. The sheeted
form and the roll format, both of which are 21” (610 mm)
life
When you store the Rogers CuClad 6250 bonding film under perfect conditions, they
do not have a limited life span. These ideal conditions include storage away from any
direct sunlight, which could cause harm to the bonding films. In addition, storage in
its original package, sealed, and at a temperature that is within 250C (that is 770F).
And lastly also ensure that its storage environment does not surpass a
relative humidity of 70%.
As per positioning, you should store the bonding film rolls suspended by roll cores or
standing upright (on edge). In doing so, you avoid creating flat spots or creased areas
due to the roll’s weight.
The Rogers CuClad 6250 bonding film bears some features that make it stand out
once you compare it with other bonding films. These features include:
1. A Dielectric constant (Dk) of 2.32 – Rogers CuClad 6250 bonding films have
a pretty low Dk, which hit only 2.32.
2. A thickness of 0.0015” – Rogers CuClad 6250 bonding films have a thickness
of 0.0015″, that is 0.038 mm. With this thickness, the Rogers CuClad 6250
bonding film is able to create a thick bond between different components.
Combining this thickness with this bonding film’s low melting point feature,
you get fascinating outputs as the net result.
3. Impeccable tangent loss – Rogers CuClad 6250 bonding films have an
impeccable tangent loss that stands at 0.0015 at a bandwidth of 10GHz.
4. Impeccable melting temperature – Rogers CuClad 6250 bonding films have
a resin melting temperature of 2130F. With this resin temperature melting
point, this boding film is able to function even under extreme temperatures.
films
If you are looking to use the Rogers CuClad 6250 bonding film on your Print Circuit
board. Then here are some benefits that you are likely to reap:
1. Low pressure and temp lamination – The Rogers CuClad 6250 bonding film
provides pretty low temperature and pressure lamination. Their pressure and
temp lamination is actually lower than that of a conventional
thermoplastic RF film.
2. Impeccable dielectric properties – These bonding films have dielectric
properties that are incredible. Their dielectric properties are almost similar to
those of a laminate system. They are hence mostly chosen for the bonding
of multi-layer print circuit boards.
3. Pressure-sensitive layers – These bonding film lets you attach layers that are
pressure sensitive. You can hence include layers such as a dielectric foam
layer.
Properties dictate the efficiency of a component. Hence, they are crucial to your
choice of a bonding film or any other component.
Properties come in many different formats. For example, we have physical properties,
mechanical properties, electrical properties, and so on.
The Rogers CuClad 6250 bonding film bears the following properties which make it
stand out:
Physical properties
These are the properties that we measure without altering the bonding film’s chemical
composition. These properties include:
Density
Under normal conditions, the density of the Rogers CuClad 6250 bonding films
stands at:
0.930 g/cc
Thickness
The thickness property of the Rogers CuClad 6250 bonding film makes it stand out
amongst other bonding films. Its thickness stands at a whooping:
0.0381 microns
The Rogers CuClad 6250 bonding film has impressive electrical properties. These
properties come in handy when utilizing this bonding film on Print Circuit boards.
Here are some electrical properties that make the Rogers CuClad 6250 bonding film
stand out:
Volume resistivity
The Rogers CuClad 6250 bonding film bears the following volume resistivity:
1.00e + 16 ohm-cm
Dielectric constant
When you place the Rogers CuClad 6250 bonding film under a 1.00e + 10 Hz
frequency. Its dielectric constant hits:
2.32
Dielectric strength
Under normal circumstances, the dielectric strength of the Rogers CuClad 6250
bonding film is:
Dissipation factor
When you place the Rogers CuClad 6250 bonding film under a temperature of 1.00e
+ 10 Hz. Its dissipation factor stands at:
0.0013
Arc resistance
The arc resistance of the Rogers CuClad 6250 bonding film under normal conditions
stands within the range of:
During PCB assembly, the print circuit board and its components mostly undergo a lot
of heating. Therefore attaching components with bad thermal properties could cause
damage to the component or even the PCB.
However, this is not the case with the Rogers CuClad 6250 bonding film. These
bonding films bear some remarkable thermal properties, which include:
Thermal conductivity
The Rogers CuClad 6250 bonding film has a thermal conductivity of:
Under continuous use, the Rogers CuClad 6250 bonding film bears a maximum
service temperature that is:
<=75.0 0C
Brittleness temperature
The Rogers CuClad 6250 bonding film has a brittleness temperature that hits:
-600C
Conclusion
The Rogers CuClad 6250 bonding films ensure efficiency and quality each time you
utilize them. In addition, they boost your PCB’s performance and make PCB
assembly easy to handle. Hence, if you are looking for a bonding film to use, you
might want to try this one. The results might just surprise you.
Related Posts:
https://www.raypcb.com/rogers-cuclad-6250-pcb/