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    hrishikeshdeka18
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    Packaging of microelectronic circuits and MEMS establishes interconnections and an operating environment for electrical and electro-mechanical circuits. Packaging provides signal, voltage and ground connections, facilitates thermal energy dissipation, provides stress-minimized mechanical support, and protects components from physical, chemical and environmental influences. The simplified packaging process flow for MEMS provides connections, dissipates heat, supports mechanically, and protects from harm.

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    Packaging of microelectronic circuits and MEMS establishes interconnections and an operating environment for electrical and electro-mechanical circuits. Packaging provides signal, voltage and ground connections, facilitates thermal energy dissipation, provides stress-minimized mechanical support, and protects components from physical, chemical and environmental influences. The simplified packaging process flow for MEMS provides connections, dissipates heat, supports mechanically, and protects from harm.

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    © All Rights Reserved
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    10 views3 pages

    Packaging

    Uploaded by

    hrishikeshdeka18
    Packaging of microelectronic circuits and MEMS establishes interconnections and an operating environment for electrical and electro-mechanical circuits. Packaging provides signal, voltage and ground connections, facilitates thermal energy dissipation, provides stress-minimized mechanical support, and protects components from physical, chemical and environmental influences. The simplified packaging process flow for MEMS provides connections, dissipates heat, supports mechanically, and protects from harm.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 3

    Packaging??

    • Packaging of Microelectronics circuits is the


    science and art of establishing interconnections
    and an appropriate operating environment for
    predominantly electrical (and in the case of
    MEMS–-- Electro-Mechanical) circuits to
    process and/or store information.
    Why is packaging necessary?

    MEMS/Microsystems Packaging:
    (common functions as in microelectronic packaging)
    • provision of signal, voltage, and ground connections
    • facilitation of thermal energy dissipation
    • provision of stress-minimized mechanical support.
    • protection of the components from potentially harmful
    physical, chemical and other environmental influences
    Simplified Process Flow For MEMS Packaging:

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