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Actual vapor compression cycle

Pavan, DBIT
Actual vapor compression cycle on P-h chart
1d-2 Non-isentropic compression
2-2a Pressure drop across ‘P’
discharge valve Pressure
2a-2b Pressure drop in delivery axis 2
line 2a
2b-2c De-superheating of vapor in 3a 3b 3
delivery line 2c 2b
2c-3 Pressure drop in condenser
3-3a Sub-cooling of liquid
refrigerant
3a-3b Heat gain in liquid line
3b-4 Ideal Isenthalpic Expansion 4 1 1a 1b
4a
3b-4a Expansion with heat gain
by the expansion device 1c
4a-1 Pressure drop in evaporator 1d
1-1a Superheating in evaporator
1a-1b Superheating in suction line
1b-1c Pressure drop in suction line
1c-1d Pressure drop in suction valve ‘h’ Enthalpy axis
Pavan, DBIT
Actual vapor compression cycle
1. Compression is polytrophic due to friction and heat transfer to surroundings.
2. In the hot discharge line connecting compressor and condenser pressure drop occurs
and heat loss (to the surrounding) occurs. This heat loss reduces the load on condenser to
a small extent so is acceptable. The pressure drop has to be reduced by keeping
compressor as close to condenser as possible.
3. Pressure drop in condenser is not that high compared to evaporator. It consists of
pressure drop due to friction and pressure gain due to decrease in velocity ,due to
conversion of vapor (high volume fluid) to liquid (low volume fluid). There may be a
pressure gain instead of pressure drop in condenser.
4. In case of air cooled condensers the liquid line connecting condenser and expansion
device will be hotter than surroundings so will make refrigerant to loose the heat
(subcooling) which is acceptable. But in case of water cooled condensers the liquid line
absorbs heat from the surroundings, lowering the cooling capacity of condenser. The
pressure drop in liquid line is small due to low velocity.
5. If expansion device is located at higher location than that of condenser, the pressure
drop occurs because the liquid refrigerant has to move against the gravity.
6. Expansion device is located inside the space to be cooled, so the heat gain becomes a
part of cooling capacity. Expansion device is located very close to evaporator preventing the
pressure drop in the line joining expansion device and evaporator.
Pavan, DBIT
Actual vapor compression cycle
7. Pressure drop in evaporator is higher compared to condenser. It consists of pressure
drop due to friction and pressure drop due to increase in the velocity (momentum
pressure drop) because of conversion of liquid (low volume) to vapor (higher volume). This
pressure drop makes evaporator temperature to change from inlet to outlet.
8. Larger diameter tubes can reduce vapor velocity and reduce pressure drop but a
sufficient vapor velocity is desired, so that vapor will take the oil with it while moving
through the circuit (not allowing oil accumulation to occur)and return the oil to
compressor. Higher velocity also increases heat transfer coefficient reducing the size of the
evaporator.
9. There is a pressure drop in suction line connecting the evaporator and compressor, due
to high velocity vapor. There is also additional undesired superheating due to heat gain in
suction line.

Due to undesired pressure drops and undesired heat transfer in the system at various
places ,capacity of the plant (TR) reduces and power consumption (kW) increases which
ultimately reduces COP.

Pavan, DBIT

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