ELECTROPLATING

Experiment No. 4

NAME: Cosido, Vladimer Jary T. DATE: 10/23/2023

COURSE, YEAR &SECTION: BSCE-1 M17 INSTRUCTOR: Engr. CJ Villarba

ABSTRACT

This experimental investigation pursued four key objectives related to redox reactions and
electroplating: distinguishing between oxidation and reduction processes, determining the
oxidation states of elements, identifying electron transfer, and characterizing elements as
reduced or oxidized, alongside defining the roles of reducing and oxidizing agents. Metal
samples, such as a key, concrete nail, and coin, were electroplated with copper using a 0.1 M
copper sulfate solution. At the anode, copper atoms underwent oxidation, transforming into
copper (II) ions, which dissolved into the electrolyte. Simultaneously, electrons were released
in the oxidation process, flowing from the anode to the cathode. The copper ions in the
copper sulfate solution experienced reduction through an electric current from a battery,
resulting in a thin copper layer forming on the plated objects.

Furthermore, the experiment introduced a quantitative approach by measuring the flow of

electrons through the electrolytic cell, which allowed for the calculation of the produced
metal amount. The study employed fundamental electrochemical equations and Faraday's
constant to establish a direct relationship between the electric charge, deposition time, and the
molar mass of the plating metal. The results indicated an increase in the mass of the plated
object, providing insights into the efficiency of the electroplating process. In conclusion, this
research successfully achieved its objectives, deepening the understanding of redox reactions
and enabling a quantitative assessment of electroplating efficiency, emphasizing the
importance of controlled electron transfer in the electroplating process.
INTRODUCTION

Electroplating, a fundamental electrochemical process, finds its roots in the pursuit of

enhancing the properties of various materials and objects, be it for improved aesthetics,
increased durability, or enhanced corrosion resistance (Johnson, 2022). This section serves to
illuminate the motivations and contexts that underpin the study of electroplating while
providing a backdrop of relevant research and established principles.

The fascination with electroplating stems from the desire to manipulate the surface properties
of objects to meet specific requirements. This practice dates back to the early 19th century
when Luigi Brugnatelli successfully plated silver onto a surface using electrical current
(Bellis, 2019). Electroplating, at its core, is a process wherein a metal coating is deposited
onto a conductive surface through a series of redox reactions in an electrolyte solution. The
metal to be plated acts as the cathode, while an anode, typically made of the plating metal or
an inert material, completes the electrochemical cell (Lou & Huang, 2006).

In the contemporary context, electroplating continues to be an essential technique in various

industries, including automotive, electronics, aerospace, and even jewelry making. Its
versatility stems from the ability to precisely control the thickness and composition of the
deposited metal layer. This, in turn, endows the plated objects with desired attributes,
whether it's enhancing the luster of jewelry, improving the resistance of components to
corrosion, or even ensuring optimal electrical conductivity. Such applications have rendered
electroplating a topic of enduring interest (Stringent Datalytics, 2023)

In this study, we seek to delve deeper into the intricacies of electroplating, differentiating
between oxidation and reduction reactions, determining oxidation numbers of the involved
elements, and identifying the electron transfer processes. Through a comprehensive
exploration, our central questions revolve around elucidating the fundamental mechanisms of
electroplating, dissecting the role of different elements, and quantifying the efficiency of this
electrochemical process. The subsequent sections will detail our experiment, hypotheses, and
research questions, aiming to unravel the mysteries behind this electroplating phenomenon
while contributing to the ongoing body of knowledge in this field.

EXPERIMENTAL (Materials and Methods)

In this experimental investigation, we aimed to explore the electroplating process in detail

and quantify the deposition of copper onto various metal substrates. To achieve this, we
employed a series of scientific procedures that allowed us to carefully study the electroplating
phenomenon. The materials used in the experiment included a 0.1 M copper sulfate solution,
0.5 M hydrochloric acid, distilled water, sandpaper for surface preparation, and metal
samples to be plated, consisting of a key, concrete nail, and a piso coin. Additionally, we
utilized three copper plates, 100-mL beakers (three in total), two alligator clips for electrical
connections, a 9V dry cell as the power source, a stirring rod for mixing solutions, and an
electronic balance for precise measurements.

Our experiment followed a systematic set of steps. Firstly, the metal samples to be plated
were thoroughly cleaned using steel wool to ensure a clean and uniform surface, and their
initial masses were carefully recorded. Subsequently, we established an electrochemical cell
by connecting the metal to be plated (the cathode) to the negative electrode of the 9V dry cell
using an alligator clip. Simultaneously, another alligator clip connected a copper plate (the
anode) to the positive electrode of the dry cell. Both the metal to be plated and the copper
plate were then placed into one of the 100-mL beakers.

The electroplating process was initiated by immersing the metal samples in a 0.1 M copper
sulfate solution, allowing the process to proceed for a specific time, typically 2 minutes. After
this period, the metal to be plated and the copper plate were removed from the solution. The
plated metal samples were subsequently weighed, and their final masses were recorded. The
mass of copper deposited onto the metal samples was calculated by subtracting their initial
mass from the final mass. This process was repeated for each metal sample to be plated,
ensuring comprehensive data collection.

In this experiment, metal samples like key, concrete nail, and coin are to be plated with
copper though a 0.1 M copper sulfate solution. At the anode, copper atoms are oxidized into
copper (II) ions, allowing them to dissolve into the electrolyte.
2+¿+2 e−¿¿
Cu(s) → Cu(aq ) (oxidation half-reaction equation)

The electrons released in the oxidation process then flow from the anode to the cathode. The
copper ions in the copper sulfate solution are reduced by the electric current from the battery
to form a thin layer of copper on the object to be plated.
2+¿+2 e−→Cu( s) ¿
Cu(aq ) (reduction half-reaction equation)

According to Michael Faraday's Law of Electrolysis, "the amount of electrical charge

introduced to the non spontaneous system is proportional to the chemical change produced
and that a quantity of electricity produces a corresponding amount of substance being
electrolyzed".

If the amount of electrons flowing through an electrolytic cell could be measured, the
amount of metal produced could also be calculated. The amount of electrons flowing
through the cell is computed using the equation:

Q
n= = ¿
F F

where n is the number of moles of electrons flowing through solution, Q is the amount of
charge passing through the solution (in coulombs or ampere-seconds), I represent the
amount of current (in amperes), t is the deposition time (in seconds), and F is the Faraday's
constant (96,485 coulombs per mole of electrons).

mole of plating metal

m=n(MM ) −¿transferred
mole of e ¿

The equations above can be combined, forming the equation:

The amount of metal produced is then calculated using the equation: where MM is the molar
mass of the plating metal (in grams per mole of plating metal). The ratio of mole of plating
metal to mole of electrons transferred is based on the balanced reduction half-reaction
equation.
 mole of plating metal
m= ¿ (MM )
F mole of e
−¿transferred
¿

This equation allowed us to quantify the amount of copper that was successfully electroplated
onto each metal substrate, shedding light on the efficiency and effectiveness of the
electroplating process. In the subsequent stages of data analysis, appropriate statistical tests
were conducted to further examine and interpret the experimental results, enhancing our
understanding of the electroplating process.

RESULT

Trial No. Object Mass Mass Mass of copper Mass of Percentage

to be before after deposited copper Difference
plated plating plating (experimental) deposited
(theoretical)
1 Key 5.68 g 5.70 g 0.02 g 0.03 33.33%

2 Nail 4.68 g 4.70 g 0.02 g 0.04 50%

3 Coin 6.0 g 6.02 g 0.02 g 0.03 33.33%

Table 1. Summary of Results

The mass before plating is 5.68 g, the mass after plating is 5.70 g, the mass of copper
deposited (experimental) is 0.02 g, the mass of copper deposited (theoretical) is 0.03 g, and
the percentage difference is 33.33% for the first object to be plated (key). The mass before
plating is 4.68 g, the mass after plating is 4.70 g, the mass of copper deposited (experimental)
is 0.02 g, the mass of copper deposited (theoretical) is 0.04 g, and the percentage difference is
50% for the second object that was coated (nail). For the third object that was plated (a coin),
the mass before plating was 6.0 g, the mass after plating was 6.02 g, the mass of copper that
was deposited (in an experiment) was 0.02 g, the quantity that was deposited (in a theoretical
calculation) was 0.03 g, and the percentage difference was 33.33%.

DISCUSSION

The experimental investigation into electroplating yielded several important findings that
shed light on the electrochemical process and the deposition of copper onto different metal
substrates. The discussion section outlines the significant observations, the relevance of these
results to our initial hypotheses, and the theoretical implications for broader scientific
understanding.

First and foremost, the experiment demonstrated that electroplating successfully allowed for
the deposition of copper onto the metal samples, as evidenced by the observed changes in the
mass of the plated objects. Specifically, the weight of the metal samples increased like the
key (from 5.68 g to 5.70 g), indicating the addition of a copper layer, thus validating the
effectiveness of the electroplating process.
The results revealed a consistent pattern in the deposition of copper across the different metal
substrates. This pattern aligns with our expectations and establishes electrochemical
principles, where copper ions are reduced at the cathode (the metal to be plated) while copper
atoms are oxidized at the anode (the copper plate). The experiment's outcomes conform to
our hypotheses, further highlighting the fundamental principles of redox reactions involved in
electroplating.

While the results were generally in agreement with our expectations, there are variations due
to factors such as surface irregularities, variations in the contact between the metal samples
and the copper plates, and the exact timing of the electroplating process. These factors could
introduce minor inconsistencies in the deposition of copper.

The theoretical implications of these findings extend beyond the specifics of electroplating
and can be applied to broader scientific contexts. The study reinforces the importance of
controlling electroplating parameters, which is crucial not only for precise manufacturing but
also for fields such as corrosion protection, electronics, and even environmental
considerations where efficient metal deposition is essential. Furthermore, these results
emphasize the universality of redox reactions and their role in various electrochemical
processes. To explore any contradictions or exceptions in the future, additional research
might focus on the influence of factors such as temperature, concentration of the electrolyte,
and surface preparation methods on the electroplating efficiency. Such investigations could
further refine our understanding of the electroplating process and its potential applications in
diverse fields.

CONCLUSION

In conclusion, this experimental investigation accomplished its primary objectives focused on

understanding redox reactions and the electroplating process. The study effectively
distinguished between oxidation and reduction reactions, determined the oxidation states of
elements, identified electron transfer processes, and characterized elements as either reduced
or oxidized, while defining the roles of reducing and oxidizing agents. Through the
electroplating of metal samples including a key, concrete nail, and coin with copper using a
0.1 M copper sulfate solution, the experiment revealed the underlying mechanisms involved.
At the anode, copper atoms underwent oxidation, converting into copper (II) ions that
dissolved into the electrolyte, while simultaneously, electrons were released, flowing from
the anode to the cathode. The copper ions in the copper sulfate solution were reduced through
an electric current from a battery, resulting in the deposition of a thin copper layer on the
plated objects. This research not only achieved its objectives but also contributed to a deeper
comprehension of redox reactions and allowed for a quantitative assessment of electroplating
efficiency, emphasizing the crucial role of controlled electron transfer in the electroplating
process.

REFERENCES

Johnson, M. (2022). Electroplating. https://study.com/academy/lesson/electroplating-process-

princples-uses.html
Bellis, M. (2019). The History of Electroplating. https://www.thoughtco.com/history-of-
electroplating-1991599

Lou H. & Huang Y. (2006). Electroplating.

https://www.in.gov/idem/ctap/files/ctap_lou_2006_electroplating.pdf

Stringent Datalytics (2023). Shining the Spotlight on the Booming Electroplating Market:
Uncovering the Key Trends, Growth Opportunities, and Future Prospects.
https://www.linkedin.com/pulse/shining-spotlight-booming-electroplating-market-uncovering