半導體產業及製程

TSMC
FAB14
張永政
Jonathan_chang@tsmc.com

國立臺南大學 數位學習科技系 黃國禎 1

 哪裡有IC的存在
Wireless Network New IT

ADSL

Powerful
Computing
Power

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哪裡有IC的存在
New IT

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 IC 製造的演進
 真空管 (1895-1947)
 電晶體 (William Shockley, John
Bardeen, Walter Brattain –
1947-1958 - Ge)
 IC (Jack Kilby –1958 - Silison)

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 What is IC

 I.C. is the short form for INTEGRATED

CIRCUIT.
Poly
Gate Ox

S (Source) D (Drain)
Si

 In Wafer Fabrication, we are forming

hundreds or even thousands of I.C. on a
wafer (thin circular disc) of silicone.

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 Moore Law (1965)
 The observation made in 1965 by Gordon Moore, co-
founder of Intel, that the number of transistors per
square inch on integrated circuits had doubled every year
since the integrated circuit was invented. Moore
predicted that this trend would continue for the
foreseeable future. In subsequent years, the pace slowed
down a bit, but data density has doubled approximately
every 18 months (1975), and this is the current definition
of Moore's Law, which Moore himself has blessed.

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What is IC size

100 um

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IC gate size
 1 um = 10-6 m
 1 nm = 10-3 um
 頭髮直徑 = 50-100 um
 Current minimum gate width = 14 nm
 Minimum gate size = 2.35 * 10–10 m

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 Foundry Growth Forecast
40% 45

35% 40

Foundry Sales $ Billions

35
Contribution Rate

30%
30
25%
25
20%
2002-2010 CAGR 20
15% WW IC = 10%
15
Foundry = 20%
10% 10

5% 5

0% 0
1993 1995 1997 1999 2001 2003 2005 2007 2009

Foundry Contribution Rate in IC

Foundry Sales $B
Market

Source: Dataquest, TSMC

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 Sales Trend

US $ M Year 2002 : $4.65 Billion

6,000 25% YoY growth

5,000

4,000
1H 03
$2.57 B
3,000 11.2% YoY

2,000

1,000

0
'92 '93 '94 '95 '96 '97 '98 '99 '00 '01 '02 ‘
03

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 TSMC Market Share Growth
Worldwide Dedicated Foundry Industry by Revenue

TSMC 53% TSMC 56%

Other 14% Other 12%

1Q03 2Q03
$2.1 Billion $2.6 Billion
Chartered 6% Chartered 5%

UMC 27% UMC 27%

Source: Companies, TSMC

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Sales Breakdown by Technology

100% 1 1
5 8 11 17
0.13u-
30 29 20
24 21
75% 0.15u
21
23
22 22 21 21 0.18u
50% 24
0.25u
23 27
25 25 24
25%
20 0.35u

14 13 11 12
13 9 0.50u+
9 11 12 11 11 9
0%
1Q02 2Q02 3Q02 4Q02 1Q03 2Q03
Sales
35.8 44.2 39.8 41.2 39.3 49.9
(NT$Bn)

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TSMC Provides Broad Leading-edge
Technologies
 Logic Processes to 90-nm
 Mixed Signal Processes to 90-nm
 SiGe BiCMOS Processes to 0.18-micron
 Embedded High Density Memory to 90-nm
 Embedded Non-Volatile Memory to 0.18-
micron
 Image Sensor Technology to 0.18-micron
 High Voltage Processes to 0.25-micron
 Copper and Low-k Dielectric Processes

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The R&D Investment Leader
US $ M
350 R&D

300
%
250 ~ 32
G R
CA
200

150

100

50

0
1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002

R&D expense between 1992 and 1997 have not been restated under the current definition

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 Roadmap Leads ITRS
250 
Technology Generation(nm)


99 ITRS (International Technology Roadmap
for Semiconductors)
180 


130  
00 ITRS

TSMC 
01 ITRS

100
90

65 
97 99 01 03 05 07 09
Year

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 How much semiconductor revenue

Worldwide semiconductor sales are expected to hit $237.1 bln in 2005, up

4.7% from $226.6 bln in 2004, according to iSuppli. The research company
previously had predicted 9.6% growth in semiconductor revenue in 2005

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What is IC industry

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TSMC changes game rule
IDM Fabless Foundry Assembly
Design House service Service

Design Design

Manufacturing TSMC

Assembly Assembly
Test Test

Sales Sales

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 台積公司客戶
無晶圓廠之 自有晶圓廠之
專業設計公司 整合元件製造商 系統公司

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What is Foundry Service Industry

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Global FABless Industry

Framework is necessary
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Global FABless Industry

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 IC industry
 IDM
 Design House

 Foundry

 Assembly

 Test

 System Integration

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IC fabrication
 Mask
 Litho
 Etch
 Diff
 CMP
 TFE

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C013 Cu process
introduction

Metal-2

W W W W

IMD-1
Metal-1

W ILD W
W W

Poly
Poly
P SD P SD P SD NSD NSD NSD

Trench oxide
VTP
NAPT
PAPT

Nwell Pwell

國立臺南大學 數位學習科技系
P Substrate 黃國禎 25
 晶圓的尺寸 所代表的意義

100 dies 180 dies 400 dies

6 inch 8 inch 12 inch

1. 量產 2. 降低生產成本
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 TECH 所代表的意義

1 um = 0.000001 m = 1000 nm
微米 柰米
0.13 um = 130 nm
100 um = 頭髮的寬度
(1) 相同圖形 距離 vs 電阻
S 時間 vs 速度
(2) 相同尺寸(面積), Die數
0.25um 0.13um 儲存容量
單位面積電容

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 IC process 基本製程

流程 說明 圖釋
薄膜 薄膜(Thin_film) Wafer
1.化學氣相沉積(CVD) FILM
2.金屬濺鍍(PVD) Wafer
3.擴散(Diffusion)

FILM
黃光 黃光(PHOTO) Wafer
1.光罩(MASK)
2.光阻(Coater)
3.曝光(Exposure) 光罩
4.顯影(Development) 光阻 光阻
FILM FILM
Wafer Wafer
蝕刻(ETCH)
植入 蝕刻 1.濕蝕刻(Wet-ETCH)
2.乾蝕刻(DRY-ETCH)

光阻去除(PR remove)
將光阻去除後就是我們所需的
光阻去除 圖形(PATTERN)

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 What is IC

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 IC 的製程就如同人類建造高樓一樣 , 一層一層慢慢的搭建起來,首先在晶

片上鍍上一層薄膜 , 然後在黃光區曝出須要的圖形 , 接著再到蝕刻區將圖案刻薄

膜上 , 如此即結束一層的製程 , 而後再不斷的重覆以上的動作 , 直到全部的圖形都

堆壘在晶片上為止 , 通常一般的

IC 製程須要經過 15-20 層才能完成. W W W

蓋高樓 W
W W

Poly
NSD NSD NSD

Trench oxide
NAPT

打地基
Pwell

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Dual Damascene Process
C013 Copper process

MECU1_DP ECP
MEOX5_PH
VACU1_PH
MEOX5_PH1 PR Coating
TRCH
MEOX5_ET2
MEOX5_ET1 LRM
VACU1_ET
MECU1CMPTRCH
MEOX5_DP PE-SION

MEOX5_ET SEED
MECU1SPU PEB MEOX4_DP PE-FSG

MEOX3_DP PE-SN

MEOX2_DP PE-FSG

MEOX1_DP PE-SN

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 C013 Cu-FSG AlCu 12KA
PESiN 6KA 4KA
PEOX 4KA
SiN 750A

M8 (Cu) M8 (9K) USG 7.5KA (9.9KA)

SiN 300A
1200A USG 7.2KA (IMD7=6.5KA)
Via7
SiN 500A for V7=0.36*0.36
M7 (3.5K) FSG 2.3KA (4.2KA)
SiN 300A

SiN 500A

M3 (Cu) M3 (3.5K) FSG 2.3KA (4.2KA)

SiN 300A
900A
Via2 FSG 4.9KA
SiN 500A

M2 (Cu) M2 (3.5K) FSG 2.3KA (4.2KA)

SiN 300A
900A FSG 4.9KA (IMD1~6=4.5KA)
Via1
SiN 500A

M1 (Cu) M1 (2.6K) FSG 1.7KA (2.9KA)

SiN 300A
600A
HDP PSG5.5KA W-Plug
SiN 400A

STI

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C013 FSG-Cu 8M Stacked Via

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 IT system in IC fabrication

Supply Chain Engineering Chain

 MES (SC) (EC)

 EEC
Internet

 EC
Inter-Company
e-Manufacturing
Intra-Company
 SC

Manufacturing Equipment
Execution System Engineering System
(MES) (EES)

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 產業活動

策略規劃

行 銷 行
政
品
工程與研發 生產規劃 支
援
質
與
廠區控制
管
工
理
（生產）工廠自動化
程
配 送

維修與服務
e-Manufacturing
 產業電子化活動

供應商之 顧客之
供應商
供應商 主企業 顧客 顧客

營業 營業 營業

工程研發 工程研發 工程研發

採購 生產 配銷 採購 生產 配銷 採購 生產 配銷

行政支援 行政支援 行政支援

e-Manufacturing
 電子化應用系統 (I)

供應商之 顧客之
供應商
供應商 主企業 顧客 顧客

EC/QR EC/QR EC/QR

CE/PDM CE/PDM CE/PDM

PES/CSM MES SCM PES/CSM MES SCM PES/CSM MES SCM

ERP ERP ERP

e-Manufacturing
 電子化應用系統 (II)

Knowledge Management

Quick
Quick
Response
Enterprise Resource Planning Response
(QR) Supply Chain Management (SCM)
(ERP) (QR)

e-Commerce
e-Commerce
(EC)
(EC)
Enterprise Information Management (PIM)
Procurement Component &
Customer Execution Product Data 。 Enterprise
Supplier Customer
Relation Document
System Management Management Relation
Management Management
(PES) (PDM) (CSM) Management
(CRM) (EDM)
(CRM)

Engineering Manufacturing

CAD CAE CAPP CAM MES MCS

e-Manufacturing
 電子化應用系統 (III)

基礎發展環境

企業智財BIC / 知識管理KM
供應面 需求面

供應鏈管理 企業資源規劃 顧客關係管理

SCM ERP CRM
工程資料管理
工程資料管理
PDM
PDM
製造執行系統
製造執行系統
MES
MES

電子商務平台/網站應用程式伺服軟體/應用程式伺服軟體
EC Platform / WEB Application Server/ Application Server

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