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WW 00Ystabil- .CO .The W in the circuit,WasW 0Y.Cfor calculating
voltages and currents
.TW
WW .100Y.C M .T W is critical to W
The output capacitor maintaining regulator
. 1 M T
present well as the
W . 1 0 formula
O M
W .CO mustSeries
ity, and meet the required conditions
WW for both ESR
0Y .CO .TW the power dissipated
WW .100Y.C M.TW
in the regulator:
WW .100Y(Equivalent .T WResistance) andWminimum amount
. 1 0 of ca-
M
WW .C OM
pacitance.
W W W Y . CO W W WW 00Y.CO .TW
Y W 0 .T
W 00MINIMUM CAPACITANCE:
W.1 TheYminimum
.T
OMoutput capacitance required W
0
W.1 stabil-Y.COM W W W.1 Y.COM W
.C to maintain
W W
. 1 0ity0 is 33 µF (this
M
W may be increased
.Tvalue W without.10limit).
W
0
O M .T W
W .100 O M.T
W O WW .100Y . C
.C WW .100Y.C M.TW W
Larger values of output capacitance will give improved tran-
WW .1sient 00Y response.
M .TW W O W O M.T
W ESR LIMITS:
WW The
O
0Y.ofCthe output W will causeW
.Tcapacitor
W 0if 0Y
.C .TW WW .100Y.C M.TW
0ESR . 1 M
. 1 M WW 00Y.CO .TW
loop instability
W Wit is too high Y . C
or O low. The acceptable range of ESR
too
W W WW plotted
0 Y .CO .TW W
W 0 current isM
.10load .T in the graph below. It is essen- .10 + IM
.1
DS012080-6
M
WW 00Y.CO .TW
versus shown = IO
W W Y . C
tial that the output O capacitor meet these requirements,
W W WW 00YIP .C IN L
= (V − V
G

T W W
M. 2. Power DissipationW
)I + (V ) I
W or oscillations 00 can result..T W.1 Y.COM W
D IN OUT L IN G

W.1 Y.COM W W W.1 Y.COFIGURE W

Diagram
0
W W 10maxi- M.T
W . 1 00 M .T W
W . 100The next O M
parameter .T which must be calculatedW is .the
C O
W O C
.allowable WWThis is.1calcu- . .TW
WW .100Y.C M.TW WW .10lated 0Yby
mum
using M TW rise, T (max).
temperature
the.formula:
R
00Y M
W O W O
W
WW .100Y.C M.TW
O
WW .1T 0(max) R
0Y.C= T (max) J
.T−W T (max)
A WW .100Y.C M.TW
M WW tem- .CO .TW
WW 00Y.CO perature,
Where: T (max) is the maximum allowable junction
W W .C O J
W which is 125˚CW for commercial00Y
W 00 Y .T W W .T .1 M
W.1 Y.COM W W W.1 Y.COM grade parts.
W WW 00Y.CO .TW
W W 00 W
M.T W.1 Y.COM W
T (max) is the maximum ambient temperature
W .100 M.T W.1 Y.COwhich
A
will be encountered in the applica-
W .C O W W W
WW .100Y W W .1the00calculatedOvalues
tion. .T W 00 .T
W O M.T W
Using
. C
M for T (max) and P , theW W.1 Y.COM W
maxi-
W
WW .100Y.C M.TW TW
R D
Yvalue for the.junction-to-ambient W re- .100 .T
W mum allowable .1θ00 , can now
thermal
W O W
sistance,
C O Mbe found:
W W .C OM
WW Y. Y W
WW .100Y.C M.TW
(J−A)

DS012080-5 θ
(J−A)
. 100
= T (max)/P
R D
M .TW W
W .100 O M.T
O W O Y. C
W
WW .100Y.C M.TW
FIGURE 1. ESR Limits W to be ≥ 60˚C/W
IMPORTANT:
Wfound C
If the .maximum
00Y for the M
allowable value for θ
.TW package, ≥ 80˚C/W WW
(J−A) is
.100 M .TW
. 1
W package,Y.orC≥174˚C/W O
TO-220 for
W O
Wthat for most O ESR is speci- for the SOT-223 pack-W .C W
00Y
the TO-263
Y.C the designer WW
It is important to note capacitors,
WWtemperature. 0 .T W must age, no heatsink0is0needed since the . W alone willW
Tpackage dis- . 1 M.T
fied only at room
. 1 0 However,
M W .1 O M W C O
WW range
ensure that the ESR will stay inside
.CO .TW
the limits shown over the sipate
Wenough heat to
.C
satisfy these requirements.
W WW .100Y . .TW
entire operating Wtemperature .1 00Yfor the design. M If W
the calculated1value
. 00Yfor θ M falls.T
(J−A) below these limits, a
W O M
W O
For aluminum electrolytic
WW
Wcapacitors, ESR
temperature0is0Y
.COwill increase
reduced from .25˚C T Wto
by heatsinkW
W
is required.
0 0Y.C M.TW WW .100Y.C M.TW
about 30X as the
. 1
−40˚C. This type of capacitor
1
W.is not well-suited .C OM for low tem- HEATSINKING
W WTO-220 PACKAGE Y .CO PARTS W W WW 00Y.CO .T
perature operation.WW Y W W 0 .T .1
00
Wa.1more stable OM
.T The TO-220 can be1attached
. 0 on a PCto board.
Wplane
a typical heatsink, or se-
OMIf a copper plane is WW 00Y.CO .T
M
Solid tantalum capacitors have
W Y .C ESR over tem-
W
cured to a copper W Y .C
Wthe values.1of0θ0 will be theMsame W W
perature, but are more Wexpensive.than 100aluminum toelectrolyt- M .T to be used, (J−A) .T as shown in W.1 Y.COM
ics. A cost-effective approach W sometimes used isO
.C parallel the next section for
W Wthe TO-263.Y.CO W W
an aluminum electrolytic WwithWa solid Tantalum, 0Y with theMtotal
0Aluminum .TW W . 100 M .T W .100 M
capacitance split about 75/25% with
W W . 1
the
. C O
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W W Y . C O
W W W W
0 Y.CO
Y W W 0 .T 0
W .100ESR is the .T 0 W.1
larger value.
If two capacitors are paralleled, theW effective
.C OM par- W W.1 Y.COM W W
W W W
W The “flatter”
allel of the two individual values.
talum will keep the effective ESR fromW
0Yof the Tan-
.10asESR quickly atO M.T
W
W .100 OM
.T
rising
C low
W .C W
temperatures. WW .100Y. M.T
W W .100
Y
M.T
W O W C O
HEATSINKING WW .100Y.C M.TW WW .100Y.
A heatsink may be required dependingW on the maximumO W
power dissipation and maximum ambient WW temperature 0 0 Yof.C the . T W WW
.1 the junc- OM
WW
application. Under all possible operating conditions,
.C W
tion temperature must be within the W range
. 1 0 Y
specified0under
M.T
Absolute Maximum Ratings. W . C O
theW Y
.100
To determine if a heatsink is required,W power dissipated
by the regulator, P , must be calculated. W
WW
D

5 www.national.com
 W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
.100 M.T W.1 Y.COM W .1 M
WW 00Y.CO .TW W W WW 00Y.CO .TW
W 00 .T W.1 Y.COM W
W .1
.CO M W W.1 Y.COM W W
WW .100Y W W .100 M.T
W 00 .T
W O M.T W .C O W W.1 Y.COM W
WW .100Y.C M.TW WW .100Y M.T
W W .100 M.T
W O W O W W .C O
WW .100Y.C M.TW WW .100Y.C M.TW W .100
Y
M.T
W
W O W C O
W O
WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y. M .TW
W O
W O WW(Continued) .CO .TW As a design WWaid, Figure .C the maximum
00Yto ambientM .TW allowable
WW .100Y.C M.TW
Application W Hints 4 shows
. 1 00Y M .1
power dissipation compared
W θ Y.Cis O temperature for the
W C O If a manufactured heatsink isW
W to be selected, .C O value of
the TO-263 device W (assuming 35˚C/W andW the maxi-
WW .100Y. .TW Y W mum junction W temperature .10is0125˚C). OM.T
(J−A)

W O
heatsink-to-ambient
Mcalculated:
W resistance,
thermal
W .100θ , must (H−A)
O MT
first .be
W W .C
W . C 00Y W
WW .100Y.C M θ .T=W θ −θ −Wθ . 1 00Y M .TW W
W . 1 O M.T
OWhere: θ
(H−A) (J−A) (C−H)
W (J−C)
O .C
W
WW .100Y.C M.TW the junction
is defined asW
Wtothethethermal
(J−C) .C from .TW
00ofYthe case.M
resistance WW .100Y M .TW
W .
surface1 O A
W O
W O value of 4˚C/W W
WW .100Y.C M.TW for this calculation. W can be assumed 00Y
.forCθ (J−C)
.TW WW .100Y.C M.TW
. 1 M
W W .C O θ
W is defined as theW
W
thermal resistance Y .CO be- W W WW 00Y.CO .TW
W 00 Y (C−H)
W
.T tween the case and the W 0
.10of the heat-OM .T .1 M
W.1 Y.COM W WW 00Y.CO .TW
surface
W sink. The value ofW θ will vary .from
Y C W W
Wabout 2.5˚C/W 00(depend- M.T
(C−H)
W
W .100 O M.T about 1.5˚C/W to
W.1 insulator, .C O W W.1 Y.COM W
.C ing on method of attachment, W W
WW .100Y M
W If the exact value
.Tetc.). W is unknown,
W . 1
Y
002˚C/W M.T
O
W
W .100 O M.T
W O should be assumed for θ .C WW .100Y. C
Y.Ca value for.Tθ W is found usingWtheWequation.1shown, .TW
.
WW .100When 00Y .TW
(C−H) DS012080-8

M W thanY.CO M FIGURE 4. Maximum Power Dissipation W vs T Ofor M

W a heatsink
(H−A)
O be selected that has a valueW WW
AMB
.C W
WW .10or0equal Y.Ctomust .T
this number.W W that is less . 1 0 0 M .TW the TO-263 Package
. 1 00Y M.T
M W O W C O
W θ is.C O numerically by the heatsinkWmanufacturer Y.C Figure 5 and Figure 6
W 6 assumes Wshow the W
information for
Y.
the SOT-223
.TW
WW .1in0the0Y 100for 1 ounce
specified
.TW Wtemperature.1rise 00 package..T aθ
(H−A)
catalog, or shown
M in a curve that plots
W O M Figure (J−A)
W .
of 74˚C/W
O M
O for the heatsink.
W vs power dissipation copper and 51˚C/W for 2 ounce W .C
WW .100Y.CjunctionMtemperature
copper and a maximum
WW .100Y.C M.TW .TW of 125˚C. W W.100Y OM.TW
W O
WHEATSINKING
WW Both.1the
O
Y.C (“S”) and.TSOT-223
TO-263 AND SOT-223 PACKAGE
W (“MP”) packages WW use .a100Y.C M.TW
PARTS
WW .100Y.C M.TW
00TO-263
W
copper plane on OM
.Cheat
the PCB and the PCB itself as a heatsink. WW 00Y.CO .TW W WW 00Y.CO .TW
WW To optimize 0 Y
M. T W W
W.1 Y.COM W
0 W.1 Y.COM W
the sinking ability of the plane and PCB,
W
solder
.1the tab of CtheO package to the plane. W W
WWFigure 3.1shows . .TtheWmeasured values W 00 .T
W
00Yfor the TO-263
O M
Wof θ (J−A)
W .100 O M.T W W.1 Y.COM W
Y.C W . C W
WW Wused .100Y W .100 .T
for different copper area sizes using a typical PCB with 1
W the copper area M.T
W .100and no solder
ounce copper
O M .Tover
mask
W C O W W .C OM
W
WW .100Y.C M.TW WW .100Y. Y
for heatsinking.
M .TW W
W .100 O M.T
W O C
W
WW .100Y.C M.TW
O
WW .100Y.C M.TW WW .100Y. M .TW
W O
W O W
WW FIGURE .CO .TW WW .100Y.C M.TW
WW .100Y.C M.TW 00Y5. θ M
DS012080-11

.1
WW 00Y.CO .TW
vs Copper (2 ounce) Area for the
WW 00Y.COSOT-223
(J−A)

W W .C O W
Package
W
W 00 Y .T W W .T .1 M
W.1 Y.COM W W W.1 Y.COM W WW 00Y.CO .TW
W W 00 .T W
W
W .100 O M.T W.1 Y.COM W W W.1 Y.COM
. C W W 00 .T
WW .100Y M.T
W W .100 M.T W.1 Y.COM
W O W .C O W
WW .100Y.C M.TW WW .100Y M.T
W W .100 M.T
W O W O W W .C O
Wθ W vs Copper .C WW .100Y.C M.TW W .100
Y
DS012080-7

00Y .TforWthe M
1 W .CO
FIGURE 3. . (1 ounce) M Area
W Package (J−A)
C O W W .C O W Y
W TO-263
Y . W W 0 Y .T W W 0 0
W 00
W.1 theYcopper M.T
Oarea
0
W.1 Y.COM W W W.1
As shown in the figure, increasing
W .C beyond 1 W W
00
W very little.1improvement.
square inch produces It should.TW also W .100 OM
.T
be observed that the minimum W value of θ forM
O the TO-263 W W .C
WaW Y. C (J−A)
W Y DS012080-12
W
package mounted to
.100
PCB is 32˚C/W.
W O M.T
W
FIGURE 6. Maximum
W .100Power Dissipation
O M.T vs T for
AMB

WW .100Y. C
WW .100Y.C M.TW Please see
the SOT-223 Package

W O WWfor power enhancement techniques to

AN1028
WW .100Y.C M.TW be used withWthe SOT-223 package.
W O
WW .100Y.C M.TW
W O
WW .100Y.C
W
WW
www.national.com 6
 W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
.100 M.T W.1 Y.COM W .1 M
WW 00Y.CO .TW W W WW 00Y.CO .TW
W 00 .T W.1 Y.COM W
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WW .100Y W W .100 M.T
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WW .100Y.C M.TW WW .100Y M.T
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W
W O W C O
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WW .100Y.C M.TW
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WW .100Y.C M.TW WW .100Y. M .TW
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W O
WW .100Y.CPhysical .T WDimensions 0 0Y.C unless
WWinches .(millimeters) .TW WW .100Y.C M.TW
1 M W O
W OM W O
WW .100Y.C M.TW
WW .100Y.C M.TW WW .100Y.C M.TW
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WW .100Y.C M.TW WW .100Y.C M.TW
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W WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W .1 M
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WW .100Y.C M.TW WW .100Y M.T
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WW .100Y.C M.TW WW .100Y.C M.TW W .100
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W WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W .1 M
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W W
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W
W .100 OM
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W W.1 Y.COM W
C W .C W
WW .100Y. M.T
W W .100
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W 00
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W O W .C O W
WW .100Y.C M.TW WW .100Y M .TW W .100 M.T
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WW .100Y.C M.TW WW .100Y.C M.TW W .100
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W O W O
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WW .100Y.C M.TOrder
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W 3-Lead W Package.100Y.C M.TW
SOT-223W WW .100Y.C M.TW
Part Number LM3940IMP-3.3
W O W O
W
WW .100Y.C M.TW
O
WWMA04A.100Y.C M.TW
NSC Package Number WW .100Y.C M.TW
W O W O
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WW .100Y.C M.TW
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WW .100Y.C M.TW WW .100Y.C M.TW
W W .C O
W WW 00Y.CO .TW W WW 00Y.CO .TW
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7 www.national.com
 W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
.100 M.T W.1 Y.COM W .1 M
WW 00Y.CO .TW W W WW 00Y.CO .TW
W 00 .T W.1 Y.COM W
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W O M W C O
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WW .100Y.C M.TW
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WW .100Y.C M.TW WW .100Y. M .TW
W O W O
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WW .100Y.C M.TW
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WW .100Y.C M.TW WW .100Y.C M.TW
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W WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W .1 M
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W W 00 .T W
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W WW 00Y.CO .TW W WW 00Y.CO .TW
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W W.1 Y.COM W
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NSC
W .1
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www.national.com 8
 W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.