AT&S Internship Report 2023

Figure Numbers Table

1. Overall Flow diagram ……..….………………………………07
2. Surface preparation of the panel ………………………………08
3. Basic cross section of DFPR …………………………………..08
4. Photo tool ……………………………………………………...09
5. Camtek AOI & Verification system …………………………..10
6. Multiple inner cores ……………………………………….......11
7. Oxide Coating ………………………………………………....11
8. Books placed between Platens for pressing to take place ……..12
9. Pannels being drilled …………………………………………..13
10.PTH process …………………………………………………...16
11.Platting thin copper to the walls of the holes ………………….16
12.Solder mask being applied …………………………………….17
13.Legend Printing ………………………………………………..20
14.Panel after routing ……………………………………………..20
15.Jig testing …………………………………………………...…21
16.Flying probe testing ……………………………………..…….22
17.Defect marked in FI ………………………………………...…23
18.Shrink wrapping with Humidity label ……………………..….24
19.Solvent extraction unit …………………………………….…..26
20.Settler Box ………………………………………………….…27
21.Sectional view of Electrowinning Cell ……………………….28
22.Top and Side view of Buffer Tank ……………………………29
23.Process Flowsheet of Copper Recovery ………………………33

Dayananda Sagar College Of Engineering Bangalore