Flex & Rigid-Flex Circuits

Array
Panelization
6 Key Elements to Maximize Material Usage
and Improve Yields
 Introduction
Flexible and rigid-flex circuit board technologies have additional elements,
beyond those of rigid PCBs, that require review and consideration when
creating assembly arrays that maximize material utilization and improve
manufacturing yield rates.

Beyond the technology of the design and its size and shape, material
usage and yield rates are the two elements that have the most significant
impact on the cost of a design and ensuring complete and on-time
deliveries. An optimized array also addresses yield rates and throughput at
the component assembly process.

Whether the part is a flex only with stiffeners or a rigid-flex, the size and
shape of the design, the material requirements, the number and location(s)
of rigid areas, the number of rigid and flex layers, stiffener, and PSA
requirements all combine to determine the optimum array configuration.

In this eBook, we will review the important elements that impact both
material usage and manufacturing/assembly yields.
 Key Element
#1
Assembly Array Configuration
The majority of flex and rigid-flex parts are supplied in an assembly array
format due to component assembly requirements. Similar to rigid PCBs,
the array contains multiple individual parts which are stepped, repeated,
and retained within the larger format of the assembly array. The size of the
array and how it fits within the usable area of the available production panel
sizes is critical in achieving a high degree of material utilization.

The array configuration will be, in part, defined by the size of the individual
part. However, the part shape, how the parts are oriented, the number of
parts stepped up in the X and Y dimensions, spacing between adjacent
parts, and the width of the surrounding array border, when combined with
the available production panel sizes, will determine the material utilization.
Any opportunity to increase the number of parts within a production panel
will reduce the individual part cost through improved material utilization.

Many designs have unique shapes that allow parts to be rotated and
nested together, which significantly improves material usage. There may,
however, be limitations depending on available breakaway tab locations,
stiffener requirements, etc., which prevent an optimal configuration. Due to
a large number of possible combinations and permutations, this will require
input from your supply partner to effectively resolve.
 Rotated and nested rigid-flex arrays for improved material usage.

“
ARRAY SIZE, IN RELATION TO THE PRODUCTION
PANEL SIZE, IS CRITICAL TO MATERIAL
UTILIZATION.
 Key Element
#2
Material Tolerances
Polyimide materials, used in flexible and rigid-flex circuit boards, are
homogeneous and non-reinforced, which allows the finished circuit to meet
the design’s bend requirements. Because of this, the materials do not have
or maintain during production the same dimensional tolerances of FR4
materials used in rigid printed circuits.

A typical polyimide material tolerance from the material supplier is +/-

0.001” per linear inch. If allowed to accumulate excessively, this tolerance
will have a negative impact on yield rates. The material dimensions will
change as the material is processed into a finished circuit.

An oversize array, combined with small via pad sizing, creates the
opportunity for layer-to-layer registration challenges for both the signal
layers, in a multi-layer design, and with the coverlays used to encapsulate
the flex areas. Both items may lead to reduced yield rates.
 Material manufacturer’s spec sheet defining dimensional stability relative to
IPC standards.

“
SMALLER ARRAYS WITH FEWER INDIVIDUAL
PARTS MINIMIZE THE ACCUMULATION OF
MATERIAL TOLERANCES AND IMPROVE YIELD
RATES.
 Key Element
#3
Impact of Flex and Rigid-Flex PCB Technology

Flex and rigid-flex PCB technology, by design, results in a finished part that
is not uniform in its construction or thickness across the entire dimensions
of the part. These changes, in both materials and thickness, inherently
create additional dimensional tolerances due to a reduction in the
mechanical stability of the individual layers as compared to the solid and
uniform thickness of a rigid PCB design.

Rigid-flex designs require the pre-preg layers to have clearance cutouts for
the flexible areas. Flexible circuits will have stiffeners laminated in specific
locations to support component areas or meet ZIF connector requirements.

Identifying and accounting for a potential accumulation of design-related

tolerances is necessary when creating an optimum assembly array. Again,
the potential negative impact is layer-to-layer registration issues and
reduced yield rates.
 4-layer rigid-flex construction after lamination with pre-preg flex area cutouts.

“
DESIGN AND CONSTRUCTION-RELATED
DIMENSIONAL TOLERANCES NEED TO BE
DEFINED AND ACCOUNTED FOR IN AN
OPTIMUM ARRAY CONFIGURATION.
 Key Element
#4
Component Assembly Considerations

The component technology, package type(s), and assembly methods

of a design need to be factored into the array configuration so as not to
create complications and yield reductions during the component assembly
process. Designs with fine pitch SMT leads, or BGA packages, are more
sensitive to an accumulation of dimension tolerances, across the extents of
the array, than designs with PTH components as an example.

A larger array will generally improve assembly throughput and reduce the
assembled circuit cost. However, an overlay large area, with the inherent
accumulation of material and design-related dimensional tolerances, may
prevent proper solder paste stencil application to the fine pitch SMT pads
at the extents of the array. This results in misaligned solder paste, potential
solder bridging, and other assembly problems. There may be an option
to scale the solder paste stencil to match the finished array size, but it is
generally not preferred.

This option is commonly reserved for very large parts where the array size
is defined by the individual part size and reducing the array size is not an
option.
 Fine pitch SMT rigid-flex in max. 4-up array.

“
COMPONENT PACKAGING MAY IMPOSE
MAXIMUM SIZE LIMITS ON THE ASSEMBLY
ARRAY TO PREVENT ASSEMBLY ISSUES.
 Key Element
#5
Part Retention in the Assembly Array

Flex and rigid-flex are retained within an array with breakaway tabs in a
similar manner as rigid PCBs. The configuration of the tabs however will
differ depending on if it is located in a flex-only or rigid-only area.

For flex circuits, or if the flex area of a rigid-flex is relatively large, the
breakaway tab is a small uncut portion of the flex area outline. Holes are
not typically used in 1- and 2-layer flex constructions as it weakens the tab,
which may then separate prematurely. Higher layer count flex constructions
may use holes if necessary. The tabs are then cut to separate the part.

For rigid-flex designs, the breakaways are the same as used in rigid PCBs.
They consist of a small, uncut portion of the rigid outline with small holes
stitched across to facilitate separation. Ideally, the tab holes are located
within the part outline (if there is sufficient spacing to the circuit pattern) so
that the remaining tips of the separated tab do not extend outside the part
outline.

V-scoring is used on occasion for rigid-flex designs only. It can only be

applied to straight orthogonal part outline edges due to scoring equipment
process limits. V-scoring also requires an additional cutting operation to
separate the parts from the array. The centrally located flex layers will
remain uncut by the V-scoring operation and will not separate without an
additional cutting operation to cut through the flex layers.
 Flex circuit with stiffener using breakaway tabs with holes in stiffened area and
without holes in flex only area.

“
DEPANELIZATION REQUIREMENTS SHOULD BE
REVIEWED BY THE CM TO AVOID POTENTIAL
ISSUES AND ADDITIONAL COSTS.
 Key Element
#6
Stiffeners and PSAs

Most flex circuit designs, and many rigid-flex designs, require stiffeners to
either support a component area or meet the thickness requirement of a
ZIF-type connector. Stiffener materials are typically polyimide or FR4 but
can also be stainless steel or aluminum. The location(s) of stiffeners in a
design may create limitations in the array configuration and necessitate a
specific but less-then-optimized array configuration.

Different materials use different breakaway tab configurations and have

dissimilar material adjacent to each other will prevent the locating of a
breakaway tab which is important to the structural integrity of the assembly
array. The most common occurrence is between a flex area and a rigid or
FR4 stiffener area.

It may also be advantageous to orient the parts in the array in a manner

that facilitates the application of the stiffener(s). This may result in a net
cost saving even though the material usage is not as high as possible.

The above also applies to pressure-sensitive adhesives (PSAs) that are

used to retain a flex circuit within an enclosure. When combined with
stiffeners, further assembly array considerations may occur.
 Array configuration to facilitate PSA application in strip format.

“
STIFFENERS AND PSAS MAY FACTOR
INTO THE AVAILABLE ASSEMBLY ARRAY
CONFIGURATIONS TO PREVENT ADDED
MANUFACTURING COSTS.
Need Help With an Array
Panelization?
Our flex and rigid-flex circuit board solutions are custom
designed for many top tier OEMs. Manufactured with
dependable reliability, our flexible circuits are built
to withstand the rigors of aerospace, medical,
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Our team of engineers and CAD/

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Our flex and rigid-flex PCBs are manufactured for

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assist you from early design stages of your application
all the way to end-product production for all your flex
and rigid-flex circuit board needs.

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 About The Author
Paul Tome
Product Manager Flex & Rigid Flex

As Product Manager of Flex & Rigid-Flex

Circuits, Paul oversees our entire flex &
rigid-flex product line. Though Paul’s main
responsibility is customer technical support,
he is involved in each project from the
beginning conceptual stages to delivery.
He works directly with customers on their
specific design requirements and makes
sure that each product is designed correctly,
troubleshooting any issues that may arise in
the process.

Paul came to Epec with 24 years of a great

variety of experience in the electronics
industry. He has been involved in all aspects of the industry including sales,
engineering, and manufacturing. He has worked with PCBs and equipment
manufacturing and has also been the owner of an engineering service and
trust bureau.

Previously, he was president at Advanced Circuit Services. Paul’s experience

and expertise make him an indispensable part of Epec’s team.

Visit Our Website @ www.epectec.com

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