KXTG 7731 S

ORDER NO.
KM41201532CE
F13
Telephone Equipment
Model No. KX-TG7731S
KX-TG7732S
KX-TG7733S
KX-TGA470S
Link-to-Cell Cellular Convergence
Solution
S: Sliver Version
(for U.S.A.)
KX-TGA470S KX-TG7731S
(Handset) (Base Unit)
(Charger Unit)
Configuration for each model

Model No Base Unit Handset Charger Unit Expandable
KX-TG7731 1 (TG7731) 1 (TGA470) Up to 6
KX-TG7732 1 (TG7731) 2 (TGA470) 1 Up to 6
KX-TG7733 1 (TG7731) 3 (TGA470) 2 Up to 6
KX-TGA470* 1 (TGA470) 1
*KX-TGA470 is also an optional accessory, which contains a

handset and a charger.
© Panasonic System Networks Co., Ltd. 2012

Unauthorized copying and distribution is a violation
of law.
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KX-TG7731S/KX-TG7732S/KX-TG7733S/KX-TGA470S
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
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TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 4 15.3. Circuit Board (Handset_Main) ------------------------ 85
1.1. For Service Technicians --------------------------------- 4 15.4. Circuit Board (Charger Unit)--------------------------- 87
2 Warning -------------------------------------------------------------- 4 16 Exploded View and Replacement Parts List ----------- 88
2.1. Battery Caution--------------------------------------------- 4 16.1. Cabinet and Electrical Parts (Base Unit) ----------- 88
2.2. About Lead Free Solder (PbF: Pb free)-------------- 5 16.2. Cabinet and Electrical Parts (Handset)------------- 89
2.3. Discarding of P. C. Board-------------------------------- 5 16.3. Cabinet and Electrical Parts (Charger Unit) ------- 90
3 Specifications ----------------------------------------------------- 6 16.4. Accessories and Packing Materials ----------------- 91
4 Technical Descriptions ----------------------------------------- 7 16.5. Replacement Parts List--------------------------------- 95
4.1. Circuit Configuration of TG773x Series
Phones ------------------------------------------------------- 7
4.2. US-DECT Description ------------------------------------ 8
4.3. Block Diagram (Base Unit_Main)---------------------10
4.4. Tel Interface Circuit--------------------------------------- 11
4.5. Block Diagram (Base Unit_RF Part) -----------------12
4.6. Circuit Operation (Base Unit) --------------------------13
4.7. Block Diagram (Handset)-------------------------------20
4.8. Block Diagram (Handset_RF Part)-------------------21
4.9. Circuit Operation (Handset)----------------------------22
4.10. Circuit Operation (Charger Unit) ----------------------24
4.11. Signal Route -----------------------------------------------25
5 Location of Controls and Components ------------------27
6 Installation Instructions ---------------------------------------27
7 Operating Instructions-----------------------------------------27
8 Test Mode ----------------------------------------------------------28
8.1. Engineering Mode ----------------------------------------28
9 Service Mode -----------------------------------------------------32
9.1. How to Clear User Setting (Handset Only)---------32
10 Troubleshooting Guide ----------------------------------------33
10.1. Troubleshooting Flowchart -----------------------------33
11 Disassembly and Assembly Instructions ---------------49
11.1. Disassembly Instructions -------------------------------49
11.2. How to Replace the Base Unit LCD -----------------53
11.3. How to Replace the Handset LCD -------------------55
12 Measurements and Adjustments---------------------------56
12.1. Equipment Required -------------------------------------56
12.2. The Setting Method of JIG -----------------------------56
12.3. Adjustment Standard (Base Unit)---------------------60
12.4. Adjustment Standard (Charger Unit)-----------------61
12.5. Adjustment Standard (Handset) ----------------------62
12.6. Things to Do after Replacing IC or X'tal ------------63
12.7. Frequency Table ------------------------------------------65
12.8. Bluetooth Frequency Table-----------------------------66
13 Miscellaneous ----------------------------------------------------67
13.1. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------67
13.2. How to Replace the Flat Package IC ----------------69
13.3. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------71
14 Schematic Diagram ---------------------------------------------72
14.1. For Schematic Diagram---------------------------------72
14.2. Schematic Diagram (Base Unit_Main) --------------74
14.3. Schematic Diagram (Base Unit_RF)-----------------76
14.4. Schematic Diagram (Base Unit_Operation) -------77
14.5. Schematic Diagram (Handset_Main) ----------------78
14.6. Schematic Diagram (Charger Unit) -----------------80
15 Printed Circuit Board-------------------------------------------81
15.1. Circuit Board (Base Unit_Main) -----------------------81
15.2. Circuit Board (Base Unit_Operation) ----------------83

1 Safety Precautions
1.1. For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
Attention:
A nickel metal hydride battery that is recyclable powers the product you have purchased.
Please call 1-800-8-BATTERY (1-800-822-8837) for information on how to recycle this battery.

2.2. About Lead Free Solder (PbF: Pb free)

Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component Component
pin
Remove all of the
excess solder
Solder
(Slice View)
2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g
2.3. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

3 Specifications
■ Standard: ■ Bit rate:
DECT 6.0 (Digital Enhanced Cordless 1.152Mbit/s (DECT 6.0)
Telecommunications 6.0) 1.0 Mbit/s (Bluetooth)
Bluetooth wireless technology 2.0 ■ Modulation:
■ Number of channels: GFSK (Gaussian Frequency Shift Keying)
60 Duplex Channels (DECT 6.0)
■ RF transmission power:
79 Duplex channels(Bluetooth)
■ Frequency range: 115 mW (max/DECT6.0)
1.92 GHz to 1.93 GHz (DECT 6.0) ■ Voice coding:
2.402 GHz to 2.48 GHz (Bluetooth) ADPCM 32 kbit/s (DECT 6.0)
■ Duplex procedure: CVSD/PCM 64kbit/s (Bluetooth)
TDMA (Time Division Multiple Access) PCM 64kbit/s(BT_IC)
■ Channel spacing:
1.728MHz (DECT 6.0)
1.0MHz(Bluetooth)
Base Unit Handset Charger
Power source AC Adaptor Rechargeable Ni-MH battery AC Adaptor
(PNLV226Z, 120 V AC, 60 Hz) AAA (R03) size (1.2 V 550 mAh) (PNLV226Z, 120 V AC, 60 Hz)
Receiving Method Super Heterodyne Super Heterodyne
Oscillation Method PLL synthesizer PLL synthesizer
Detecting Method Quadrature Discriminator Quadrature Discriminator
Tolerance of OSC Frequency 10.368 MHz ±100 Hz 13.824 MHz ±100 Hz
Modulation Method Frequency Modulation Frequency Modulation
ID Code 40 bit 40 bit
Ringer Equivalence No. (REN) 0.1B
Dialing Mode Tone (DTMF)/Pulse Tone (DTMF)/Pulse
Redial Up to 48 digits Up to 48 digits
Speed Dialer Up to 24 digits (Phonebook)
Power Consumption Standby: Approx. 1.2 W 11 days at Standby, Standby: Approx 0.1 W
Maximum: Approx. 4.5 W 13 hours at Talk Maximum: Approx 2.0 W
Operating Conditions 0 ˚C - 40 ˚C (32 ˚F – 104 ˚F) 0 ˚C - 40 ˚C (32 ˚F – 104 ˚F) 0 ˚C - 40 ˚C (32 ˚F – 104 ˚F)
20 % – 80 % relative air humidity 20 % – 80 % relative air humidity 20 % – 80 % relative air humidity
(dry) (dry) (dry)
Dimensions (W x D x H) Approx. 150 mm × 117 mm × 67 mm Approx. 54 mm × 34 mm × 174 mm Approx. 73 mm × 76 mm × 43 mm
Mass (Weight) Approx. 210 g Approx. 150 g Approx. 50 g
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
• Optional Headset: KX-TCA60, KX-TCA93, KX-TCA400, KX-TCA430
• Optional Range extender: KX-TGA405

4 Technical Descriptions
4.1. Circuit Configuration of TG773x Series Phones
TG773x consists of DECT cordless telephone and Bluetooth Module.
Both voices of transmission and reception are transferred by PCM.
BBIC on DECT side controls the cordless telephone system, which makes control data communication with BT_IC on BT
Module in serial data.
Bluetooth Devices
Cellular Phone
TGA470 (For Link to Cell
Handset communication)
Bluetooth
DECT6.0 Headset
Bluetooth Bluetooth
Main PCB
Control/Data
signal
(UART)
BBIC BT_Module
(IC501) (IC721)
SPEAKER
Audio signal
(PCM)
EEPROM IC611 FLASH IC601 QSPI FLASH
(Data) (TAM) IC502
(Program)
TEL I/F POWER
PSTN DC
5.5V

4.2. US-DECT Description

The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.65).
4.2.1. TDD Frame Format

5 ms 5 ms
Up Link ( Handset -> Base Unit ) Down Link ( Base Unit -> Handset )
RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
DATA rate : 1.152 Mbps

417 µs (available) 417 µs (blind)
4.2.2. TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 µs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer Dummy bearer
Base unit RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
Handset 1
(Stand by)
Handset 2 TX RX
(Link)
Handset 3 TX RX
(Link)
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.

4.2.3. Signal Flowchart in the Radio Parts

Reception
Base unit:
A voice signal from TEL line is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC501).
The RF signal, after which is amplified in BBIC, is fed to selected antenna.
Handset:
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
Handset:
A voice signal from microphone is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC1).
The RF signal, after which is amplified in BBIC, is fed to an antenna.
Base unit:
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

4.3.
LCD LED
Q141
Q161 TR_RLY D101 TEL_JACK
IC751 Crystal 3 2 TIP
10.368MHz SIDE_TONE
CIRCUIT RING
4 1
IC501

BBIC
+1.8V
IC502
RF_Block
AVD/VDD Q301
DC_JACK
VRF IC302 DC5.5V+
/VPA VBAT
Block Diagram (Base Unit_Main)
REGULATOR
10
GND
VDD_PA RF_VDD
CHARGE
IC721 IC601 IC611 +
BT
Module -
KEY
+2.4V PAD
Q302
KX-TG7731/7732/7733 BLOCK DIAGRAM (Base Unit_Main)

4.4. Tel Interface Circuit
RING
TIP
SA103
P101
SA101
L102
L101
C106 R106
C104 R102 C108 R104
C105 R105
C103 R101 C107 R103
CALLER ID
DETECT
REGULATOR
2
1
C101
D101
C102
DETECT
BELL
4
3
R141
CONTROL
CIRCUIT
Q141
R142
SIDE TONE
TX AMP
RX AMP

4.5.
IC501 RF block
ANT1 PLL
3856-3843MHz 10.368
MHz

/3859-3845MHz
ANT2 Modulator
D802 D801
TXDATA
Control
Logic
12
Block Diagram (Base Unit_RF Part)
RXDATA
Mixer Demodulator
KX-TG7731/7732/7733 BLOCK DIAGRAM (Base Unit_RF Part)

4.6. Circuit Operation (Base Unit)

General Description:
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
PCM OUT
Bluetooth Unit
PCM IN
TDD & TDMA ADPCM

Digital TEL
with FHSS
Speech Analog Line
Processor ADPCM Processor Front Interface
RF part End
&
Host CPU
Caller ID
Modem Multi-
plexer
BBIC (IC501)
Digital TAM System SP
EEPROM Flash Memory Flash Memory IC601

Keys/ LEDs
IC611 (Program)
/ Charge
IC502
4.6.1. BBIC (Base Band IC: IC501)

• Voice Message Recording/Play back
The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.
4.6.2. Flash Memory (IC502)

Main program data is stored.
4.6.3. Flash Memory (IC601)

Following information data is stored.
• Voice signal
ex: Pre-recorded Greeting message, Incoming message
4.6.4. EEPROM (IC611)

Following information data is stored.
• Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
4.6.5. Bluetooth Unit (IC721)

Use for Bluetooth communication.

4.6.6. Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
+5.5V +3.0V VDD3 VDD4
IC302 IC501 IC502

+3.0V_CP
+5.5V +3.0V QSPI FLASH
3.0V
AC Adaptor
REGULATOR VDD1 BBIC VDD5
IC601
+1.8V +3.0V_CP2
Q301 TAM FLASH
VDD2
IC611
+2.4V EEPROM
Q302
RF Part
IC751 LEDs
IC721
Bluetooth
unit
VBAT
VDDC (1.2 V)
Reset (RSTN)
(IC501_77pin)
Startmonitor
(IC501 57pin)
(CKM/STM)
BBIC chip initialize

4.6.6.1. Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.
D362 R372 R371

+5.5V
F301 DCP
A K
CHARGE+
DCM
C351
D361
( )
CHARGE-
+
C306

4.6.7. Telephone Line Interface

Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell (RINGING) signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
L1T→L101→C105→R105→R110→R111→R112→BBIC pin18(RINGING)
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 19 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
R160 Q141
E
R162
B
Q151
+ C R141
C167
R165
B
C164
C161
(3216)
R142
C163
R131
C165
TP9 K
C173
C142
RX R161
D142
R164
A
Pin25 of IC501
R178
C172
C101
R163
C171
R166
R151 D101
Q142 L101 L1T
B C
+
~
3 2
E _
SA101
~
2
4 1
R152
V
V
C152
R133
C168
R167
R145
C132
R144
1
C102 L102 L1R
TP10
P101
TX R181 C184
Pin27 of IC501
C181
C186
HOOK
Pin19 of IC501 C107 R103 R101 C103
RINGING
Pin18 of IC501 R105 C105
CIDOUT C108 R104 R102 C104

R111
Pin24 of IC501
R110
R112
C111
R106 C106
C110
C113
CIDINn R108
Pin23 of IC501
CIDINp R107
Pin21 of IC501
R109
C109
LSRn
Pin28 of IC501

4.6.8. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 32 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 17 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
Q141
Q161
R141
R163
R142
R131
Pin 17 of IC501 C101
PARADET
D101
R121 R151 3 2
R167
C132
Q142
R152 4 1
C152
SA101
L1T
R133
R145
L1R
C102 TEL JACK
Pin 32 of IC501
ADC0
P101
HOOK R122
Pin 19 of IC501

4.6.9. Calling Line Identification (Caller ID)/Call Waiting Caller ID

Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
Single message format
1st Ring 2nd Ring
2 sec Silent interval 4 sec 2 sec
0.5 s 575 ms min 0.5 s
DATA
STD Ring / 20 Hz
Tip-Ring 0.1 Vrms
70 Vrms
A DATA in
1200 Hz 2200 Hz
=DATA "1" =DATA "0 "
B DATA out
1 bit=833 µs
month day hour minute number

04 15 16 35 2013487000
Plural message format

1st Ring 718 ms
0.5 s 2nd Ring
2 sec
DATA
DATA CODE NAME month day hour minute number

201 John Smith 04 16 16 35 2013487000

Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line→P101→L101, L102→C105, C106→R105, R106→R108, R107→IC501(23, 21).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
Call Waiting Format
CAS: CPE Alerting Signal

Dual Tone of 2130 Hz, 2750 Hz Continuance Signal
-15 dBm (900 ohm load) of 1200 Hz (Data "1") "FSK"
Signal Flow
Telephone Exchange CAS MARK DATA
Cordlessphone
80 5 ms 0~500 ms 58~75 ms about 300 ms
(be changed by
Information Volume)
ACK: Acknowledged Signal

DTMF
Signal Flow "D"
ACK
Cordlessphone Telephone Exchange
0~100 ms 60 5 ms
CIDOUT
Pin 24 C107 R103 R101 C103
R110
C110
L101 L1T
CIDINn R108 R105 C105
SA101
IC501 Pin 23
2
V
V
R107 C108 R104 R102 C104
CIDINp 1
L102 L1R
Pin 21
R106 C106 P101
R109
C109
LSRn
Pin 28

4.7. Block Diagram (Handset)

VBAT
IC3
ANT1
X1
EEPROM
13.824 MHz
VBAT
WP, CLK, DATA

CHG_DET
RF part
CHG_CTL RXp
RXn
RXON
TXp
RSTN RESET TXn
Q3 TXON
CHARGE
VBAT
BATTERY
MIC IC1
MIP BBIC
MIN
Receiver
HSSPOUTP
Headset Jack
LOUT
3V HSMIP
4.0V
CN431 VBAT
IC4
LED
HEADSET_DET CHARGE
(KEY) CP_OFF
LED PUMP
Q6 (BELL)
KEYSTOROBE_A~E
KEY_LED
Q5
BELL_LED
KEYIN_1~5
Monitor SP
SPOUTP
SPOUTN
CKM/STM CKM//STM
4V
LED
(LCD) LCD KEYS
KX-TGA470 BLOCK DIAGRAM (Handset)

4.8. Block Diagram (Handset_RF Part)

TXp
TXn
ANT TXON
DA801
RXON
RXp
RXn
KX-TGA470 BLOCK DIAGRAM (Handset_RF Part)

4.9. Circuit Operation (Handset)

4.9.1. Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.20).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, EEPROM, LCD)
• EEPROM: IC3
- Setting data is stored. (e.g. ID, user setting)
4.9.2. Power Supply Circuit/Reset Circuit

Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → BBC1 (IC1) 10 pin
The Reset signal generates IC1 (54 pin) and 1.8 V.
VBAT
VDDC (1.2 V)
Reset (RSTN)
(IC1_54 pin)
Startmonitor
(IC1 57pin)
(CKM/STM)
BBIC chip initialize
VBAT
3.0V
3.0V
BATTERY
EEPROM
2CELL
GND
VDDC (1.2V)
DOUBLER OUT (Charge Pump)
For all peripherals
3.0V
BBIC LCD
VBAT
4.0V
External Charge Pump
Circuit or IC
3.0V 4.0V
4.0 output
LCD BACKLIT LED

BELL, KEY LED
GND GND

4.9.3. Charge Circuit

Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V) → F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery...
BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.14).
Q2
C27
R2
R9
R8
CHG +
Q3
BATT +
R4 47K Q4 BATTERY
2CELL
R6
10K BATT +
CHG -
Q9
GND
GND
GND
CHG CTRL (32)
BBIC
R7 CHG DET (34) IC1
100K
4.9.4. Battery Low/Power Down Detector

Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.35 V ± 50 mV
The BBIC detects this level and " " starts flashing.
• Power Down
Battery voltage: V(Batt) 2.1 V ± 50 mV
The BBIC detects this level and power down.
4.9.5. Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

4.10. Circuit Operation (Charger Unit)

Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.22)
F1
R1 R2 D1 TP1
J1
TP2
AC Adaptor
The route for this is as follows: DC+pin of J1(+) → F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).

4.11. Signal Route
SIGNAL ROUTE IN 㸢㩷 ROUTE 㸢㩷 OUT
HANDSET TX HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

- <HANDSET_RF_TX_ROUTE> - ANT. ---
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141 - D101
- L101/[L102 - P101] - T/R(TEL LINE)
HANDSET RX T/R(TEL LINE) - L101/[P101 - L102] - D101 - Q141 - R165 - R177 - C173 - Q171 - C178 - R178
- IC501(16 - 44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
--- ANT. - <HANDSET_RF_RX_ROUTE> - IC1(28/27) - C16 - L8 -
HEADSET_JACK(5 - 4) - HANDSET SPEAKER
HEADSET TX HEADSET_JACK(2) - R80 - C14 - R22 - IC1(25) - <HANDSET_RF_TX_ROUTE> - ANT. ---

---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161- Q141 - D101
- L101/[L102 - P101] - T/R(TEL LINE)
HEADSET RX T/R(TEL LINE) - L101/[P101 - L102] - D101 - Q141 - R165 - R177 - C173 - Q171 - C178 - R178
- IC501(16 - 44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
--- ANT. - <HANDSET_RF_RX_ROUTE> - IC1(28) - C16 - L8 - HEADSET_JACK(5)
HANDSET HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

SP-Phone TX - <HANDSET_RF_TX_ROUTE> - ANT. ---
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141
- D101 - L101/[L102 - P101] -T/R(TEL LINE)
HANDSET T/R(TEL LINE) - L101/[P101 - L102] - D101 - Q141 - R165 - R177 - C173 - Q171 - C178 -R178
SP-Phone RX - IC501(16-44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
--- ANT. -<HANDSET_RF_RX_ROUTE> - IC1(29/31) - Backside SP
CELLULAR TX HANDSET MIC - R73/74 - C11/13 - RA4 -IC1(22/23)

- <HANDSET_RF_TX_ROUTE> - ANT. ---
ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(2/3 - 80)
- IC721(31 - 19) - R781 - ANT_BT - CELL PHONE
CELLULAR RX CELL PHONE - ANT_BT - R781 - IC721(19 - 3) - IC501(81 - 94/95)

- <BASE_UNIT_RF_TX_ROUTE> - ANT
---ANT.- <HANDSET_RF_RX_ROUTE> - IC1(28/27)
- C86 - L74 - HEADSET JACK(5-4) - R11- HANDSET SPEAKER
Bluetooth from BT Headset - ANT_BT - R781 - IC721(19 - 3) - IC501(81 - 27)

Headset Sound - C184 - Q161 -Q141 - D101 - L101/[L102-P101] - T/R (TEL LINE)
TX(to Tel Line)
Bluetooth T/R (TEL LINE) - L101/[P101-L102] - D101 - Q141 - R165 - C173 - R178
Headset Sound - IC501(25 - 80) - IC721(31 - 19) - R781 - ANT_BT - to BT Headset
RX(from Tel Line)
Note:
: inside of Handset

RF part signal route

SIGNAL ROUTE IN 㸢㩷 ROUTE 㸢㩷 OUT
INTERCOM HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

HANDSET TO - <HANDSET_RF_TX_ROUTE> - ANT. ---
BASE UNIT ANT - <BASE_UNIT_RF_RX_ROUTE> - IC501(2/3 - 41/43) - SPEAKER
INTERCOM MIC - C457/C458 - RA452 - IC501(37/38 - 94/95) - <BASE_UNIT_RF_TX_ROUTE> - ANT

BASE UNIT --- ANT. - <HANDSET_RF_RX_ROUTE> - IC1(28/27) - C86 - L74
TO HANDSET - HEADSET_JACK(5 - 4) - R11 - HANDSET SPEAKER
GREETING HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

RECORDING - <HANDSET_RF_TX_ROUTE> - ANT. ---
ANT - <BASE_UNIT_RF_RX_ROUTE> - IC501(2/3 - 69/70) - IC601
GREETING PLAY IC601 - IC501(69/70 - 27) - C184 - Q161 -Q141- D101 - L101/[L102-P101] - T/R (TEL LINE)
TO TEL LINE
ICM RECORDING T/R (TEL LINE) - L101/[P101-L102] - D101 - Q141 - R165 - C173 - R178
- IC501(25 - 69/70) - IC601
ICM PLAY TO IC601 - IC501(69/70 - 41/43) - SPEAKER

SPEAKER
DTMF SIGNAL IC501(27) - C184 - Q161 -Q141- D101 - L101/[L102-P101] - T/R (TEL LINE)
TO TEL LINE
CALLER ID T/R(TEL LINE) - L101/[P101 - L102] - C105/C106 - R105/R106 - R108/R107 -IC501(23/21)
BELL DETECTION T/R(TEL LINE) - L101 - C105 - R105 - R110 - R111 - R112 - IC501(18)
HANDSET RF IC1(44/45) - L809 - C812 - DA801 - C803 - C801 - ANT

[ TX_ROUTE ]
HANDSET RF ANT - C801 - C803 - DA801 - C826 - IC1(46/47)

[ RX_ROUTE ]
BASE UNIT RF IC501(95/94) - L802/C813 - C812 - DA801 - C803 - DA802 - C851/C853 - ANT1/ANT2
[ TX_ROUTE ]
BASE UNIT RF ANT1/ANT2 - C851/C853 - DA802 - C803 - DA801 - C826 - C854/C853 - IC501(3/2)
[ RX_ROUTE ]
Note:
: inside of Handset

5 Location of Controls and Components

Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Note:
7 Operating Instructions
Note:

8 Test Mode
8.1. Engineering Mode
8.1.1. Base Unit
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{FLASH}
Navigator key/ {CALL WAIT}
? (Volume) key
{OFF}
Dial keypad
H/S LCD
H/S key operation ^
V
Caller List
1). Press .
INT SELECT PLAY
^
V
Initial setting
2). Select "Initial Setting" using {^}or {V}
then press SELECT or {>}.
INT SELECT PLAY
^
V
Select "Set tel line" using {^}or{V}
Set tel line
BACK SELECT
^
See next page
3). Enter "7", "2", "6", "2", "7", "6", "6", "4". V
Note: 7262 7664 = PANA SONI Set dial mode
(see letters printed on dial keys)
BACK SELECT
4). Select "Write EEP" using {^} or{V}
Service Mode
then press SELECT or {>}. Read EEP
Write EEP
BACK SELECT
5). Enter "٨", "٨", "٨", "٨" (Address). (*1)
Set Addr.:
Default Data
6). Enter "㧖", "㧖" (New Data). (*1)

CLEAR M

Set Addr.:
7). Press M , a long confirmation beep
New Data
will be heard.
CLEAR M
8). Press {OFF} to return to standby mode. Set Addr.:
After that, turn the base unit power off and then power on. ____ __
BACK
Note: * To enter "Set dial mode", press SELECT or {>} at " Set tel line".
It is necessary to turn on the power of base unit.
* "Set tel line" isn't appeared at Cell line only mode.
To back normal mode, execute the following procedure:
1 {MENU} i {#}{1}{5}{7}
2 {V}/{^}: Select "off "i {SELECT}
3 {OFF}
Frequently Used Items (Base Unit)
ex.)
Items Address Default Data New Data Remarks

Frequency 00 07 / 00 08 70/02 - - Use these items in a READ-ONLY mode to
ID 00 02 ~ 00 06 Given value - - confirm the contents. Careless rewriting may
cause serious damage to the computer system.
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex) Input Keys Desired Number (hex) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5

8.1.2. Handset
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{FLASH}
Navigator key/ {CALL WAIT}
? (Volume) key
{OFF}
Dial keypad
H/S key operation H/S LCD

^
V
1). Press .
Caller List
INT SELECT PLAY
2). Select "Initial Setting" using {^} or {V} ^

V
Initial setting
INT SELECT PLAY

3). Enter "7", "2", "6", "2", "7", "6", "6", "4". ^
V
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys) Ringer setting
BACK SELECT
4). Select "Write EEP" using {^} or{V}
then press SELECT or {>}. Service Mode
Read EEP
Write EEP
BACK SELECT
5). Enter "٨", "٨", "٨", "٨" (Address). (*1) Set Addr.:
Default Data
CLEAR M
6). Enter "㧖", "㧖" (New Data). (*1)
Set Addr.:
New Data
CLEAR M
7). Press M , a long confirmation beep
will be heard. Set Addr.:
____ __
BACK
8). Press {OFF} to return to standby mode.
After that, remove and reinsert the batteries. Press the Power button for
about 1 second if the power is not turned on.

Frequently Used Items (Handset)

ex.)
Items Address Default Data New Data Possible Adjusted Possible Adjusted Remarks
Value MAX (hex) Value MIN (hex)
Battery Low 00 12/00 13 00 / 00 - - -
Frequency 00 07 / 00 08 00 / 01 - - - (*2)
ID 00 02 ~ 00 06 Given value - - -
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.

9 Service Mode
9.1. How to Clear User Setting (Handset Only)
Handset
Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.

10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
FLOW CHART
Not working
Power ON Base Unit Check Power
OK
Not record (*1)
Record Check Record
OK
Not playback
Playback Pre-Message Check Playback
OK
Link
No link
No charge
Battery Charge Check Battery Charge
OK
OK
Check Link
NG
Range Check the RF part
OK
No voice
Handset Voice Transmission Check Handset Transmission
OK
No voice
Handset Voice Reception Check Handset Reception
OK
Caller ID Error
Caller ID function Check Caller ID
OK
NG
Bluetooth Function Check BT Communication
Cross Reference:
Check Power (P.34)
Check Record (P.35)
Check Playback (P.38)
Check Battery Charge (P.38)
Check Link (P.39)
Check the RF part (P.41)
Check Handset Transmission (P.46)
Check Handset Reception (P.46)
Check Caller ID (P.46)
Check BT Communication (P.47)
Note:
(*1) When a user claims that the unit disconnects a call right
after the greeting message and no incoming messages can
be recorded, this symptom can not be reappeared with TEL
simulator in the service center. In this case, try to change
the Auto disconnect activation time and Vox level.
<How to change the Auto Disconnect activation time
and VOX level> (P.36) item (A) and (B).

10.1.1. Check Power

10.1.1.1. Base Unit
Is the AC Adaptor inserted into AC outlet? (*1)
NO
Is output voltage of AC adaptor 5.5 V? Check AC Adaptor.
YES
NO
Check VDD1(1.8V) :Test point (VDD1) Check Power Supply Circuit.
OK
NO
RSTN: Reset = "High"? Check Reset Circuit.
YES
NO
Check Xtal CLK=10.368MHz? Check X501.
YES
Check BBIC.
Cross Reference: Note:

Power Supply Circuit/Reset Circuit (P.14) BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and
supply voltage of AC adaptor.
(*2) Refer to Circuit Board (Base Unit_Main) (P.81).
10.1.1.2. Handset
Is the battery inserted to BATT+ and BATT-?
YES
NO
Is the voltage of TP-VBAT 2.3 V more? Check the battery and around BATT+ and
BATT- are not shorted.
YES
NO
Is the voltage of TP 3.0 V about 3.0 V?
YES Check Power Supply Circuit/Reset Circuit.

NO
Is the voltage of TP VDDC about 1.8 V?
YES
NO
Check Xtal CLK = 13.824MHz? Check X1, C8, C9.
YES
Check BBIC (IC1).
Cross Reference:
Power Supply Circuit/Reset Circuit (P.22)

10.1.2. Check Record

10.1.2.1. Base Unit
Not record Incoming Message
NO
Check Bell signal. Check Telephone Line Interface
[Bell].
OK
NO
Does the unit catch line? Check Telephone Line Interface
[OFF HOOK].
YES
NO
Check Line In: Pin 25 of BBIC. Check ICM Recording in Signal Route.
OK
Check Auto Disconnect Circuit.

OK
Check Parallel Connection Detection

Circuit.
OK
Check BBIC and Flash Memory.

Signal Route (P.25) Flash Memory is IC601.
Telephone Line Interface (P.16) BBIC is IC501.
Parallel Connection Detect Circuit/Auto Disconnect
Circuit (P.17)

<How to change the Auto Disconnect activation time and VOX level>
A) Auto Disconnect activation time:
Some Telephone Company lines (fiber or cable) ON Hook and OFF Hook voltages are lower than conventional lines, which may
cause a malfunction of Auto Disconnect detection. To solve this problem, try changing the Auto Disconnect activation through
the procedures below.
1) Press "MENU " key at standby Mode and "#" key.
Note: The set must power on and be linked.
2) Press "9", "0", "0", "0"," " .
LCD (H/S)
Service ready
:
BACK
3) Press "7","3","1".
Service ready
:7 3 1
CLEAR
4) Then enter the below last digit;
last digit Auto disconnect & CPC

"0" (*1)
: enable ࡮࡮࡮㨇default㨉
(*1)
Auto disconnect : enable
"1"
CPC : disable
Auto disconnect & CPC

"2" (*2)
: disable
Note:
(*1) Both Auto Disconnect and CPC don't detect for the first 2 seconds.
(*2) If the "Disable" is selected, even if the parallel-connected telephone is OFF HOOK,
the line isn't disconnected.
5) Back to "standby" mode automatically after step 4).

You can hear beep sound which is a confirmation tone.

B) Vox level:
It makes easier to detect a small voice (caller) by raising the sensitivity of VOX level. Therefore, the recording of TAM is not
turned off during a detection.
1) ~ 2) are same as (A).
3) Press "5","1","1".
Service ready
:5 1 1
CLEAR
4) Then enter the below last digit;
last digit default setting

"0"
: normal
"1" 6dB up
5) Back to "standby" mode automatically after step 4).

You can hear beep sound which is a confirmation tone.

10.1.3. Check Playback

10.1.3.1. Base Unit
NO
Check VDD1(1.8V) :Test point (VDD1) Check Power Supply Circuit.
OK
NO
Check output of BBIC (Pin 41,43). Check BBIC and Flash Memory.
OK
Check Speaker and its surroundings.

Power Supply Circuit/Reset Circuit (P.14) Flash Memory is IC601.
BBIC is IC1.
(*1) Refer to Circuit Board (Base Unit_Main) (P.81).
10.1.4. Check Battery Charge

10.1.4.1. Base Unit
Plug in the AC Power source.
Charge Handset on Base Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Base Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at
Base Unit from mechanical point of view.
Cross Reference:
Charge Circuit (P.15)
10.1.4.2. Handset
NO
Is Check Power OK? Check Power of Handset.
YES
NO
Is BBIC (IC1: 34) high at charge state? Check Charge Circuit.
Cross Reference:
Check Power (P.34)
10.1.4.3. Charger Unit

Plug in the AC Power source.
Charge Handset on Charger Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Charger Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at Charger Unit
from mechanical point of view.
Cross Reference:

10.1.5. Check Link

10.1.5.1. Base Unit
Does Base Unit make link with normal working YES

Base Unit is OK. Check Handset.
Handset?
NO
Is the voltage of VDD3 about 3.0V? NO

Check around Power Supply Circuit.
YES
Is the voltage of VDD1 about 1.8V? NO
YES
Does the RF clock (CLK) oscillate at 10.368 MHz in NO Check around X501 and RF module and adjust
Base Unit Test Mode? clock frequency.*2
YES
Check the RF part
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.63) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command “SFR “until the frequency counter becomes13.824 MHZ±55HZ.

10.1.5.2. Handset
Does Handset make link with Base Unit? YES

Handset is OK. Check Base Unit.
(Correct working unit)
NO
Is the voltage of TP VBAT about 2.2~2.8 V? NO Check the batteries.
YES
NO
Is the voltage of TP VDDC about 1.8 V? Check around Power Supply Circuit/Reset Circuit.
YES
OR
Is the voltage of TP 3.0 V about 3.0 V? Adjust +3.0V Vottage to 3.0V *1
YES
Does the RF clock (CLK) oscillate: 13.824 MHz NO Check around X1 and RF module and adjust
in Handset Test Mode? clock frequency. *2
YES
Check the RF part
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.64) for Handset.
*2 How to adjust the frequency of X1:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-57pin).
To adjust frequency, send command “SFR “until the frequency counter becomes13.824 MHz±55HZ.

10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part
1. Prepare Regular HS(*1) and Regular BU(*2).
2. a. Re-register regular HS (Normal mode) to base unit (to be checked).
If this operation fails in some ways, the base unit is defective.
b. Re-register handset (to be checked) to regular BU (Normal mode).
If this operation fails in some ways, the handset is defective.
After All the Checkings or Repairing
1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
START
No Registration of Registration of No
Base unit is defective Regular HS to handset to Handset is defective
base unit Regular BU
Yes Yes
(other checkings)
Registration of Regular HS to Regular BU
Registration of handset to base unit

(checked ones)
Note:
(*1) HS: Handset
(*2) BU: Base Unit

10.1.6.2. RF Check Flowchart

Each item (1 ~ 5) of RF Check Flowchart corresponds to Check Table for RF part (P.43).
Please refer to the each item.
Start
1 2
Link NG Control NG Check BBIC interface parts.
confirmation signal
Normal confirmation (RF Block <->BBIC on BU/HS P.C.B)
OK OK
3
X'tal
NG
Frequency Adjust X'tal Frequency. (*1)
confirmation
OK
4
NG
TX confirmation Check TX Block.
OK
5
Range NG
confirmation TEST RANGE Check.
Normal
OK
GOOD
Note:
(*1) Refer to Check Link (P.39).

10.1.6.3. Check Table for RF part
No. Item BU (Base Unit) Check HS (Handset) Check

1 Link Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link.
2 X'tal Frequency confirmation Check X'tal Frequency. Check X'tal Frequency.
(10.368 MHz ±100Hz) (13.824 MHz ±100 Hz)
HS, BU Mode: [Adjustment]
3 TX confirmation 1. Remove wire antenna 2 and connect 1. Connect spectrum analyzer to TP.(*3)
spectrum analyzer to TP. (*2). 2. Confirm TX power whether satisfied spec.
HS Mode: 2. Confirm TX power whether spec. is Power >=16.0dBm
HS_Burst Mode] (*1) satisfied.
Power >=12.5dBm
BS Mode:
BS_Burst Mode] (*1)
4 Range Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode: [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link. 3. Compare the range of the HS (being
3. Compare the range of the BU (being checked) with that of the Regular HS.
checked) with that of the Regular BU.
Note:
(*1) Refer to Commands (P.59)
(*2) Adjustment Standard (Base Unit) (P.60)
(*3) Adjustment Standard (Handset) (P.62)

10.1.6.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item BU (Base Unit) Check HS (Handset) Check

Range Confirmation TX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(TX Power check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the HS and the Regular BU
HS, BU setting according to CHART1. according to CHART1.
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK. Link OK = TX Power of the HS is OK.
No Link = TX Power of the BU is NG. No Link = TX Power of the HS is NG.
Range Confirmation RX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(RX sensitivity check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the Checking HS and the Reg-
HS, BU setting according to CHART1. ular BU according to CHART1.
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK. Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the BU is NG. No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (to be checked) Regular_HS

TX Power TX Power
BU (Base Unit) TX Power Check Low Hig h
BU (Base Unit) RX Sensitivity Check High Low
HS (to be checked) Regular_BU

TX Power TX Power
HS (Handset) TX Power Check Low High
HS (Handset) RX Sensitivity Check High Low
Note:
(*1) Refer to Commands (P.59).

10.1.7. Registering a Handset to the Base Unit

The supplied handset and base unit arepre-registered. If for some reason the
handset is not registered to the baseunit, re-register the handset.
1 Handset:
{MENU} i # 1 3 0
2 Base unit:
Press and hold MLOCATORN forabout 5 seconds until theregistration tone
sounds.
L If all registered handsets startringing, press {LOCATOR} againto stop, then
repeat this step.
L The next step must be completedwithin 90 seconds.
3 Handset:
Press {OK}, then wait until a longbeep sounds.
Note:
L While registering, “Base in registering” is displayed on allregistered
handsets.
L When you purchase an additionalhandset, refer to the additionalhandset’s
installation manual forregistration.
10.1.8. Deregistering a Handset

A handset can cancel its ownregistration to the base unit, or otherhandsets
registered to the same baseunit. This allows the handset to end itswireless
connection with the system.
1 {MENU} i # 1 3 1
L All handsets registered to thebase unit are displayed.
2 { } : Select the handset you want tocancel. i {SELECT}
3 { }: “Yes” i {SELECT}
4 {OFF}

10.1.9. Check Handset Transmission

Check MIC of handset.
Check handset Tx in Signal Route.
Cross Reference:
Signal Route (P.25)
10.1.10. Check Handset Reception

Check speaker of handset.
Check handset Rx in Signal Route.
Cross Reference:
Signal Route (P.25)
Note:
When checking the RF part, Refer to Check the RF part
(P.41).
10.1.11. Check Caller ID

BASE UNIT
Did bell ring? NO Check bell signal detection in
(Message indicator Telephone Line Interface.
blinks)
YES
Check Calling Line Identification (Caller ID)/

Call Waiting Caller ID.
Cross Reference:
Telephone Line Interface (P.16)
Calling Line Identification (Caller ID)/Call Waiting Caller
ID (P.18)
Note:
• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
• It is also recommended to confirm that the customer is really
a subscriber of the service.

10.1.12. Check BT Communication

Plug in the AC power source and wait
10 seconds.
Operate to enter the menu of "Bluetooth"

by using a handset
Press [MENU] Bluetooth [SELECT]
Is it possible to enter the menu of "Bluetooth"?

NO
YES
Is it possible to register BT_Headset? Check the circuit of around RF parts of BT

NO Module
YES
Check Voice Transmission of the BT_Headset

NG
Check the circuit of around PCM
OK communication of main board and BT
module
Check Voice Reception of the BT_Headset
NG
OK
Refer to Troubleshooting Guide in the

Check ph.book transfer from cell Operationg Instructions.
NG
Unplug/plug in the AC power source again
Check the Check_PIN (PIO01 of IC721) (*1)

...
Continued to the next page.

Cross Reference:
Bottom View (P.82)

...
Case1: OK
AC power on
PIO01
㻍㻍
㻍0.06sec 2.8sec 㻍3.6sec
1.4sec
Case2: NG1(fail to reset BT_IC)
AC power on If BT_IC does not work, 1st and 2nd signals does not
appear.
Check the circuit of around
PIO01 POWER and RESET parts
of BT Module.
㻍
1.4sec
Case3: NG2 (fail to receive of UART signals)
AC power on If BT_IC fails to receive of UART, 2nd signal does not turn
to HIGH.
PIO01
㻍
1.4sec
Check the circuit of around
Case4: NG3 (fail to transmit of UART signals) UART communication (*1) of
main board and BT module.
AC power on If BT_IC fails to transmit of UART, 2nd signal does not turn
to LOW.
PIO01
㻍
1.4sec
still NG
Replace BT module (*2)
Cross Reference:
Schematic Diagram (Base Unit_RF) (P.76)
Note:
(*2) After replacing, need to adjust the frequency of BT.
Refer to Things to Do after Replacing IC or X'tal (P.63)

11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1. Base Unit
Ԙ 4 screws
Ԙ Remove the 4 screws to remove

the cabinet cover.
ԙ Remove the solders.
Cabinet cover
ԙ Solders
Ԛ Remove the screw and pararell wire

to remove the main P.C. board.
Ԛ Pararell wire
Main P.C. board

ԛ 2 screws
ԛ Remove the 2 screws to remove
the Jack holder.
Jack holder
Ԝ Remove the 2 screws to remove Ԝ 2 screws

the operational P.C.B board.
Operational P.C.B board

11.1.2. Handset
Ԙ Remove the 2 screws. Ԙ 2 screws
ԙ Insert a plastic card.

(Ex. Used SIM card etc.)
between the cabinet body Cabinet body
and the cabinet cover, then
pull it along the gap to open
the cabinet.
Cabinet cover
Ԛ Likewise, open the other
side of the cabinet.
Cabinet cover
ԛ Remove the cabinet cover
by pushing it upward.
Ԟ Screw
Ԝ Remove the solders and tape.
Ԝ Solders
ԝ Remove the 2 screws to remove Ԝ Tape

the 2 charge terminals.
Main P.C. board
Ԟ Remove the screw to remove

the main P. C. board.
ԝ 2 charge terminals
ԝ 2 screws

11.1.3. Charger Unit

Ԙ Screw
Ԙ Remove the screw to remove

the cabinet cover.
Main P.C. board

ԙ Solders
ԙ Remove the solders to remove

the 2 charge terminals.
2 charge terminals

11.2. How to Replace the Base Unit LCD

Ԙ Fit the heatseal of a new LCD.
Vertical Interval
Tolerance
0.2mm
New LCD
Horizontal Interval
0.2mm Tolerance
If interval tolerance between center lines
is less than 0.2 mm, it is o.k.
OK
Operational P.C.B.
NG
(Inclined)
ԙ Heatweld with the tip of the soldering
iron about 5 to 8 seconds
(in case of 60W soldering iron).
Tip of Soldering Iron

(Part No. PQZZ430PIR) NG
(Vertical interval tolerance is
more than 0.2 mm.)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
NG
(Horizontal interval tolerance is
more than 0.2 mm.)

Ԛ Attach the LCD and fix by hook A (two points).

11.3. How to Replace the Handset LCD

Note:
The illustrations are simplified in this page.
They may differ from the actual product.
P. C. board
Vertical Interval
Tolerance
Peel off the FFC (Flexible Flat Cable) from

the LCD, in the direction of the arrow. Take 0.2 mm
care to ensure that the foil on the P.C. board
is not damaged.
Horizontal Interval
0.2 mm Tolerance
If interval tolerance between center lines
is less than 0.2 mm, it is o.k.
New LCD
OK
Fit the heatseal of a new LCD.
NG
(Inclined)
Tip of Soldering Iron

(Part No. PQZZ430PIR)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
Heatweld with the tip of the soldering
iron about 5 to 8 seconds NG
(in case of 60W soldering iron).
(Vertical interval tolerance is
more than 0.2 mm.)
NG
(Horizontal interval tolerance is
more than 0.2 mm.)

12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.33)
12.1. Equipment Required

• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

<Preparation> Note:
• Serial JIG cable: PQZZ1CD300E* *: If you have the JIG Cable for TCD500 series
• PC which runs in DOS mode (PQZZ1CD505E), change the following values of
• Batch file CD-ROM for setting: PNZZTG7741M resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
Resistor Old value (kΩ) New value (kΩ)

R2 22 3.3
R3 22 3.3
R4 22 4.7
R7 4.7 10
12.2.1. Connections (Base Unit)

Connect the AC adaptor.
Connect the JIG Cable GND (black).
Connect the JIG Cable RX (red) and TX (yellow).
To Serial Port
(COM port 1*)
3 UTX (yellow)
3 URX (red)
UTX URX 2 GND (black)

GND
JIG Cable PC
Base unit P. C. board

Note:
*: COM port names may vary depending on what your PC calls it.

12.2.2. Connections (Handset)

Connect the DC Power or Battery to BATT+ and BATT-.
Connect the JIG cable GND (black) to GND.
Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
3 URX (red)
To Serial Port
URX UTX
3 UTX (yellow)
(com port 1*)
2 GND (black)
GND
DC Power
1 BATT+ BATT-
or Battery
JIG Cable
PC
Handset P. C. board
Note:
*: COM port names may vary depending on what your PC calls it.

12.2.3. How to install Batch file into P.C.
1. Insert the Batch file CD-ROM into CD-ROM drive and

copy PNZZTG**** folder to your PC (example: D drive).
<Example for Windows>
2. Open an MS-DOS mode window. On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
3. At the DOS prompt, type "D:" (for example) to select the
drive, then press the Enter key.
<Example>
4. Type "CD 㪳PNZZTG****", then press the Enter key.
5. Type "SET_COM=X", then press the Enter key C: >Documents and Settings>D:
(X: COM port number used for the serial connection on your PC). D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
6. Type "READID", then press the Enter key. 00 52 4F A8 A8
䊶If any error messages appear, change the port number or D: >PNZZTG****>DOSKEY
䇭check the cable connection. D: >PNZZTG****>
䊶If any value appear, go to next step.
7. Type "DOSKEY", then press the Enter key. <Example: error happens>
C: >Documents and Settings>D:

D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
‫ޓ‬CreateFile error
ERROR 10: Can't open serial port
D: >PNZZTG ****>
Note:
• “*****” varies depending on the country or models.

12.2.4. Commands
See the table below for frequently used commands.
Command name Function Example

XBT 0 Base unit only. Type "sendchar XBT 0".
For excluding failure of command
response.
Please send this command at first
before other command is executed.
*However, if you want to execute "#X"
command
then DO NOT USE this command.
rdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
readid Read ID (RFPI) Type “readid”, and the registered ID is read out.
writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
hookoff Off-hook mode on Base Type “hookoff”.
hookon On-hook mode on Base Type “hookon”.
getchk (Base unit) Read checksum Type “getchk”.
How to use of 1.rdeeprom Read EEPROM Type “RdEeprom 03 7D 04”, and the data from address
"getchk" "03 7D" to "03 80" is read out
in Handset *This command gets 4 byte "WW", "XX", "YY", "ZZ".
*Please NEVER forget these 4 byte data!
2.sendchar epw Write EEPROM Type “sendchar epw 03 7D 04 FF FF FF FF”
3.sendchar RST Reset baseset Type “sendchar RST”
4.getchk Read checksum Type “getchk”.
5.sendchar epw Write EEPROM Type “sendchar epw 03 7D 04 WW XX YY ZZ”
*"WW", "XX", "YY", "ZZ" is 4 byte data that already read
from same address.
wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
hs_burst Handset outputs RF power in burst test Type"hs_burst"
mode
bs_burst Base unit outputs RF power in burst Type"bs_burst"
test mode on antenna 2
tx_high Keep TX power high Type"tx_high"
tx_low Keep TX power low Type"tx_low"
How to using "#X" command for base unit

XBT Enter this command before using Type "sendchar XBT 1" and then "OK" is back when it
following command "#X", "bs_burst", succeeds.
tx_high" "tx_low" for Base Unit. (caution)
Before entering this command, wait 10 seconds after
power on the base unit
#X Read and Write BT parameters [Read MAC address]
Type"sendchar #X sme" and MAC address is read out
(Attention) (exp. sendchar #XXsme 0080 F08C FFD1)
When type "sendchar #X" command, must be [Write MAC address]
the "X" must be capital Type"sendchar #X sme **** **** ****" and
letter. (note) part of **** should be set correct MAC address
[Read the data of crystal of BT]
Type"sendchar #X nc" and adjustment parameter of
crystal
of BT is read out
(exp. #XXnc=0x1D)
[Write the data of crystal of BT]
Type"sendchar #X nc **" and adjustment parameter of
crystal
of BT is read out
(note) part of ** should be set the adjusted value.
Note:
For the command related with BT XBT and #X, the example of this, refer to Things to Do after Replacing IC or X'tal (P.63)

12.3. Adjustment Standard (Base Unit)

When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View
PC
UART
Oscilloscope
JIG
GND UTX URX
R737
C552
BT_IO1
BT_IO2
RA501
R731
R732
UTX URX C721
R738
RA721
C521 R733 Q732
ANT1_TP
C346
C731
Spectrum Analyzer DC
GND
Q731
R735 R736
ANT2_TP
BTSPI_MISO
GRY
BTSPI_CLK
BTSPI_CSB
BTSPI_MOSI
BT_UTX
BT_RTS
DCP
C301 ANT_C3
BT_GND
PUR DCM BRN
F301 R721 L1R
DC 3.0A +5.5V TEL
R654
5.5V TP_ANT_BT
PNLB2017Z
R657
KX-TG774x/773xH
L1T YLW
R655
R656
R751
Q652
Q653 -LV
Spectrum Analyzer L661

IC611 C115
C103
C663
L665
C662
R115
C106
C105
R611
R101
JTAG
R612
C664 C611
C602
PbF
C666
L664
R605
R606 SPN ORG

R613
C665
C104
R601
Volt
8
R607
C603
RSTN Q155
R155
R602 R312 C809 SP
L663
Q601 R156
Meter
R102
C515
L662
Q302
C167 R157
R671
SPP
C517
IC601 C312
C514 BLU
R106
R104
R162 Q161
IC502 R165
R166
R673
VDD4 VDD2
D153
R603
R604
C184
C171
Oscilloscope
R161
C163
C165
R164
R511 C601
C108 C181 TP9 C173
C518R507 R107
C113
R672
C505 R311 C111 TP10
C510
STM/CKM/P15
R103
C509
R167
R163
VDD5R517
R451
R105
C501 R112
R151
D472
D473
C168
R515 VDD1 Q301

C152
R111
C519
R152
C107
R502
R516
C477
C478
C311
D133
D361
VDD3
C351
MIN MIP C455 CHARGE+
RA451
CHARGE-
C452
C451
C479
C454
ORG
BLU
C476
CHG A
STM/CKM/P15
Audio Frequency
Frequency Counter (*1) MIC
OSC
Send command "SFR", then

the frequency output on this TP.
Oscilloscope (*2)
Start Monitor
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.43)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.14)

12.4. Adjustment Standard (Charger Unit)

12.4.1. Bottom View

Digital
Volt Meter
Charge+
Charge-
12 /2 W
PNLB2081Z -IG
PbF
D1
F1
R2
R1
A
(GND)
DC POWER
DC 5.5 V

12.5. Adjustment Standard (Handset)

12.5.1. Component View

LED11 LED10 LED12
Connect between ANT-Short and ANT-Short GND.
ANT_Short-GND
Oscilloscope
R50
R49
R51
C38
ANT_Short
Gr
VOLT METER
ee
ANT_TP
n
C801 OTP C92 C91 C93
40
R
ANT
RESET
VE
SCL
R91
I
CS
CE
Or
RE
an
CD SID
ge
2
C4
C70
PbF
C71
Spectrum Analyzer
D21
D22
Bl
ue
D
LE
W
C897
Or
7
C804
C7
an
ge
C803
0
C76
R7
C802
Q5
C825
DA
R806
8 C814 C81
C812
01
L8
C8
C22
09
11
C826 C863 C44
C25
C822 C820C813 C810 C23
C52
C46
R807 C805 C24 C24

C806
R1
ATSTP
C43
CKM/STM
GND_J
C53
C68
CKM/STM
C99
X1
RSTN TDI C45
R69
C98
R66
TCK C17
IC1
R67
the frequency output on this TP.
* Send command "SFR", then
C1 C21
TEST
RTCK
TMS
8
R24
Frequency Counter (*1)
R68
RA5 TD0
C40
C2
C69
ATSTN
9
Oscilloscope (*2)
E_WP
C2
E_SDA
E_SCL
C3C3
0
* Start Monitor
1
C3
C34
2
C4
IC3 C96 C97

1
C51 L3
C39
L9
C16
R31
C36
C33
R21
R22 C14 R25
RA4 C89
C60
C59
Oscilloscope
C13
R26
3.0V C88
VBAT_MON
C80
R60 R33
C11
VBG/CHG_MON
R28
VDDC C79 R34

R27
C12
R23
C37
Q6
C3
C2
C1
RA1 RA3 RA2
L5
L4
C7
C4
VOLT METER
NE
Bl
ue
HO
-P
SP
150
Or
an
ge
C72
C73
D14
D13
MIC+ +47
MIC Load
SPM MIC+
1.1 kHz
OSC
PNLB2012Z -PA +
C85
C84 L75
L8
SPP MIC- MIC- 47
L1
C56
CN4
IC4
C57
Q3 Q4 Q2 C32 R80
C82
C58
L7
C83 C87
L6
R2 L10
CHG_DET
R8 C27 URX UTX

CHG_CTRL
R6
C8
R9
GND
DC POWER SUPPLY
C10
C9
Q9
C90
F1
C15 VBAT GND

R4 C35
2.6 V 2.34 V
R7 C6
R45 BAT- VBAT
CHG-
BAT+
CHG+
DC VOLT METER
D3
R73
C28
D4
R74
R3 C5 A
CHG (+) CHG (-)
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.43)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.22)

12.6. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.6.1. How to download the data

12.6.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG (P.56).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

BBIC(IC501) Programming data is stored in memory. 1) Clock adjustment: Refer to Check Point (H).(*2)
EEPROM (IC611) Adjusted parameter data is stored in memory. 1) Change the address “0001” of EEPROM to “55” to download
(country version batch file, default batch file, the data.
etc.) 2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TG7731US_US_RevXXX_YYY.bat”. (*1)
4) Clock adjustment
FLASH1 (IC601) Voice prompt data is stored in memory. 1) Wait more than 15 seconds after connecting the JIG Cable.
(vary depending on country version) 2) Execute the command “VPDL2011 -AA ZZZ.bin” (*1).
(writing time: approx. 1 min (115200 bps).)
FLASH2 (IC502) Program D/L 1) Make sure to connect the JIG cable and disconnect the DC
Power in order to download the data.
2) Execute the command “flw441 *********.hex”.
3) Connect the DC Power.
4) Press the PC Enter key once.
5) After a few minutes, “Successful upgrade” is displayed on the
PC indicating downloading has finished.
6) Detach the JIG cable, then disconnect the DC Power.
7) Connect the DC Power.
8) Connect the JIG cable again, and execute the command
“getchk”, then confirm the checksum value is correct.
. If the downloading fails, start again from step 1).
9) Default batch file: Execute the command “default.bat”.
“TG7731US_US_RevXXX_YYY.bat”. (*1)
11) Clock adjustment: Refer to Check Point (H). (*2)
X'tal (X1) System clock Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 5.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(10.368MHz ± 41Hz).
4) If the frequency is not 10.368MHz ±41Hz, adjust the
frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 10.368MHz ±5Hz.
Note:
(*1) XXX_YYY: revision number, ZZZ:Voice prompt, AA: Baud rate(9600/19200/57600/115200)
"XXX_YYY and "ZZZ" vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The
Setting Method of JIG (P.56).
When adjust the frequency the BT Unit or write the MAC address to the BT Unit.
Item Test command Description

Input Echo back
1 Power on - - Wait 10seconds and connect JIG
2 Test mode sendchar XBT 1 OK Enter"XBT 1" and then "OK" is back
#XXTEST when it succeeds to enter test mode.
sendchar #X ts
3 Confirm a default value sendchar #X nc #XXnc=0x1A Confirm a default value before adjusting the
frequency.
4 Adjust the frequency sendchar #X b3 39 19 #XXTS ch=2441 pwr=19 Adjust the frequency to "2441MHz ± 10kHz" by
changing the value of,
sendchar nc,
#XXnc=0x, Test Point: ANT-C3, refer to Bottom View
(P.82)
Note:
: Enter key

12.6.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG (P.56).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC3) Adjusted parameter data is stored in memory. 1) Default batch file: Execute the command “default.bat”.
(country version batch file, default batch file, 2) Default batch file (remaining): Execute the command
etc.) “TGA470US_DEF_RevXXX_YYY.bat”. (*2)
“TGA470US_US_RevXXX_YYY.bat”. (*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
X'tal (X1) System clock 1) Apply 2.6V between BATT+ and BATT- with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the fre-
quency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 5 Hz.
Note:
(*2) XXX_YYY: revision number
"XXX_YYY" vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.56).

12.7. Frequency Table
Ch. (hex) TX/RX Frequency (MHz)

Channel 0 00 1928.448
Channel 1 01 1926.720
Channel 2 02 1924.992
Channel 3 03 1923.264
Channel 4 04 1921.536

12.8. Bluetooth Frequency Table
Ch. Frequency (MHz) Ch. Frequency (MHz) Ch. Frequency (MHz)

0 2402 33 2435 66 2468
1 2403 34 2436 67 2469
2 2404 35 2437 68 2470
3 2405 36 2438 69 2471
4 2406 37 2439 70 2472
5 2407 38 2440 71 2473
6 2408 39 2441 72 2474
7 2409 40 2442 73 2475
8 2410 41 2443 74 2476
9 2411 42 2444 75 2477
10 2412 43 2445 76 2478
11 2413 44 2446 77 2479
12 2414 45 2447 78 2480
13 2415 46 2448
14 2416 47 2449
15 2417 48 2450
16 2418 49 2451
17 2419 50 2452
18 2420 51 2453
19 2421 52 2454
20 2422 53 2455
21 2423 54 2456
22 2424 55 2457
23 2425 56 2458
24 2426 57 2459
25 2427 58 2460
26 2428 59 2461
27 2429 60 2462
28 2430 61 2463
29 2431 62 2464
30 2432 63 2465
31 2433 64 2466
32 2434 65 2467

13 Miscellaneous
13.1. How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description is only applied on the model with Shield case.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 °F ± 68 °F (320 °C ± 20 °C)
13.1.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.1.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P.C.Board.
IC
P.C.Board
Hot Air Desoldering Tool
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
Tweezers, etc.
IC
P.C.Board
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
Hot Air Desoldering Tools

P.C.Board
3. After removing the IC, clean the P.C.Board of residual solder.

13.1.4. How to Install the IC

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
Soldering Iron
Land
Solder
P.C.Board
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.
Note:
• When placing the IC, the positioning should be done very carefully.
IC
Soldering Iron
Land
Solder
P.C.Board
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.
Note:
• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
IC
P.C.Board
Hot Air Desoldering Tool
4. After soldering, confirm there are no short and open circuits with visual inspection.

13.2. How to Replace the Flat Package IC

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.5)
13.2.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.

13.2.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.2.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

13.3. Terminal Guide of the ICs, Transistors and Diodes

13.3.1. Base Unit
4 5 9
1 8 16
(Reverse View)
1 48 25 4 8
2 24 1 1
49
3
PNWI1TG7731H
72 1
73 96 PNWI2TG7741H
C0DBEYY00102 C1CB00003663 PNWI3TG7741H C0JBAQ000247 B1ACGP000008
C Cathode
4
5
B Anode
E 3
E C 1 2
B
B1ABDM000001
B1ADGE000012
2SC6054JSL DSC7003S0L PSVTUMG11NTR PQVDMD5S DA2J10100L
Cathode Cathode
Cathode Anode (Reverse View)

Anode Anode
Anode
Cathode
B3AAB0000347
PQVDPTZT2530 B0ECKM000008 B0DDCD000001 LNJ237W82RA B3ABB0000331
13.3.2. Handset
C
(Reverse View) 8
5 654
88 67 B
66 3
1 4 1 2 E
1
22 45
B1ADCF000040
23 44 DRC9113Z0L
C2HBCY000081 PNWITGA470BR C0DBZYY00357 2SC6054JSL B1ABGE000011
Cathode Cathode
(Reverse View)
Cathode
Anode
Anode Anode
B0BC4R3A0006 B0DDCD000001 B3ACB0000190
13.3.3. Charger
Cathode
Anode
B0ECKM000008

14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
Important Safety Notice:

Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
Important Safety Notice:

Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.

Memo

14.2. Schematic Diagram (Base Unit_Main)

+3.0V
C751
0.1u
180k
NC
1k
IC751
R754
R751
R752
SP_LED 1 QB VCC 16
BT_HS_LED(R) 2 QC QA 15
BT_HS_LED(G) 3 QD SPI2_DO
SI 14
CELL1_LED(R) 4 QE R753
*RCLR 13
CELL1_LED(G) 5 QF NC IO_LE
RCK 12
CELL2_LED(R) 6 QG SPI2_CLK
Q653 SCK 11
CELL2_LED(G) 7 QH IO_CLR
5 C1 B1 1 BT_HS_LED(R) *SCLR 10
8 GND QH’ 9
*WBX02 13pin E2
PARALLEL WIRE 4 C2 B2 3 BT_HS_LED(G) (1)
+3.0_CP2
2
1
*RA451
AP1
NC
+3.0_CP2
3
4
RA653 1k
*C458 NC
10k
R658 MIN
8
7
6
5
16
SP Phone Tx
C456
R657 680
NC
CELL1_LED(R) 1.2k
R656 100 Q654
1
2
3
4
BT_HS_LED(G)
R665
MIP
R655 680 *C457 NC
SP Phone Rx
*C455
*C454
BT_HS_LED(R)
MSG_LED
NC
NC
MSG_LED MIP MIN
ANS_LED
ANS_LED
LCD_BLT
LCD_BLT
2
1
L661 NC
*RA452
LCD_GND
LCD_RST
NC
LCD_RST SPN
L665 NC LCD_CS
LCD_CS
L664 NC LCD_CD
3
4
LCD_CD SPP
L662 NC SPI2_DO
C478 10p
C477 10p
D473 NC
D472 NC
LCD_SID *C459
A K
A K
C475 R475
C474 R474
L663 NC SPI2_CLK
C479
C476
+1.8V
150p
150p
LCD_SCL
1
C473 10p NC 10p
LCD_VDD C460
*R659 NC KEYIN6
KEYIN6
2200p
2200p
*R660 NC KEYS_A C472 10p
KEYS_A
47k
47k
47k
C506
560
KEYS_B +3.0V C461
+3.0_CP2 2.2u 10p
NC
NC
NC
NC
NC
NC
NC
R515
R516
R517
Q652
3.3k
R668
C661
C662
C663
C664
C665
C666
C667
C668
0.1u
1k
5 C1 B1 1 CELL1_LED(G) KEYS_F
KEYS_E
KEYS_D
33 R123
40 R502
E 2
4 C2 B2 3 CELL1_LED(R) VDD4: 3.0V VDD4
48
47
46
45
44
43
42
41
39
38
37
36
35
34
+3.0_CP
C507 1u
VDD5: 3.0V
CP_C1x
CP_VBAT1
P4_7
P4_6
P4_5
DP0/PAOUTn/P3_0
VDD_PA
DP1/PAOUTp/P3_1
P1_7/CHARGE
CHARGE_CTRL
MIC2p
MIC2n
SOCn
SOCp
NTC/ADC2
ADC1/INT0/P1_0
Q651 MODEL VDD5 +3.0_CP2
5 C1 B1 1 CELL2_LED(R)
R507
CP_C2x
100k
*R511 1k 49
+3.0V
C508
C509 2.2u 50 CP_C1y
E 2
1u
C510 NC 51 CP_VBAT2
16 CP_C2y
R654 100 4 C2 B2 3 CELL2_LED(G) C511 1u 52
CELL1_LED(G) 53 CP_VOUT1
R653 680 C512 NC
CELL2_LED(R) RA652 1k 54 CP_VOUT2
R652 100 1 8 KEYIN4 CHARGE_DET
CELL2_LED(G) 55 PON/P1_6
2 7 KEYIN3 C505 0.1u
KEYS_E STM/CKM/P15 56 VDD2
3 6 KEYIN2 R508 10
KEYS_C 57 P2_7/BXTAL
4 5 KEYIN1 KEYS_C
KEYIN1 58 P1_5/INT5/RDI/VDDE
KEYIN6
KEYIN2 RA651 1k 59 P1_4/INT4/TDOD
KEYIN3 1 8 KEYS_F
KEYS_E
KEYIN5
LCD_BLT 60 P1_3/INT3/SIO IC501
P0_3/SCL2/URX2
P0_2/SDA2/UTX2
2 7
P0_1/URX/PWM0
KEYS_D 61 P1_2/INT2/SK
3 6 KEYS_D KEYS_A
LED_VDD 62 P1_1/INT1/LE
4 5 KEYS_C KEYIN4
KEYIN4 63 P2_6/WTF_IN
KEYIN3
P2_5/PCM_FSC/SF P0_0/UTX
KEYIN5 64 P5_0
*R661 NC KEYIN5 KEYIN2
KEYS_F 65 P5_1
*R651 NC KEYIN1
P2_4/SCL1/PCM_DO/DP3
SP_LED
P2_3/SDA1/PCM_DI/DP2
P5_2
P2_2/PCM_CLK/CLK100
P2_1/ECZ2/PWM1/LED4
P2_0/ECZ1/PWM0/LED3
IO_LE 66
MICP MIP 67 P5_3
SP_LED IO_CLR
MICN MIN 68 P5_4
SPI_DI
1 *Q655 SPI_DO 69 P0_7/SPI_DI/PWM1
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC P0_6/SPI_DO
WLED_CUR_0
WLED_CUR_1
WLED_CUR_2
SPI_CLK 70
TAM_CSn 71 P0_5/SPI_CLK
C651
C657
C655
C652
C653
C654
C656
C658
C659
C660
*WBX01 13pin 72 P0_4/SPI_EN

+3.0V R671 47k +1.8V
RSTn
JTAG
R672 47k
P5_5
PARALLEL WIRE
R673 47k
R732 R731
R737 R733
R738 R735
AP1
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
180k 120k
22k
47k
NC
C731
0.1u
+3.0V
(2)
BT Headset Rx
R736
33k
NC
C513
Cell Phone Tx
1k
0.1u
BT_UTX
BT BLOCK
ANTENNA-BT ANT_BT Q731 Q732
R505
R791
RSTN
R781 BT_URX
0
NC
TP_ANT_C3 BTSPI_CLK RA501
BTSPI_MISO URX
1
ANT_C3 3 2
C782
C781
BT_SPI
PCM_FSC
MSG_LED
PCM_CLK
ANS_LED
NC
NC
BTSPI_CSB
PCM_DO
4 1
BT_RST
PCM_DI
BTSPI_MOSI UTX 220
2
BT Headset Tx
SDA2
SCL2
C521
C522
NC
NC
BT_GND
Cell Phone Rx GND (3)
+3.0V R506 +3.0_CP2
23
22
21
20
19
18
17
16
+3.0V JTAG
100 (4)
GND11
GND10
GND9
GND8
RF
GND7
GND6
GND5
C721
0.1u +3.0_CP2 IC611
R721
470k
C611
0.1u
BT_IO1 PIO1 64K EEPROM

24
BT_IO2 10k 1 A0
25 PIO2 GND4 15 BT_RST R606 R607 VCC 8
26 GND12 RESETB 14 2 A1
VCC SPI_CLK Q601 R605 10k WP 7 (5)
27 13 TAM_WP
28 GND13 IC721 SPI_MISO 12 BT_UTX BT_URX 3 A2 SCL 6 (6)
2.2k
C603
0.01u
C602
29 USB_D+ SPI_CSB 11
NC
4 VSS SDA 5
30 USB_D- SPI_MOSI 10 BT_UTX (7)
PCM_IN TX
PCM_SYNC
31 9
3.3k
560
560
560
+3.0V IC601
PCM_OUT
BT_RTS
C601
32 PCM_CLK RTS 8
0.1u
BT_CTS
1 8
GND1
GND2
GND3
*CS VCC
CTS
R604
R603
R602
R601
2 DO/IO1
RX
7
*HOLD/IO3
RA721
8
7
6
5
3 6 SPI_CLK
1k
*WP/IO2 CLK
1
2
3
4
5
6
7
4 5 SPI_DO
1
2
3
4
BT_URX GND DI/IO0
PCM_DI 16M FLASH SPI_DI

PCM_FSC TAM_CSn
PCM_CLK
PCM_DO
BT Headset Rx
Cell Phone Tx
BT Headset Tx
Cell Phone Rx

Q141 REFERENCE
R160
E
1XX : TEL LINE
910 3XX : POWER, CHARGE
C161 R159
R162
4XX : MIC, SP
47k
R165 27k
NC
B
Q161 5XX : BBIC
C R141
C164
B 6XX : FLASH, EEPROM, KEY, LCD
10M
10u
NC
NC (3216)
C167
2.7k (3216)
E 7XX : FOR DK/BT
C142 K0.01u
100k
R155
D142 30V
8XX : RF
R142
C165 NC
D143 NC
C163 NC
R131
A K
TP9
Rx C173 R164 R161
8.2k
0.1u 2.7k 100k
C101 680p
4700p
C171
R163
12
R151
R166
Q155 Q142 D101
B C L101 NC L1T
C132 K0.01u
0.01u
NC
470k
100k
R133 150k
NC
2. 2u
NC
3 2
R144 10k
R145 2.2k
E (YELLOW)
R167 27
SA101
2
SA102
300V
NC
4 1
(1)
C152
R152
R157
R156
C168
1
C102 680p L102 NC L1R
TP10 P101 22 (GREEN)
Tx C184 C115
2
SA103
1u NC
C186
C181
NC
10p
NC
R115 GAP
1
NC
C107 R103 R101 C103
+1.8V
0.01u 180k 4.7M 0.01u
R105 1M C105 680p
D153 NC
A K
K
D133
*C451 NC C108 R104 R102 C104
*C452 NC VDD1: 1.8V DCP: 5.5V
A
*R451
0.01u 180k 4.7M 0.01u

NC
+5.5V !
R106 1M C106 680p +5.5V
F301
VDD1 +1.8V +3.0V 3.0A DCP
R178
Q301
(0.5W) (0.5W)
3.3k
R371
C306
C301
NC
NC
1
+3.0V
R311
10p
C174 2200p
0.1u
10k
C311
C109
C519
R372
1u Caller ID
32 R122 1k
C172 10p
1
820p
C112
DCM
R702
10k
R125 270 R109
82k
*R373
D362
K A
NC
R111 3.9k
31
30
29
28
27
26
25
C110 820p
CHARGE_DETR703
C123 10p
C124 10p
C125 10p
0.033u NC
R112
120K
C111
R110
*Q701
ADC0/P3_3
LDO_CTRL
AVD
ONE_CELL
LSRn
LSRp
VREFm
MICh
82K
1k
CHG+
C113 CHARGE+
*R701
CIDOUT/MICn 0.082u NC
24 *Q702
CIDINn/MICp 23
A K
R108 1k NC
Bell
D361
C351
VREFp From Handset
C701
NC
22
1u
R107
NC
CIDINp/P3_2 1k
21 CHARGE-
RINGp/P3_7 20
RINGn/P3_6
RINGOUT/RINGING/P3_5
19 VDD3: 3.0V
18 R121 1k
PARADET/P3_4 17 LCD_CS
P4_4 16 SPI2_CLK
P4_1/SPI2_CLK 15 VDD3 +3.0V +5.5V
EEP_WP
P4_0/SPI2_EN 14 C504 0.1u
IC501 VDD1
RF_SUPPLY1
13 C503 10p
+3.0V
AVD_XTAL
12 C502 1u IC302
11 2 OUT1 IN 3
XTAL1 10
XTAL2 C520 NC 4 OUT2
9
R322
0.1u
AVS_XTAL
100
NC
10p
8 R501 F56k ADJ
NC
1u
3 1
REF_RES IC501
C341
330u
7 R891 220 10.368M C501 1
0.1u
RFP0 6 X501 2
C343
C322
RFP1
C321
5 132 VSS/GNDplane16
C346
C342
VSS_LNA2
R321
RF_SUPPLY_PA
VSS/GNDplane15
140
4 131
RF_RXp VBAT 110
LDORF_CTRL
3 VSS/GNDplane14
RF_SUPPLY2
128
RF_RXn 2 VSS/GNDplane13
127 ULP_XTAL
VSS_LNA1 1 VSS/GNDplane12 117
124
VSS/GND
ULP_VBAT
from Handset
RF_TXn
RF_TXp
VSS/GNDplane11 116
RFP0n
114 ULP_PORT
VDD3
RFP2
113 VSS/GNDplane10 118

ANT1 ULP_MAIN_CTRL 115 QSPI_SCK
112 VSS/GNDplane9
RXON VSS/GNDplane8 QSPI_SCK
106 QSPI_IO3
89
90
91
92
93
94
95
96
133
RF_RXp 120
105 VSS/GNDplane7 QSPI_IO3 119 QSPI_IO2
(2) RF_RXn
TXON
C516
VSS/GNDplane4 QSPI_IO0
0.1u
102 121 QSPI_CS

RF_TXp VSS/GNDplane3 QSPI_CS
99 125
RF_TXn VSS/GNDplane2 LCD_CD
R892 220 98 P5_7
10k
ANT2 VSS/GNDplane1 130 LCD_RST

C514 NC 97 P5_6
+2.4V VDD2 129 TAM_WP
C515 NC P4_3/SPI_DI
to Handset 101
R312
+3.0_CP P4_2/SPI2_DO 100

SPI2_DO
DC_SENSE 107
Q302 DC_I
C312
VDD2: 2.5V 108

1u
+3.0V DC_CTRLN 111

122 VDDIO DC_CTRL 109
C517
0.1u
(3)
+3.0_CP
(4)
3.3k
3.3k
10k
C518
IC502
0.1u
16M FLASH
HAK_CL1
QSPI_CS 1 *CS 8
R611
R612
R613
VCC
QSPI_IO1 2 SO/SIO1 7 QSPI_IO3
EEP_WP
(5) QSPI_IO2
NC/SIO3
3 *WP/SIO2 6 QSPI_SCK
(6) SCL2 SCLK
SDA2 4 GND SI/SIO0 5 QSPI_IO0
(7) GND
NC: No Components
KX-TG7731/7732/7733 SCHEMATIC DIAGRAM (Base Unit_Main)

14.3. Schematic Diagram (Base Unit_RF)

ANT_1
ANT_2
ANT1_TP ANT2_TP
2
GND
GND
1
C851 C853
10p 10p
C843
C844
C854
C850
NC
NC
NC
NC
GND GND GND GND
W 0.15mm
2
W 0.15mm L 22+/-4mm
GND L 22+/-4mm 1st or 4th layer GND
1st or 4th layer
3
DA802
100p C855
C857
10p
C858 10p
C856
100p
C841
1p
GND GND GND GND
W 0.15mm
L 20+/-2mm
ANT1
ANT2
GND GND 3rd layer
R807
RXON
220
C822
C823
100p
10p
C826 GND GND
10p C863
C837
0.9p
RF_RXn
7p
C820
0.7p
from Handset
GND C864
RF_RXp
7p
2
C803
3 W 0.125mm
+3.0V GND
1.5p 1 L 7.6mm
DA801 Gap 0.125mm
C804
C802
1.8p
1.8p
1st layer
C809
C811
10p
10p
GND GND GND GND
W 0.15mm BPF W 0.15mm GND GND

L 5.0mm L 5.0mm Pre-matching to Handset
W 0.15mm
1st layer 1st layer L 20+/-1mm RF_TXp
3rd layer
C810
L803
L802
5.6n
C805
5.6n
3.3p
1p
RF_TXn
C814 R801 C812
10p 18 NC GND GND
C813
R803
R802
1p
NC
NC
C806
3.3p
GND GND
R806 GND
TXON
220
C825
10p
W 0.15mm
L 20+/-2mm
3rd layer GND
ZA1 NC
10 9 8 7
11
6
12
1 2 3 4 5
GND
NC: No Components
KX-TG7731/7732/7733 SCHEMATIC DIAGRAM (Base Unit_RF)

14.4. Schematic Diagram (Base Unit_Operation)

R901 270 LED905
R902 270 LED906
13 *LED911 RED R903 270 LED907

CELL1_LED(R) K A
*LED916 GREEN R904 270 LED908
BT_HS_LED(G) K A
*LED915 RED
BT_HS_LED(R) K A
10 LED902 RED
MEG_LED K A
LED901 RED
ANS_LED K A
LCD_BLT CN901
10pin:TG4731 LCD_GND GND 1

GND
13pin:TG7731 GND
C901 1u 2
VG
LCD_RST GND 16V
3
/RSTB
LCD_CS
4
/CSB
LCD_CD 5
VSS
C903
6.3V
1u
GND 6
LCD_SID A0
7
SDA
LCD_SCL
8
SCLK
LCD_VDD 9
VDD1
1
10
VDD2
C902 1u 11
13 *LED912 GREEN V0
CELL1_LED(G) 25V
K A 12
XV0
*LED913 RED
CELL2_LED(R) K A
*LED914 GREEN
CELL2_LED(G) K A
10
KEYS_E
KEYS_C
ERASE UP ANS
1 2 1 2 2 1
KEYIN1
10pin:TG4731
13pin:TG7731 KEYIN2
MSG4
1 2
KEYIN3
KEYS_D MSG3
1 2
VLED
MSG2
1 2
NC3
RPT MSG1 SKIP
NC2
1 2 1 2 1 2
NC1
1 STOP DOWN LOCAT/INT
1 2 1 2 1 2
PCB
FOR TG773x,TG473x
CT2 CT1 CARBON_TEST
NC: No Components
KX-TG7731/7732/7733 SCHEMATIC DIAGRAM (Base Unit_Operation)

14.5. Schematic Diagram (Handset_Main)

Charge Current
VBAT VBAT
!
F1
BAT+
2.5A
220u
220u
220u
C10
39p
C1
C2
C3
39p
NC
39p
C4
C7
NC
C8
C9
(1608)
0.1u
C90
6.3
6.3
6.3
GND GND GND GND GND GND GND GND
BAT-
R45
Battery C15
39p
0.1
CHG_CUR
GND When on Charge CP3V
C69
0.1u
8
7
6
5
RA5
3.3k 8 1
VCC A0
EEP_WP EEP_WP E_WP
1
2
3
4
Q2 C27 7
WP A1 2
1s EEP_SCL EEP_SCL E_SCL
6
32K 3
1000p SCL A2
R2 EEP_SDA EEP_SDA E_SDA
5 4
CHG+ SDA VSS
30k
30k
R9
R8 *IC3 GND
CHG+
3.3
Q3 * Start Monitor
CHARGE
47k
R4
100k
* When "SFR" command

K0.1u
1.5k
R3
R7
Terminal
C5
TO RF BLOCK
CHG- Q4 is executed, 13.824 MHz TXON

frequency will be output.
K0.1u
TXn
C6
TXp
10k
R6
GND GND GND CP3V RXp

GND RXn
Q9
RXON
R66 10k
R67 10k
R68 10k
R69 10k
C35
NC
GND VDDC VBAT

GND GND TDI
CHG_CTRL TMS
C45 C43 C46 10p
CHG_CTRL K0.1u K0.1u
TCK
CHG_DET TDO RSTN
CHG_DET
CKM/STM
GND_J CP3V
RTCK
ATSTN
ATSTP
GND
TEST
C44
K1u
GND
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
VBAT
JTAG_RTCK
JTAG_TMS
JTAG_TCK
JTAG_TDI
JTAG_TDO
VDDC1
DP_USB/GPI29
DM_USB/GPI28
VDDUSB
GPIO[27]
VCC_VCO
NC
RSTN
TEST
ATST_p
ATST_n
ANT_n
TRSW_p
GND_RF
RXn
RXp
TXp
CP3V
EEP_SCL 67 44
GPIO[0]/SCL_IIC TXn
R60
2.2k
EEP_SDA 68 43
GPIO[1]/SDA_IIC TRSW_n
UTX EEP_WP 69 42
UTX GPIO[2] ANT
URX HEADSET_DET 70 41 C22
URX GPIO[3] VCC_FE C25 K2.2u
STB_D 71 40 k0.1u
GND GPIO[4] VDD_IF
C59
C60
NC
NC
LCD_RESET 72 39 C23
GPIO[5] VCC_IF C26 10u
73 38 0.1u
GND GPIO[6] VDD_APU
LCD_SID 74 37 C24 (1608)
GPIO[7] VBAT_APU
LCD_SCL
GND 75
GPIO[8] XIN 36 1u (1)
C40 76
VDDIO1 XOUT 35
(2)
VBAT
LCD_CS
LCD_CD
KIN_1
GND
k0.1u 77
78
79
GPIO[9]
GPIO[10] IC1 DCINS
PWM0
34
33
32
VBAT
CHG_DET
CHG_CTRL
GPIO[11] PWM1
KIN_2 80 31
KIN_3 81
GPIO[12] SPOUTP
30
(3)
GPIO[13] VCCPA
KIN_4 C68 (4)
NC
82 29
GPIO[14] SPOUTN
*L6
CP4V KIN_5 1u
*IC4
83
84
GPIO[15] LOUT 28
27 (1608)
(5)
1 6 STB_A 85
GPIO[16]
GND
HSSPOUTP
26
(6)
VOUT CP GPIO[17] MPWR
GND
*C56
(1608)
86 25
VDDIO2 HSMIP (7)
1u
(1608)
STB_B
D10p
D10p
*C57
2 5 87 24
1u
GND VCC GPIO[18] HSMIN

URX 88 23
DOUBCAPN1
GPIO[19] MIP
DOUBCAPP1
3.3k
R26
DOUBCAPN
DOUBCAPP
DCIN0/LIN0
DCIN3/LIN1
4
C41
3
COREOUT
DOUBOUT
SHD CN
C88
C89
GPIO[20]
GPIO[21]
GPIO[22]
GPIO[23]
GPIO[24]
GPIO[25]
GPIO[26]
C17 10p
k0.1u
89
VDDC2
DCIN1
DCIN2
*C58
VCCA
0.039u
VREF
VBAT
1u
C80
(8)
MIN
4.0V
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
UTX
10p
CP_OFF STB_C GNDA
C30 1u
(1608)
R24
C18
(9)
10u (1608)
STB_E 10
C20 10u
C21 1u
(1608)
CP_OFF
C51
C29 GNDA
BELL_LED
1u
RIGHT DOWN UP TALK OFF KEY_LED (1608) VBAT_MON
GND
CP3V 3.0V GNDA
KIN_5
FLASH AST 7 4 1 VBAT (10)
C31 10u
C32 1u
RA4
C11 K0.1u 3.3k

(1608)
(1608)
R33
VDDC VDDC
VBG/CHG_MON
100k 100k
KIN_4
SP 0 8 5 2 FLASH:1.8V / ROM:1.2V
C13 K0.1u
R31
0.1u
C36
KIN_3 GNDAGND
LEFT SHARP 9 6 3
KIN_2 CHG_CUR
SOFT_B SOFT_C SOFT_A VOL_DW VOL_UP
RE1
RE1
1.2V (11)
39p
C34
L3
KIN_1
3.0V (12)
100k
C33
0.1u
R21
CHG_CUR
STB_C
STB_D
STB_A
STB_B
STB_E
LCD_RESET
KEY_LED
LCD_CD
LCD_CS
LCD_SCL
LCD_SID
BELL_LED
CP3V CP4V CP3V

CP3V
LCD_BACKLIGHT
BELL LED [White] LCD BACKLIGHT KEY BACKLIGHT
RESET
(AMBER) (AMBER)
SCL
CD
(AMBER)
CS
SID
+
C92 K1u
R91 NC
WLED
C91 1u
C93 1u
-
LED20
LED21
OTP
*LED11
*R51 *LED12
LED7
LED8
LED9
LED5
LED2
LED3
LED4
LED6
LED1
LED10
*C76
*R70
*C77
*C38
10p
10p
47
NC
NC
NC
NC
NC
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
R49
R50
150
150
NC
GND GND GND GND GND

8
7
6
5
4
3
2
1
4
3
2
1
RA1
RA2
RA3
330
330
NC
10
11
12
13
14
15
5
6
7
8
5
6
7
8
1
2
3
4
GND
GND
GND
VDD
VDD
SDA
VG
SCLK
RST
VSS
CS
GND(OTP)
XV0
A0
V0
*Q5
*C81
100p
Q6 B/W LCD Unit

100p
C79
GND GND
GND GND
NC: No Components

RF BLOCK
ANT-Short-GND
ANT-Short R807
RXON
470
C822
10p
W 0.15mm
ANT-Pattern L 20mm W 0.15mm/L 7mm
3rd layer GND W 0.5mm /L 5mm
ANT_TP
GND C826 1st layer
GND RXn
10p
C863
C801
C820
1.8p
RX_RF
1.8p
10p
RXp
C803 GND
1.3p 2
3 C812 L809
TXp
1 8.2n 1p
C813
1.6p
C805
DA801
2.4p
C804
C802
2p
1.8p
C810
W 0.15mm
2.5p
L 20mm
3rd layer GND GND
TX_RF
C897
GND
24p
GND W 0.2mm TXn
R806
C806
L 10.0mm
2.4p
W 0.2mm 470 1st layer GND
GND GND L 3.8mm
C825
10p
1st layer GND
W 0.15mm VBAT
L 6.2mm
1st layer GND
C811
C814
100p
NC
GND GND
TXON
D10p
C52
R1
X1 SP-phone RX
L4 180n
(1) GND NC
13.824M
+
(2) L5 NC SP-PHONE_SPEAKER
C53
12p
4.3V
4.3V
C72
D14
D13
10p
C73
10p
GND
Speakerphone_SP+
(3)
(4) Speakerphone_SP-
SPP GND GND GND GND
C42
(5) RECEIVER- C16 22u
RECEIVER+ K1000p
(6) L9
+
K1000p
C39
R22 C14 0 RECEIVER

(7) 3.3k
-
0.039u
D10p
D10p
C96
C97
NC
NC
Headset_RECEIVER
C98
C99
C71
C70
D22
4.3V
D21
4.3V
NC
NC
GNDA SPM
R25
2.2k
(8) GND GND GND GND
GNDA GND Handset RX L1

R23 MIC POWER 1
(9) 390
R80 100 L7 2 CN4
C37
(1608)
10u
3
4 Headset Jack
5
C82 K470p
C83 D10p
GNDA L8 10 L75 L10

K1000p
NC
K1000p
C87
HEADSET_DET
C84
(10)
C85
100k
R32
GNDA1 GNDA GNDA GNDA1

GNDA GNDA GNDA1 GNDA1
GND
R27
2.2k
MIC+ MIC+ R73 33

(11) C28
1
MIC AP1
R74 33 NC
(12) 2
MIC- MIC-
D4 NC
D3 NC
2.2k
R28
C12
10u
Handset TX
SP-phone TX GND GND
R34
390
GNDA
*RF-SHIELD
NC
GND
NC: No Components
KX-TGA470 SCHEMATIC DIAGRAM (Handset_Main)

14.6. Schematic Diagram (Charger Unit)

!
F1 R1 R2 D1 TP1
1
A K
2 1 (0.5W) 1 (0.5W)
J1
TP2
SCHEMATIC DIAGRAM (Charger Unit)

15 Printed Circuit Board

15.1. Circuit Board (Base Unit_Main)
C343
C851
C850
C781 R321 R322

C843 C306
IC302 ANT_2
ANT_1
IC721
C321
C322
R781
C854
BT_CTS C782 C853
BT_URX
BRN R791 DC
TP_ANT_C3
ANT_BT
GRY
PUR
TEL
R653 R371
P101
SA101 C844
DA802
YLW C857 CELL1_LED(R) CELL1_LED(G)
R652
BT_HS_LED(G) CELL2_LED(R)
C858 R753 C751
SA103 C841 R752 R754
C855
BT_HS_LED(R) CELL2_LED(G)
SA102 R891 Q651MSG_LED KEYS_E
C803
C341
IC751
C804
C856
C102
ANS_LED KEYS_C
C342
C802 LCD_BLT KEYIN1
L101
C657
L102 R892 C655 LCD_GND KEYIN2
C661
D143
C825
C101
R803
E DA801 LCD_RST KEYIN3
Q655
R141
C652
R505
R806
R801 LCD_CS KEYS_D
D101 C822 C653
R131
ORG R802
Q141
L802
R506 C654
D142
C814 LCD_CD LED_VDD

R807
C812
C826
R651
C658
<-TG773x
C811
C823
LCD_SID KEYIN4
C659
C813
C513
L803
C516
SP C837 C810
R133
C132
R160
R661 LCD_SCL KEYIN5

R159
C820
C142 1 C805 C806

R668 LCD_VDD KEYS_F
R142
BLU
C164
C863
Q654 RA652
Q142 C864 R659 KEYIN6 SP_LED
<-TG774x
C161
R501 C667
C668 KEYS_A MICN
C502 IC501
X501
C520
R660KEYS_B MICP
C503
C504
R144
R145
R508
C512
WBX02
WBX01
R121 R658 C656
C511
C651
R110 R108
RA651
C123
C660
C508
C110
C124
R702
C125
Q702
R123 C461
C172 C459 C472 C507

R122
C174 C473
C460
D362
C112
C475
R372
R178
C474
R125
C186
C109
R109
C701 C506 R665

R703
RA653
R474
R475 ZA1
R373
RA452
C456
C457
R701 Q701 KX-TG774x/773xH
PbF A
CHG PNLB2017Z -LV C458
BLU ORG
KX-TG7731/7732/7733 CIRCUIT BOARD (Base Unit_Main (Component View))

15.1.2. Bottom View

For JIG
GND UTX URX
BT_01
R737
C552
BT_IO1
BT_IO2
RA501
R731
R732
UTX URX C721
R738
RA721
C521 R733 Q732
ANT1_TP
C346
Q731 C731
DC
GND R735 R736
ANT2_TP
BTSPI_MISO
GRY
BTSPI_CLK
BTSPI_CSB
BTSPI_MOSI
BT_UTX
BT_RTS
DCP
C301
BT_GND
ANT_C3
PUR BRN
DCP DCM
L1R
F301 R721
3.0A +5.5V TEL
ANT_BT
R654
TP_ANT_BT
PNLB2017Z
R657
KX-TG774x/773xH
L1T YLW
R655
R656
R751
Q652
Q653
-LV
L661
IC611 C115
C103
C663
L665
C662
R115
C106
C105
R611
R101
JTAG
R612
C664 C611
C602
PbF
C666
L664
R605
R606 SPN ORG

R613
C665
C104
R601
R607
SPN
C603
RSTN Q155
R155
R602 R312 C809 SP
L663
Q601 R156 SPP
R102
C515
L662
Q302
C167 R157
R671
SPP
C517
IC601 C312
C514 BLU
R106
R104
R162 Q161
R165
IC502 R166
R673
D153
VDD4 VDD2
R603
R604
C184
C171
R161
C163
C165
R164
R511 C601
C108 C181 TP9 C173
C518R507 R107
C113
R672
STM/CKM/P15 C505 R311 C111 TP10
C510
STM/CKM/P15
R103
C509
(CLK:13.824MHz)
R167
R163
VDD5R517
R451
R105
C501 R112
R151
D472
D473
C168
R515 VDD1 Q301

C152
R111
C519
R152
C107
R502
R516
C477
C478
C311
D133
D361
VDD3
C351
MIN MIP C455 CHARGE+
RA451
CHARGE-
C452
C451
C479
C454
ORG
BLU
C476
CHG A
MIN MIP
KX-TG7731/7732/7733 CIRCUIT BOARD (Base Unit_Main (Bottom View))

15.2. Circuit Board (Base Unit_Operation)
LED901
LCD
R901
C903
R903 LED907 LED905
ERASE ANS
R904 R902
LED908 LED906
C902 C901
STOP LOCAT/INT
UP
LED916
LED915
MSG1 MSG2
TG773xH
LED912
LED911
RPT LED902 SKIP

TG473xH
MSG3 MSG4
PNLB2049Z -IG
LED914
LED913
DOWN
PbF
A
KX-TG7731/7732/7733 CIRCUIT BOARD (Base Unit_Operation (Component View))

Memo

15.3. Circuit Board (Handset_Main)

LED11 LED10 LED12
ANT_Short-GND
R50
R49
R51
C38
ANT_Short
Gr
ee
ANT_TP
n
C801 OTP
ANT-TP C92 C91 C93
RESET
ER
ANT-GND SCL
R91
IV
CS
Or
CE
an
RE
CD SID
ge
2
C4
C70
PbF
C71
D21
D22
Bl
ue
D
LE
W
C897
Or
7
C804
C7
an
ge
C803
0
C76
R7
C802
Q5
C825
DA
R806
C814 C81
8
C812
01
L8
C8
C22
09
11
C826 C863 C44
C25
C822 C820C813 C810 C23
C52
C46
R807 C805 C24 C24

C806
R1
ATSTP
C43
CKM/STM
CKM/STM GND_J
C53
C68
C99
X1
RSTN TDI C45
R69
(CLK:13.824MHz) C98
R66
TCK C17
IC1
R67
C1 C21
TEST
RTCK
TMS
8
R24
R68
RA5 TD0
C40
C2
C69
ATSTN
9
E_WP
C2
E_SDA
E_SCL
C3C3
0
1
C3
C34
2
C4
IC3 C96 C97

1
C51 L3
C39
L9
C16
3.0V
R31
C36
C33
R21
R22 C14 R25
RA4 C89
C60
C59
C13
(Output)
R26
3.0V C88
VBAT_MON
C80
R60 R33
C11
VBG/CHG_MON
R28
VDDC C79 R34

R27
C12
R23
C37
Q6
C3
C2
C1
RA1 RA3 RA2
L5
L4
C7
C4
NE
Bl
ue
HO
-P
SP
Or
an
ge
C72
C73
D14
D13
SPM MIC+ SP-

MIC+
PNLB2012Z -PA MIC-
C85
C84 L75
SPP MIC-
L8 L1 SP+
C56
CN4
IC4
C57
Q3 Q4 Q2 C32 R80
C82
C58
L7
C83 C87
URX
L6
R2 L10
R8 C27 URX UTX
CHG_DET
UTX for signal communication jig

CHG_CTRL
R6
C8
R9
C9
GND
Q9
C90
C10
F1
C15 VBAT GND

R4 C35
R7 C6
VBAT
R45 BAT-
CHG-
BAT+
CHG+
D3
R73
C28
D4
R74
R3 C5 A
CHG (+) CHG (+) CHG (-) CHG (-)
KX-TGA470 CIRCUIT BOARD (Handset_Main (Component View))

15.3.2. Bottom View
CN3_C
PNLB2012Z -PA
VOL_UP
VOL_DW
LED7 LED9 LED9
SOFT_A SOFT_B SOFT_C
SP FLASH
UP
LED1 LEFT RIGHT LED2
TALK DOWN OFF
1 2 3
LED4
LED3
4 5 6
LED20
LED21
7 8 9
LED5
LED6
0 #
MIC
KX-TGA470 CIRCUIT BOARD (Handset_Main (Bottom View))

15.4. Circuit Board (Charger Unit)

PNLB2081Z -IG
J1
A
CIRCUIT BOARD (Charger Unit (Component View))
15.4.2. Bottom View
PNLB2081Z -IG
PbF
D1
F1
R2
R1
CIRCUIT BOARD (Charger Unit (Bottom View))

16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
1
3
2
9
6
E1 (*1)
A
10
7
E2
8
11
E3
12
13
14
13
PCB1
PCB2
A
18
15
16 22
17 A
Ref.No. Figure
A A
2.6 x 8mm 20 19
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Base Unit LCD (P.53)

16.2. Cabinet and Electrical Parts (Handset)

CUSHION RUBBER
*STICK IT WITHIN THE FRAMEWORK ON P.C.B.
B
E106
E103 E104
105 E102
E107
103 E105
102
E101(*1)
MIC100 109
106 110
PCB100
108
107
101
118
117
123
111
122
104
114
119 (*2)
113 121 (*3)
112
120
115
B
116 Battery cover
Spacer (No.121)
Ref.No. Figure Stick it between

ribs.
B
Ǿ28 mm
Put it in the center.
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.55).
(*2) The rechargeable Ni-MH battery HHR-4DPA is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 121) to the exact location described above.

16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
PCB200
200-3
200-2
200-4 Ref.No. Figure
B
201 φ2×8 mm

16.4. Accessories and Packing Materials

16.4.1. KX-TG7731S
A6 A2
A5
A1
P2
A3, A4
P1

16.4.2. KX-TG7732S
A106
A102
A105
P102
A101
P102
A101
A103, A104
P101

16.4.3. KX-TG7733S
A206
A205
A202
P202
P202
A201
P202
(*1)
A203, A204
P201
Note:
(*1) This pad is a piece of Ref No.P201 (GIFT BOX).

16.4.4. KX-TGA470S
A303
P302
(*1)
A302
A301
P301
Note:
(*1) This pad is a piece of Ref No.P301 (GIFT BOX).

16.5. Replacement Parts List Safety Ref.

No.
Part No. Part Name & Description Remarks
1. RTL (Retention Time Limited) 12 PNJK1146W KEYBOARD SWITCH, TAM

Note: 13 PNLA1047Z ANTENNA, SUB
The “RTL” marking indicates that its Retention Time is 14 PNLA1052Z ANTENNA, BT
15 PNHR1584Z GUIDE, JACK PS-HB
Limited.
16 PQJJ1T039L JACK, MODULAR
When production is discontinued, this item will 17 K2ECYZ000001 JACK, DC
continue to be available only for a specific period of 18 PNKF1228Z1 CABINET COVER PS-HB
time. 19 PNHA1013Z RUBBER PARTS, FOOT
CUSHION
This period of time depends on the type of item, and 20 PNGT6445Z NAME PLATE
the local laws governing parts and product retention.
At the end of this period, the item will no longer be 16.5.1.2. Main P.C. Board Parts
available. Note:
2. Important safety notice (*1) When replacing IC501, IC502, IC601 or X501, make
Components identified by the mark indicates special the adjustment using PNZZTG7741M. Refer to How to
characteristics important for safety. When replacing any download the data (P.63) of Things to Do after Replacing
of these components, only use specified manufacture's IC or X'tal.
parts. (*2) When replacing the base unit LCD, See How to
3. The S mark means the part is one of some identical parts. Replace the Base Unit LCD (P.53).
For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column Safety Ref. Part No. Part Name & Description Remarks
No.
shows quality of the material and a flame resisting grade
PCB1 PNWP1TG7731H MAIN P.C.BOARD ASS'Y
about plastics. (RTL)
5. RESISTORS & CAPACITORS (ICs)
Unless otherwise specified; IC302 C0DBEYY00102 IC
IC501 C1CB00003663 IC(BBIC)(*1)
All resistors are in ohms (Ω) k=1000Ω, M=1000kΩ
IC502 PNWI2TG7741H IC(FLASH)(*1)
All capacitors are in MICRO FARADS (µF) p=µµF IC601 PNWI3TG7741H IC(FLASH)(*1)
*Type & Wattage of Resistor IC611 PNWI1TG7731H IC(EEPROM)(*1)
IC751 C0JBAQ000247 IC
Type
(TRANSISTORS)
ERC:Solid ERX:Metal Film PQ4R:Chip Q141 B1ACGP000008 TRANSISTOR(SI)
ERDS:Carbon ERG:Metal Oxide ERS:Fusible Resistor Q142 B1ABDM000001 TRANSISTOR(SI)
ERJ:Chip ER0:Metal Film ERF:Cement Resistor Q161 DSC7003S0L TRANSISTOR(SI)
Wattage Q301 B1ADGE000012 TRANSISTOR(SI)
10,16:1/8W 14,25:1/4W 12:1/2W 1:1W 2:2W 3:3W Q302 B1ADGE000012 TRANSISTOR(SI)
Q601 2SC6054JSL TRANSISTOR(SI) S
*Type & Voltage Of Capacitor
Q651 PSVTUMG11NTR TRANSISTOR(SI) S
Type
Q652 PSVTUMG11NTR TRANSISTOR(SI) S
ECFD:Semi-Conductor ECCD,ECKD,ECBT,F1K,ECUV:Ceramic Q653 PSVTUMG11NTR TRANSISTOR(SI) S
ECQS:Styrol ECQE,ECQV,ECQG:Polyester Q654 2SC6054JSL TRANSISTOR(SI) S
ECUV,PQCUV, ECUE:Chip ECEA,ECST,EEE:Electlytic Q731 2SC6054JSL TRANSISTOR(SI) S
ECQMS:Mica ECQP:Polypropylene Q732 2SC6054JSL TRANSISTOR(SI) S
Voltage (DIODES)
D101 PQVDMD5S DIODE(SI)
ECQ Type ECQG ECSZ Type Others
ECQV Type D133 DA2J10100L DIODE(SI)
D142 PQVDPTZT2530 DIODE(SI) S
1H:50V 05:50V 0F:3.15V 0J :6.3V 1V :35V
D362 B0ECKM000008 DIODE(SI)
2A:100V 1:100V 1A:10V 1A :10V 50,1H:50V
2E:250V 2:200V 1V:35V 1C :16V 1J :16V DA801 B0DDCD000001 DIODE(SI)
2H:500V 0J:6.3V 1E,25:25V 2A :100V DA802 B0DDCD000001 DIODE(SI)
(COILS)
L802 G1C5N6Z00007 COIL
16.5.1. Base Unit L803 G1C5N6Z00007 COIL
(RESISTOR ARRAYS)
16.5.1.1. Cabinet and Electrical Parts RA501 D1H422120001 RESISTOR ARRAY
RA651 D1H81024A024 RESISTOR ARRAY
Safety Ref. Part No. Part Name & Description Remarks RA653 D1H81024A024 RESISTOR ARRAY
No.
1 PNGP1225Y2 PANEL, UPPER PC-V-2
(BT UNIT)
2 PNKM1256Z2 CABINET BODY PS-HB
IC721 PNWP3TG7621H BT UNIT
3 L0AA02A00087 SPEAKER
(VARISTOR)
4 PQHG10729Z RUBBER PARTS, SPEAKER
SA101 PQVDDSS301L VARISTOR (SURGE S
5 PQHR11313Z GUIDE, SPEAKER ABS-HB ABSORBER)
6 PNKE1130Z2 CASE, CHARGE TERMINAL PS-HB (RESISTORS)
7 PNJT1107Z CHARGE TERMINAL R101 PQ4R10XJ475 4.7M S
8 PNJK1148Z KEYBOARD SWITCH, LED R102 PQ4R10XJ475 4.7M S
LENS
R103 PQ4R10XJ184 180k S
9 PNBC1404X4 BUTTON, NAVIGATOR KEY ABS-HB
R104 PQ4R10XJ184 180k S
10 PNHR1585Z GUIDE, BUTTON PS-HB
R105 PQ4R10XJ105 1M S
11 PNBC1345Z3 BUTTON, MESSAGE PMMA-HB
R106 PQ4R10XJ105 1M S

Safety Ref. Part No. Part Name & Description Remarks Safety Ref. Part No. Part Name & Description Remarks
No. No.
R107 D0GA102JA021 1k R735 ERJ2RKF4702 47k
R108 D0GA102JA021 1k R736 ERJ2GEJ223 22k S
R109 ERJ2GEJ823 82k S R738 ERJ2RKF3302 33k
R110 ERJ2GEJ823 82k S R751 D0GA102JA021 1k
R111 D0GA392JA015 3.9k R752 ERJ2GEJ184 180k S
R112 D0GA124JA015 120k R791 ERJ3GEY0R00 0 S
R121 D0GA102JA021 1k R801 D0GA180JA015 18
R122 D0GA102JA021 1k R806 D0GA221JA021 220
R123 D0GA102JA021 1k R807 D0GA221JA021 220
R125 D0GA271JA015 270 R891 D0GA221JA021 220
R131 PQ4R18XJ106 10M S R892 D0GA221JA021 220
R133 ERJ3GEYJ154 150k S (CAPACITORS)
R141 D0GB104JA057 100k C101 F1K2H681A008 680p
R142 PQ4R18XJ272 2.7k S C102 F1K2H681A008 680p
R144 D0GB103JA057 10k C103 ECUV1C103KBV 0.01
R145 D0GA222JA021 2.2k C104 ECUV1C103KBV 0.01
R151 D0GA104JA021 100k C105 F1K2H681A008 680p
R152 ERJ2GEJ474X 470k S C106 F1K2H681A008 680p
R159 ERJ3GEY0R00 0 S C107 ECUV1C103KBV 0.01
R160 ERJ3GEYJ911 910 C108 ECUV1C103KBV 0.01
R161 D0GB104JA057 100k C109 ECUE1H821KBQ 820p
R162 D0GB473JA057 47k C110 ECUE1H821KBQ 820p
R163 ERJ14YJ120U 12 C111 ECUE1A333KBQ 0.033 S
R164 D0GB272JA057 2.7k C112 ECUE1H100DCQ 10p S
R165 ERJ3GEYJ273 27k S C113 ECUE1A823KBQ 0.082 S
R166 ERJ3GEYJ822 8.2k S C123 ECUE1H100DCQ 10p S
R167 D0GG270JA007 27 C124 ECUE1H100DCQ 10p S
R178 D0GA332JA015 3.3k C125 ECUE1H100DCQ 10p S
R311 D0GA103JA021 10k C132 ECUV1H103KBV 0.01
R312 D0GA103JA021 10k C142 ECUV1H103KBV 0.01
R321 ERJ2RKF1400 140 C152 ECUE1C103KBQ 0.01 S
R322 ERJ2RKF1000 100 C161 F1K1E1060001 10
R371 ERJ14YJ1R0U 1 C168 ECUV1A225KBV 2.2 S
R372 ERJ14YJ1R0U 1 C171 ECUV1H472KBV 0.0047
R474 D0GA1R0JA014 1 C172 ECUE1H100DCQ 10p S
R475 D0GA1R0JA014 1 C173 ECUE1A104KBQ 0.1
R501 D0GA563ZA006 56k C174 ECUE1H222KBQ 0.0022 S
R502 D0GA332JA015 3.3k C184 ECUV1C105KBV 1
R505 D0GA102JA021 1k C186 ECUE1H100DCQ 10p S
R506 D0GA101JA021 100 C311 ECUV1C105KBV 1
R507 D0GA104JA021 100k C312 ECUV1C105KBV 1
R508 ERJ2GEJ100 10 S C321 ECUV1A105KBV 1
R511 D0GA102JA021 1k C341 F2A1A3310040 330
R515 D0GA473JA021 47k C342 ECUE1A104KBQ 0.1
R602 D0GA561JA021 560 C461 ECUE1H100DCQ 10p S
R605 D0GA222JA021 2.2k C474 ECUE1H222KBQ 0.0022 S
R606 D0GA103JA021 10k C475 ECUE1H222KBQ 0.0022 S
R607 D0GA103JA021 10k C476 ECUE1H151JCQ 150p
R613 D0GA332JA015 3.3k C479 ECUE1H151JCQ 150p
R652 D0GA101JA021 100 C501 ECUE1A104KBQ 0.1
R653 D0GA681JA021 680 C502 ECUE0J105KBQ 1
R657 D0GA681JA021 680 C506 ECUV1A225KBV 2.2 S
R658 D0GA122JA015 1.2k C507 ECUV1A105KBV 1
R665 D0GA103JA021 10k C508 ECUV1A105KBV 1
R668 D0GA561JA021 560 C509 ECUV0J225KBV 2.2 S
R671 D0GA473JA021 47k C511 ECUV1A105KBV 1
R721 ERJ2GEJ474X 470k S C519 ECUE1A104KBQ 0.1
R732 ERJ2GEJ184 180k S C603 ECUE1C103KBQ 0.01 S

Safety Ref. Part No. Part Name & Description Remarks 16.5.2. Handset
No.
C611
C661
ECUE1A104KBQ
ECUE1A104KBQ
0.1
0.1
16.5.2.1. Cabinet and Electrical Parts
C721 ECUE1A104KBQ 0.1
C731 ECUE1A104KBQ 0.1 Safety Ref. Part No. Part Name & Description Remarks
C751 ECUE1A104KBQ 0.1 No.
C802 F1G1H1R8A480 1.8p 101 PNGP1228Z2 PANEL, LCD PMMA-HB
C803 F1G1H1R5A480 1.5p 102 PNYE1066Z TAPE, DOUBLE SIDED
C804 F1G1H1R8A480 1.8p 103 PNKM1257Y2 CABINET BODY ABS-HB
C805 F1G1H3R3A480 3.3p 104 PNGT6432Y NAME PLATE
C806 F1G1H3R3A480 3.3p 105 L0AD01A00026 RECEIVER
C809 ECUE1H100DCQ 10p S 106 PNYE1065Y SPACER, CUSHION LCD
C810 F1G1H1R0A480 1p 107 PNBC1354ZA BUTTON, NAVIGATOR KEY ABS-HB
C811 ECUE1H100DCQ 10p S 108 PNJK1149Y KEYBOARD SWITCH
C813 F1G1H1R0A480 1p 109 PNJT1027Z CHARGE TERMINAL (L)
C814 ECUE1H100DCQ 10p S 110 PNJT1026Z CHARGE TERMINAL (R)
C820 F1G1HR70A480 0.7p 111 PNJK1150Z RUBBER PARTS, SIDE
C822 ECUE1H100DCQ 10p S SWITCH
C823 ECUE1H101JCQ 100p 112 PQHR11315Z GUIDE, SPEAKER ABS-HB
C825 ECUE1H100DCQ 10p S 113 L0AA02A00096 SPEAKER
C826 ECUE1H100DCQ 10p S 114 PQHS10784Y SPACER, SPEAKER NET
C837 F1G1HR90A480 0.9p 115 PQJC10056W BATTERY TERMINAL
C841 F1G1H1R0A480 1p 116 PNKE1131Z1 COVER, EP CAP
C851 ECUE1H100DCQ 10p S 117 PNKF1229Z1 CABINET COVER ABS-HB
C853 ECUE1H100DCQ 10p S 118 PNHR1588Z OPTIC CONDUCTIVE PARTS, PS-HB
C855 ECUE1H100DCQ 10p S LED LENS
C856 ECUE1H101JCQ 100p 119 PNQT2006Z LABEL, ATTENTION
C857 ECUE1H100DCQ 10p S 120 PNQT2335Z LABEL, BATTERY
C858 ECUE1H101JCQ 100p 121 PNHS1079Z SPACER, BATTERY
C863 F1G1H7R0A480 7p 122 PNKK1066Z1 LID, BATTERY ABS-HB
C864 F1G1H7R0A480 7p 123 PNYNTGA470BR LID, BATTERY ASS'Y ABS-HB
(OTHERS)
E1 L5DYBYY00021 LIQUID CRYSTAL DISPLAY 16.5.2.2. Main P.C. Board Parts
(*2)
Note:
E2 PNHX1406Z COVER, LCD SHEET
(*1) Reconfirm the model No. written on the handset's name
E3 PNHR1386Z GUIDE, LCD ABS-HB
P101 D4DAY220A022 THERMISTOR (POSISTOR) plate when replacing PCB100. Because the model No. of
F301 K5H302Y00003 FUSE the optional handset may differ from the included handset.
X501 H0J103500037 CRYSTAL OSCILLATOR (*1) (*2) When replacing IC3 or X1, make the adjustment
using PNZZTG7741M. Refer to Handset (P.64) of Things
16.5.1.3. Operational P.C. Board Parts
to Do after Replacing IC or X'tal.
(*3) When replacing the handset LCD, See How to
Safety Ref. Part No. Part Name & Description Remarks Replace the Handset LCD (P.55).
No.
PCB2 PNWP2TG7731H OPERATIONAL P.C.BOARD
ASS'Y (RTL)
Safety Ref. Part No. Part Name & Description Remarks
(LEDS) No.
LED901 B3AAB0000347 LED PCB100 PNWP1TGA470R MAIN P.C.BOARD ASS'Y
LED902 B3AAB0000347 LED (RTL) (*1)
LED905 LNJ237W82RA LED (ICs)
LED906 LNJ237W82RA LED IC1 C2HBCY000081 IC
LED907 LNJ237W82RA LED IC3 PNWITGA470BR IC(EEPROM)(*2)
LED908 LNJ237W82RA LED IC4 C0DBZYY00357 IC
LED911 B3AAB0000347 LED (TRANSISTORS)
LED912 B3ABB0000331 LED Q2 B1ADCF000040 TRANSISTOR(SI)
LED913 B3AAB0000347 LED Q3 B1ABGE000011 TRANSISTOR(SI)
LED914 B3ABB0000331 LED Q4 B1ADCF000040 TRANSISTOR(SI)
LED915 B3AAB0000347 LED Q5 DRC9113Z0L TRANSISTOR(SI)
LED916 B3ABB0000331 LED Q6 DRC9113Z0L TRANSISTOR(SI)
(RESISTORS) Q9 2SC6054JSL TRANSISTOR(SI) S
R901 D0GA271JA015 270 (DIODES)
R902 D0GA271JA015 270 D13 B0BC4R3A0006 DIODE(SI)
(CAPACITORS) D22 B0BC4R3A0006 DIODE(SI)
C901 ECUV1C105KBV 1 DA801 B0DDCD000001 DIODE(SI)
C902 F1H1E1050001 1 (LEDS)
C903 ECUE0J105KBQ 1 LED1 B3ACB0000190 LED
LED2 B3ACB0000190 LED

No. No.
LED12 B3ACB0000190 LED C22 ECUE1A104KBQ 0.1
(COILS) C23 ECUE1A104KBQ 0.1
C812 PQLQR4C8N2J COIL S C24 ECUE0J105KBQ 1
L4 G1CR18J00004 COIL C25 ECUV1A225KBV 2.2 S
(RESISTOR ARRAYS) C26 ECJ1VB0G106M 10 S
RA2 D1H83314A013 RESISTOR ARRAY S C27 ECUE1H102KBQ 0.001 S
RA3 D1H83314A013 RESISTOR ARRAY S C29 ECUV1A105KBV 1
RA4 D1H433220001 RESISTOR ARRAY C30 ECUV1A105KBV 1
RA5 EXB28V332JX RESISTOR ARRAY C31 ECJ1VB0G106M 10 S
(IC FILTERS) C32 ECUE0J105KBQ 1
L1 J0JCC0000286 IC FILTER C33 ECUE1A104KBQ 0.1
L3 J0JDC0000045 IC FILTER C34 ECUE1H390JCQ 39p
L7 J0JCC0000276 IC FILTER C36 ECUE1A104KBQ 0.1
L10 J0JCC0000286 IC FILTER C37 ECJ1VB0G106M 10 S
L75 J0JCC0000286 IC FILTER C39 ECUE1H102KBQ 0.001 S
(SWITCHES) C40 ECUE1A104KBQ 0.1
VOL_DW K0H1BB000094 TACTILE SWITCH C41 ECUE1A104KBQ 0.1
VOL_UP K0H1BB000094 TACTILE SWITCH C42 ECUE1H102KBQ 0.001 S
(RESISTORS) C43 ECUE1A104KBQ 0.1
R2 ERJ2GEJ303 30k C44 ECUE0J105KBQ 1
R3 D0GA152JA021 1.5k C45 ECUE1A104KBQ 0.1
R6 D0GA103JA021 10k C51 ECJ1VB0G106M 10 S
R8 PQ4R18XJ3R3 3.3 S C53 ECUE1H120JCQ 12p S
R9 ERJ2GEJ303 30k C56 ECUE0J105KBQ 1
R21 D0GA104JA021 100k C57 ECUE0J105KBQ 1
R22 D0GA332JA015 3.3k C58 ECUE0J105KBQ 1
R23 ERJ2GEYJ391 390 S C68 ECUE0J105KBQ 1
R24 ERJ2GEJ100 10 S C69 ECUE1A104KBQ 0.1
R31 ERJ2RKF1003 100k C79 ECUE1H101JCQ 100p
R32 D0GA104JA021 100k C80 ECUV1C393KBV 0.039
R33 ERJ2RKF1003 100k C81 ECUE1H101JCQ 100p
R34 ERJ2GEYJ391 390 S C82 ECUE1H471KBQ 470p S
R45 ERJ6RSJR10V 0.1 C83 ECUE1H100DCQ 10p S
R50 D0GA151JA021 150 C84 ECUE1H102KBQ 0.001 S
R51 D0GA151JA021 150 C87 ECUE1H102KBQ 0.001 S
R69 D0GA103JA021 10k C92 ECUE0J105KBQ 1
R70 D0GA470JA021 47 C93 ECUV1C105KBV 1
R80 D0GA101JA021 100 C801 ECUV1H100DCV 10p
R806 ERJ2GEJ471 470 S C802 F1G1H2R0A480 2p
R807 ERJ2GEJ471 470 S C803 F1G1H1R3A480 1.3p
L8 ERJ2GEJ100 10 S C804 F1G1H1R8A480 1.8p
L9 ERJ2GE0R00 0 S C805 F1G1H2R4A480 2.4p
(CAPACITORS) C806 F1G1H2R4A480 2.4p
C1 EEE0JA221WP 220 C810 F1G1H2R5A480 2.5p
C2 EEE0JA221WP 220 C811 ECUE1H101JCQ 100p S
C3 EEE0JA221WP 220 C813 F1G1H1R6A480 1.6p
C4 ECUE1H390JCQ 39p C820 F1G1H1R8A480 1.8p
C5 ECUE1A104KBQ 0.1 C822 ECUE1H100DCQ 10p S
C6 ECUE1A104KBQ 0.1 C825 ECUE1H100DCQ 10p S
C9 ECUE1H390JCQ 39p C826 ECUE1H100DCQ 10p S
C10 ECUE1H390JCQ 39p C863 F1G1H1R8A480 1.8p
C11 ECUE1A104KBQ 0.1 C897 F1G1H240A557 24p
C12 PQCUV0J106KB 10 S L809 F1G1H1R0A480 1p
C13 ECUE1A104KBQ 0.1 (OTHERS)
C14 ECUV1C393KBV 0.039 MIC100 L0CBAY000053 MICROPHONE
C15 ECUE1H390JCQ 39p E101 L5DYBYY00043 LIQUID CRYSTAL DISPLAY
C16 F1J0J2260002 22 (*3)
C17 ECUE1H100DCQ 10p S E102 PNHX1569Z COVER, DIFFUSION SHEET
C18 ECUE1H100DCQ 10p S E103 PNHX1518Z COVER, LCD SHEET
C20 ECJ1VB0G106M 10 S E104 PNHR1587Z TRANSPARENT PLATE, LCD PMMA-HB
C21 ECUE0J105KBQ 1 E105 PNHR1586Z GUIDE, LCD ABS-HB

No. No.
E106 PQHG10729Z RUBBER PARTS, RECEIVER A103 PNQX5106Z INSTRUCTION BOOK (*1)
E107 PNVE1002Z BATTERY TERMINAL ABS-HB A104 PNQW3019Z LEAFLET, QUICK GUIDE
CN4 K2HD103D0001 JACK A105 PNKE1132Z1 HANGER, BELT CLIP ABS-HB
F1 K5H252Y00002 FUSE A106 PNKL1001Y1 STAND, WALL MOUNT ABS-HB
X1 H0J138500003 CRYSTAL OSCILLATOR (*2) S P101 PNPK3481002Z GIFT BOX
P102 PNPD1592Z CUSHION
16.5.2.3. LED Board Parts
16.5.4.3. KX-TG7733S
No. Safety Ref. Part No. Part Name & Description Remarks
No.
(LED)
A201 PNLV226Z AC ADAPTOR
WLED B3AFB0000370 LED
A202 PQJA10075Z CORD, TELEPHONE
16.5.3. Charger Unit A203
A204
PNQX5106Z
PNQW3019Z
INSTRUCTION BOOK (*1)
LEAFLET, QUICK GUIDE
A205 PNKE1132Z1 HANGER, BELT CLIP ABS-HB
16.5.3.1. Cabinet and Electrical Parts A206 PNKL1001Y1 STAND, WALL MOUNT ABS-HB
P201 PNPK3482002Z GIFT BOX
No.
200 PNLC1029ZS CHARGER UNIT ASS'Y 16.5.4.4. KX-TGA470S
without NAME PLATE
(RTL)
200-1 PNKM1258Y2 CABINET BODY PS-HB Safety Ref. Part No. Part Name & Description Remarks
200-2 PNJT1105Z CHARGE TERMINAL No.
200-3 PNKF1150Z1 CABINET COVER PS-HB A301 PNLV226Z AC ADAPTOR
200-4 PQHA10023Z RUBBER PARTS, FOOT A302 PNQX5093Z INSTRUCTION BOOK (*1)
CUSHION A303 PNKE1132Z1 HANGER, BELT CLIP ABS-HB
201 PNGT6446Z NAME PLATE P301 PNPK3490001Z GIFT BOX
16.5.3.2. Main P.C. Board Parts
16.5.5. Screws
No.
PCB200 PNWPTGA470CH MAIN P.C.BOARD ASS'Y No.
(RTL)
A XTB26+8GFJ TAPPING SCREW
(DIODE)
B XTB2+8GFJ TAPPING SCREW
D1 B0ECKM000008 DIODE(SI)
(JACK)
J1 K2ECYB000001 JACK
16.5.6. Fixtures and Tools
(RESISTORS) Note:
R1 ERJ14YJ1R0U 1 (*1) See Equipment Required (P.56), and The Setting
R2 ERJ14YJ1R0U 1 Method of JIG (P.56)
(FUSE) (*2) When replacing the Handset LCD, See How to
F1 K5H302Y00003 FUSE
Replace the Handset LCD (P.55)
16.5.4. Accessories and Packing Materials
Note: Safety Ref. Part No. Part Name & Description Remarks
No.
(*1) You can download and refer to the Operating PQZZ1CD300E JIG CABLE (*1)
Instructions (Instruction book) on TSN Server. PNZZTG7741M BATCH FILE CD-ROM (*1)
PQZZ430PIR TIP OF SOLDERING IRON
16.5.4.1. KX-TG7731S (*2)
PQZZ430PRB RUBBER OF SOLDERING IRON
(*2)
No.
A1 PNLV226Z AC ADAPTOR
A2 PQJA10075Z CORD, TELEPHONE
A3 PNQX5106Z INSTRUCTION BOOK (*1)
A4 PNQW3019Z LEAFLET, QUICK GUIDE
A5 PNKE1132Z1 HANGER, BELT CLIP ABS-HB
A6 PNKL1001Y1 STAND, WALL MOUNT ABS-HB
P1 PNPK3480002Z GIFT BOX
16.5.4.2. KX-TG7732S
T.I/N
KXTG7731S
No. KXTG7732S
A101 PNLV226Z AC ADAPTOR KXTG7733S
A102 PQJA10075Z CORD, TELEPHONE KXTGA470S

ORDER NO. KM41309648SE
F13
Telephone Equipment
1 Model No. KX-TG7731S

-
ent
pl em KX-TG7732S
S up
KX-TG7733S
KX-TGA470S
Solution
S: Sliver Version
(for U.S.A.)
Please file and use this supplement manual together with the service manual for Model No.KX-TG7731S/
KX-TG7732S/KX-TG7733S/KX-TGA470S, Order No. KM41201532CE.
TABLE OF CONTENTS
PAGE
1 REPLACEMENT PARTS LIST--------------------------------- 2
1.1. REFERENCE CHART------------------------------------ 2
1.2. ORIGINAL AND NEW PARTS
COMPARISON LISTS------------------------------------ 2

of law.

1 REPLACEMENT PARTS LIST

1.1. REFERENCE CHART
Reason for Change

*The following items (1-8) indicate the reason for change. See the “Notes” column for each part in ORIGINAL AND NEW PARTS
COMPARISON LISTS.
1. Improve performance Remarks:
2. Change of material or dimension *c: To share the parts with other models
3. To meet approved specification
4. Standardization
5. Addition
6. Deletion
7. Correction
8. Other
1.2. ORIGINAL AND NEW PARTS COMPARISON LISTS
Ref. No. Part No. Part Name & Description Pcs/ Remarks Notes Time of Change
Original (Old) New Set (Suffix)
Main P.C.Board Parts (Handset)
C1 EEE0JA221WP ---------- CAPACITOR, 220µF 0 *c 6 V ---
C3 EEE0JA221WP ---------- CAPACITOR, 220µF 0 *c 6 V ---
NM
KXTG7731S
KXTG7732S
KXTG7733S
KXTGA470S

F13
Telephone Equipment

-
ent
pl em KX-TG7732S
S up
KX-TG7733S
KX-TGA470S
Solution
S: Sliver Version
(for U.S.A.)
TABLE OF CONTENTS
PAGE
1.1. REFERENCE CHART------------------------------------ 2

of law.


Reason for Change

COMPARISON LISTS.
2. Change of material or dimension *j: To meet the standards.
4. Standardization
5. Addition
6. Deletion
7. Correction
8. Other
Cabinet and Electrical Parts (Handset)
104 PNGT6432Y PNGT7243Y NAME PLATE 1 *j 4 Y ---
NM
KXTG7731S
KXTG7732S
KXTG7733S
KXTGA470S

F13
Telephone Equipment

-
ent
pl em KX-TG7732S
S up
KX-TG7733S
KX-TGA470S
Solution
S: Sliver Version
(for U.S.A.)
TABLE OF CONTENTS
PAGE
1.1. REFERENCE CHART------------------------------------ 2

of law.


Reason for Change

COMPARISON LISTS.
2. Change of material or dimension *m : Discontinued (To be replaced with a new part)
4. Standardization
5. Addition
6. Deletion
7. Correction
8. Other
Cabinet and Electrical Parts (Base Unit)
20 PNGT6445Z PNGT7734Z NAME PLATE 1 *m 8 V ---
OY
KXTG7731S
KXTG7732S
KXTG7733S
KXTGA470S

KXTG 7731 S

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KXTG 7731 S

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ORDER NO.

Configuration for each model

*KX-TGA470 is also an optional accessory, which contains a

© Panasonic System Networks Co., Ltd. 2012

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IMPORTANT SAFETY NOTICE

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

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• ICs and LSIs are vulnerable to static electricity.

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2.2. About Lead Free Solder (PbF: Pb free)

2.2.1. Suggested PbF Solder

0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g

2.3. Discarding of P. C. Board

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TEL I/F POWER

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4.2. US-DECT Description

4.2.1. TDD Frame Format

DATA rate : 1.152 Mbps

4.2.2. TDMA system

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4.2.3. Signal Flowchart in the Radio Parts

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KX-TG7731/7732/7733 BLOCK DIAGRAM (Base Unit_Main)

4.4. Tel Interface Circuit

C104 R102 C108 R104

C103 R101 C107 R103

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KX-TG7731/7732/7733 BLOCK DIAGRAM (Base Unit_RF Part)

4.6. Circuit Operation (Base Unit)

TDD & TDMA ADPCM

EEPROM Flash Memory Flash Memory IC601

4.6.1. BBIC (Base Band IC: IC501)

4.6.2. Flash Memory (IC502)

4.6.3. Flash Memory (IC601)

4.6.4. EEPROM (IC611)

4.6.5. Bluetooth Unit (IC721)

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4.6.6. Power Supply Circuit/Reset Circuit

IC302 IC501 IC502

BBIC chip initialize

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4.6.6.1. Charge Circuit

D362 R372 R371

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4.6.7. Telephone Line Interface

CIDOUT C108 R104 R102 C104

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4.6.8. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Parallel connection detection when off hook:

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4.6.9. Calling Line Identification (Caller ID)/Call Waiting Caller ID

month day hour minute number

Plural message format

DATA CODE NAME month day hour minute number

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Call Waiting Caller ID

Call Waiting Format