University of energy and natural resources

COURSE NAME: Computer Engineering Lab I

COURSE CODE: CENG 203
CLASS: Computer Engineering

GROUP 3

GROUP 3 MEMBERS
Name of Member Index Number
Salifu Abdul-Rahaman UEB1101522
Ofori Mathias Sekyere UEB1101122
Bennin Humaidu Kojo UEB1101222
Frimpong Daniel UEB1101322
Martey Isaac Nii Marlai UEB1101422

PCB LAB REPORT

CHAPTER 1
 Experiment 1: FULL WAVE BRIDGE RECTIFICATION OF 5V POWER CIRCUIT

Introduction
Full wave rectification is the type of rectification in which both halves of the input alternating
waveform are converted to a single output waveform. This can be done using a center-tapped
transformer or by bridge rectification. In this experiment, we focused on bridge rectification.
OBJECTIVE:
This experiment aims to document the construction and functionality of a full wave bridge
rectification circuit for a 5V power supply.
PRINTED CIRCUIT BOARD (PCB):
The PCB serves as the foundation for the circuit, facilitating the connection and arrangement of
components in an organized manner.
From the experiment, the results found were as expected as that of the theoretical results. Only
just slight and negligible differences were encountered which was not enough to alter the
expected results.

Procedure
The components and equipment needed to experiment are as follows:
Component Quantity
1. Resistor 1
2. Diode 4
3. LED 1
4. Capacitor 2
5. 5V Power Source 1
6. 12V Power Source 2
7. Screw Terminal Block 2
8. Voltage Regulator (LM7805_TO220) 1
9. Connecting Wires

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The procedure followed when we were experimenting was as follows;
Design Phase:
1. We Created a schematic diagram of the circuit layout using a design software; KiCad.
2. We Choose appropriate components based on the circuit requirements and availability.
3. We Design the physical layout of the circuit board, arranging components for optimal
performance and space efficiency.

2. PCB Layout:
 We Import the schematic into the PCB layout software.
 We Place components on the PCB layout according to the schematic, considering factors
such as signal flow, heat dissipation, and accessibility.
 We then Route traces between components to establish electrical connections, ensuring
proper signal integrity and impedance matching.
 Create ground and power planes to provide stable reference voltages and minimize
electromagnetic interference (EMI).
 WE Perform a design rule check to identify and resolve any layout errors or violations.

Manufacturing Preparation:
 We generated files, which contain the information necessary for PCB fabrication,
including copper traces, drill holes, and component placements.
 Created a list of all components required for assembly, including part numbers,
quantities, and reference designators.
 We Prepared an assembly drawing illustrating component placement and orientation for
assembly technicians.
 We Selected PCB specifications such as material type, thickness, and surface finish based
on the application and budget.
Assembly:
 We procure all necessary components listed in our list of component preparation.
 Then we assemble the PCB by soldering components onto the board according to the
assembly drawing and component placement.
 We perform quality control checks to ensure all components are soldered correctly, and
there are no short circuits or solder bridges.

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Testing and Debugging:
 Then PCB was tested to verify functionality and performance according to the design
specifications.
 We identified and troubleshoot any issues or errors encountered during testing, making
necessary adjustments or component replacements.

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