Mechanical Drawings

Chapter 4:

SF363 Flip-Chip Fine-Pitch BGA Package Specifications (0.80 mm pitch)

UG075_c4_01_052208

Figure 4-1: SF363 Flip-Chip Fine-Pitch BGA Package Specifications

270 www.xilinx.com Virtex-4 FPGA Packaging and Pinout Specification

UG075 (v3.5) April 9, 2021