Process Software

Process Users Guide

BGA2 Process Profile

8020 Software Part Number 08001-8000-001-##
8028 Software Part Number 08028-8000-001-##
8098 Software Part Number 08098-8000-001-##
MAXµm Software Part Number 09028-8000-001-##

The information in this document is the property of Kulicke & Soffa Industries, Inc. Any reproduction,
publication or distribution to a third party is strictly forbidden unless written permission is given by an
authorized agent of Kulicke & Soffa.

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September 21, 2001
Kulicke and Soffa
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Table of Contents

INTRODUCTION......................................................................................................................................................................... 3
W HAT IS A PREMIUM PROCESS? .................................................................................................................................................3
FEATURES AND BENEFITS............................................................................................................................................................4
LOOP SHAPES A CHIEVEABLE ......................................................................................................................................................4
BGA2 LOOP SCREENS....................................................................................................................................................................5
BGA2 GUI SCREENS.......................................................................................................................................................................6
PARAMETER DEFINITION ............................................................................................................................................................7
PARAMETER CONSIDERATIONS AND DEFINITIONS.................................................................................................................7
PARAMETER DEFINITION.....................................................................................................................................................12
INSPECTION ..................................................................................................................................................................................14
PARAMETER COMPARISON CHART................................................................................................................................18
NOTES............................................................................................................................................................................................19

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Introduction

What is a Premium Process?

The BGA2 Premium Process Software Profile is included in the standard software version for the
MAXµm, 8098, 8020 and 8028 Automatic Ball Bonder Systems. This Profile was included to meet your
complex and dynamic bonding requirements. As the Semiconductor Industry changes the electronic
packages to meet required consumer needs, the Premium Process Software supports the assembly
equipment in order to meet those needs.

This Premium Process Profile for the MAXµm, 8020, 8098 and 8028 Automatic Ball Bonder is included in
the standard software version.
The additional Premiums Processes listed below require a Site License and can be activated at our
factory or acquired through Software@kns.com. Please contact your K&S representative for literature
and Site License pricing for any of the following Premium Process:

• BGA3 Low Loop

• BGA4 CD Loop

• BGA Plus

• Bump

• Chip Scale Package (CSP) Long Loop

• Chip Scale Package (CSP) Loop

• J-Wire

• RF Loop

• Security Bonds (Bump/Loop)

• Spider Loop

• Stand-Off Stitch 1

• 7K Wires Process

• 12K Wires Process (8028 & MAXµm Only)

• Free Air Ball (K&S Diagnostics)

• Flexible Pitch Indexing

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Features and Benefits

The BGA2 Loop Premium Process Software is a Standard looping trajectory in the 8020 and 8028
Operating Software that is developed for challenging BGA applications.
BGA2 benefits include:

• Higher Yields
BGA2 Loop process gives a solution to the problems associated with
intermittent tight wire loops.

• Increased Flexibility
The BGA2 Process allows for parameter munipulation to obtain two loop shapes:
BGA2 Loop and BGA2 Worked Loop.

• Increased Capability
New parameters have been created to improve looping control over the specific
looping and bonding requirements.

Loop Shapes Achieveable

Standard Loop Shape

BGA2 Loop Shape

BGA2 Worked Loop Shape

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

BGA2 Loop Screens

Following screens had been created to incorporate the parameters in the BGA2 process. If you
have worked with the BGA2 process, you may be already familiar with the following screens.

BHD

Wire Length

BGA2 Loop Profile

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

BGA2 GUI Screens

BGA2 Worked Loop Screens

The parameter difference between BGA2 and BGA2 Worked Loop is that the Smoothness
parameter is not used or available.

BHD

Wire Length

BGA2 Worked Loop Profile

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Parameter Definition

Parameter Considerations and Definitions

The following parameters are used for the BGA2 looping process. If you have worked with the
BGA2 process, you may be familiar with most of these parameters.

Shape Factor Defines how severe a bend is to be placed on a wire at the Span Length location
by specifying the angle of arc to be swept during the kinking motion.
Representations below show a wire with the shape factor kink formed at the
capillary tip bond.
USEAGE Shape Factor 1 is generally set around 20 degrees so that the highest point of the
loop remains over the first bond. Span Length 1 and Shape Factor 1 settings of 0
will provide a standard loop shape. When Shape Factor 1 is set to 0, this acheives
a loop shape equal to standard loop. When combined with Span Length at 100%
and Smoothness set to 100% and increase in machine performance is realized.

Shape Factor

Shape Factor

Shape Factor

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Parameter Definitions BGA2 Loop Profile

Span Length Defines in length or as a percentage of wire length the location where a
bend is formed in the wire for a worked type loop. Below are example
representations that show a wire pay-out for span length to the point of the Shape
Factor kinking motion.
USEAGE Used for low and / or long loops to add stiffness to the loop and reduce
wire sway. Span Lengths of less that half of the wire length provides better loop
control, however longer lengths are possible especially when incorporated with
smoothness to create a BGA style loop.

Span Length 1

Span Length 1

Span Length 1

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Parameter Definition

Smoothness Provides control over how localized a bend is produced by Shape Factor. By
specifying a distance as a percentage of wire length that the wire bending is to
begin spreading wire deformation out over the distance between Smoothness
and Span Length. This creates a gentler curve to the wire as seen in the
representations below. To have an effect on the loop profile the
smoothness factor needs to be set to a value less than span length.
Smoothness can be disables by setting it to a value equal to Span Length.

USEAGE Generally used where a gentle curve is desired instead of a more defined
worked kink. A typical value will be 20% when a rounded loop is desired or
100% when a worked loop is preferred.

Example Loop Shapes:

Rule: Smoothness < Span Length
Span Length = 85%
Smoothness = 55%

Rule: Smoothness < Span Length

Span Length = 85%
Smoothness = 65%

Rule: Smoothness < Span Length

Span Length = 85%
Smoothness = 75%

Rule: Smoothness >/= Span Length

Span Length = 85%
Smoothness = 86%

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Parameter Definition

LOOP BALANCE Is a factor that is used to adjust the relative height between wires of
varying length.

USEAGE Loop Balance values >100% will raise the height of longer wires and
lower the height of shorter wires. Loop Balance values <100% will lower
the height of longer wires and raise the height of shorter wires.

Loop Balance 95%

Short Wire Long Wire

Loop Balance 100%

Short Wire Long Wire

Loop Balance 105%

Short Wire Long Wire

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Parameter Definitions

Y Balance Balances Loop heights between front and rear wires. Y Balance Adjust is a
factor that is used to equalize relative loop heights between front and backside
wires. Values greater than 100% has the affect of raising front-most wires
and simultaneously lowering backside wire loops. In contrast, using
values less than 100% has the affect of lowering front-side wires while
simultaneously raising backside wire loops. A Y Balance setting of 100%
has no effect on loop height.

USEAGE Adjustments should be made in 0.2% increments and will require

readjustments to loop factor after loop heights are equalized.

Y REAR

Y REAR
X LEFT

X LEFT X RIGHT

X RIGHT
Y FRONT
Y FRONT

X Balance X Balance is a factor that is used to equalize relative loop heights

between left-side and right-side wires. Values greater than 100% has the
affect of raising left-side wires and simultaneously lowering right-side wire
loops. In contrast, using values less than 100% has the affect of lowering
left-side wires while simultaneously raising right-side wire loops. An X
Balance setting of 100% has no effect on loop height.

USEAGE Adjustments should be made in 0.2% increments and will require

readjustments to loop factor after loop heights are equalized.

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Parameter Definition
Contact Angle / Contact Offset

Contact Angle Sets the approach angle of the capillary to second bond.

Contact Offset Adjusts the second bond X, Y coordinates of the Z touchdown point
towards first bond so that the remainder of the XY motion is made with the
capillary dragging along the surface.

USEAGE Contact Angle and Contact Offset are used as a tool to modify the
second bond impact characteristics. The dragging motion can be
used to elongate the second bond, this can help to pull straight a swayed
wire and to separate and weaken a tail bond from the second bond.

LF2 = 0

Contact Angle

Contact Offset

LF2 = 20 2nd Bond Point

TIP2

LF2 LF2 sets the percent of distance the bond head moves parallel to
the bond surface prior to making second bond.

USEAGE LF2 is used to control the lay down of the wire. A value of 0 uses the
belly of the wire to kick the loop up so that a clearance can be
created for ground bar clearances. A value of 20 will pull out on the wire,
laying the wire flat and usually providing better wire straightness.

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Starting Parameters

This section provides starting parameters and the recommended ranges to help you learn and
understand the BGA2 process. It has been provided to serve as a starting point for your process,
and your specific application may require changes from some of these starting values.

The recommended starting parameter value is listed in the tables below.

Starting Parameters

These starting parameters should provide a loop height of approximately 8 mils.

Parameter BGA2 BGA2 Worked

Kink Height 6 6
Reverse Motion 6 6
Reverse Motion Angle 100 100
Bleed Voltage 1000 1000
Span Length 75 75
Shape Factor 25 25
Smoothness 45 N/A
Loop Factor -7 -7
Loop Balance 100 100
X Balance 100 100
Y Balance 100 100
LF2 12 12
LF4 100 100
Impact Time 0 0
Contact Angle 0 0
Contact Offset 0 0

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Sample Application
APPLICATION DESCRIPTION
Inspection Avg STD Min
Loop Height above ball 7.9 0.18 7.4
Loop Height top of loop 8.4 0.48 7.4
Pull – Above Ball 7.8 .28 7.3
Pull – Mid Span 4.8 .44 3.3
Pull – 2nd Bond 4.3 .31 3.9

LOOPING PARAMETERS
Parameter Value
Loop Profile BGA2
Kink Height 6
Reverse Motion 6
Loop Factor -7
Contact Angle 0
Contact Offset 0
LF4 100
Bleed Voltage 1000
Impact Time 0
Rmot Angle 100
LF2 12
Shape Factor 1 25
Span Length 1 75
Loop Balance 100
Smoothness 45

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Troubleshooting

General Troubleshooting Suggestions

BGA looping - Power/ground bar clearance (sagging wires). BGA profile works the best for
reducing this problem. Use a Span length of 90-100%. Increasing the shape factor can reduce the
problem, but may increase the loop height if set to high. Reducing the LF2 parameter to 0-5 can
help.

Low loop - loop height control (TSOP packages). Controlling the loop height can be difficult where
the bond height from the die to the lead becomes small. In these cases, the highest part of the loop
can be in the middle of the wire, where it is difficult to control, instead of above the ball. The contact
angle and contact offset parameters can be effective, and the m-loop (shape factor 2 and span
length 2) can help to eliminate the problem

Weak second bonds - Usually a minimum pull of 4 grams at second bond is acceptable. With
small tip capillaries, this value can drop into the 3-gram range. Do experiment to find optimum
settings. Lowering the Constant Velocity can help with finer pitch caps. Lowering the Contact
Angle and Contact Offset can help, but may increase the S-ing.

S-ing wires - Commonly observed on corner wires of a package. Using a worked loop or BGA
loop provides the best straightness. Increasing Contact Angle and Contact offset will increase the
straightness, but can lead to weaker second bonds.

Loop height variation - Generally not a big problem. The range of loop heights can be as much
as 1.5 mils. Make sure the wirefeed system is clean and the components are aligned. The LF3
parameter (~10 mils) can help reduce

Neck Damage - is caused by overworking the wire. Adjusting the amount of reverse motion and/or
reverse motion angle can reduce it. Also lowering the EFO current or changing wire type will
decrease neck damage by modifying the heat affected zone.

Snake wires - can be described as a mechanical kink in somewhere in the wire loop. It can be
serious enough that adjacent wires can short together. New parameters have been developed to
eliminate this issue. Reducing “Z-Tear Speed” slows the tearing speed at the tail bond and can
eliminate the problem. Increasing “Z-Tear USG” can also eliminate the problem. This parameter
turns on the USG during the tearing motion.

Leaning wires - is characterized by the wire not being vertical off the ball bond. It can lean from
side to side. The problem can be bad enough to cause shorting wires. The parameters described
above can also be effective in reducing the problem.

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
 BGA2 Loop Profile

Troubleshooting

General Looping Troubleshooting Chart

Problem Spec Possible Actions Effective Downside
Parameters
S-ing +/- 1 mil < 100 mil wire Increase the loop height Contact Angle Weak Second
length +/- 1% > 100 mil Increase the flat length Contact Offset Bonds
wire length Use worked or BGA loop Second Bond TIP
profiles
Loop Height Standard Deviation < Mechanical set-up TOL correction UPH
Variation 0.33 mils Parameters LF3
Sagging wires Wire Clearance > 1 wire Use Worked or BGA Shape Factor 1 UPH
diameter after 20 mils profiles Span length 1 S-ing
passed 2nd bond Flat Length Loop height may
LF2 become too high
Loop Height Control 4 mils to 6 mils Use BGA3 profile Span Length 2 UPH
Shape Factor 2
Weak Second > 4.0 grams at stitch Experiment with relevant TIP S-ing wires
bonds bond pull parameters Constant Velocity Tail bond peeling
Time
Power
Force
Contact Angle
Contact Offset
Snake wire +/- 1 mil < 100 mil wire Increase capillary hole Z Tear Speed UPH
length +/- 1% > 100 mil size Z Tear USG
wire length
Leaning wires < +/- 10 um from Increase capillary hole Z Tear Speed UPH
vertical above the ball size Z Tear USG

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September 21, 2001
Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Loop Profile

Parameter Interaction

Parameter Interaction Table

Wire 1st Bond Ball Looping 2nd Bond

Loop Factor
Kink Height

Rev Motion
Tail Length
Geometry

2nd USG
Capillary

1st USG

2nd C/V
Throttle
1st C/V

2nd tip
EFO I

2nd T

2nd F
Bleed
RMA
1st T

1st F
Wire

FAB

CO
CA

IT
Ball Height X X X - - - + +

Ball Shear X X X X X X X

Neck Damage X X X X + - - + X - + +

Exit Angle X X X X X X X X

X X X + X X
Nicking

Loop Height X X X X + - + X + X X X - X

LH Max Loc X X X X X X X X

S'ing X X X X - + X - X X X X - - X + - +

Tail Proportions X - - - X X X X X

X X X X X X X X X X
2nd Pull

Tool Mark/Peel X X X X X X X + + +

UPH* X + - - - + -

Appearance X X X X X X X X X X X X X X X X X X X X X X X X

X Correlation observed

+ Positive correlation observed

- Negative correlation observed

Deviation from default values should generaly be made as final adjustments to process.

* Due to the inticate nature of the profile, UPH is significantly reduced when worked loop profile is selected.

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Kulicke and Soffa.
2101 Blair Mill Road, Willow Grove PA 19090 USA
BGA2 Profile

Parameter Comparison Chart

1488 - 8028 Parameter Comparison

1488 default 8028 default Range Function Conversion

Kink Height 8 Kink Height 8 0 - 100 mils Sets kink height. Used to control kink above ball. Lower [1488] = [802X]
values may cause neck damage.
Reverse Motion 8 Reverse Motion 8 0 - 150 mils Sets reverse motion. Use this parameter to increase or [1488] = [802X]
decrease the loop height above the ball
Loop Factor 130 Loop Factor -4 -20 - +20 mils Adds or subtracts wire from the loop. Use to fine tune loop [1488] = [802X]
height
Contact Ratio 0 Contact Angle 0 0 - 10 Contact angle at 2nd bond. Higher values increase wire [1488] = [802X]
straightness, but can lower pull strengths at 2nd bond.
Approach 0 Contact Offset 0 0 - 3 mils Controls X/Y skid distance at second bond. Use to minimize [1488] = [802X]
Distance tail bond peeling
LF 4 100 LF 4 100 1 - 100% Bond throttle. Looping motion only [802X] = 100% for production use.
Use LF 4 only for debugging loops.
Impact Time 0 Impact Time 0 0 - 25% Low loop parameters. Similar to contact angle. Use no more than 2% on 802X.
Rmot Angle 90 Rmot Angle 90 0 - 180 Sets the reverse motion angle. Use to fine tune loop shape [1488] = [802X]
Degrees above the ball
LF 2 10 Loop Factor 2 20 0 - 20 Pullout - Lower value can reduce wire laydown at second [1488] = [802X]
bond. Higher value can increase wire straightness. Note: 802X default = 20 mils; 1488
default = 10 mils. If using 1488 default
value, set [802X] = 10 mils.
Shape Factor 1 0 Shape Factor 1 0 -90 - 90 Programmable theta adjusts the height of the loop at mid-span [1488] = [802X]
Degrees
Span Length 1 0 Span Length 1 0 0 - 100% Adjust the position of the mid-span kink [1488] = [802X]
Smoothness Smoothness 0 - 100% Adjusts the radius on the mid-span kink [1488] = [802X]
Loop Balance Loop Balance 90 - 110% Normalizes the difference in loop heights from short to long [1488] = [802X]
wires. Higher values increase the loop heights of longer
wires. Lower values decrease the loop heights of longer
wires
Shape Factor 2 0 Shape Factor 2 0 -90 - 90 Use for “m-loop” shape. Set Shape Factor 1 to -15, and [1488] = [802X]
Degrees Shape factor 2 to +15.
Span Length 2 0 Span Length 2 0 0 - 100% Use for “m-loop” shape. Set Span length1 to 25% and Span [1488] = [802X]
length 2 to 75%
Loop Height 10 Loop Height 10 4 - 100 mils Sets the loop height. Reduced parameter [1488] = [802X]

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September 21, 2001
Kulicke and Soffa
2101 Blair Mill Road, Willow Grove PA 19090 USA
Notes

This page is for additional notes by the user.

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September 21, 2001
Kulicke and Soffa
2101 Blair Mill Road, Willow Grove PA 19090 USA